NEWS | JOBS | FAST LINKS

Heraeus TFD

XYZTEC

:: Corporate Member News ::

:: NATEL and OnCore Manufacturing Announce Merger Agreement (full story)

:: News from Torrey Hills (full story)

:: Amkor Technology Receives Intel’s Preferred Quality Supplier Award (full story)

:: News from Master Bond (full story)

:: Ernest Waaser Joins Nusil As Its New Chief Executive Officer (full story)

:: EV Group Extends Leadership in High-Vacuum Wafer Bonding Technology (full story)

:: Gel-Pak Vacuum Release Trays Selected as Ideal Carrier for GaN HEMT Die (full story)

:: Kyzen is a New National Distributor of Honeywell’s Solstice Performance Fluid (full story)

:: KYOCERA Earns Three Year ISO 14001 and ISO 9001 Recertifications for Top Quality and Environmental Management (full story)

:: Fraunhofer Research Institution for Modular Solid State Technologies to be Renamed (full story)

:: News from Indium (full story)

:: Nordson EFD Releases (full story)

:: News from Palomar & Recent Palomar Blogs (full story)

:: Finetech Opens New Production and Development Center in Germany (full story)

:: Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications (full story)

:: Unisem Receives Supplier Excellence Award from Allegro MicroSystems (full story)

:: TechSearch International Analyzes Flip Chip and Wafer Level Package Growth (full story)

:: AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film (full story)

:: Sonoscan’s Steve Martell Wins IPC President’s Award (full story)

:: Job Openings ::

:: Technical Sales Engineer - YINCAE (full story)

:: Inside Sales Representative in Southern California (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Kyzen

Unisem

Sonoscan

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


:: NATEL and OnCore Manufacturing Announce Merger Agreement (full story)

Combination Creates One of the Premier EMS Companies in the Mid-Tier Space

NATEL Engineering Company, Inc. (NATEL) and OnCore Manufacturing, LLC (OnCore), both global suppliers of electronic manufacturing services (EMS), announced today that an agreement has been signed to merge the two firms. The merger will create a new EMS company with an expansive array of capabilities and an expanded manufacturing and technology portfolio to service critical customer needs.

The combined company will be one of North America’s largest Electronic Manufacturing Service companies building high-reliability low-to-medium volume and high-mix electronic subassemblies and systems with strategic market focus on the Medical, Industrial and Aerospace and Defense sectors. The new organization will have13 manufacturing locations, approximately 3,750 employees, and annual revenue of approximately $770 million.

“This is a compelling strategic combination that creates a market-focused leader in the high-reliability mid-tier EMS space. The merger of OnCore and NATEL provides an excellent value for our customers and exciting new opportunities for all employees,” stated Sudesh Arora, NATEL President and Chief Executive Officer.

“Both NATEL and OnCore have pursued successful strategies to grow their respective businesses and we are excited to bring these two companies together. We are highly complementary organizations and our combined value proposition will deliver competitive advantages for our customers,” stated Sajjad Malik, OnCore Chief Executive Officer.

Best in Class Solutions

NATEL is recognized as America’s largest, most experienced private manufacturer of microelectronics for mission-critical high-reliability applications including large format lithium ion (Li-ion) assemblies for the International Space Station. NATEL is at the forefront of operational excellence and LEAN manufacturing practices in both its microelectronic and EMS solutions. OnCore’s full product life-cycle engineering services and robust processes and systems for the production of complex and highly regulated products are keys to its customer success. The combined company will offer a unique set of capabilities delivering vertically integrated engineering and manufacturing solutions to the Medical, Industrial and Aerospace and Defense markets with a North American footprint in corridors of innovation and manufacturing options in low-cost regions.

The transaction is expected to close before the end of April 2015. Financing for the transaction was provided through a fully underwritten commitment from Goldman Sachs Bank USA and GE Capital Corporation. B. Riley & Co., LLC acted as financial advisor for NATEL, and Lincoln International acted as financial advisor for OnCore.

About OnCore
OnCore Manufacturing, LLC is a leading provider of product commercialization services for low-medium volume, high-complexity products to international blue-chip aerospace and defense, industrial, and medical companies. With manufacturing facilities in Springfield and Wilmington, MA, Longmont, CO, San Marcos and Fremont, CA, Suzhou, China and Tijuana, Mexico, OnCore manages customers’ high-complexity products while providing them maximum flexibility to manage their business in a close, collaborative relationship. More information is available at www.oncorems.com. OnCore is an equal opportunity employer.

About NATEL
NATEL is a major independent manufacturer of a wide variety of electronic products, providing high mix, lowto- mid volume production for its customers. As one of the largest and oldest privately held EMS companies in the U.S., NATEL is known for solving tough engineering problems that result in high-reliability, high-quality electronics for customers in the medical, aerospace and defense, and industrial markets. NATEL is favorably positioned among mid-tier EMS manufacturers to “make amazing things happen.” NATEL holds and maintains industry-specific certifications that include AS9100, ISO 13485, and ISO/TS 16949. Its MIL-PRF- 38534 (DSCC) Class H and K certifications certify NATEL’s expertise in designing and manufacturing microelectronic assemblies for space and mission-critical defense programs placing it in an elite group of defense and aerospace industry manufacturers. NATEL, headquartered in Chatsworth, CA, has manufacturing locations in California, Nevada, Ohio and Mexico. To learn more, visit www.NatelEMS.com or Twitter, @NATEL. NATEL is an equal opportunity employer.

