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:: Corporate Member News ::


:: Be Sure to Visit SSEC/VEECO at Booth #38 (full story)

:: Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services (full story)

:: ASE Group’s broad portfolio of technology encompasses IC test program design, wafer probe, wafer bump, wafer level package, and much more (full story)

:: SPTS Technologies on display at Booth #57 (full story)

:: Mentor Graphics® is a leader in electronic design automation software (full story)

:: Visit Palomar at Device Packaging - Booth #25 (full story)

:: Visit DYCONEX and Micro Systems Engineering (MSE) at booth# 62 and explore their interconnect and packaging solutions (full story)

:: Solving The Problem Of Increasing Soft Error Rates (full story)

:: Innovations in Socketry…See you at Booth 21! (full story)

:: Visit M-Solv Ltd at Booth #13 (full story)

:: Rudolph Ships JetStep Lithography System for High Volume Fan-out Packaging Applications (full story)

:: Assembly of Active Optical Cables (AOC) (full story)

:: TESEC Introduces Next Generation MEMS Handler (full story)

:: Finetech & Martin Appoint Torenko for Rework System Sales (full story)


Download the Complete Device Packaging 2015 EXHIBIT DIRECTORY

:: Job Openings ::

:: Inside Sales Representative in Southern California (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

DPC/GBC Premier Sponsor: VEECO

Golf Hole Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: ASE US, Inc.

SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
Hole Sponsor: NAMICS
Applied Materials - Event Sponsor
Sponsor: Lam Research
EV Group - Evening Sessions Sponsor

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Be Sure to Visit SSEC/VEECO at Booth #38

Solid State Equipment Corporation is now VEECO

SSEC 3300 Series, Single Wafer Wet Processors for Advanced Packaging (WLP and 3D). Metal etch for UBM/RDL with SSEC’s WaferChek - in-situ adaptive process control. Wafer thinning and stress relief. Combination batch immersion /single wafer spray processing for PR and dry film strip, lift-off, flux removal, post-etch residue and TSV clean. High efficiency cleaning tools. Spin Coat and develop processes.

Veeco’s process equipment solutions enable the manufacture of LEDs, flexible OLED displays, power electronics, hard drives, MEMS and wireless chips. We are the market leader in MOCVD, MBE, Ion Beam and other advanced thin film process technologies. Our high performance systems drive innovation in energy efficiency, consumer electronics and network storage and allow our customers to maximize productivity and achieve lower cost of ownership.

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Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services

Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect.


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ASE Group’s broad portfolio of technology encompasses IC test program design, wafer probe, wafer bump, wafer level package, and much more

ASE Group’s broad portfolio of technology encompasses IC test program design, wafer probe, wafer bump, wafer level package, and much more. Leading the OSAT market, ASE generated sales revenues of $4.4 Billion in 2012. For more on our proven copper wire bond capabilities and our advances in 3D & TSV technologies, please visit

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SPTS Technologies on display at Booth #57

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and thermal wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the acquisition of SPTS, Orbotech is now able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s UV Laser Drilling, Laser Direct Imaging and Precision Inkjet Printing solutions.

SPTS operates three manufacturing facilities in the UK and US, and operates across 19 countries in Europe, North America and Asia-Pacific.

For further information please visit

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Mentor Graphics® is a leader in electronic design automation software

Mentor Graphics® is a leader in electronic design automation software. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design.

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Visit Palomar at Device Packaging - Booth #25

Laser Diode & Optical Component Packaging Requirements
The intricate packaging process for optoelectronic devices can challenge the efforts to reduce manufacturing costs. Since the goal of an optical component is to manipulate light, the design rules for the optoelectronics packaging are significantly more complex than semiconductors. For semiconductors, advances in wafer processing technology have resulted in a packaging process that is both automated and planar. However, for optical components, the front-end process is significantly different; and for photonic devices, the controlled assembly processes and critical assembly tolerances create a challenge during both package design and manufacturing. Read more:


Parallel Processes
The intricate packaging process for optoelectronic devices can challenge the efforts At Palomar Technologies we often discuss the versatility of our equipment, as we have many uniquely adaptable and accurate approaches to a challenge. With the extensive possibilities of our technology, the overall production and throughput of these products are also exceptional. Customers know they need the capabilities of our Die and Wire Bonders and they also want to get as much production out of them as possible. This is when parallel processes come into play.
Read more:

Subscribe to the PTI Blog! Join the industry peers who already have!


