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:: Corporate Member News ::

* IMAPS 2014 Exhibitors & Sponsors Issue *

:: News from Palomar (full story)

:: Torrey Hills Technologies and Hengli Honored as Gold Prize Winner at the 6th Annual 2014 Golden Bridge Awards Presentation (full story)

:: News from Unisem (full story)

:: Visit Neu Dynamics/NDC International at Booth 405 - NDC/NDCI for your microelectronics packaging needs (full story)

:: AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications (full story)

:: Refining for Tomorrow, RELDAN METALS, Co. Come visit us at Booth 521 (full story)

:: Visit Teledyne Microelectronics Booth 300 at IMAPS! (full story)

:: Shinko Electric Industries at Booth #609 (full story)

:: Since 1977 Accu-Tech Laser Processing has been the benchmark for quality laser services (full story)

:: Visit Axus Technology at Booth # 634 (full story)

:: Center for Nanoscale Science & Engineering, North Dakota State University (full story)

:: Sage Analytical Lab invites you to visit booth #428 at this year's IMAPS in San Diego, California! (full story)

:: AIM Solder at IMAPS 2014 (full story)

:: SOURIAU PA&E specializes in the custom design and manufacture of hermetic connectors and electronic packaging (full story)

:: Come Visit i3 Electronics, Inc (full story)

:: MicroScreen LLC at Booth # 316 (full story)

:: Visit EPP GmbH at IMAPS 2014 (full story)

:: Fraunhofer Institute for Reliability and Microintegration IZM at IMAPS 2014 (full story)

:: Rudolph Technologies on Display (full story)

:: Visit NATEL at Booth 505 - The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages... (full story)

:: Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders... (full story)

:: Visit METALOR at Booth 209 (full story)

:: Be Sure to Stop by the KOA Speer Electronics, Inc. Booth (full story)

:: Geib Refining Corp. (full story)

:: Camtek Ltd. is a worldwide provider of automated and technologically advanced solutions designed to enhance manufacturing processes (full story)

:: At CCI, we eliminate ESD (full story)

:: Plasma-Therm, LLC on Display at IMAPS San Diego (full story)

:: DuPont Microcircuit Materials (full story)

:: Perfection Products manufactures Process Magazines and Carriers (full story)

:: DISCO Hi-Tec America, Inc. (full story)

:: Yxlon FeinFocus at Booth #502 (full story)

:: Job Openings ::

:: AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Invensas: IMAPS Cafe Refreshment Breaks Sponsor
Indium Corp - Keynote Presentations Sponsor
Palomar Technologies: Dessert "Happy Hour" Sponsor
Plasma Therm: Bag Insert Sponsor
Technic - Golf Hole Sponsor
Golf Hole Sponsor: Quik-Pak

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


News from Palomar

Optoelectronics in the News
In light of the recent steps toward congressional endorsement of optics and photonics as a vital enabling technology for the economy (pun intended), it is fitting this week to discuss optoelectronics. A bill proposed in the U.S. Senate “recommends that federal agencies work with optics and photonics industry and research partners and support internal programs to leverage knowledge and resources and to promote innovation”. What comprises this subject of optoelectronics? Read more: http://www.palomartechnologies.com/blog/bid/207469/Optoelectronics-in-the-News.

Automating Power Amplifier Packaging
A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It can also provide for us a blueprint of what might be ahead. While most everything is automated today, it’s important to drive home the message that automation is the keystone through which a company can enter into profit. Read more: http://www.palomartechnologies.com/wire-bonders-speak/bid/18508/Automating-Power-Amplifier-Packaging.

Palomar

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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Torrey Hills Technologies and Hengli Honored as Gold Prize Winner at the 6th Annual 2014 Golden Bridge Awards Presentation

NASA Endorsed AST1003-0304N Drying Furnace Awarded for Excellence in Technology
Torrey Hills Technologies, LLC (THT) and Hengli Eletek, Co. Ltd were jointly honored as Gold Prize winner for the 6th annual 2014 Golden Bridge Awards under the New Products and Services from all over the world category for their innovative model AST1003-0304N drying furnace. Golden Bridge Awards are an annual industry and peers recognition program honoring Best Companies of all types and sizes from all over the world. NASA, one of the earliest customers to take advantage of this pioneering furnace technology, endorsed THT/Hengli's entry into the Awards.