Media Contacts:
Jonathan Davis
NATEL VP of Corporate Development
jdavis@natelems.com
818-734-6559.

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News from Torrey Hills

IMAPS Fellow Ken Kuang publishes an Amazon Best Selling book in Business Entrepreneurship: From Start-up to Star: 20 Secrets to Start-up Success

torrey hills

From its humble beginnings, Torrey Hills has become a major player in supplying microelectronic components and process equipment, with an impressive 63 percent average annual growth rate and customers in more than sixty countries, and making the INC500|5000 list five times in a row, a striking accomplishment that’s only one of many for this man who was born in a wooden shack. 

In this book, Ken and his colleagues Joyce Zhang and Eileen Han share their philosophies, insights, and the business savvy that has driven their small company to such amazing heights in such a short time. No matter what industry you’re in, you’ll find stimulating ideas, useful stratagems, and winning tactics that will help you grow your business from Start-up to Star Player, or to move your established business up to the next level of success.

Ken has also offered to give 200 copies of the book to IMAPS members.  US members just pay postage of $3.95 and overseas members $20. Contact support@torreyhillstech.com for details.


Torrey Hills Technologies Initiated and Led the Donation Total of 31,122 Pounds of Rice to Kokang Refugees
Torrey Hills Technologies, LLC (THT) donated 7,156 pounds of rice purchased with funds raised from the sale of Amazon best-selling book, From Start-Up to Star, written by Ken Kuang, President and CEO of THT, and two of his colleagues. The rice was prepared by a group of volunteers in China, who had been able to put together a joint donation of 31,122 pounds of rice, following the lead of THT, to support Kokang refugees.

Kokang is a remote place in Burma which shares a border with China's Yunnan Province. Kokang suffered a violent conflict on February 9, 2015 that had forced 40,000 to 50,000 civilians to flee their homes and seek shelter on the Chinese side of the border. 4,500 others had taken refuge in LashioShan State.

This joint donation can support 2,500 refugees to survive up to 15 days. Kuang said in a statement:  "Our Company has close ties to and operations in China. We want to take the opportunity to express our deep concern for Kokang refugees. And we hope for the fast healing and recovery from this violent conflict."

 

 

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Amkor Technology Receives Intel’s Preferred Quality Supplier Award

Amkor Technology, Inc. has announced that it has been recognized as one of 19 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2014. Amkor has demonstrated industry-leading commitment across all critical focus areas on which we are measured: quality, cost, availability, technology, customer service, labor and ethics systems and environmental sustainability. Amkor was recognized for its significant contributions in providing Intel with wafer probe, wafer bump, assembly, and final testing services that were deemed essential to Intel’s success.

“We are honored to receive Intel's Preferred Quality Supplier Award for the second consecutive year,” said John Stone, Amkor's executive vice president, global sales and marketing. “We share a common vision and continue to collaborate with Intel to provide the technology solutions and manufacturing initiatives that Intel requires. This prestigious award reflects our dedication to world-class customer support and our ability to meet Intel’s high standards.”

“Congratulations to Amkor for winning the 2014 Preferred Quality Supplier Award! Amkor has been a key partner to Intel by providing Intel’s packaging assembly and testing solutions. Intel recognizes Amkor’s commitments on providing leading technology with excellent quality while maintaining great support on availability, cost and sustainability.  We are looking forward to strengthening the partnership with Amkor in the area of new packaging technology in 2015,” said Armin Sarstedt, Vice President of Technology and Manufacturing Group and Director of Intel’s Silicon Foundry and OSAT Management.

The PQS award is part of Intel’s Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to strive for excellence and continuous improvement. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, technology, environmental, social and governance goals. Suppliers must also achieve 80 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at http://www.intel.com/go/quality.

A celebration to honor PQS award winners was held in Santa Clara, California themed “Innovating to Deliver Smart and Connected Devices”, which illustrates the contributions this supplier has made in 2014. In addition, there was an announcement on Intel’s website at http://intel.com.

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News from Master Bond

Master Bond Inc. of Hackensack, New Jersey has developed a new two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive called EP76M.  EP76M has a convenient one to one mix ratio by weight or volume.  It has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties.  It has a thermal conductivity of 8-9 BTU/in/ft²/hr/°F.  EP76M readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature.

Master Bond EP76M has superior durability, thermal shock and chemical resistance.  It exhibits high bond strength to similar and dissimilar substrates.  It has a coefficient of thermal expansion of 30 in/inx106/°C.  EP76M has a service operating temperature range of -60°F to +250°F. A higher temperature version called EP76MHT can resist up to 400°F.

