Heraeus TFD

:: Corporate Member News ::

:: LORD Corporation Hires Crispin To Expand Electric Vehicles Focus (full story)

:: Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications (full story)

:: News from Master Bond (full story)

:: Remtec Has Expanded Its Process Capabilities and Developed New Technologies for Metallized Ceramic Sensors, Detectors and Analyzers (full story)

:: Isola’s Astra MT Materials Successfully Evaluated with Freescale Radar ICs (full story)

:: Indium Corporation Receives SMT China Vision Award (full story)

:: TJ Green Announces Four Day Process Cert Class In Pasadena, CA Sept 15-18 2015 (full story)

:: TechSearch International Makes Sense of Package Alphabet Soup (full story)


:: Job Openings ::

:: Technical Sales Engineer - YINCAE (full story)

:: Inside Sales Representative in Southern California (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.




NEO Tech


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: LORD Corporation Hires Crispin To Expand Electric Vehicles Focus

LORD Corporation has announced that Polly Crispin has been appointed to the new role of Global Market Development, Electric Vehicles for the Automotive, Industrial and Electronic Assemblies (AIEA) area of the business.

LORD supplies thermal management solutions for the EV powertrain with particular focus on the inverter, charger, battery pack and electric motor. According to Jim Greig, Global Sales and Marketing Manager for LORD Corporation, the electronic vehicle market is on the verge of explosive growth. “Managing the massive amounts of information related to the market and focusing on the key target OEMs and their tier suppliers is critical for success in this electronic vehicles market,” said Greig.

In this new role, Crispin will be responsible for researching, identifying, analyzing and developing business opportunities in the electric vehicles market. She will provide market input to ensure the progress of solutions through commercialization, as well as help to define potential markets for relevant technologies.

Crispin joined LORD in 2014 as a Customer Service Representative for the AIEA team. Her background consists of a variety of positions in technical industries, and most recently, she worked for a biofuel company and global environmental NGO in London, UK. She also has experience in business development and technical management for international and regional petroleum entities. Crispin holds an M.A. in Environment, Politics, and Globalization from King’s College London, an M.B.A. from Saint Joseph’s University and a B.S. from The Pennsylvania State University.


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Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

The JetStep System boasts new productivity improvements and lower cost-of-ownership

Rudolph Technologies, Inc. has announced that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications.

“The JetStep System will be equipped with new hardware and software features that significantly increases our industry-best productivity. These upgrades will also be applied to the existing installed base, providing our customer with a significant capacity increase at a best-in-class cost-of-ownership," said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. "The JetStep System continues to be the clear choice for advanced packaging fan-out wafer level processes due to its ability to handle warped wafers with varying die placement.”

“In addition to lithography, we are pleased to supply the latest 2D and 3D inspection and metrology solutions for the same FOWLP applications,” added Mike Goodrich, vice president and general manager of the Rudolph’s Inspection Business Unit. “Our newest NSX Systems offer the fast, reliable inspection and metrology needed for demanding advanced packaging applications, such as photoresist thickness and redistribution layer (RDL) and under bump metallization (UBM) height measurements.”

Further enhancing both the JetStep System and the NSX Systems is Rudolph’s Discover® Yield Management Software, which enables yield improvement through real-time analysis for faster solutions, increasing the productivity of each tool and the overall fab yield.

The JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of back-end manufacturing. The systems address the needs of both the existing flip chip processes (bump and copper pillar), as well as emerging processes, such as fan-out wafer level packaging, interposers and 3D approaches. The JetStep system is unique in its ability to not only handle standard wafers, but also a wide range of substrates and sizes with significant process-induced warp, while being capable to print fine features for large packages such as interposers in a single shot. With these capabilities, the system provides the flexibility to meet the diverse manufacturing requirements of advanced packaging with superior throughput when compared to legacy lithography tools initially designed for the front-end, wafer-based processes.

The NSX family is the market leader for automated macro defect inspection for advanced packaging. The NSX system is a single solution that combines 2D inspection with 3D metrology. Discover software is Rudolph’s inline defect and metrology analysis and data management system.