Concerned about the negative impacts of modern manufacturing on the environment, the Hengli/THT team invented a new volatile organic compound (VOC) removal / thermal oxidizing system for their model AST belt furnace. Connected to the furnace exhaust, this ground-breaking VOC removal system eliminates VOC emissions to outside air. Widely used in electronics manufacturing as solvents that are dried on a belt furnace and exhausted into the air, VOCs are one of the top causes for smog. The electronics manufacturing process contributes a significant portion of VOCs to air pollution, yet no other furnace manufacturers have approached this issue. THT and Hengli are the first to achieve a green solution that allows VOCs to be oxidized into CO2 before being released into the ambient air.

“Our invention is a classic story of ‘Necessity is the mother of invention’,” said Ken Kuang, President and CEO of THT. “The 2013 Eastern China smog was a severe air pollution episode that affected East China and caused airports, highways, and schools to close. By eliminating VOCs so that they cannot be exhausted into the air, we can begin to reduce smog. It was a pleasure to have NASA as the first customer to vouch for this technology.”

Torrey Hills Technologies, LLC (http://www.torreyhillstech.com, http://www.beltfurnaces.com) is a leader in developing and delivering quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to large-scale furnace equipment for semiconductor packaging, circuit board assembly, advanced materials processing and solar cell manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.

Hengli Eletek Co., Ltd. (http://en.ecmee.com/ ) was founded in 1992 with the mission to become a leading supplier of thermal processing solutions to the global electronics and materials markets. Hengli products have been highly appreciated by customers from more than 20 countries located in North America, South America, Europe, Asia, and Australia.

The coveted annual Golden Bridge Awards program recognizes and honors the world’s best in organizational performance, products and services, innovations, executives and management teams, women in business and the professions, case studies and successful deployments, public relations and marketing campaigns, product management, websites, blogs, white-papers, videos, advertisements, creativity, partner programs, and customer satisfaction programs from every major industry in the world. Learn more about The Golden Bridge Awards at www.goldenbridgeawards.com.

Torrey

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News from Unisem

Unisem Announces QFN Side wall Plating Capability and Leadframe Grid Array (LFGA) Package Offering 
 Unisem, a global provider of semiconductor assembly and test services, has announced its QFN side wall plating capability and LFGA package offering at the company’s facility located in Batam, Indonesia.   

The QFN side wall plating technology offers a unique set of advantages, as it protects the copper wire from exposure during the board mounting process and allows soldering to occur on the external side wall, so that a visual inspection can be made. The process that was developed at Unisem is the Immersion Tin process, which has already started production.
Unisem is also pleased to announce the addition of the Lead Frame Grid Array (LFGA, also called HDL developed by QPL), to its comprehensive set of package offerings. The LFGA is a leadframe based package that can be configured in a fully populated grid array providing a significantly reduced footprint. The reduced footprint also helps reduce cost at the assembly level with increased leadframe capacity. Additional benefits of the LFGA are design options such as isolated power and ground rings and shorter wire lengths compared to standard QFN style packages.

Unisem Announces Exhibits at Upcoming Fall Conferences 
Unisem, has announced that it will be exhibiting at the following conferences this Fall:

  • MEMS Industry Group’s Shanghai 2014 Conference on Sept 11 in Shanghai, China.
  • iMAPS 47th International Symposium on Microelectronics on Oct 14-15 in San Diego, CA.
  • 2014 MEPTEC Semiconductor Packaging Technology Symposium on Oct 23 in Santa Clara, CA.
  • International Wafer-Level Packaging Conference on Nov 12-13 in Santa Clara, CA.

The company will also participate in IEEE-CPMT’s ESTC 2014: 5th Electronics System-Integration Technology Conference on Sept 16-18 in Helsinki, Finland but will not be exhibiting. 