EP76M is easy to apply.  Contact pressure is only required for cure.  The adhesive spreads evenly and smoothly.  It is 100% reactive and does not contain any diluents or solvents.  Cures can be accelerated by the use of heat.  Parts A and B are both colored gray.  EP76M is available for use in glass jars and metal containers.  They are packaged in small and larger sizes (pint and quart units) for convenient application.

Master Bond

Two Component Flame Retardant Epoxy Developed for Aerospace Industry
Developed primarily for specialty aviation applications, Master Bond EP90FR-V is a two part epoxy system that passes the vertical burn test portion of the FAR standard 14 CFR 25.853(a) for flame retardancy. This enables it to be used in aviation applications including interior panels, door frame lining and floor/door assemblies.

EP90FR-V has a convenient one to one mix ratio by weight and a moderate viscosity of 20,000-40,000 cps. This system is suitable for bonding, sealing, coating, potting and encapsulation applications. It bonds well to a variety of substrates including metals, composites, glass, ceramic and many plastics. As a non-halogenated type system, EP90FR-V has an excellent environmental profile, which allows easy handling. It is also a reliable electrical insulator.

EP90FR-V is serviceable over the temperature range of -60°F to +250°F. Chemical resistance to water, fuels, oils and many common solvents is outstanding. Its Shore D hardness is greater than 75. This system is color coded, which facilitates mixing. The color of Part A is black, Part B is white and the cured material is gray. For ease of application, it can be packaged in guns, FlexiPaks™ and premixed and frozen syringes. It is also available in standard packaging including ½ pint, pint, quart, gallon and 5 gallon container kits.

Master Bond

 

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Ernest Waaser Joins Nusil As Its New Chief Executive Officer

NuSil Technology LLC, announces the appointment of Ernest Waaser as its new Chief Executive Officer. Mr. Waaser brings over 30 years of experience leading numerous public and privately-held healthcare companies. He takes over from NuSil's co-founder and CEO, Dick Compton, who is retiring as CEO, but will continue to serve as Chairman of the NuSil Board of Directors.

Prior to NuSil, Mr. Waaser was an Operating Partner at Linden Capital Partners and previous to that served as CEO of Systagenix Wound Management, a private equity-backed spinout of Johnson & Johnson's advanced wound care unit, where he led the business through a period of growth resulting in a sale to Kinetic Concepts, Inc.

Mr. Waaser spent his early career in various roles with DuPont's chemical, industrial and imaging businesses. In the nearly two decades following his career at DuPont, Mr. Waaser held top leadership positions at a number of healthcare businesses, including President of Teleflex Medical, Chief Executive Officer of Hill-Rom, and Chief Operating Officer of Sterling Diagnostic Imaging, a leveraged buy-out of DuPont's medical imaging assets. Mr. Waaser previously served on the board of AdvaMed and on the advisory board of Xavier University Department of Health Administration. He holds a Bachelor of Science in Nuclear Engineering from Mississippi State University and a Master of Engineering from the University of South Carolina.

"We are thrilled to have an executive of Ernest's caliber join the NuSil team," said Matt Holt, a member of the Board of Directors and Managing Director at New Mountain Capital, NuSil's majority shareholder. "With his proven track record of growing global Medtech businesses, we believe he is absolutely the right person to lead NuSil through its next phase of growth and expansion. Our ability to recruit this kind of talent speaks to the outstanding job that Dick Compton and the management team have done in building an exciting, growth oriented environment at NuSil. Dick is a true icon in the specialty silicone industry and we are pleased that he will continue as Chairman of the Board. "

"I am delighted to be joining NuSil and I look forward to leading the growth of the outstanding company that Dick and the executive team have built," said Mr. Waaser. "NuSil clearly differentiates itself with its high-touch, personalized approach to the customer experience. Combining that with its world class technical capabilities makes NuSil the partner of choice for the world's most demanding silicone applications. I'm thrilled to lead an organization that truly delivers on its brand promise." 

For more information, please contact NuSil at +1 (805) 684-8780, or visit http://www.nusil.com.   

 

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EV Group Extends Leadership in High-Vacuum Wafer Bonding Technology

Two new EVG®580 ComBond® system configurations address university / research & development and high-volume manufacturing needs respectively

EV Group has introduced two new configurations to its EVG®580 ComBond® series of automated high-vacuum covalent wafer bonding systems. Addressing the needs of universities and R&D institutes, and high-volume manufacturing (HVM) requirements, respectively, both system configurations achieve electrically conductive and oxide-free bonds of materials with different lattice constants and coefficients of thermal expansion at room temperature.

Top view of an EVG(R)580 ComBond(R) automated high-vacuum wafer bonding system. The integrated cluster system enables fully automated wafer transport, handling and processing in high vacuum.Applications that demand room-temperature bonding of substrates with very different material properties and that are supported by the EVG580 ComBond series include advanced engineered substrates, power devices, stacked solar cells and emerging technologies such as silicon photonics.

New Configuration Details
The new entry-level EVG580 ComBond system for universities and R&D institutes
comes with one cassette station or manual load port as well as a single-arm robot, supporting up to three process modules. The EVG580 ComBond HVM system can be configured with two cassette stations or an equipment front-end module with up to four cassettes for continuous mode operation, as well as comes with a dual-arm robot to support up to six process modules for maximum throughput.