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Visit DYCONEX and Micro Systems Engineering (MSE) at booth# 62 and explore their interconnect and packaging solutions

DYCONEX AG is a world leading supplier of highly complex, flexible, rigid-flex and rigid HDI (high-density interconnect)/microvia PCBs for applications where miniaturization and best-in-class quality and reliability are crucial for success.

Micro Systems Engineering GmbH (MSE) specializes in customized solutions for advanced microelectronics. MSE is a leading European supplier of complex LTCC (low temperature co-fired ceramic) substrates, as well as substrate assembly and semiconductor-packaging technologies for both ceramic and organic substrates.

DYCONEX and MSE are part of the MST group. At IMAPS Device Packaging 2015, they will highlight their capabilities in advanced interconnect and packaging technologies – one-stop solutions for your microelectronic packaging applications.

For more information please visit us at booth# 62.

Furthermore, we would like to invite you to the presentation of Susan Bagen, Application Development Manager at MST Inc.: "Advanced Electronic Packaging Options for Miniaturization of Complex Medical Devices" on Thursday, March 19, 2015, 10-45 AM - 11:15 AM.

Dyconex MSE

Dyconex MSE



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Solving The Problem Of Increasing Soft Error Rates

Low alpha tin (Sn) can gain in alpha emissions over time if the manufacturer does not remove Pb210. In order for tin, or an alloy containing tin, to remain stable (at secular equilibrium) and not have an increase in alpha emissions over time (causing increasing soft errors), the manufacturer/supplier of low alpha material must remove the lead isotope lead 210 (Pb210). The low alpha tin can contain any of the 4 non-radioactive isotopes of lead (Pb204, Pb206, Pb207, Pb208) as these isotopes of lead are stable and do not decay further into Po210 as does the most common form of lead - (Pb210). That is why low alpha tin/lead alloys can be produced even down to an emission level of <0.002 cph/cm2 that are at secular equilibrium and do not increase in alpha emission rates over time. Some low alpha manufacturers have tried reducing the lead content in tin to very low levels to obtain low alpha tin, but even trace amounts of Pb210 (less than 0.001 ppm) can have an increasing alpha emission rate over time.

See Jerry Cohn at our booth (#20) at the IMAPS Device Packaging Conference and we will tell you more and how our proprietary processes eliminate this problem.

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Innovations in Socketry… See you at Booth 21!

Innovations in Socketry…

Supporting the Electronics Industry in:

Space and Defense

We offer the latest in Test and Burn-In Sockets for: QFP, CQFP, MCM, SOIC, Laser Diode, LCC, LGA, BGA, QFN, MLF, MEM, 3D Memory Stack, Medical Substrates, HF Device, PGA, Substrate Modules and Custom Integrated Circuits

Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets, has been providing innovative interconnect solutions for over 50 years. Our broad experience allows us to tackle the challenges of a constantly evolving industry. Azimuth offers complete in-house services facilitating cost-effective solutions from engineering and design, machine shop prototyping, tooling fabrication, and production injection molding. Our company provides state of the art concepts in Socketry with a commitment to excellence and service.


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Visit M-Solv Ltd at Booth #13

M-Solv, an innovative leader in developing new and advanced laser processes for microelectronic applications are pleased to announce that we will be exhibiting and presenting at the IMAPS 11th International Conference and Exhibition 2015. Come and visit us at booth #13 to learn more about our tools, technology and application know-how. Our experts will be on hand and happy to discuss any of your questions.

On the booth we will be showcasing a video demonstration of M-Solv’s proprietary Scanned Mask Imaging (SMI) technology. SMI allows direct patterning and ablative removal of materials down to a resolution of a few microns. A photo-mask is raster scan illuminated by a UV multi-mode solid state laser. A high resolution projection lens delivers a de-magnified image of the photo-mask to the substrate, where the energy is used to modify the target material.