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News from Master Bond

Master Bond’s Low Stress, Optically Clear, One Part Silicone Meets NASA Low Outgassing Specifications
Passing ASTM E595 testing for NASA low outgassing, Master Bond MasterSil 920-LO is a high performance, room temperature vulcanizing silicone for sealing, coating and small encapsulations. This single component system has a moderate, flowable viscosity and a solid electrical profile, which makes it well suited for conformal coating applications in the electronic and optical industries. Featuring a soft durometer of 25-35 Shore A, this low stress silicone can protect sensitive electronic components.

As a one part system, MasterSil 920-LO offers convenient handling with no mixing and has a neutral non-corrosive cure. Similar to other one component silicones, the curing mechanism is based on humidity, where the higher it is, the faster the cure. Its tack free time ranges from 45-60 minutes. MasterSil 920-LO bonds very well to a wide variety of substrates including metals, glass as well as many plastics and rubber materials. With its inherent flexibility, the compound can withstand rigorous thermal cycling and shock. It is also optically clear and has a refractive index of 1.43.

It is serviceable over the wide temperature range of -175°F to +500°F and has a six month shelf life in its original, unopened packaging at room temperature. MasterSil 920-LO is available in syringes, 100 gram bottles, 200 gram bottles and pint containers.

Master Bond Optically Clear Adhesives
MasterSil 920-LO is high temperature resistant, flexible single part silicone that passes NASA low outgassing requirements. This low stress system also features impressive optical clarity.

Read more about Master Bond’s optically clear polymer adhesives at
or contact Tech Support.
Phone: +1-201-343-8983
Fax: +1-201-343-2132

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Remtec Has Expanded Its Process Capabilities and Developed New Technologies for Metallized Ceramic Sensors, Detectors and Analyzers

Remtec Inc. (, the leading manufacturer of ceramic substrates and packages using PCTF® metallization, has expanded its process capabilities and developed new techniques to manufacture high performance metalized ceramic sensors in a variety of diverse applications. These include motion/velocity and acceleration systems, electrical measurement (capacitance and resistance), medical monitoring, diagnostic and detection, optical such as light sources, infrared detectors and fiber optics, liquid and gas flow, biosensors, temperature and thermal conductivity as well as wireless sensors.

Remtec’s thick & thin film advanced ceramic metallization provides a versatile and cost effective solution for demanding applications focusing on a broad range of sensors and sensing related systems. To meet specific customer requirements, Remtec applies a variety of different technologies based on its core thick & thin film metallization, often combined with plating techniques.

Recognizing that the specifications for individual metalized ceramic sensors vary significantly by application, Remtec offers designers a number of interrelated metallization technologies including thick and thin films, PCTF® (Plated Copper over Thick / Thin films) and AgENIG® (Electroless Ni - Immersion Au over Thick film Ag). Typical features of Remtec metallized ceramics include high density multilayer circuits (up to 6 metal layers), etchable thick films (50µm line/spacing), plugged via holes with low dc resistance of 2 mΩ and wraparounds, leadless SMT connections and an infinite solder leach resistance.

In addition, Remtec’s metallized ceramics withstand continuous high temperature operation to 250oC, function in harsh and corrosive environments and are compatible with a variety of raw ceramic materials including Alumina, Beryllia, Aluminum Nitride, Zirconia, Barium Titanate and Silica. Oftentimes, sensor designers specify Remtec’s metallized ceramic substrates because of Remtec’s extensive experience in manufacturing products for high frequency wireless applications, high speed circuitry with a tightly controlled impedance, optoelectronics components and assemblies as well as high temperature electronics.

Typical sensor applications are industrial accelerometers, fluid analyzers, liquid and gaseous flowmeters, thermal conductivity measurements, sensing content and flow of liquids in a corrosive environment, biosensors as well as sensors for medical diagnostic such as non-intrusive testers for vital signs, X-ray imaging in dental instrumentation and optical detectors for tissue properties.

Remtec, a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging solutions for sensors and detectors, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military industries.

For more information, please visit
Editorial Contact: Dean M. Wood 401-225-6789

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Isola’s Astra MT Materials Successfully Evaluated with Freescale Radar ICs

Advanced thermoset dielectric material for millimeter-wave automotive radar to be demonstrated at IMS 2015.