Both new ComBond system configurations, as well as the standard system that can accommodate up to five process modules, are built on a modular platform supporting wafers up to 200 mm in diameter. In addition to one or more bond chambers, the systems feature a dedicated ComBond Activation Module (CAM), which provides advanced surface preparation by directing energized particles to the substrate surface to achieve a contamination-free and oxide-free bond interface. The systems operate in a high-vacuum-process environment with base pressures in the range of 5x10-8 mbar, which prevents re-oxidation of the treated wafers prior to the bonding step.

"The EVG580 ComBond system with its standard five-module configuration, which was launched last autumn, has already demonstrated its capabilities with multiple R&D partners and customers," stated Dr. Thomas Glinsner, corporate product management director at EV Group. "With the new three-module system, we will now make this breakthrough technology available to universities and smaller R&D institutes, which often are at the forefront of pioneering advanced electronic materials and device research, such as heterogeneous integration of compound semiconductors for silicon photonics and other leading-edge applications. All ComBond systems can be further customized to address specific application development needs, such as with special metrology modules utilizing free ports of the high-vacuum handling."
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Gel-Pak Vacuum Release Trays Selected as Ideal Carrier for GaN HEMT Die

Gel-Pak, a division of Delphon and leading manufacturer of device shipping and handling carriers, announced that its proprietary Vacuum Release trays were selected as the ideal carrier for three of Cree’s new Gallium Nitride(GaN) HEMT components including a 20W, 6GHz die; a 75W, 6GHz die, and a 320W, 4GHz die.

The Gel-Pak Vacuum Release trays (VR) effectively immobilize these die to ensure that they remain damage-free during transportation and storage. The components are held in place until they are released when vacuum is applied to the underside of the tray.  “There is a tremendous amount of growth in the use of GaN in next-generation semiconductors including high power, high frequency, wide bandwidth, high temperature applications,” says Darby Davis, Gel-Pak vice president of sales and marketing, “Gel-Pak is constantly looking for ways to protect these components with products and materials that companies can use during processing, storage and transportation.

 

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Kyzen is a New National Distributor of Honeywell’s Solstice Performance Fluid

Honeywell has announced  that it has expanded its distribution of Solstice Performance Fluid (PF), a new low-global-warming-potential solvent used to clean metal and plastic parts for the electronics, aerospace and medical device manufacturing industries.

KYZEN, a leader in the distribution and development of environmentally responsible cleaning technologies and engineering services, has become a national distributor of Solstice PF in the United States. Based in Nashville, Tenn., KYZEN is a provider of cleaning technologies for a variety of businesses, including those in the electronics, semiconductor, optics and metal finishing industries.

“As a leading distributor and developer of cleaning technologies, KYZEN’s expertise will help us accelerate the adoption of Solstice PF,” said David Cooper, global business director for Honeywell Fluorine Products. “Solstice PF provides customers with excellent cleaning power that can effectively clean today’s smaller, more intricate electronics and precision industrial components.”

“Our customers are inventing breakthrough technologies, and they need advanced cleaning technologies to match them,” said Tom Forsythe, executive vice president of KYZEN. “We are constantly updating and expanding our cleaning technology offerings, and Solstice PF will enable us to meet our customers’ needs today and in the future.”

Solstice PF is used to clean oils, greases and other substances from high-performance metal and plastic parts that require precision cleaning, including those used in electronics as well as medical device and aerospace manufacturing. It offers excellent cleaning power when compared to today’s legacy solvents, while helping manufacturers comply with current and proposed environmental and safety requirements.

Solstice PF has a global warming potential (GWP) of 1, which is significantly lower than the GWPs of the most commonly used solvents today, including HCFC-225 (which has a GWP of 370), HFC-4310mee (which has a GWP of 1,700) and HFE-7100 (which has a GWP of 320). Solstice PF is non-flammable per ASTM E681 testing, and has an occupational exposure limit of 800 parts per million. It is also not a volatile organic compound (VOC), as determined by the U.S. Environmental Protection Agency (EPA) and South Coast Air Quality Management District (SCAQMD).

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KYOCERA Earns Three Year ISO 14001 and ISO 9001 Recertifications for Top Quality and Environmental Management

Kyocera America, Inc. has announced that it has passed a rigorous three-year recertification audit for both ISO 9001, the international standard for quality management, and ISO14001, the international standard for environmental management systems. The audit verifies Kyocera’s dedication to maintaining both certifications continuously since its initial certifications in 1994 (ISO 9001) and 1997 (ISO 14001).

“Kyocera remains committed to providing the highest quality, most reliable products in an environmentally responsible manner,” said Bob Whisler, president of Kyocera America, Inc. “The ISO 9001 and ISO 14001 certifications are effective tools that help to govern our strict quality and environmental programs, both of which are priorities for Kyocera’s operations worldwide.”

ISO 9001 is a quality management standard that imparts a methodology to consistently meet and exceed customer standards while incorporating continuous improvement practices into daily operations.

ISO 14001 is an environmental management standard for companies with a focus on minimizing environmental impact and continuously improving environmental performance.