This novel technology takes advantage of the low running costs associated with solid state laser systems, as well as the flexibility and quality of process offered by imaging systems. In comparison to excimer laser systems of equivalent specification, the process cost of ownership can be <50% using SMI technology, with no reduction in quality, and with higher throughput.

To discuss M-Solv’s SMI technology or any of our other processes, technologies or tools, come and visit us at booth #13 to meet our experts, we look forward to seeing you at the show.


M-Solv Limited is an innovative leader in developing new and advanced laser and inkjet deposition processes for microelectronic and photovoltaic applications. These technologies combined place M-Solv at the forefront of pioneering process techniques in various industry sectors, including large area flexible electronics, photovoltaic and advanced packaging.

M-Solv is based in Oxford, UK, with an office in Hong Kong, a manufacturing partner in Taiwan and partnerships worldwide. As an equipment manufacturer and integrator, M-Solv provide complete engineered solutions for large scale production, pilot trials and R&D applications. Further information about M-Solv’s tools and technology can be found on the M-Solv website:




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Rudolph Ships JetStep Lithography System for High Volume Fan-out Packaging Applications

Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new customer will use the JetStep W Series for fan-out wafer level packaging (FO-WLP) applications. . Visit or Rudolph booth #33 for more information.

Link to Press Release

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Assembly of Active Optical Cables (AOC)

MRSI Systems, a developer and manufacturer of high precision turnkey placement and dispensing systems, announced its latest system for the assembly of AOC (Active Optical Cables). The MRSI-M3 Ultra-Precision Assembly Work Cell is configured for the assembly of photonics devices. High volume manufacturing is achieved using established automation solutions. Common requirements include ultra-high precision placement, in-situ UV curing, advanced vision algorithms, delicate force sensing, material traceability, automated material handling, eutectic bonding, precision dispensing and stamping.

Jon Medernach Key Account, Sales Engineer
MRSI Systems
101 Billerica Ave., Bldg. 3
North Billerica, MA 01862
Cell: (978) 758-4999
Office: (978) 667-9449

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TESEC Introduces Next Generation MEMS Handler

TESEC Corporation announces the introduction of a new family of MEMS (Micro Electro Mechanical Systems) handlers, the ULTRA Series.   TESEC adopts the use of advanced aerospace motion technology in the ULTRA Series to achieve higher accuracy, better efficiency and faster throughput.  The ULTRA Series products provide an industry best in lowering Cost of Ownership, “COO” and Cost of Test, “COT”!
The Ultra Series initial focus is for Inertial MEMS such as accelerometers and gyroscopes.  There are two models: the ULTRA L, MEMS test module for Laboratory, engineering and small production use and the ULTRA P for high volume, mass-Production. 

ULTRA L can be used for MEMS product engineering, test development, or small volume test.  All work performed with the ULTRA L is directly transferable to high volume testing on the ULTRA P.  Both systems provide stimulus for accelerometers and gyroscopes with 6DOF, ±360 degrees and 3 axis of movement.

The ULTRA P, a self contained, mass-production system employs advanced Pick & Place technology to transfer devices as small as 2x2mm in size, to/from JEDEC trays to carriers.  The carriers allow parallel testing of up to 96 devices, resulting in throughput rates of greater than 20,000 units per hour “UPH”.   ULTRA systems are all tri-temperature capable, with ±1°C accuracy.   Due to the special design of non-magnetic materials in the test unit, Helmholtz coils may be added to enable testing of magnetic sensors, allowing expansion of ULTRA systems to 9 DOF.
The first ULTRA P System shipped in February and TESEC is forecasting volume production of ULTRA Systems starting later this year.

The ULTRA Series is developed by TESEC under joint technical partnership with FocusTest, Inc, Wilmington, MA, USA, a company known for its expertise in development of MEMS handling, motion stimulus and test systems for more than 20 years.

