Heraeus TFD


:: Corporate Member News ::

:: Palomar Technologies Announces the Latest in Wedge Bonding Technology: The 9000 Wedge Bonder (full story)

:: Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES (full story)

:: Brewer Science Commends Congress for Passing Landmark Pro-Manufacturing, Pro-Innovation Legislation (full story)

:: Celebrating 60 years of Nordson innovation (full story)

:: News from Master Bond (full story)

:: Epoxy Technology Inc. Announces a Distributor Change in Europe in France, Algeria , Morocco and Tunisia to FT Polymer SAS (full story)

:: Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JDEC TO-Style Window Lids for Optoelectronic Circuits (full story)

:: Sonoscan Automates Inspection of IGBT Modules (full story)

:: TJ Green Announces a Full Day “Intro to Micro” Training Class (PDC) at Device Packaging Symposium on March 16th in Phoenix, AZ (full story)

:: SOURIAU PA&E Specializes in the Custom Design and Manufacture of Hermetic Connectors and Electronic Packaging (full story)

:: DuPont Microcircuit Materials Introduces Pure Copper Conductive Ink (full story)

:: EV Group Establishes Nanoimprint Lithography Competence Center for Photonic Applications (full story)

:: Unisem Receives 2014 Supplier Award from United Monolithic Semiconductors (full story)

:: Job Openings ::


Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Canon USA
Specialty Coating Systems

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Palomar Technologies Announces the Latest in Wedge Bonding Technology: The 9000 Wedge Bonder

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of the 9000 Wedge Bonder. The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements: large work area, inline factory automation, advanced user control, bond data miner, high-speed wire bonding, wire feed clamp versatility, and high-precision. Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.
Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implemented on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages
The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include providing various loop form functions, highly regulated constant wire length as well as loop height, individual loop shapes, and a loop length range from 70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire
Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.
Media Contact
Claudia Haskin
Marketing Communications Manager
Palomar Technologies, Inc. | +1 760-931-3681

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Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES

Amkor Technology, Inc. has announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.  The agreement provides for the transfer of Amkor’s copper pillar wafer bump technology to GLOBALFOUNDRIES and a license under Amkor’s intellectual property to enable GLOBALFOUNDRIES to bump wafers based on this technology.   

“Technology leadership and innovation are fundamental to Amkor’s success.  Since its introduction in 2010, our proprietary copper pillar wafer bump technology has been widely adopted for use in high volume production in many applications, including the smartphone and tablet markets,” said Dr. Choon Heung Lee, Amkor’s executive vice president and chief technology officer.  “We are pleased to license our copper pillar wafer bump technology to GLOBALFOUNDRIES, a world class, leading edge foundry.”

“GLOBALFOUNDRIES is committed to providing customers of our leading edge fab technology with fully integrated solutions.  Silicon to package integration is a key component of these solutions and we are pleased to have partnered with Amkor, a technology leader for outsourced semiconductor packaging and test services, to expand our wafer bumping services to include capabilities that can further extend our copper pillar bump manufacturing,” said David McCann, Vice President of Packaging R&D at GLOBALFOUNDRIES.  “Semiconductor device scaling drives higher density off chip interconnect requirements.  Copper pillar bumping is a critical part of bringing leading edge semiconductor devices to market and this capability enhances our growing open ecosystem of manufacturing services and partners.”

Amkor’s copper pillar wafer bump technology enables low profile and small area packaging, which is required for the mobile device market.  Copper pillar technology supports 3D fine pitch memory interfaces and is utilized in 2.5D packaging where fine pitch multi-die interconnects can reduce system level costs and shorten time-to-market as compared to SoC platforms.  In addition, Amkor’s copper pillar wafer bump technology supports substantial die-to-die bandwidth between memory and logic devices, greatly reduces power consumption in high-performance products, and enables high speed interfaces when applied to analog and RF applications.