The three-year recertification audit that Kyocera America, Inc. passed requires the certification body to determine whether Kyocera’s ISO 9001 and ISO 14001 management systems are functioning well in everyday operations — including whether: all incidents are recorded; all associated measurements are made; all corrective and preventive actions are properly recorded and implemented; and the company’s top management is committed to supporting these two management systems.

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Fraunhofer Research Institution for Modular Solid State Technologies to be Renamed

Fraunhofer Research Institution for Modular Solid State Technologies EMFT will be renamed as of 31st March 2015. Most of you are familiar with us as “Fraunhofer EMFT”, and the abbreviation “EMFT” we still want to keep. In our complete name we will replace the word “modular” with “microsystems”, thus rendering our new name:

Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT

This new name emphasizes the strengthened focus of our institution on microsystems, at the same time maintaining the connection to our long-term tradition in the competence field of solid state technologies. The relevance of applications and systems for applied research is today more higher than ever. The real benefits of our research activities to our customers and the society can be made visible and tangible only by providing systems – in our case specifically microsystems. We want to highlight the significance of this aspect to our work by changing the name of our institution accordingly.

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News from Indium

Indium Corporation Expert to Present at IMAPS RaMP Conference

Indium Corporation’s Karthik Vijay, technical manager for Europe, Africa, and the Middle East,will presentat the International Microelectronics Assembly and Packaging Society (IMAPS) RaMP RF and Microwave Packaging Conference April 15-16 in Leeds, UK.

Karthik’s presentation, Void Reduction & Better Thermal Management with Engineered Flux-Coated Solder Preforms, discusses the important attributes of flux-coating formulations and coating quality. Attributes include using a uniform flux-coating to reduce oxidation and minimize voids, using low-outgassing and low-voiding halogen-free flux coatings with a unique oxidation barrier to reduce oxidation and achieve equal/better wetting, and engineering the flux-coating rheology to facilitate tape & reel packaging for high-volume automation.

Karthik is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.

Indium

Indium Corporation Receives NPI Award
Indium Corporation was presented with CIRCUITS ASSEMBLY’s NPI Award for its LV1000 flux coating for solder preforms at the IPC APEX Expo on Feb. 24 in San Diego, Calif.

Sponsored by CIRCUITS ASSEMBLY, the NPI Awards program recognizes the electronics assembly industry’s leading new products. Awards are selected by an independent panel of practicing industry engineers.

LV1000is a series of flux coatings that offers low voiding, especially in situations where the component footprint will not allow for proper outgassing of volatized flux. Its glossy, even coating is durable, so it can be used in automated assembly processes.

LV1000 is halide-free, meeting ROL0 requirements, and passes Telcordia GR-78 testing in the unactivated state. The coating’s tolerances are well-controlled, down to 0.5% by weight, to ensure no additional flux is required. LV1000 is versatile, allowing for the coating of unique geometries and sizes.

LV1000 is not only a formulation, but a process which produces flux-coated solder preforms that meet the tightest of flatness tolerances, ensuring that electronic components solder correctly, thereby minimizing defects.

For more information about LV1000, visit www.indium.com/LV1000. For more information on flux-coated solder preforms, visit www.indium.com/flux-and-epoxy/flux-coated-preforms.

Indium

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Nordson EFD Releases

Engineered Fluid Dispensing Product Catalog Sixth Edition
Available in Print, and new Digital and App Formats

The digital and mobile app versions provide convenient navigation, search functionality, and quote requests.

Nordson

Nordson EFD, announces the release of its Engineered Fluid Dispensing Product Catalog Sixth Edition. New this year, the catalog is available in digital and mobile app versions on the Nordson EFD website at catalogs.nordsonefd.com and nordsonefd.com/apps/. The catalog, available in nine languages, is a comprehensive compilation of Nordson EFD's products. The digital edition makes it easy to select and request a quote for precision dispensing equipment and accessories.

"We believe customers will find this a much easier way to see the range of EFD dispensing solutions, find specific products and part numbers, and request a quote," said Rhonda Mitchell, strategic marketing services manager, Nordson EFD. "Hyperlinks make it easy for users to watch dispensing videos and view additional technical information. Apps are also available to access the catalog on Apple and Android smartphones."

The digital and mobile app versions feature:

  1. Easier Search: Search by keyword, product name, part number, or peruse and click on sections in the table of contents.
  2. Links to More Info: Click on individual product part numbers for more details, including links to data sheets, the product web page, and product videos.
  3. Request a Quote: Add products to the cart and request pricing.
  4. Options to Share: Users can share their cart with an EFD sales person, their purchasing department, colleagues, and others.
  5. Mini-Brochures: Create mini-brochures by clicking the PDF icon on the toolbar and selecting a range of catalog pages.

The 100-page catalog includes information about markets and applications that benefit from Nordson EFD precision dispensing systems. It includes detailed descriptions of each EFD product with specifications, features, benefits, photos, diagrams, and charts, along with a comprehensive list of dispensing accessories. Fluid volumes and conversions, a helpful viscosity reference chart, dispensing tip recommendations, and a detailed valve selection guide are also included.

