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:: Corporate Member News ::

* IMAPS 2014 Exhibitors & Sponsors Issue *

:: THANK YOU IMAPS 2014 Exhibitors & Sponsors - ONLY 1 BOOTH STILL REMAINS! (full story)

:: Visit NATEL at Booth 505 - The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages... (full story)

:: Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders... (full story)

:: Visit METALOR at Booth 209 (full story)

:: Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS (full story)

:: Visit Micro Systems Technologies (MST) at booth# 335 during the IMAPS 2014 exhibition in San Diego (full story)

:: News from Palomar (full story)

:: Kulicke & Soffa Appoints Dennis Ang Lien Lee as Senior Director, Global Head of IT (full story)

:: Technic Launches Technology Support Hub (full story)

:: New Ownership at F&K Delvotec (full story)

:: 5N Plus - Specialty Metals and Compounds - at Booth #429 (full story)

:: Visit Teledyne Microelectronics at Booth #300 (full story)

:: IBM Microelectronics -- Packaging Products and Services (full story)

:: Harrop Industries at Booth #522 (full story)

:: FOGALE nanotech is the Leader in Metrology & Inspection Tools for 3D Packaging, MEMS and related applications (full story)

:: TJ Green Associates Proudly Announces Upcoming Public Training at IMAPS 2014 (full story)

:: Job Openings ::

:: AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
HONEYWELL
AMICRA
Neu Dynamics

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


THANK YOU IMAPS 2014 Exhibitors & Sponsors - ONLY 1 BOOTH STILL REMAINS!

