NEWS | JOBS | FAST LINKS

KESTER

Heraeus TFD

:: Corporate Member News ::

:: You are cordially invited to a complementary Workshop on Friday, July 10 at SHENMAO in San Jose (full story)

:: Anaren Selects David E. Kopf as New President of Its Space & Defense Group (full story)

:: Master Bond’s One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests (full story)

:: Indium Corporation's Patented BiAgX®: A Drop-In Replacement for High-Pb Solders (full story)

:: Nordson ASYMTEK Introduces the Latest Edition of Fluidmove® Software for Dispensing Systems (full story)

:: News from Palomar (full story)

:: TJ Green Announces Certification Courses & Webinars (full story)

 

MPP

:: Job Openings ::

:: Sales Engineer - AdTech Ceramics, Chattanooga, TN (full story)

:: Technical Sales Engineer - YINCAE (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Kyocera

Shenmao America, Inc.

SCS

Kulicke & Soffa

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


:: You are cordially invited to a complementary Workshop on Friday, July 10 at SHENMAO in San Jose

You are cordially invited to a complementary Workshop on Friday, July 10 from 2 PM to 4 PM at 2156 Ringwood Ave., San Jose, CA 95131 in celebration of our facility, to meet with our SHENMAO Headquarters R&D Engineers and to introduce new products. Hors d’oeuvres and Refreshments will be served.

The topics of the Workshop are Head-on-Pillow issues and ask us anything about soldering, we will answer any question about SMT, wave, or other soldering processes.

Head-on-Pillow (HoP) is one of the common defects encountered during soldering of BGA components. The main Root causes for HoP can be categorized into material issue and process issue. The SHENMAO research represents a solder paste flux re-design which enables a more robust wettability of all elements in the solder joint and eliminate the poor-wetting solder defects. Aiming to eradicate the HoP manufacturing defects, the new flux design focuses on the improvement of basic flux characteristics in terms of activity, fluidity, and thermal resistance.

SHENMAO America produces SMT Solder Paste at this facility, markets Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.

Please RSVP to:

https://docs.google.com/forms/d/1_IIXIZ2j9WFanSpnIJsyptEiyua16Y0GvvvJ881bHEY/viewform

Or
Watson Tseng, General Manager at: watson_tseng@shenmao.us or 408-943-1755 www.shenmao.com Map: http://mapq.st/1IjeBMp

Looking forward to seeing you at the workshop!
Watson Tseng, General Manager, SHENMAO America, Inc.

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Anaren Selects David E. Kopf as New President of Its Space & Defense Group

Anaren, Inc has, announced that it has named David E. Kopf as the new President of the company’s Space & Defense Group, effective June 29, 2015.

Larry Sala, Anaren President and CEO stated, “David’s extensive business development and leadership experience with growing technology-based businesses in the space and defense markets will enhance the capabilities of our Space & Defense Group to expand our customer base, accelerate revenue growth and ultimately increase value for our shareholders. We are very excited to have David join our team and look forward to his significant contribution to the continuing success of Anaren.”

Most recently, Kopf was Vice President of Engineering and Operations at Astronics Aerosat, based in Amherst, NH. Prior to that, he held executive, business development and engineering management posts at Cobham Defense Electronics, Tyco Electronics M/A-Com, and Sanders (a Lockheed Martin Company) and BAE. Kopf earned his MBA at New Hampshire College, his BSEE (with a minor in economics) from Case Western Reserve University, and his MSEE in Microwave Engineering from the University of Massachusetts.

 

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Master Bond’s One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests

Specially formulated for medical device applications, Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for high performance bonding, sealing and coating. This system meets both USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilization techniques such as gamma radiation, EtO and some types of liquid sterilants.

This one part system has a paste viscosity and non-corrosive cure with a tack-free time of 15-30 minutes at room temperature. Similar to other single component silicones, MasterSil 912Med’s cures depended upon the humidity level. The higher the humidity, the faster the cure and thinner sections cure more quickly than thicker ones. It is translucent in color and is serviceable over the wide temperature range of -75°F to +400°F.

MasterSil 912Med has a tensile strength of 700-1,100 psi and offers superior adhesion to many materials, including metals, composites, ceramics, glass, rubbers, plastics and other silicone substrates. Featuring an elongation of 250-350%, this flexible system can withstand highly rigorous thermal cycling as well as thermal and mechanical shock. It is a reliable electrical insulator with a volume resistivity of >1015 ohm-cm.

MasterSil 912Med is available in 80 gram tubes and has a shelf life of 6 months.