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Brewer Science Commends Congress for Passing Landmark Pro-Manufacturing, Pro-Innovation Legislation

Dr. Brewer: ‘Blunt, Brown, Reed, and Kennedy are Champions of American Manufacturing and Innovation’

The doors to new innovation and opportunities for American manufacturing were flung wide open today with final passage of a pro-manufacturing bill strongly supported by Brewer Science and its president and founder, Dr. Terry Brewer.  The legislation would establish a Network for Manufacturing Innovation (NMI) to position the United States as the global leader in advanced manufacturing.

Dr. Brewer, who testified before the U.S. Senate Commerce Committee in support of the bipartisan Revitalize American Manufacturing and Innovation Act, lauded its passage and praised the bill's sponsors, U.S. Senator Roy Blunt (R-MO), U.S. Senator Sherrod Brown (D-OH), U.S. Rep. Tom Reed (R-NY 23), and U.S. Rep. Joe Kennedy (D-MA 4), calling them “champions of American manufacturing and innovation.”

"This landmark legislation will help ensure the United States remains a global leader in advanced manufacturing and innovation,” said Dr. Brewer.  “It will provide a much-needed manufacturing network that will help the private sector successfully develop emerging technologies, which will lead to new products and new advanced manufacturing jobs.  As one of the nation’s leading advanced manufacturers, we are overjoyed by the passage of this legislation, and we commend the leadership of its sponsors."

Brewer Science helped lead a nationwide coalition in conjunction with several manufacturing organizations, including Semiconductor Equipment and Materials International (SEMI), to support the legislation.

Dr. Brewer said Senator Roy Blunt deserves special praise for his leadership in advancing the bill across the finish line with his leadership position in the U.S. Senate and his service on both the Commerce Committee and Appropriations Committee.  The legislation was included as part of an omnibus spending bill enacted by both chambers of Congress.  The bill now goes to President Obama for his signature.

The Revitalize American Manufacturing and Innovation Act will help accelerate manufacturing innovation in advanced technology areas by leveraging resources to bridge the gap between basic research performed at U.S. universities and research laboratories and product commercialization conducted by U.S. manufacturers. The initiative will establish Institutes for Manufacturing Innovation (IMIs) and link them to form a National Network for Manufacturing Innovation (NNMI). This network of hubs will lead American efforts in developing and producing the next generation of manufactured products.

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Celebrating 60 years of Nordson innovation

On October 11, 1954, Walter Nord and sons Eric and Evan incorporated Nordson as a stand-alone company, and in October, we celebrated the 60th anniversary of that occasion.

During these 60 years, innovation has occupied a prominent place in the company's philosophy. Nordson's founders were engineers who built the company on winning products and patented technologies, but their belief in new and better ways of doing things extended beyond that. They encouraged innovative approaches in every aspect of their company – from globalization and manufacturing to customer service, philanthropy, and employee development. The founders of the businesses acquired by Nordson over the years have shared the same commitment to innovation, adding to a rich history and helping build Nordson into the market-leading company it is today.

In 1996, ASYMTEK was one such business acquired by Nordson. Founded in 1983, ASYMTEK was designing, manufacturing, and selling benchtop automation and dispensers. Nordson recognized how ASYMTEK presented sophisticated automation and strength in the electronics industry while Nordson offered a well-established global sales and service network. ASYMTEK is now recognized as a world leader in fluid dispensing, jetting, and conformal coating technologies who offers advanced solutions for precision manufacturing processes, including semiconductor packaging, printed circuit board assembly, precision product assembly, and medical and biotechnical device assembly. For over 30 years, they have been leading through the introduction of innovative products, applications expertise, and award-winning global support.



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News from Master Bond

NASA Low Outgassing Approved Master Bond’s One Component Epoxy Features a Glass Transition Temperature of 225°C

Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation applications. This low viscosity system has very low exotherm upon curing and can be cast in sections up to and beyond a ½ inch in thickness. As a single component system, it offers convenient handling, doesn’t require mixing and has an unlimited working life at room temperature.