Catalog sections include:

  • Fluid dispensers
  • Optimum® components and 2K mixers
  • Precision valves including PICO jetting systems
  • Fluid reservoirs and Atlas™ fillers
  • MicroCoat® lubrication system
  • Automated dispensing systems, including the new PRO series
  • Solder solutions
The catalog is available in English, Chinese, French, German, Italian, Japanese, Korean, Portuguese, and Spanish. For more information visit Nordson EFD on the web at www.nordsonefd.com, www.facebook.com/NordsonEFD, or www.linkedin.com/company/nordson-efd, email info@nordsonefd.com, or call +1 401.431.7000 or 800.556.3484.
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News from Palomar & Recent Palomar Blogs

The Future is Bright with Strategies in Light 2015
Over 7,000 people attended the Strategies in Light conference again this year at the Sands Convention Center and Expo in Las Vegas, Nevada February 24-26. Hall A was brimming with exhibitors, including Palomar Technologies.The technical conference ran all week, with over 100 leading industry speakers, 300+ exhibitors, and 50 countries represented. The LED and alternative lighting market is alive and well!

The majority of attendees agreed that not only did exhibit quality and variety exceed their expectations, but also that the technical information presented throughout the conference did too. Green technologies are here to stay! Come visit us next year at the Strategies in Light technical conference and exposition at the Santa Clara Convention Center March 1-3, 2016.

Read More:
http://www.palomartechnologies.com/blog/the-future-is-bright-with-strategies-in-light-2015

Palomar

Palomar Technologies has acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing and wafer bonding of microelectronic packages and components.  SST International will complement Palomar’s existing line of wire and die bonders to provide customers the premier “one-stop shop” for precision assembly and hermetic packaging of electronic components.

Read more:
http://www.palomartechnologies.com/news-room/press-releases/palomar-technologies-acquires-sst-international

 Palomar

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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Finetech Opens New Production and Development Center in Germany

Finetech GmbH has opened a new, state-of-the-art production and development center in Berlin-Marzahn. The approximately 8 million euro investment in the new facility will ensure optimal conditions for on-going business growth. The new facility in Marzahn will consist of a two-story production and office building with an effective area of 20,000 sq. ft. as well as a separate facility to house the 35,000 sq. ft. factory floor. Specifically designed for working with highly sensitive devices, the new factory complex will contain several ISO 9-6 class cleanrooms.

Neil O'Brien, General Manager for Finetech USA, stated, "I am very excited about welcoming our customers to this impressive world class headquarters. It is a strong commitment to our continued growth in the marketplace. The facility will position us for expansion in R&D, product engineering, applications, and support staff for many years to come. Our customers will benefit from the expanded cleanroom space for special assembly, sample demonstration, certifications, and detailed application work."

With over 100 employees engaged in the manufacturing of FINEPLACER® die bonding and rework systems, and all departments expanding over the years, the new facility will provide stronger communication and coordination processes and allows plenty of room for expansion as the company continues to grow.

"The new buildings complex will provide vast opportunities of adapting processes and workflows according to current and future requirements," said Finetech GmbH CEO Gunter Kürbis. "I'm convinced the new production and development center will put us all in the position to be optimally prepared for the challenges and opportunities on the horizon."

To ensure quick response to customer requirements, Finetech maintains sales and service subsidiaries in global core markets. The entire value-added cycle from product development to manufacturing to sales is handled in Germany.

Finetech

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Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes

Rudolph Technologies, Inc. has announced that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.

“Copper pillar bumping and TSV have emerged as leading interconnect technologies for advanced packaging, and Rudolph is committed to partnering with customers to develop these next-generation processes. The JetStep system has demonstrated excellent performance on copper pillar and TSV applications in our applications lab, and we look forward to replicating this performance using production wafers at the customer site,” stated Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. “We expect to see significant productivity and process improvement over this customer’s existing lithography systems.”

“We are pleased to ship the JetStep system to a third customer,” adds Mike Plisinski, executive vice president and chief operating officer. “This agreement demonstrates not only an increasing emphasis in the back-end on productivity and cost-of-ownership, but also the growing adoption of the JetStep system for advanced packaging lithography.”

The JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of newly-developed processes now emerging in back-end manufacturing. The JetStep W Series is intended for use with wafers or other round substrates. The JetStep S Series is for square or rectangular substrates. Both systems feature a 2X reduction stepper with a large field of view (52mm x 66mm) to improve exposure efficiency and throughput. The JetStep system is unique in its ability to handle a wide range of substrates, including glass interposers, square or rectangular substrates up to 720mm by 600mm, and standard or reconstituted wafers from 300mm to next-generation 450mm diameters; and to accommodate the warped substrates that frequently occur in these processes. An onboard, automated reticle library, holding up to 30 reticles, and adjustable field apertures combine to increase throughput and flexibility. These and other purpose-designed features, such as the large automatic magnification compensation range, provide significant benefits in advanced package applications that are unavailable from legacy lithography tools initially designed for front-end, wafer-based processes.

For more information about Rudolph’s JetStep systems, please visit www.rudolphtech.com.