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Visit Neu Dynamics/NDC International at Booth 405 - NDC/NDCI for your microelectronics packaging needs

Neu Dynamics Corp/NDC International is an ISO 9001:2008 certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronics, components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications. We further offer small to medium volume contract molding services for microelectronic packages such as BGA, QFN, MLP, optical components etc. We also have capability to provide insert molding services for items such as connectors. We offer specialized equipment built for today’s high-tech semiconductor assembly processes.

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AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the “thickness” of these devices, and hence, the thickness of the dies and wafers.  Wafers and substrates are thinned down from as thick as 750 micron down to 25-50 micron to improve the performance and/or provide a thinner and lighter electronic device.

While back-grinding tapes are used in many applications in place of traditional wax solutions, a temporary bonding wax that can be applied to the thickness of 10 micron still provides many advantages over the thicker back-grinding tapes.  This is particularly true for more aggressive processes and more fragile wafers.

Responding to this need for thinner wafers and substrates, AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.  Unlike traditional wax, AIT’s wax-like media provides well-defined melting points of 80ºC and 160ºC for different processing requirements and easy removal. The bonding medium can be dissolved cleanly with IPA or acetone.  AIT temporary bonding media has been proven useful in all of the four primary methods for wafer thinning: mechanical grinding, chemical mechanical polishing (CMP), wet etching and atmospheric downstream plasma (ADP), and dry chemical etching (DCE).

AIT

 

AIT’s back-grinding liquid wax (BGL) can be spun to form 10 micron film for precision bonding with a die-shear bond strength of over 500 psi for temperatures 15ºC below the melting point.  AIT provides the temporary bonding/protective wax in pre-dissolved isopropyl alcohol (IPA).  The thickness of this wax film can be adjusted in the spin coating process or by diluting the wax liquid further with IPA.

One of AIT’s feature Temporary Bonding IPA-Soluble Wax Solutions, BGL7080 can be heated to 60ºC and still maintain a stable bond.  Other high temperature waxes, such as BGL70160-HV and BGL7080-HV7 can maintain a relatively stable bond up to 135ºC and 150ºC respectively.  These waxes can withstand exposure to high temperature up to 225ºC for shorter time periods without degradation.

Release or dismount is achieved by melting the wax at a high temperature to lower the viscosity of the wax layer significantly, thus allowing the release of the wafer or device mechanically by lifting or gentle sliding.

For high temperature waxes, IPA or other solvents must be used to swell, penetrate, soften, and dissolve the waxes.  This can be done by dipping and soaking the wafer/substrate into an IPA bath.  Warm IPA at 40 -60ºC will accelerate this dismount mechanism.

Some examples of AIT’s temporary bonding/protective waxes are listed in the table below. AIT developed these solutions by working closely with our customers to meet their specific needs. AIT can formulate a solution that will work for your stringent requirements.

Properties of AIT’s Back-Grinding and Thinning Wax Liquids


PARAMETERS

BGL7080

BGL7160-HV

BGL7160-HV7

Release Mechanism

Debonding by melt and mechanical slipping

Isopropyl alcohol to swell, soften, and remove the wax

Isopropyl alcohol to swell, soften, and remove the wax

De-Bonding Temperature

120°C with slipping push

40°C with               iso-propanol

40°C -60°C with   iso-propanol

Thickness of Temporary Bonding Layer

5-25 micron by spin coating

10 - 100 micron by spin coating or spraying

10 -100 micron by spin coating or spraying

Die-Shear Bond Strength (PSI)

>500 psi

>500 psi

>500 psi

Operating temperature range for processing

20 - 60°C

20 - 135°C

20 - 150°C

Cleaning Media

Iso-propanol (IPA)

Iso-propanol (IPA)

Iso-propanol (IPA)

Water Jet Resistance

      Outstanding

   Outstanding

    Outstanding

Note:  AIT backgrinding and thinning temporary materials are free of silicones or siloxanes.