EP17HT-LO is a high performance material with a high tensile, compressive and lap shear strengths of 10,000 psi, 20,000 psi and 3,200 psi at room temperature, respectively. This epoxy bonds well to an array of substrates including metals, composites, ceramics and plastics. Shrinkage upon cure is exceptionally low. EP17HT-LO is 100% reactive and contains no solvents or diluents.

This formulation resists chemicals such as acids, bases, fuels, salts, oils and many solvents. It also is a competent electrical insulator and retains these properties even when exposed to elevated temperatures. The compound passes NASA low outgassing tests making it well suited for applications in the aerospace, opto-electronic, oil/chemical processing and specialty OEM industries. This tan colored, no mix epoxy system is available for use in a variety of sizes ranging from ½ pint to 5 gallon containers.

Master Bond High Temperature Resistant Adhesives

Master Bond EP17HT-LO is a NASA low outgassing system for bonding, sealing, coating and potting that features electrical insulation properties, high strength, chemical resistance and a high glass transition temperature. Read more at or contact Tech Support.
Phone: +1-201-343-8983
Fax: +1-201-343-2132

Low Viscosity UV Curable System Has Superior Non-Yellowing Properties

Well suited for bonding dissimilar substrates, Master Bond UV15X-2 is a one part UV curable adhesive, sealant, coating and potting compound. This versatile system combines a high performance physical profile with very low shrinkage upon curing. It is widely employed in fiber-optic, optical, electronic, microelectronic, semiconductor and laser applications.

With a tensile strength of 6,000-7,000 psi, UV15X-2 bonds well to a wide variety of substrates including glass, metals, ceramics and many plastics, especially polycarbonates and acrylics. It features impressive light transmission properties and has a refractive index of 1.51. This low viscosity system is not oxygen inhibited and cures readily in 10-30 seconds when exposed to a UV light source. The rate of cure depends upon the compound’s distance from the light source, the thickness of the section and the intensity of the light source. No solvents or vapors are released during the curing process. UV15X-2 can also be readily cured in sections up to ¼ inch thick.

Serviceable over the wide range of -80°F to +300°F, UV15X-2 is able to withstand rigorous thermal cycling. It resists many chemicals, such as water, oils, fuels, acids and bases. Other notable characteristics include reliable electrical insulation values, dimensional stability and abrasion resistance. UV15X-2 is available in a variety of standard packaging options from ½ pints to 5 gallon units. It can also be purchased in syringe applicators.

Master Bond Optically Clear Adhesives

Master Bond UV15X-2 is an optically clear UV system for bonding, sealing, coating and potting applications that require non-yellowing properties, low shrinkage upon cure and excellent physical strength profile. Read more at or contact Tech Support.
Phone: +1-201-343-8983
Fax: +1-201-343-2132


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Epoxy Technology Inc. Announces a Distributor Change in Europe in France, Algeria , Morocco and Tunisia to FT Polymer SAS

Epoxy Technology Inc, a leading manufacturer of high performance specialty epoxy, UV and Hybrid adhesives for 48 years, announces a change in our distributor covering France, Algeria, Morocco and Tunisia from Techni Industries France to   FT Polymer SAS (

EPO-TEK® product or service requests in these locations should now be directed to FT Polymer SAS   at:, Tel: +33 1 39 13 20 82, Fax: +33 1 39 13 33 79.

We are especially pleased to announce that Mr. Stéphane Fournier will be leading FT Polymer as General Manager. Mr. Fournier has extensive adhesive knowledge and specialized expertise with over 25 years of experience assisting customers in this region.

FT Polymer is part of a well-established group, RG Distribution, along with Gentec Benelux; who also represent EPO-TEK products. Epoxy Technology values our customers in France and we are happy to add FT Polymer to our European distributor network.  We encourage you to work directly through them for all of your specialty adhesive needs.

For more information on any of Epoxy Technology products or our listing of authorized distributors, please visit our website at: or contact us directly at +1 978-667-3805.