Isola Group has announced today that its Astra MT laminate materials have been successfully evaluated with Freescale® Semiconductor radar ICs. Freescale, a leader in Integrated Circuits (ICs) for ADAS 77 GHz radar, teamed with RFbeam Microwave to perform the evaluation. Isola will show the demonstration example in booth 1135 at the International Microwave Symposium (IMS) 2015.

The ultralow-loss Astra MT dielectric materials are ideal for patch antenna designs and RF front-end PCBs for 76 to 81 GHz radar applications. Astra MT materials enable a higher yield in RF-hybrid PCB manufacturing, reducing production costs. In conjunction with Freescale’s millimeter-wave radar chipset, the booth demonstration will highlight the reliable electrical performance in wide field-of-view radar applications for automotive systems.

Tarun Amla, Executive Vice President and Chief Technology Officer at Isola stated, "We are very pleased with the verification and validation results for Astra MT materials on the Freescale reference design. Astra MT was engineered for harsh automotive environments and offers a very low cost of manufacturing, higher thermal reliability, better dimensional stability and is available to customers worldwide."

Léon Audergon, Engineering Director at RFbeam Microwave GmbH stated, “Astra MT laminates were used without any modification with the Freescale radar ICs. We did not see any difference in the performance compared with PTFE products in our first attempt. The product offers ease of manufacturing compared to PTFE products, as it processes similarly to FR-4 materials."

Patrick Morgan, Director and General Manager of the ADAS Radar and Safety Business Unit at Freescale Semiconductor stated, “Freescale conducted a millimeter wave evaluation on Astra MT laminates including measurements with the complete radar system. Measurements indicate that the very low-loss dielectric constant on Astra MT materials support the performance of Freescale radar ICs."

The demonstration example using Freescale radar ICs on Astra MT material will be featured at the Isola booth (#1135) at the International Microwave Symposium (IMS) 2015, May 17-22 at the Phoenix Convention Center in Phoenix, AZ.

To learn more about Astra MT materials, please visit

Freescale’s portfolio of radar ICs include the MR2001: Multi-channel 77 GHz Radar Transceiver Chipset. For more information, please visit Freescale’s Advanced Driver Assistance Systems Design Center.

For more information, visit our website at http://www.isola−

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Indium Corporation Receives SMT China Vision Award

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. 

The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.

Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations. 

Indium10.1 offers the lowest cost-of-ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including best-in-class print definition and transfer efficiency, low-voiding performance, and head-in-pillow and graping resistance. 
For more information about Indium10.1 or Indium Corporation’s complete Pb-free solder paste series, visit, or email
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


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TJ Green Announces Four Day Process Cert Class In Pasadena, CA Sept 15-18 2015

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (4 Days) 
This four-day process certification course is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy-to-understand format.
Registration Form

Additional Training Courses Offered by TJ Green Later This Year:
Or download a webinar from their online semiconductor training center

Wire Bonding Certification (3 Days) 
Bethlehem, PA     August 25-27, 2015      OR        Anaheim, CA     December 2-4, 2015
This is an intense three-day course that combines classroom activities and "hands-on" skills at the wire bonder. Students have to demonstrate a basic level of wire bonding proficiency and pass a written test at the end. Older model manual ball and wedge bonders are used to teach the basic skills of wire bonding and associated trouble shooting. In addition, high/ low power microscopes and wire pull test equipment allows the student to see and fell what makes for a good bond. Visual inspection and defect recognition are in accordance with MIL-STD-883 TM 2017 and TM 2010.
Registration Form

Microwave Packaging Technology (3 Days) 
San Diego, CA
December 7-9, 2015
This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and microwave packaging technology. 
This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material tradeoffs, and process selection are all covered in detail. Microwave Design for Manufacturability DFM concepts are introduced and reinforced throughout the course.
Registration Form

Pre Cap Visual Inspection per MIL-STD-883 (TM 2017) (1 Day) 
Bethlehem, PA
October 15, 2015
Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. “Hands-on” training at the microscopes will supplement the classroom lecture.
The course is intended for quality assurance personnel, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.
Registration Form