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Unisem Receives Supplier Excellence Award from Allegro MicroSystems

Unisem was recently honored with the Supplier Excellence Award from its valued customer Allegro MicroSystems. Allegro is a leader   in developing, manufacturing and marketing high-performance semiconductors. This award recognizes Unisem’s outstanding service and support to Allegro.

Mr. Marc Levesque, Vice President, Supply Chain Management of Allegro noted, “During the past 18 months, Unisem Ipoh was ranked as Allegro’s number one semiconductor subcontractor supplier. Unisem’s exemplary performance to quality, delivery, cost, customer satisfaction and technology has ranked the company the highest amongst its peers and has provided Allegro with the support required to deliver similar results to our customers.  This award demonstrates the positive impact of our strong management collaboration, which is an essential recipe to assuring great success for both of our organizations.” 

Upon receipt of the award, Mr. CS Ho, COO of Unisem Ipoh commented, “We are honored that Allegro has presented us with this prestigious award. We look forward to our continued partnership with Allegro and to ensuring top quality service and support to all of our customers worldwide.”

For additional information on Unisem, please visit: www.unisemgroup.com. Follow Unisem on Twitter and on Linkedin.

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TechSearch International Analyzes Flip Chip and Wafer Level Package Growth

Shipments of flip chip and wafer level packages (WLPs) continue to increase. TechSearch International’s new study, 2015 Flip Chip and WLP: Emerging Trends and Market Forecasts, provides unparalleled analysis of what’s behind the numbers for the growth of flip chip and wafer level packages (WLPs). Highlighted are the trends in Cu pillar adoption and an explanation for its 29% CAGR. Emerging trends such as the adoption of fan-out WLPs (FO-WLPs) and the trend toward panel level packaging are analyzed in-depth. The detailed analysis is based on the company’s 27-year history of studying markets and critical technology and infrastructure issues.

Flip chip has migrated from mainly high-performance devices found in supercomputers, servers, network systems, and PCs to the explosive growth in filters and RF devices found in today’s smartphones. In units, the compound annual growth rate (CAGR) from 2014 to 2019 is approximately 15%, while in number of wafers the CAGR is only 11% because much of the growth is for small size die. The industry is experiencing a transition from solder bump to Cu pillar, just as it moved from an evaporated bump to a plated process. While the transition to copper pillar is underway, SnAg remains the Pb-free solution of choice. Details of flip chip applications, bump types, and pitch trends are based on extensive interviews and research. Flip chip assembly choices such as mass reflow and thermocompression bond are discussed and underfill options are provided. Growth in gold bumping for LCD driver ICs is included. A critical analysis of planned capacity and utilization is provided for each geographic region.

Increased demand for thinner, lighter-weight portable products continues to drive WLP growth. These packages offer a small footprint and a low-profile solution that enables ultrathin consumer products such as smartphones, tablets, and wearable electronics. A detailed analysis of WLP shipments by device type, ball count, ball pitch, and thickness is provided. The CAGR for fan-in WLPs in units from 2014 to 2019 is almost 9% for the five-year period, while the CAGR in wafers is 10%. A number of companies plan to adopt FO-WLPs and projected demand and available capacity are highlighted.

The 135-page report with full references provides forecasts for the flip chip wafer bumping market by application, device type, FCIP/FCOB split, number of wafers, and number of die. Merchant and captive capacity is included and projections by bump type and wafer size are provided. Forecasts for WLP demand in number of die, wafers and device type are provided. Bumping, wafer level packaging, substrate suppliers and contract assembly service providers are highlighted with contacts provided. A set of 56 PowerPoint slides accompanies the report.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see http//www.techsearchinc.com.

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AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is proud to be the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Leveraging its expertise manufacturing film adhesives for the semiconductor industry over the last 30 plus years, AIT offers Wafer Processing Adhesives (WPA) from 5 to 80 micron film adhesives for device wafer processing up to 450mm with and without topography. AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes.

AI Technology, Inc. (AIT)’s temporary bonding Wafer Processing Adhesives (WPA) are thermally stable to 320-330°C and the bonded compound wafers are compatible with standard WLP process equipment and for backside processing of 3D-TSV wafers. High integrity in bond strength enables easy back grinding to a thickness of 50 μm. AIT’s thermally and chemically stable polymers can withstand multiple device wafer processes, such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and extended elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum.

In comparison to traditional wax based and polyimide based temporary handling solutions, AI Technology, Inc. (AIT)’s WPA-TS 320 and WPA-TL 330 demonstrate some of the highest temperature capabilities for thin wafer processing as well as easy removal and cleaning.