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Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JDEC TO-Style Window Lids for Optoelectronic Circuits

Remtec Inc.,( has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard  SMT leadless packages for electro optical circuits matching standard TO-type window lids.  These new packages address the long-standing demands of the photonics industry for an SMT packaging solution as a viable alternative to standard TO-type packages. 

Now standard economical surface mounted packages can be produced for a wide range of circuits and I/O configurations fully compatible with most of JEDEC TO-style window caps such as TO-8, TO-46 and beyond at operating frequencies up to 10 GHz and higher.  This approach reduces the total design cycle, minimizes tooling and engineering costs and reduces end user assembly costs. Remtec’s ability to use standard TO-style lids on a surface-mountable substrate eliminates the need for through-hole mounting of the device on the PCB.  More importantly, the device assembly can be done in multiple-up panel format resulting in additional cost savings. 

Remtec’s new SMT packages for optoelectronic circuits are based on extensive experience in design and manufacturing of various products for RF, photonics and other industries.  Remtec’s expertise in the design and fabrication of RF substrates and packages complements its capability in the fabrication of substrates and submounts for laser and photo diodes, LEDs, sensors and detectors. This experience extends to a broad use of its PCTF® technology for surface mounted leadless substrates and packages with hermetic, metal plugged vias and castellations (wraparounds) on alumina, aluminum nitride and beryllium oxide.

New SMT leadless ceramic packages with standard TO-style window lids permit Remtec to expand product offerings to a number of applications such as APD preamplifiers, LED sensors for non-invasive medical testing, VCSEL laser diodes, optical data transfer systems, analytical instrumentation and other circuits.
For more information, please visit or stop at our booth 4227 at SPIE Photonics West, February 10-12, 2015.

Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA.  Remtec provides custom and semi-custom packaging solutions for RF/MW products, DC power electronics, optoelectronics and other high density circuit applications   in commercial, industrial and military industries.

Editorial Contact:  Dean M. Wood   401-225-6789



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Sonoscan Automates Inspection of IGBT Modules

Power IGBT modules having voids and other internal structural defects are a problem for makers and users of the modules. These defects can block heat dissipation and cause electrical failure.

Sonoscan has now developed and is shipping a fully automated Acoustic Micro Imaging system that images and analyzes these module defects.

The C-SAM® model DF2400Z incorporates Sonoscan’s inverted transducer, placed beneath the module to prevent water from reaching module circuitry. There is no need for human attention. Once your recipe for scanning has been defined, the factory automation interface controls the operation step by step:

  • a conveyor loads two IGBT modules onto the two (for high throughput) system stages.
  • the two ultrasonic transducers, one for each stage, raster-scan each module. Ultrasound is pulsed into the module and echo signals are received from gap-type defects at the depths of interest.
  • at the conclusion of scanning, accepts and rejects are stacked in separate locations.

The accept/reject criteria are written by the user of the system. Early users of the system are chiefly searching for voids, delaminations and non-bonds in the solder layer, because these defects are frequent causes of failure. But all depths within the module can be imaged separately in a single scan, if desired, with no change in throughput speed.

Because imaging is typically carried out before encapsulation of the modules, the acoustic images reveal what type of rework is needed on rejects. In addition to


Acoustic image gated on IGBT module’s solder layer reveals
numerous heat-blocking voids (red)

Sonoscan, Inc.
2149 E. Pratt Blvd., Elk Grove Village, IL 60007
Phone 847-437-6400
Contact Bill Zuckerman x 237
Email; web

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TJ Green Announces a Full Day “Intro to Micro” Training Class (PDC) at Device Packaging Symposium on March 16th in Phoenix, AZ

This overview course is intended for those unfamiliar with microelectronics packaging technology. People in sales, purchasing, program management, new engineers, managers, equipment/material suppliers, people new to this industry or anyone looking to get a broad industry overview and review of the industry drivers, history and future trends are welcome to attend. This is an easy-to-follow class with lots of pass around samples and short video clips that puts everything in perspective and will allow you to understand where you sit in the microelectronics packaging food chain. Lots of time left for questions. To get more info or register, go through the IMAPS website at Device Packaging Symposium.