1 BOOTH STILL AVAILABLE FOR IMAPS 2014

Exhibitor Booth Booth Type Booth Category
5N Plus Inc. 429 10 x 10 In-Line
Accu-Tech Laser Processing, Inc. 506 10 x 10 Corner
AdTech Ceramics 616 10 x 10 Corner
AdValue Photonics 535 10 x 10 In-Line
Advance Reproductions Corp. 336 10 x 10 In-Line
Advanced Dicing Technologies 415 10 x 10 In-Line
Advantest Corporation 523 10 x 10 Corner
AI Technology, Inc. 402 10 x 10 In-Line
AMADYNE GmbH 434 10 x 10 In-Line
AMICRA Microtechnologies GmbH 330 10 x 10 Corner
ASM Pacific Technology, Ltd. 504 10 x 10 Corner
ATV Technologie GmbH 617 10 x 10 Corner
Axus Technology 634 10 x 10 Corner
Azimuth Electronics, Inc. 509 10 x 10 Corner
Besi North America, Inc. 225 10 x 10 In-Line
Camtek USA, Inc. 622 10 x 10 Corner
Canon USA 510 10 x 10 Corner
Ceradyne, Inc., a 3M company 526 10 x 10 In-Line
Center for Nanoscale Science & Engineering, North Dakota State Univ. 706 10 x 10 - RESEARCH CORRIDOR In-Line
Chip Scale Review (Media Sponsor) 426 10 x 10 In-Line
Cleanlogix LLC 229 10 x 10 In-Line
Coining, Inc., an AMETEK company 607 10 x 10 In-Line
Conductive Containers, Inc. 417 10 x 10 Corner
CORWIL Technology 424 10 x 10 In-Line
CVInc 327 10 x 10 In-Line
DAETEC tbd 10 x 10 In-Line
Deweyl Tool Company, Inc. 408 10 x 10 In-Line
DISCO Hi-Tec America. 611 10 x 10 In-Line
DuPont Microcircuit Materials 431 10 x 10 Corner
East China Research Institute of Microelectronics 512 10 x 10 In-Line
Electronic Production Partners GmbH 501 10 x 10 Corner
Element Six Technologies US Corp. 530 10 x 10 Corner
Epoxy Technology, Inc. 407 10 x 10 Corner
ESL ElectroScience 605 10 x 10 Corner
F & K Delvotec, Inc. 514 10 x 20 Corner
Ferro Corporation 331 10 x 10 Corner
Finetech, Inc. 317 10 x 10 Corner
Fogale Nanotech 528 10 x 10 In-Line
Fraunhofer Institute for Reliability and Microintegration IZM 705 10 x 10 - RESEARCH CORRIDOR In-Line
FREEDM-Laboratory for Packaging Research in Electronic Energy Systems (NCSU) 703 10 x 10 - RESEARCH CORRIDOR Corner
FRT of America, LLC 620 10 x 10 Corner
Geib Refining Corporation 301 10 x 10 In-Line
Gel-Pak/Quik-Pak 312 10 x 10 Corner
Georgia Tech 3D Systems Packaging Research Center (PRC) 704 10 x 10 - RESEARCH CORRIDOR Corner
Haiku Tech, Inc. 115 10 x 10 In-Line
Harrop Industries, Inc. 522 10 x 10 In-Line
Hary Manufacturing Incorporated 104 10 x 10 Corner
HD Microsystems 236 10 x 20 Corner
Heraeus Electronic Materials Division 205 10 x 20 Island
Hesse Mechatronics, Inc. 309 10 x 20 Corner
Hi-Rel Laboratories, Inc 413 10 x 10 In-Line
Hybond, Inc. 435 10 x 10 In-Line
i3 Electronics (formerly Endicott Interconnect Technologies) 507 10 x 10 In-Line
IBM Corporation 427 10 x 10 In-Line
Indium Corporation 217 10 x 10 In-Line
Infinite Graphics 314 10 x 10 In-Line
Inkron Ltd. 614 10 x 10 In-Line
Integrated Electronics Engineering Center (IEEC), Binghamton Univer. 707 10 x 10 - RESEARCH CORRIDOR In-Line
Interconnect Systems, Inc. 401 10 x 10 In-Line
Kulicke & Soffa Industries, Inc. 215 10 x 10 In-Line
Kyocera America, Inc. 410 10 x 10 In-Line
KOA Speer Electronics 425 10 x 10 In-Line
LINTEC OF AMERICA, INC 214 10 x 10 Corner
Metalor Technologies USA 209 10 x 20 Island
MicroScreen LLC 316 10 x 10 Corner
Micross Components 420 10 x 10 Corner
Micro Systems Technologies, Inc. 335 10 x 10 In-Line
Mini-Systems, Inc. 406 10 x 10 In-Line
Momentive Performance Materials 610 10 x 10 In-Line
MRSI Systems LLC 231 10 x 10 Corner
NAMICS Corporation 320 10 x 10 Corner
Natel Electronic Manufacturing Services, Inc. 105 Island - 20 x 20 Island
Neu Dynamics Corp. 405 10 x 10 Corner
NorCom Systems, Inc. 210 10 x 10 Corner
Nordson DAGE 227 10 x 10 In-Line
NTK Technologies, Inc. 517 10 x 10 Corner
Palomar Technologies, Inc. 221 10 x 20 Corner
Perfection Products, Inc. 505 10 x 10 Corner
Photofabrication Engineering, Inc. 111 10 x 10 Corner
PJC Technologies, Inc. 615 10 x 10 In-Line
Plasma-Therm, LLC 108 10 x 20 Island
Polysciences, Inc. 422 10 x 10 In-Line
Reldan Metals Co., Div of AR Metals, LLC 521 10 x 10 Corner
Riv, Inc. 100 10 x 10 Corner
Royce Instruments, Inc. 321 10 x 10 Corner
Rudolph Technologies 520 10 x 10 Corner
Sage Analytical Lab, LLC 428 10 x 10 In-Line
Sales & Service, Inc. 423 10 x 10 In-Line
Samtec 421 10 x 10 Corner
SANTIER Thermal Management Solutions 500 10 x 10 In-Line
SavanSys Solutions LLC 329 10 x 10 Corner
Semi Dice, Inc. 102 10 x 10 In-Line
Shinko Electric America 609 10 x 10 In-Line
Sierra Circuits, Inc. 608 10 x 10 In-Line
Sikama International, Inc. 213 10 x 10 Corner
Sonoscan, Inc. 315 10 x 10 Corner
Souriau PA&E 414 10 x 10 Corner
SST International 305 10 x 20 Corner
Stellar Industries Corp. 400 10 x 10 In-Line
Taiyo Ink Mfg. Co., Ltd. 613 10 x 10 In-Line
Tango Systems, Inc. 436 10 x 10 In-Line
TDK Corporation 606 10 x 10 In-Line
Technic, Inc. 411 10 x 10 Corner
Teledyne Microelectronic Technologies, Inc. 300 10 x 10 Corner
Torrey Hills Technologies, LLC 515 10 x 10 Corner
TPT Wire Bonder 325 10 x 10 In-Line
Tresky Corporation 323 10 x 10 In-Line
U.S. Tech (Media Sponsor) 430 10 x 10 Corner
UBOTIC Company Ltd. 322 10 x 10 Corner
Unisem Group 524 10 x 10 In-Line
Ushio, Inc. 536 10 x 10 In-Line
UTZ Technologies 328 10 x 10 In-Line
VIOX (now Ceradyne, Inc., a 3M company) 526 10 x 10 In-Line
West Bond, Inc. 416 10 x 10 Corner
XYZTEC 404 10 x 10 Corner
YINCAE Advanced Materials, LLC. 326 10 x 10 Corner
YXLON International, Inc. 502 10 x 10 In-Line
Zeta Instruments 604 10 x 10 Corner
Total Booths: 129

 

 

Exhibitor Questions or need assistance reserving a booth?
Contact Brian Schieman at bschieman@imaps.org or call 919-293-5000

 

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Visit NATEL at Booth 505 - The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages...