Packaging And Testing Of Implanted Medical Devices (1 Day) 
Bethlehem, PA
October 16, 2015
Implanted medical products such as cochlear implants and pacemakers along with an entire new generation of MEMS based sensors and drug delivery systems need to be packaged  in such a way as to survive the hardships of the body and perform reliably for five or ten years.
This course is a top to bottom review of both hermetic and non-hermetic packaging approaches for medical implants and is intended for process engineers, designers, quality engineers, and managers responsible for the reliability of the final product in vivo.
Registration Form 

Additional public training courses are scheduled throughout the year and are also available in-plant. Check the TJ Green LLC website for up-to-date course schedules and locations.


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TechSearch International Makes Sense of Package Alphabet Soup

With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI, and SLIT are high-density substrates without through silicon vias (TSVs). Fan-out wafer level packages (FO-WLPs) also provide an option for a split die package. Roadmaps from FO-WLP suppliers show the transition to finer features.

Package options for power devices are also discussed, including a special section on automotive packages. A detailed analysis focuses on the trends in Cu clip packages for MOSFETs. A double-digit growth rate is projected for this increasingly popular package. Also included is an update on the market for embedded component packages with a new market forecast split into actives and passives.

The detailed analysis is based on the company’s 27-year history of studying markets and critical technology and infrastructure issues in advanced packaging. The 37-page report with full references provides analysis on these important developments. A set of 30 PowerPoint slides accompanies the report.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see http//

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:: Job Openings ::

Technical Sales Engineer - YINCAE

YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices.

As our customer base and marketing efforts expand, we require an enthusiastic and talented Technical Sales Engineer to support our sales efforts and contribute towards sales and development strategies

Specific responsibilities include, but are not limited to the following:

- Search for new clients who could benefit from our products in your designated region
- Establish new, and maintain existing, long-term relationships with customers
- Persuade clients that a product or service best satisfies their needs in terms of quality, price and delivery
- Negotiate and close sales by agreeing to terms and conditions
- Offer after-sales support services
- Analyze costs and sales
- Meet regular sales targets and coordinate sales projects
- Coordinate sales projects
- Support marketing by attending trade shows, conferences and other marketing events
- Make technical presentations and demonstrate how a product will meet client needs
- Provide pre-sales technical assistance and product education
- Liaise with other members of the sales team and other technical experts
- Provide training and produce support materials for other members of the sales team
- Develop long-term relationships with clients through managing and interpreting their requirements
- Prepare weekly and monthly reports for head office

- Must possess a four year degree in electronic engineering or technical related field.
- Minimum 2 year experience in SMT industry

This full time position includes base salary, high commission and benefits

More Information?
Mary Liu
YINCAE Advanced Materials, LLC
Tel: (518) 452-2880 Fax: (518) 452-2779

Inside Sales Representative in Southern California
Position Overview:
responsible for achieving sales and revenue goals by developing, building, and strengthening long-term relationships with customers, independent sales reps, distributors and partners

Duties and Responsibilities:

  • Serve as internal sales support for the sales team to achieve or exceed assigned sales quotas and goals
  • Collaboratively works with sales team members to develop and maximize opportunities, and generate sales activities with independent sales reps, distribution network
  • Partner effectively with FAE, outside sales reps to drive territory coverage, and maintain positive distributor relationships.
  • Coordinate marketing campaigns such as trade shows, online and offline promotions, seminar and technical trainings, and travel for marketing and sales events and customer visits.
  • Keeps management informed by submitting activity and results reports.
  • Monitors competition by gathering current marketplace information on pricing, products, new products, delivery schedules, merchandising techniques, etc.
  • Performs other duties as assigned by management.


  • Bachelor’s degree with four years college or university
  • 3-5 years professional sales/telemarketing experience preferred
  • Strong presentation, communication, organization, multitasking and time management skills, sales skills including prospecting, negotiation and closing skills
  • Demonstrated record of achievement in prior sales related position preferred
  • Able to travel to customers/team sites as required


Ray Petit, Pacific Rim Engineering
(949)285-6383 |


Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our online JOBS Board ( ) at no cost - part of corporate membership!


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:: Issue 174 ::
June 10, 2015



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