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Refining for Tomorrow, RELDAN METALS, Co. Come visit us at Booth 521

Abington Reldan Metals, LLC has been refining for over 30 years with a combined experience of over 50 years turning our clients' waste into recoverable, quantifiable assets. The sellable assets we recover come from sources as varied as manufacturing scrap, plating facilities, jewelry scrap, electronic waste, scrap dealers, dental production materials, to name only a few resources of precious metals bearing scrap.

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Visit Teledyne Microelectronics Booth 300 at IMAPS!

Visit us at IMAPS, in San Diego on October 14-15, 2014 to learn about the new Teledyne Microelectronics.  

For 50 years, Teledyne Microelectronics has led the industry in innovative microelectronics packaging solutions. We continue to build on our rich heritage with a new production facility that combines microelectronics packaging with circuit card assembly and flex and rigid flex printed circuit boards.  Together, we provide a complete, vertically integrated advanced engineering and manufacturing solution. 

Click here to register for a free IMAPS exhibit hall pass.

Contact us to schedule a meeting or setup a visit to our new facility.

We look forward to seeing you in San Diego! 

TELEDYNE MICROELECTRONICS
1425 Higgs Road, Lewisburg, TN  37091 |  12870 Panama Street, Los Angeles, CA  90066

931.359.4531 | microelectronics@teledyne.comwww.teledynemicro.com

 

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Shinko Electric Industries at Booth #609

Shinko Electric Industries CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. Shinko manufactures a full line of Organic Substrate structures including coreless options offering enhanced electrical performance and package size reduction. Shinko can also provide subcontract assembly services with an emphasis on packaging solutions such as POP, SIP and Camera Modules utilizing our advanced package assembly technologies, including our molded core embedded package, MCeP™. Shinko is located in Nagano, Japan and provides the ultimate in service and solutions for our customers with Sales and Engineering support worldwide. For more about Shinko please visit our website at www.shinko.com.

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Since 1977 Accu-Tech Laser Processing has been the benchmark for quality laser services

Since 1977 Accu-Tech Laser Processing has been the benchmark for quality laser services. Laser Machining, Scribing and Shape Cutting of fired Ceramics, non-fired Ceramics (LTCC / green tape), AlN, Duroid, Thin Metals, Polymers, Rubber, Silicon, Sapphire, Fused Silica, CVD Diamond, and many other applications for the Microelectronics and PCB industries. Apertures and orifices. Solar cell scribing and cutting. Laser Micro-Via drilling. Laser Skiving, Routing, and PC Board Rework & Recovery Solutions for controlled depth coverlay / dielectric / solder mask / squeeze-out removal or cavity formation on rigid circuits. Prototype to Full-Scale Production Processing. We Can Use Your Data Formats: (.DXF, .DWG, Gerber, Drill Files).

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Visit Axus Technology at Booth # 634

Axus Technology delivers end-to-end support, for R&D through volume production, for CMP and substrate thinning applications. Starting with process design and development in our CMP Foundry, through delivery of production tools and processes; Axus provides industry-leading process and equipment solutions for fabs, 3D integration, and wafer & device packaging users.

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Center for Nanoscale Science & Engineering, North Dakota State University

Micro-fab (thin-film), thick-film (plating, dispensing, printing), packaging (CSP, multichip), and SMT facilities staffed with full-time research and development employees. Capabilities include design and simulation, rapid prototyping, electrical and environmental testing, polymer and silicon materials research, and materials characterization (AFM, FTIR, DSC, DTMA, SEM, TEM, XRF, NMR, etc.). http://www.ndsu.edu/cnse/

 

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Sage Analytical Lab invites you to visit booth #428 at this year's IMAPS in San Diego, California!

Join Us October 14-16!

Sage Analytical

This year's International Symposium on Microelectronics promises to deliver success for all conference attendees and bring together the future of packaging.

Driven by the development of more sophisticated packaging and subtler defects, the applications of 3-dimensional non-destructive techniques have become crucial in standard analysis flows.

Sage Analytical Lab can help you identify and isolate fail signatures including:

• BGA fatigue
• BGA cracking
• BGA voiding
• C4/Bump cracking
• Wire bond shorting
• Die attach issues
• Copper tracing in laminates, substrates and boards
• Passive component integrity and placement
• Various other metal defects

Contact us at info@sagefalab.com to learn more and be sure to visit us at Booth #428 at this year's symposium.