The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages. RF/Microwave MIC(s), Hybrids, MCM's and Higher Level Assemblies for the Defense, Aerospace, Medical, RR/Microwave, Fiber Optic/Optoelectronic, Telecommunications and Test & Measurement Industries.

For more information about NATEL, please visit: www.natelems.com.
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Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders...

Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the microelectronics, alternative energy and solid state lighting industries. Featured this year are new products to showcase our commitment to pursuing new technologies. Some of the products we will be highlighting are our new materials sets for heater circuit construction for both low and high temperature heaters, a variety of conductors for use with AlN substrates and also a line of copper pastes for constructing circuits where high thermal and electrical conductivity are required. The copper based pastes are designed to use simple thick film processing to create copper circuits for high power electronics.

www.thickfilm.net

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Visit METALOR at Booth 209

Metalor Technologies USA is a leading participant in Precious Metals and advanced materials. We produce a comprehensive range of precious metal powders and flakes for electronics and adhesive applications. Metalor is a leading supplier of Precious Metal plating products and processes, designed for a comprehensive range of metallization methods.

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Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at IMAPS

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.

LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput yields, and component performance. LV1000 is halide-free, meets the ROL0 requirement without sacrificing strength, and passes Telecordia GR-78 requirements in the both the activated and unactive state.

LV1000 provides a durable, level, clear coating that does not clog pick-and-place equipment, even in automated assembly processes. It offers complete coverage, even with a weight percentage as low as 0.5 percent.

Flux coatings provide consistent, uniform amounts of flux every time, with excellent control over the flux volume/weight percentage. Indium Corporation’s flux-coated solder performs come in a variety of packaging and can be color coded. The company’s flux coatings are applied to the outside of the preform where the flux is required, rather than in the core. 

Indium Corporation will be exhibiting at booth 217.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.            

 

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Visit Micro Systems Technologies (MST) at booth# 335 during the IMAPS 2014 exhibition in San Diego

Visit Micro Systems Technologies (MST) at booth# 335 during the IMAPS 2014 exhibition in San Diego and find out about our comprehensive solutions in the field of microelectronics and electrical components for high-reliability / high-performance industries.

The offering includes HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging technologies, as well as batteries and hermetic feedthroughs for medical implants.

Susan Bagen, Application Development Manager at MST, will present some of the latest information on “Advanced Electronic Packaging Options for Miniaturization of Complex Medical Devices” on Tuesday, October 14, 2014, 5:00 PM – 5:25 PM. We invite you to attend this presentation or visit us at booth# 335.

Micro Systems Technologies, Inc.
1839 S. Alma School Road, Suite 270
Mesa, AZ 85210-3024
www.mst.com

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News from Palomar

Bringing Old Bonder Equipment Back Online
While the word “mothball” has a negative connotation in our world of capital equipment, the fact is that the very definition of mothball is machinery that is kept in working order so that production may be restored quickly if needed. The key here of course is “working condition”. To maintain working condition, working directly with the vendor is critical to ensure the machines can be brought online when needed. Read more: http://www.palomartechnologies.com/blog/bid/207263/Bringing-Old-Bonder-Equipment-Back-Online.

PALOMAR

Mid- to High-Volume Contract Manufacturing in Microelectronic Packaging
Process is critical. Working with a team who can deliver process expertise and world-class equipment will offer many more choices and a much higher probability of success when it comes to production. In sourcing production for high-precision, step out of the box and evaluate all options. Read more: http://www.palomartechnologies.com/blog/bid/207396/Mid-to-High-Volume-Contract-Manufacturing-in-Microelectronic-Packaging .

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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Kulicke & Soffa Appoints Dennis Ang Lien Lee as Senior Director, Global Head of IT

Kulicke and Soffa Industries, Inc. has announced that the Company appointed Dennis Ang Lien Lee as Senior Director, Global Head of IT, effective immediately.  Mr. Ang will be based at the K&S Corporate Headquarters in Singapore, and will report to the Company’s Senior Vice President, Chief Financial Officer & Chief Information Officer, Jonathan Chou.