Master Bond Biocompatible Adhesives

MasterSil 912Med is high temperature resistant, flexible one part silicone that complies with USP Class VI and ISO 10993-5 requirements. This sterilization resistant formulation also features impressive electrical properties. Read more about Master Bond’s medical grade adhesives at :
http://www.masterbond.com/properties/biocompatible-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

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Indium Corporation's Patented BiAgX®: A Drop-In Replacement for High-Pb Solders

Indium Corporation’s newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.

BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.

BiAgX survives junction temperatures and high-temperature environments in excess of 175 °C, with minimal degradation of the mechanical structure and joint strength.

Environmental and legislative concerns are driving consumers away from products using solders that contain lead, including solders used in die-attach applications for analog semiconductor assembly. Customers have proven that BiAgX addresses these applications in a Pb-Free configuration.

“Our U.S. Patent has been approved. This and the other global patent applications ensure that BiAgX is the only low-cost solder solution for those ODM, OSAT, and other electronics assembly customers looking to replace high-lead containing solders,” said Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials.

BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. It is both Pb-free and Sb-free (antimony-free) and does not contain costly specialty materials, such as nanosilver or sintering aids.

BiAgX reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.

For more information about BiAgX, including technical papers and other technical information, visit www.indium.com/BiAgX.

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Nordson ASYMTEK Introduces the Latest Edition of Fluidmove® Software for Dispensing Systems

Nordson ASYMTEK releases the newest version of Fluidmove software, FM 6.1.3, with a number of product enhancements that increase functionality and make programming easier while offering the same flexibility and easy-to-use interface. Enhancements include new fiducial finding capabilities, Iterative Dummy Dot dispensing, and updates for Nordson ASYMTEK's products.

One fiducial improvement is the Shape Finder feature, which works by identifying transition lines within the field of view (covered in the last newsletter’s Applications Corner). FM 6.1.3 also offers support for Backup Fiducials, Fiducial Pattern Blocks, and Fiducial Tiering features. Backup Fiducials creates a chain of fiducials to be referenced when a particular fiducial cannot be found as a result of contrast changes. This feature accommodates production environments that use multiple substrate suppliers with varying fiducials and reflectivity, and minimizes downtime and operator intervention. With Fiducial Pattern Blocks, users can specify a set of pattern commands to run with a fiducial or set of fiducials that is executed only if the appropriate fiducial(s) are found. With this, a single recipe file can be written to cover multiple parts or patterns that may be used in production and allow for easier program portability between systems on a production floor. Lastly, Fiducial Tiering can limit operator dependence and increase uptime by allowing users to specify different handling/actions based upon resulting quality scores from a fiducial find.

Beyond vision enhancements, new features in FM 6.1.3 include Iterative Dummy Dot dispensing and improvements to Auto Dual Simultaneous (ADS). Iterative Dummy Dot dispensing allows users to establish a target location for dispensing one or more dummy dots prior to a production dispense to ensure consistent dots from beginning to end, especially with auger valves. The iterative routine automatically adjusts the dummy dot position within the specified dispense area to allow multiple dummy dots to be produced during a long production run without requiring operator intervention, and avoiding contamination of parts or the needle tip. With ADS, the system now allows multiple pattern adjustments rather than a single global adjustment based upon the fiducials used to specify device orientation. Additionally, the system is now able to account for skipping devices for Valve 2.

Most New Nordson ASYMTEK systems will begin shipping with FM 6.1.3; however, the software is also available for upgrades on existing Nordson ASYMTEK systems. Please contact your Nordson ASYMTEK sales representative if you are interested, or if you would like more information, please contact us at info@nordsonasymtek.com

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News from Palomar

The Frequently Asked Questions Mini-Series: 8000i Wire Bonder Part One

This is the second blog of the Frequently Asked Questions mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. This week we are discussing the 8000i Wire Bonder. We have split the frequently asked questions for the 8000i into two blogs, since there are so many questions. Check back next week for part two.

Read more: http://www.palomartechnologies.com/blog/the-frequently-asked-questions-mini-series-8000i-wire-bonder-part-one

The Frequently Asked Questions Mini-Series: 8000i Wire Bonder Part Two

This is the second part of the 8000i Wire Bonder Frequently Asked Questions and the third blog in the mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. Next week we will cover the 9000 Wedge Bonder. This is the second part of the 8000i Wire Bonder Frequently Asked Questions and the third blog in the mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. Next week we will cover the 9000 Wedge Bonder.