 

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AIM Solder at IMAPS 2014

AIM is a leading global manufacturer of solder assembly materials for the semiconductor, electronics and photonics packaging industries. We supply lead-free, indium alloy and AuSn alloy solders in all forms, including PREFORMS, Wire, Paste, Foil, Spheres and custom TIM's. AIM is ISO 9001:2008 and ISO 14001:2004 certified.

 

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SOURIAU PA&E specializes in the custom design and manufacture of hermetic connectors and electronic packaging

SOURIAU PA&E specializes in the custom design and manufacture of hermetic connectors and electronic packaging. Our technology is proven in the harshest environments. We work directly with engineers to custom design and manufacture electronic packaging and connectors that meet the exacting standards for the reliability satellite, missile, fighter aircraft, under-sea and other mission-critical systems require. We use unique materials in our manufacturing processes and offer a range of production capabilities – machining, plating, vacuum brazing, laser welding, and more – all at a single location. This integrated manufacturing approach can reduce complexity and risk on your next project.

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Come Visit i3 Electronics, Inc

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

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MicroScreen LLC at Booth # 316

Stainless steel and polyester screens, as well as solar cell and large format screen requirements. Automated screen coating, photoplotting services, fine line resolution screens are all offered. Fine Grain, PHD, Invar Fiber Optics Laser Cut stencils for solder paste deposition. ITAR registered.

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Visit EPP GmbH at IMAPS 2014

EPP was founded in 1987 and is a supplier of High Tech Systems, like: Lasertrimmers, AOI (Automatic Optical Inspection) Systems, Sintering Furnaces and other related Equipment. Our worldwide customers manufacture Electronics for Cars, Telecommunication, Pharmaceutics, Military and Industrial applications. Our customer base includes companies like MICRON, BOSCH, DELPHI, just to name a few. EPP is an Integrator of high tech Systems in your production line. We take full responsibility and Support our System and our customers worldwide. Our AOI Systems inspect all Screen/Stencil printed, sputtered or electroplated Layers

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Fraunhofer Institute for Reliability and Microintegration IZM at IMAPS 2014

Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of more than 300. Nearly 80% of our turnover in 2013 was earned through contract research.

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Rudolph Technologies on Display

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.

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Visit NATEL at Booth 505 - The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages...

The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages. RF/Microwave MIC(s), Hybrids, MCM's and Higher Level Assemblies for the Defense, Aerospace, Medical, RR/Microwave, Fiber Optic/Optoelectronic, Telecommunications and Test & Measurement Industries.

For more information about NATEL, please visit: www.natelems.com.
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Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders...

Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the microelectronics, alternative energy and solid state lighting industries. Featured this year are new products to showcase our commitment to pursuing new technologies. Some of the products we will be highlighting are our new materials sets for heater circuit construction for both low and high temperature heaters, a variety of conductors for use with AlN substrates and also a line of copper pastes for constructing circuits where high thermal and electrical conductivity are required. The copper based pastes are designed to use simple thick film processing to create copper circuits for high power electronics.

www.thickfilm.net

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Visit METALOR at Booth 209

Metalor Technologies USA is a leading participant in Precious Metals and advanced materials. We produce a comprehensive range of precious metal powders and flakes for electronics and adhesive applications. Metalor is a leading supplier of Precious Metal plating products and processes, designed for a comprehensive range of metallization methods.

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Be Sure to Stop by the KOA Speer Electronics, Inc. Booth

KOA Speer Electronics Inc. is a leading supplier of thick film, thin film resistors, current sense and thru-hole resistors, resistor networks, inductors, integrated components, circuit protection, LTCC modules and EMI/EMC filtering components. KOA manufactures to the highest quality level which makes them ideal for automotive, medical, aerospace, military and alternative energy applications. KOA Speers ISO9001-2008 & TS-16949 certifications prove to customers just how devoted they are to quality.

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Geib Refining Corp.