Mr. Chou stated, “I am delighted to have Dennis, a seasoned IT professional, join K&S at a pivotal point of our growth plan.  His over two decades of IT know-how gained from Fortune 500 companies will take our current IT platform to the next level in support of our business initiatives.”

Mr. Ang brings over 20 years of experience from pharmaceutical, airline and high technology sectors.  He held various IT leadership roles ranging from systems, infrastructure, networking, and governance to service delivery.  A highly experienced IT leader, Mr. Ang joins K&S from the Eli Lilly and Company (NYSE:LLY), a global pharmaceutical company, where he held diverse strategic IT roles in its global operations under a unique AMERASIA region covering Africa, Middle East, Russia, and Asia.  As IT Director for AMERASIA, he was responsible for leading and managing a virtual regional IT team and outsourced resources in a multi-vendor environment, in addition to developing IT strategy and implementing IT solutions and services to 15 affiliates.  Mr. Ang has a Bachelor’s Degree in Engineering (EEE) from the National University of Singapore and a Master’s in Business Administration from the Nanyang Technological University of Singapore.

"I look forward to this global opportunity at the K&S Corporate Headquarters in Singapore and to provide leadership in developing and implementing the company’s IT strategy in an ever-changing global environment," said Mr. Ang.

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Technic Launches Technology Support Hub

Technic is pleased to announce the official opening of the Technology Support Hub portal on our 3 global web sites in North America, Europe and Asia. With the Technic TSH, registered users will be able to access disparate and extensive resources designed to make our products easier to use and to enable our customers to design better process solutions. The portal is also designed to provide information and resources to allow our technology community to communicate information that is not readily available in other locations. The TSH features interactive calculators, application specific technical process guides, training videos, and support information for our extensive, proprietary product offerings. 

Access is free to registered users.

To register, go to www.tsh-technic.com

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New Ownership at F&K Delvotec

On 24 July 2014, Strama-MPS Maschinenbau GmbH & Co. KG located in Straubing, Bavaria, took possession of 51% of the company’s shares from owner and president Dr. Farhad Farassat. It was also agreed that Dr. Farassat will remain active in the company for another three years before the remaining shares will change hands. Strama-MPS (www.strama-mps.de) has very successfully carved a position for itself as a specialty equipment supplier in the automotive, electrical and solar technology industries. Joining forces will create considerable synergies for both companies, not only on the market side but also on the sourcing side. Strama-MPS has been very successful in providing large and complex automation solutions for various industry segments, especially in the highly demanding automotive industry.

Thanks to their in-house production facilities which include plants in lower-cost countries such as Croatia and China, they enjoy a large degree of vertical integration. F&K Delvotec, on the other hand, provides highly regarded and leading-edge technologies in wirebonding. Dr. Farassat comments on the transaction: "The deciding factor to join forces with Strama-MPS was that both our companies share the same philosophy. Strama-MPS with about 800 employees world-wide is a typical, family-owned Mittelstand company and yet is large enough to have the standing and the resources to compete successfully in global growth markets. I am happy to know that the future of the entire F&K Delvotec family which Said Kazemi and I built over 37 years into a highly esteemed technology leader will be in capable hands. All of us here at F&K Delvotec are grateful for the many years of fruitful and pleasurable cooperation with our customers that we have enjoyed. This will, I am confident, not change in the future."

As detailed by Dr. Farassat, F&K Delvotec will keep the company seat, R&D and production as well as sales and service departments and all employees at the company seat in Ottobrunn. Likewise, the locations and employees of our sales and service subsidiaries in Singapore and Foothill Ranch, California, will remain unchanged. In the coming years, we look forward to bring fresh vigor to larger, more complex and more highly automated projects from a single source to world-wide customers and help them stay ahead in their respective industries.

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5N Plus - Specialty Metals and Compounds - at Booth #429

5N Plus is a leading producer of specialty metals and compounds for use in advanced electronic, pharmaceutical and industrial applications. We have recently added production capabilities of high purity metal powders and compounds for the lead-free solder paste, die attach and ECA markets. 5N Plus is headquartered in Montreal, Quebec and operates 12 manufacturing facilities and 16 sales offices in Europe, the Americas and Asia.

www.5nplus.com

 

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Visit Teledyne Microelectronics at Booth #300

Over the past 50 years, Teledyne Microelectronics has produced millions of microelectronic hybrids that have contributed to countless hours of history. We continue to build on our rich heritage of advanced manufacturing technologies. Our microelectronics packaging experience is now combined with circuit card assembly manufacturing and printed circuit board manufacturing. Together, we provide a complete, vertically integrated advanced manufacturing solution.