Select Wafer Processing Applications:

TEMPORARY BONDING FOR WAFER THINNING AND PROCESSING OF THIN WAFERS
 Outstanding shear stress support for wet mechanical grinding and dry etching
 Unparalleled thermal stability for extended high temperature oxide deposition up to 320°C

TEMPORARY BONDING FOR THIN WAFER BUMPING AND ASSEMBLY OF THIN ICS
 Outstanding molecular stability with 0% weight loss for void free bonding at temperatures up to 330°C
 High temperature dimension stable stress-absorbing adhesive for solder bump reflow that can be separated or removed with solvent or laser assisted de-bonding

TEMPORARY BONDING FOR HIGH TOPOGRAPHY THIN WAFER PROCESSING
 Film adhesive of the same spin coating solution in any thickness, in addition to AI Technology, Inc. (AIT)’s standard 5, 10, 20, 40, 60 and 80 micron thicknesses
 Outstanding degree of planarization with vacuum lamination at a melt-flow temperature of approximately 150°C

Media Contact:
Amy Grossman, (609) 799-9388, x144. agrossman@aitechnoloy.com

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Sonoscan’s Steve Martell Wins IPC President’s Award

Steve Martell, Manager for Advanced Applications Support at Sonoscan, received the IPC President's Award during the IPC APEX EXPO® at the San Diego Convention Center on March 3.

Soon to celebrate his thirtieth year at Sonoscan, Martell was honored for his service to the electronics industry and to the IPC. His years among Sonoscan’s innovative engineers, alongside the world’s largest acoustic testing laboratory for components (SonoLab®), let him make unique contributions to component and assembly standards, technology and education.

Over the years he has brought Sonoscan’s technological expertise to a number of IPC committees, and currently is a member of nine IPC committees that focus on the standards and applications for acoustic micro imaging of MEMS devices, silicon wafers, 3D ICs, HB-LED devices, plastic chip carrier cracking, counterfeit components and other areas. He is the chairman of two of these committees.

Because he deals with applications where Sonoscan’s C-SAM® technology solves problems, Martell’s work covers the entire spectrum from the Front End environment (wafers, ingots) to Mid End (3D ICs) to Back End (electronic components) to populated printed circuit boards.

In addition to serving as the liaison with organizations concerned with standards within the electronics industry, Martell is also responsible for Sonoscan’s applications support and especially for automated in-line Acoustic Micro Imaging Systems used in manufacturing.

Sonoscan, Inc. 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847- 437-6400. Contact Bill Zuckerman x 237. Email bzuckerman@sonoscan.com; web www.sonoscan.com.

Sonoscan

Photo caption: Steve Martell (r) of Sonoscan® receives the President’s Award from John Mitchell, IPC President & CEO

 

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:: Job Openings ::

Technical Sales Engineer - YINCAE

YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices.

As our customer base and marketing efforts expand, we require an enthusiastic and talented Technical Sales Engineer to support our sales efforts and contribute towards sales and development strategies

Specific responsibilities include, but are not limited to the following:

- Search for new clients who could benefit from our products in your designated region
- Establish new, and maintain existing, long-term relationships with customers
- Persuade clients that a product or service best satisfies their needs in terms of quality, price and delivery
- Negotiate and close sales by agreeing to terms and conditions
- Offer after-sales support services
- Analyze costs and sales
- Meet regular sales targets and coordinate sales projects
- Coordinate sales projects
- Support marketing by attending trade shows, conferences and other marketing events
- Make technical presentations and demonstrate how a product will meet client needs
- Provide pre-sales technical assistance and product education
- Liaise with other members of the sales team and other technical experts
- Provide training and produce support materials for other members of the sales team
- Develop long-term relationships with clients through managing and interpreting their requirements
- Prepare weekly and monthly reports for head office

Qualifications:
- Must possess a four year degree in electronic engineering or technical related field.
- Minimum 2 year experience in SMT industry

This full time position includes base salary, high commission and benefits

More Information?
Mary Liu
YINCAE Advanced Materials, LLC
http://www.yincae.com
Tel: (518) 452-2880 Fax: (518) 452-2779
maryl@yincae.com

Inside Sales Representative in Southern California
Position Overview:
responsible for achieving sales and revenue goals by developing, building, and strengthening long-term relationships with customers, independent sales reps, distributors and partners

Duties and Responsibilities:

  • Serve as internal sales support for the sales team to achieve or exceed assigned sales quotas and goals
  • Collaboratively works with sales team members to develop and maximize opportunities, and generate sales activities with independent sales reps, distribution network
  • Partner effectively with FAE, outside sales reps to drive territory coverage, and maintain positive distributor relationships.
  • Coordinate marketing campaigns such as trade shows, online and offline promotions, seminar and technical trainings, and travel for marketing and sales events and customer visits.
  • Keeps management informed by submitting activity and results reports.
  • Monitors competition by gathering current marketplace information on pricing, products, new products, delivery schedules, merchandising techniques, etc.
  • Performs other duties as assigned by management.

Skills/Qualifications:

  • Bachelor’s degree with four years college or university
  • 3-5 years professional sales/telemarketing experience preferred
  • Strong presentation, communication, organization, multitasking and time management skills, sales skills including prospecting, negotiation and closing skills
  • Demonstrated record of achievement in prior sales related position preferred
  • Able to travel to customers/team sites as required

 

CONTACT:
Ray Petit, Pacific Rim Engineering
(949)285-6383
ray@pacificrimeng.com | www.pacificrimeng.com

 

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our online JOBS Board ( http://jobs.imaps.org ) at no cost - part of corporate membership!

 

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:: Issue 172 ::
April 1, 2015

Metallix

Oneida Research Services