Precious metal reclaim and refining facilities Gold - Silver - Platinum - Palladium - Rhodium - Iridium 100% destruction of your intellectual properties ensured by our ITAR and EPA certifications. Ceramic scrap, jars, rages, wipes, vacuum deposition, solutions, Sound hazardous waste experience. Please stop over and visit with us.

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Camtek Ltd. is a worldwide provider of automated and technologically advanced solutions designed to enhance manufacturing processes

Camtek Ltd. is a worldwide provider of automated and technologically advanced solutions designed to enhance manufacturing processes. Camtek's solutions are designed to increase products' yield and reliability, while supporting technology advances and roadmaps of the Semiconductors, Printed Circuit Boards (PCB) and Integrated Circuits (IC) Substrates industries. With more than 25 years of experience in the field of inspection and metrology and thousands of systems installed worldwide, Camtek addresses the specific needs of these interconnected industries by offering dedicated solutions for yield enhancement and manufacturing optimization. The company's portfolio is based on a wide range of technologies including intelligent imaging, image processing and functional 3D inkjet process. Camtek supports its customers through dedicated service and support teams around to world.

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At CCI, we eliminate ESD

At CCI, we eliminate ESD. Every day we take on ESD problems and wrestle them into submission. From material handling products to shippers and packaging to production process reviews. We know what it takes to eliminate ESD from your manufacturing and handling processes. Our path to leadership in the static safe packaging industry has included the invention of Corstat conductive corrugated materials in 1978 and the design of a broad scope of products using that material. Our roots go back to a passion for creating complete packaging materials for static sensitive products.

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Plasma-Therm, LLC on Display at IMAPS San Diego

Plasma-Therm is a U.S. manufacturer of advanced plasma processing equipment for research and development to high-volume production. MicroDieSingulator™ systems deliver plasma dicing-on-tape for advanced packaging applications, and the company’s leading etching and deposition technologies address the needs of specialty semiconductor markets, including solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, wireless communication, and advanced photomask etching. Customers have recognized Plasma-Therm with VLSIresearch awards for the last 16 years. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the needs of Plasma-Therm’s global customer base.

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DuPont Microcircuit Materials

DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film and GreenTape(tm) low temperature co-fired ceramic (LTCC) compositions for a wide variety of printed electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. We deliver solutions that lower the cost of ownership and improve performance, reliability and functionality. For more information on DuPont Microcircuit Materials, please visit http://mcm.dupont.com.

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Perfection Products manufactures Process Magazines and Carriers

Perfection Products manufactures Process Magazines and Carriers. Such products are Film Frames, Grip Rings, Magazines for Frames and Rings. Lead Frame Magazines, Process Boats (formed & flat style) & Magazines, Antistatic Shippers for Frames and Rings. Also, available are the 12.0” (300 mm) Wafer Frames and Magazines. Perfection - Accept Nothing Less

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DISCO Hi-Tec America, Inc.

DISCO is a company that specializes in advanced cutting, grinding, and polishing technologies.

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Yxlon FeinFocus at Booth #502

YXLON is the leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. The YXLON product portfolio includes the Y.Cheetah and Y.Cougar which offer effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Y.Cheetah and Y.Cougar combine proprietary FeinFocus technology with advanced high-speed flat panel detector technology. Within seconds, the systems adapt between inspection tasks-failure analysis, research and development, process control and product testing including QuickScan mode.

 

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:: Job Openings ::

AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering

  • AS, BS or advanced degrees in materials science and engineering, or chemical engineering or mechanical engineering.
  • Experience in cofire ceramic materials, process, equipment and designs.
  • US citizen or PR, working permit for outstanding candidates.
  • Working in San Diego, America’s Finest City!
  • Traveling to Asia at 25-35%

Send resume to HR@aem-USA.com with compensation history. AEM Components @ www.aemcomponents.com AEM Inc. @ www.aem-USA.com

CONTACT:
Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023
(949)285-6383
ray@pacificrimeng.com

 

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View the Corporate Bulletin Archives

 

EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 164 ::
September 17, 2014

Metallix

Oneida Research Services