Additional Training Courses Offered by TJ Green Later This Year:

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (4 Days)
Bethlehem, PA
March 3-6, 2015

This four-day process certification course is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy-to-understand format.
Registration Form


Pre Cap Visual Inspection per MIL-STD-883 (TM 2017) (1 Day)
Bethlehem, PA
April 13, 2015

Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. “Hands-on” training at the microscopes will supplement the classroom lecture.
The course is intended for quality assurance personnel, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.
Registration Form


Wire Bonding Certification (3 Days)
Bethlehem, PA
April 14-16, 2015

This is an intense three-day course that combines classroom activities and "hands-on" skills at the wire bonder. Students have to demonstrate a basic level of wire bonding proficiency and pass a written test at the end. Older model manual ball and wedge bonders are used to teach the basic skills of wire bonding and associated trouble shooting. In addition, high/ low power microscopes and wire pull test equipment allows the student to see and fell what makes for a good bond. Visual inspection and defect recognition are in accordance with MIL-STD-883 TM 2017 and TM 2010.
Registration Form


Packaging and Testing of Implanted Medical Devices (1 Day)
Bethlehem, PA
April 17, 2015

Implanted medical products such as cochlear implants and pacemakers along with an entire new generation of MEMS based sensors and drug delivery systems need to be packaged  in such a way as to survive the hardships of the body and perform reliably for five or ten years.
This course is a top to bottom review of both hermetic and non-hermetic packaging approaches for medical implants and is intended for process engineers, designers, quality engineers, and managers responsible for the reliability of the final product in vivo.
Registration Form


Microwave Packaging Technology (3 Days)
Boxborough, MA
May 6-8, 2015

This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and microwave packaging technology.
This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material tradeoffs, and process selection are all covered in detail. Microwave Design for Manufacturability DFM concepts are introduced and reinforced throughout the course.
Registration Form


Additional public training courses are scheduled throughout the year and are also available in-plant. Check the TJ Green LLC website for up-to-date course schedules and locations.

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SOURIAU PA&E Specializes in the Custom Design and Manufacture of Hermetic Connectors and Electronic Packaging

If you would like to learn more about the products featured on the cover of the last issue of Advancing Microelectronics, contact SOURIAU PA&E. The company specializes in specializes in the custom design and manufacture of hermetic connectors and electronic packaging. Our technology is proven in the harshest environments – from deep beneath the earth’s surface to deep space and even within the human body. We work directly with engineers to custom design and manufacture electronic packaging and connector products that meet the exacting standards for the reliability satellite, missile, fighter aircraft, under-sea and other mission-critical systems require. SOURIAU PA&E utilizes unique materials in its manufacturing processes and offers a range of production capabilities – machining, plating, vacuum brazing, laser welding, and more – all at a single location. This integrated manufacturing approach can reduce complexity and risk on your next project.

Advancing Micro

Rick Kalkowski - Marketing Administrator
Souriau - PA&E
Wenatchee, WA 98801
Tel.: 509-664-8000 Fax: 509-664-6868 |


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DuPont Microcircuit Materials Introduces Pure Copper Conductive Ink

Offers More Cost-effective Design Flexibility for Today’s Printed Electronics

DuPont Microcircuit Materials (DuPont) has introduced its first pure copper conductive ink for photonic curing, DuPont™ PE510 copper conductor.  DuPont™ PE510 is a cost-effective alternative to silver conductor inks for a variety of possible applications and is the newest product in a suite of conductive ink materials specifically tailored for use in certain types of antenna, membrane touch switch (MTS), radio-frequency identification (RFID), and consumer electronic applications. 