Takashi Saito, President of TESEC states: “TESEC’s expertise in semiconductor package handling technologies along with our global sales and service network, coupled with FocusTest’s innovative MEMS technology enables us to provide a world-class handling and test solution for MEMS devices.”


General Specification of ULTRA P

  1. DUT                Single, Dual, Tri Axial Accelerometers & Gyroscopes
  2. Package          2x2 mm to 9x9mm or larger (DFN, QFN, LGA, SO etc.)
  3. Test site          Up to 96 parallel
  4. Throughput      Over 20,000 UPH (64 sites with Tri-temp)
  5. Input/Output   JEDEC Standard Trays
  6. Temperature   -40°C  to + 125°C (±1°C)
  7. Rate Table       6 DOF (Accuracy : 0.004°)
                          3 Axis (±360° Rotation for Gyroscope)
                          Rate Range: 0.0005 to 1000°/s (0.01% accuracy)
    8.  ATE I/F              50Ω (co-axial cable), 1.5GHz, 800 IO channels

For more information contact: Jan Altiveros - Phone: 480-829-6879, Email:  

Or stop by and visit us in Booth 27 at the 11th International Conference and Exhibition on Device Packaging March 17 – 18, 2015


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Finetech & Martin Appoint Torenko for Rework System Sales

Finetech, a global supplier of advanced rework equipment and high accuracy bonders and subsidiary Martin, are pleased to announce the addition of Torenko and Associates as sales representatives in Texas, Oklahoma, Arkansas and Louisiana for Finetech and Martin rework products. Torenko will be responsible for supporting new and existing accounts for Martin rework systems, reballing units, and underheaters, as well as Finetech's ultra-precise rework solutions.

Torenko is headquartered in the Dallas/Fort Worth metroplex area, with additional offices throughout the region. They specialize in providing proven solutions to address cutting-edge SMT, semiconductor, test and repair challenges, including sub-millimeter rework applications. Torenko & Associates will be a valuable addition to the Finetech and Martin Sales team.

About Finetech and Martin
Finetech, along with subsidiary Martin in Wessling, Germany, offer a wide range of rework equipment solutions. The rework products deliver the key benefits needed for reworking advanced devices - such as precise temperature and convection flow control, outstanding placement accuracy, extensive recipe libraries, large board handling, and non-contact residual solder removal. Finetech's bonders support the most precise and complex applications from R&D environments to more automated applications. Corporate headquarters and main production are in Berlin, Germany. Sales and Technical support centers are located in Gilbert, Arizona; Manchester, New Hampshire; Shanghai, China; Kuala Lumpur, Malaysia and Tokyo, Japan.

To learn more about Finetech please visit

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:: Job Openings ::

Inside Sales Representative in Southern California
Position Overview:
responsible for achieving sales and revenue goals by developing, building, and strengthening long-term relationships with customers, independent sales reps, distributors and partners

Duties and Responsibilities:

  • Serve as internal sales support for the sales team to achieve or exceed assigned sales quotas and goals
  • Collaboratively works with sales team members to develop and maximize opportunities, and generate sales activities with independent sales reps, distribution network
  • Partner effectively with FAE, outside sales reps to drive territory coverage, and maintain positive distributor relationships.
  • Coordinate marketing campaigns such as trade shows, online and offline promotions, seminar and technical trainings, and travel for marketing and sales events and customer visits.
  • Keeps management informed by submitting activity and results reports.
  • Monitors competition by gathering current marketplace information on pricing, products, new products, delivery schedules, merchandising techniques, etc.
  • Performs other duties as assigned by management.


  • Bachelor’s degree with four years college or university
  • 3-5 years professional sales/telemarketing experience preferred
  • Strong presentation, communication, organization, multitasking and time management skills, sales skills including prospecting, negotiation and closing skills
  • Demonstrated record of achievement in prior sales related position preferred
  • Able to travel to customers/team sites as required


Ray Petit, Pacific Rim Engineering
(949)285-6383 |


Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our online JOBS Board ( ) at no cost - part of corporate membership!


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:: Issue 170 ::
March 2, 2015


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