www.teledynemicro.com

 

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IBM Microelectronics -- Packaging Products and Services

IBM Microelectronics - a world leader in semiconductor and packaging technology, products and services has the advanced packaging solutions required for “More-than-Moore”. Whether it be SoC or multi-component configurations, IBM’s packaging portfolio can help you deliver differentiated solutions while providing personalized, expert support that can help you meet even the toughest application goals. Exploit IBM’s IDM value stack (Research, Custom Logic, Specialty Foundry, and Packaging) and system-level mindset to integrate disparate technologies (including custom off the shelf components) to achieve more functional density, lower power and higher performance at a competitive cost…..The Right Packaging is essential in this new Era of Computing

BOOTH 427

www-03.ibm.com/technology/packaging/

 

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Harrop Industries at Booth #522

Harrop designs and manufactures a complete line of continuous and periodic tape casters, dryers, burn-off ovens, and kilns to produce ceramic products for laboratory, pilot plant, and industrial applications. Heat sources can be electric or gas-fired. Microwave assisted heating is available. Provide thermal analysis lab services and toll firing.

www.harropusa.com

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FOGALE nanotech is the Leader in Metrology & Inspection Tools for 3D Packaging, MEMS and related applications

FOGALE nanotech is the Leader in Metrology & Inspection Tools for 3D Packaging, MEMS and related applications.

FOGALE’s TMAP is a unique metrology and inspection tool and was recently Awarded “Best Product 2014” by 3DInCites. It is based on multi-sensor heads which include different technologies in the same integrated tool, capable to measure all required dimensions and defects.

FOGALE has a continuing development effort that has tracked and satisfied customer requirements and stays in front of the next production needs.

www.fogale.com

 

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TJ Green Associates Proudly Announces Upcoming Public Training at IMAPS 2014

TJ Green Associates, LLC, the global leader in training and consulting for military, space, and medical microelectronic devices, is offering a number of public training courses this fall, beginning with two PDCs at the IMAPS symposium in San Diego.

IMAPS 2014 Professional Development Courses:
1. Introduction to Microelectronics Packaging - This overview course is intended for those unfamiliar with microelectronics packaging technology. People in sales, purchasing, program management, new engineers, managers, equipment/material suppliers, people new to this industry or anyone looking to get a broad industry overview and review of the industry drivers, history and future trends are welcome to attend.
Monday, October 13th, 10 am – 6 pm

2. Packaging and Testing of Implanted Medical Devices - This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for package seal, hermeticity testing and for those responsible for evaluating non-hermetic packages.
Thursday, October 16th, 8 am – 12 pm

 

Additional Courses from TJ Green later this year:

Microwave Packaging Technology (3 Days)
Bethlehem, PA
November 11-13, 2014

This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and microwave packaging technology.
 
This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material tradeoffs, and process selection are all covered in detail. Microwave Design for Manufacturability DFM concepts are introduced and reinforced throughout the course.
Full Course Outline & Registration Form

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (4 Days)
Bethlehem, PA
November 18-21, 2014

This four-day process certification course is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy-to-understand format.
Full Course Outline & Registration Form

Wire Bonding Certification (3 Days)
Bethlehem, PA
December 2-4, 2014

This is an intense three-day course that combines classroom activities and "hands-on" skills at the wire bonder. Students have to demonstrate a basic level of wire bonding proficiency and pass a written test at the end. Older model manual ball and wedge bonders are used to teach the basic skills of wire bonding and associated trouble shooting. In addition, high/ low power microscopes and wire pull test equipment allows the student to see and fell what makes for a good bond. Visual inspection and defect recognition are in accordance with MIL-STD-883 TM 2017 and TM 2010.
Full Course Outline & Registration Form

Additional public training courses are scheduled throughout the year and are also available in-plant. Check the TJ Green LLC website for up-to-date course schedules and locations.

 

 

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:: Job Openings ::

AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering

  • AS, BS or advanced degrees in materials science and engineering, or chemical engineering or mechanical engineering.
  • Experience in cofire ceramic materials, process, equipment and designs.
  • US citizen or PR, working permit for outstanding candidates.
  • Working in San Diego, America’s Finest City!
  • Traveling to Asia at 25-35%

Send resume to HR@aem-USA.com with compensation history. AEM Components @ www.aemcomponents.com AEM Inc. @ www.aem-USA.com

CONTACT:
Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023
(949)285-6383
ray@pacificrimeng.com

 

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RGL Enterprises

 


:: Issue 163 ::
September 3, 2014

Metallix

Oneida Research Services