“DuPont tailored this new pure copper conductive ink to allow our customers greater flexibility in design – it enables conductivity on various types of substrates, while better managing costs,” said Steven Willoughby, marketing manager, DuPont Microcircuit Materials.  “This combination of strengths can unfold some unique opportunities in the printed electronics market.”

DuPont™ PE510 copper conductor provides a means to rapidly process low-lamp-voltage copper metallization circuit designs on a wide range of plastic substrates including FR-4, PVC, polyimide films such as DuPont™ Kapton®, and PET.  It can be processed using high-speed photonic curing equipment and provides a long lamp life as well as superior adhesion and processing.  Additional benefits include excellent printed line and space resolution.  DuPont™ PE510 can be used for a variety of consumer electronic applications and offers manufacturers design flexibility due to the wide range of substrates with which it is compatible.

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EV Group Establishes Nanoimprint Lithography Competence Center for Photonic Applications

Dedicated nanoimprint lithography (NIL) solutions to enable rapid development of NILPhotonics™ applications, feasibility studies and pilot-line production services for faster time to market

EV Group has announced that it has established the NILPhotonics™ Competence Center, which is designed to assist customers in leveraging EVG's suite of nanoimprint lithography (NIL) solutions to enable new and enhanced products and applications in the field of photonics. These include light emitting diodes (LEDs) and photovoltaic (PV) cells, where NIL-enabled photonic structures can improve light extraction and light capturing, respectively, as well as laser diodes, where photonic structures enable the tailoring of device characteristics to improve performance. The NILPhotonics Competence Center includes dedicated, global process teams, pilot-line production facilities and services at its state-of-the-art cleanrooms at EVG's headquarters in Austria as well as its subsidiaries in North America and Japan.

EV Group's NILPhotonics(TM) Competence Center assists customers in leveraging EVG's nanoimprint lithography (NIL) solutions to enable new photonic products and applications. Shown here is a six-inch full-area nanoimprinted wafer processed by EVG NIL solutions. This technology enables almost infinite design freedom to create various kinds of photonic structures."Nanoimprint lithography” is an enabling technology for the design and manufacture of all kinds of photonic structures, which can significantly shorten time to market and lower cost of production compared to conventional technologies, such as electron-beam writing and stepper systems for optical lithography," stated Markus Wimplinger, corporate technology development and IP director at EV Group. "For example, compared with conventional lithography, our full-wafer nanoimprinting technology can pattern true three-dimensional structures in the sub-micron to nano-range as well as features as small as 20 nm, which opens up a range of new photonic applications. With our NILPhotonics Competence Center, we're not just providing our customers with the most advanced NIL systems; we're also working closely with them during product development to help them determine how best to optimize their product designs and processes to take advantage of the resolution and cost-of-ownership benefits that NIL brings."

The new NILPhotonics Competence Center builds on more than 15 years of NIL experience at EVG with the largest installed base of NIL systems worldwide. EVG's NIL equipment portfolio includes the recently introduced EVG7200 UV-NIL system, which supports EVG's next-generation SmartNIL™ large-area soft NIL process for high-volume manufacturing. The EVG7200 with SmartNIL provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches. More information can be found at:


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Unisem Receives 2014 Supplier Award from United Monolithic Semiconductors

Kuala Lumpur,  Unisem was recently honored with the 2014 Supplier Award from its valued customer United Monolithic Semiconductors (UMS).

UMS designs, produces and markets leading edge RF, microwave and millimeter wave components and integrated circuits (ICs) for the Telecom, Space, Defence, Automotive and ISM Industries. This award recognizes Unisem’s outstanding service and support to UMS.

Mr. Jerome Krieg, COO of UMS presented the award to Mr. CS Ho, COO of Unisem Ipoh.  Upon receipt of the award, Mr. Ho commented, “We are honored to receive this prestigious award from UMS. We look forward to continuing to provide best in class service to UMS and all of our customers worldwide.”


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:: Job Openings ::

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our online JOBS Board ( ) at no cost - part of corporate membership!


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:: Issue 168 ::
January 15, 2015


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