Read more: http://www.palomartechnologies.com/blog/the-frequently-asked-questions-mini-series-8000i-wire-bonder-part-two

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TJ Green Announces Certification Courses & Webinars

Wire Bonding Certification (3 Days) 
Bethlehem, PA     August 25-27, 2015      OR        Anaheim, CA     December 2-4, 2015
This is an intense three-day course that combines classroom activities and "hands-on" skills at the wire bonder. Students have to demonstrate a basic level of wire bonding proficiency and pass a written test at the end. Older model manual ball and wedge bonders are used to teach the basic skills of wire bonding and associated trouble shooting. In addition, high/ low power microscopes and wire pull test equipment allows the student to see and fell what makes for a good bond. Visual inspection and defect recognition are in accordance with MIL-STD-883 TM 2017 and TM 2010.
Registration Form

Process Certification And Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules 
September 15-18, 2015
Pasadena, CA

This process certification is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy to understand format.
Registration Form

Short on time? Learn online.....
www.Microelectronics-Webinars.com

'The future of online education, on demand webinars'
Check out the free sample webinar to get a feel for the online training experience.

30-Day view period. It's cost effective and convenient.

• Die Bond Wirebond...Back To Basics ($249)
• Introduction to Microelectronics Packaging ($199)
• Visual Inspection of Microelectronic Assemblies ($199)
• Hybrid Design For Manufacturability (DFM) ($149)
• Hermeticity Testing For Military & Medical Microcircuits ($249)
• Near-Hermetic Packaging For Military And Medical Devices ($149)
• Semiconductor Packaging Training & Certification Program
o 10 Training Modules - almost 15 hrs of training materials.

Additional public training courses are scheduled throughout the year and are also available in-plant. Check the TJ Green LLC website for up-to-date course schedules and locations.

 

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:: Job Openings ::

Sales Engineer - AdTech Ceramics, Chattanooga, TN

Job Description
AdTech Ceramics is a leading manufacturer of custom ceramic products and is currently recruiting for a Sales Application Engineer to complement the existing sales infrastructure in Chattanooga, TN.

This position requires a BS in engineering, preferably in the materials or mechanical discipline with a preference of two years of Technical Sales and Marketing experience, although entry level may be considered.

The ideal candidate will be an innovative team oriented individual skilled in working with customers and product managers on the development, planning and manufacturing of custom products.

Fundamental knowledge of quality systems, mechanical drawings and general manufacturing as well as exceptional oral, written and time management skills is required. Key fundamentals include excellent communication and presentation skills, interpersonal presence, organization, attention to detail, critical thinking and reasoning skills.

Domestic and international travel as required to support accounts.

Job Requirements
* BS in Materials or Mechanical Engineering preferred with a minimum of two years experience in Technical Sales, although entry level may be considered
* Well developed sales skills including presentation, negotiation, follow-up and closure activities
* Marketing & market planning knowledge
* Critical thinking and inductive reasoning skills
* Very high oral and written expression skills
* High math skills
* Knowledge of the principals and methods of promoting and selling products in niche markets
* Knowledgeable of mechanical drawings and manufacturing processes
* Time management skills
* Ability to travel

EOE/AA/M/F/Vet/Disability

Job Snapshot
Employment Type Full-Time
Job Type Sales Engineer
Education 4 Year Degree
Relocation Yes
Industry Manufacturing, Electronics
Required Travel +/- 25%

CONTACT: Doug Brown - Douglas.Brown@adtechceramics.com

Technical Sales Engineer - YINCAE

YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices.

As our customer base and marketing efforts expand, we require an enthusiastic and talented Technical Sales Engineer to support our sales efforts and contribute towards sales and development strategies

Specific responsibilities include, but are not limited to the following:

- Search for new clients who could benefit from our products in your designated region
- Establish new, and maintain existing, long-term relationships with customers
- Persuade clients that a product or service best satisfies their needs in terms of quality, price and delivery
- Negotiate and close sales by agreeing to terms and conditions
- Offer after-sales support services
- Analyze costs and sales
- Meet regular sales targets and coordinate sales projects
- Coordinate sales projects
- Support marketing by attending trade shows, conferences and other marketing events
- Make technical presentations and demonstrate how a product will meet client needs
- Provide pre-sales technical assistance and product education
- Liaise with other members of the sales team and other technical experts
- Provide training and produce support materials for other members of the sales team
- Develop long-term relationships with clients through managing and interpreting their requirements
- Prepare weekly and monthly reports for head office

Qualifications:
- Must possess a four year degree in electronic engineering or technical related field.
- Minimum 2 year experience in SMT industry

This full time position includes base salary, high commission and benefits

More Information?
Mary Liu
YINCAE Advanced Materials, LLC
http://www.yincae.com
Tel: (518) 452-2880 Fax: (518) 452-2779
maryl@yincae.com

 

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our online JOBS Board ( http://jobs.imaps.org ) at no cost - part of corporate membership!

 

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:: Issue 176 ::
July 8, 2015

Kulicke & Soffa

Gannon & Scott

Oneida Research Services

Oneida Research Services