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:: Corporate Member News ::

- SPECIAL ISSUE -
THANK YOU IMAPS 2015 EXHIBITORS AND SPONSORS!

Register Online for your Complimentary Exhibit Pass!

IMAPS 2015

View the Final Program & Exhibit Directory
to plan your visit to IMAPS Orlando NEXT WEEK!

IMAPS 2015 Program

Exhibitor
Booth
Booth Type
Booth Category
5N Plus Inc.
Booth #418
10 x 10
In-Line
AdTech Ceramics
Booth #800
10 x 10
Corner
Advance Reproductions Corp.
Booth #803
10 x 10
Corner
Advanced Dicing Technologies
Booth #310
10 x 10
Corner
Advantest Corporation
Booth #619
10 x 20
In-Line
AEMtec GmbH
Booth #226
10 x 10
Corner
AI Technology, Inc.
Booth #308
10 x 10
In-Line
AkroMetrix, LLC
Booth #820
10 x 10
In-Line
AMADYNE GmbH
Booth #209
10 x 10
In-Line
AMICRA Microtechnologies GmbH
Booth #217
10 x 10
Corner
Applied DNA Sciences
Booth #116
10 x 10
Corner
AT&S Americas, LLC
Booth #309
10 x 10
In-Line
ATV Technologie GmbH
Booth #616
10 x 10
In-Line
Axus Technology
Booth #423
10 x 10
Corner
Besi North America, Inc.
Booth #522
10 x 10
Corner
BGA Technology
Booth #223
10 x 10
Corner
Camtek USA
Booth #111
10 x 10
Corner
Canon USA
Booth #726
10 x 10
Corner
CEA LETI
Booth: RESEARCH LAB: 526
10 x 10
In-Line
Ceradyne, Inc., a 3M company
Booth #804
10 x 10
Corner
Coining, Inc., an AMETEK company
Booth #807
10 x 10
Corner
Conductive Containers, Inc.
Booth #518
10 x 10
In-Line
Criteria Labs
Booth #122
10 x 10
Corner
Deweyl Tool Company, Inc.
Booth #206
10 x 10
In-Line
DfR Solutions LLC
Booth #421
10 x 10
In-Line
DuPont Microcircuit Materials
Booth #701
10 x 10
Corner
East China Research Institute of Microelectronics
Booth #321
10 x 10
In-Line
Electronic Production Partners GmbH
Booth #219
10 x 10
In-Line
Element Six  Technologies US Corp.
Booth #422
10 x 10
Corner
ESL ElectroScience
Booth #806
10 x 10
In-Line
EV Group
Booth #723
10 x 10
Corner
F & K Delvotec, Inc.
Booth #611
10 x 10
Corner
Ferro Corporation
Booth #618
10 x 10
In-Line
Finetech, Inc.
Booth #416
10 x 10
In-Line
Fogale Nanotech
Booth #521
10 x 10
In-Line
Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Booth: RESEARCH LAB: 326
10 x 10
Corner
Geib Refining Corporation
Booth #405
10 x 10
Corner
Georgia Tech 3D Systems Packaging Research Center (PRC)
Booth: RESEARCH LAB: 426
10 x 10
Corner
Good-Ark Semiconductor
Booth #101
10 x 10
Corner
Haiku Tech, Inc.
Booth #419
10 x 10
In-Line
Hary Manufacturing Incorporated
Booth #609
10 x 10
In-Line
HD Microsystems
Booth #817
10 x 20
Corner
Heraeus Electronic Materials Division
Booth #605
10 x 20
Corner
Hesse Mechatronics, Inc.
Booth #208
10 x 20
Corner
Hi-Rel Group (Shared with Applied DNA Sciences)
Booth #116
10 x 10
Corner
Hi-Rel Laboratories, Inc
Booth #708
10 x 10
Corner
Hitachi Chemical Co., Ltd.
Booth #322
10 x 10
Corner
HSIO Technologies
Booth #808
10 x 10
Corner
i3 Electronics
Booth #523
10 x 10
Corner
IBM Canada, Ltd.
Booth #826
10 x 10
Corner
Indium Corporation
Booth #517
10 x 20
Corner
Infinite Graphics
Booth #721
10 x 10
In-Line
Institute for Electronics & Nanotechnology at Georgia Tech
Booth: RESEARCH LAB: 427
10 x 10
In-Line
Interconnect Systems, Inc.
Booth #211
10 x 10
Corner
International Consortium for Advanced Manufacturing Research (iCAMR)
Booth #228
10 x 10
Corner
Inventec Performance Chemicals
Booth #118
10 x 10
In-Line
KOA Speer Electronics, Inc.
Booth #320
10 x 10
In-Line
Kulicke & Soffa Industries, Inc.
Booth #709
10 x 10
Corner
Kyocera America, Inc.
Booth #716
10 x 10
Corner
Lake Mary High School
Booth #823
10 x 10
Corner
Metalor Technologies USA
Booth #504
10 x 30
Corner
Metallix Refining
Booth #120
10 x 10
In-Line
Micro Systems Technologies Management AG
Booth #707
10 x 10
In-Line
Microelectronics Assembly Technologies & Polymer Assembly Tech.
Booth #818
10 x 10
In-Line
MicroScreen LLC
Booth #221
10 x 10
In-Line
Micross Components
Booth #318
10 x 10
In-Line
Mini-Systems, Inc.
Booth #623
10 x 10
Corner
Moldex 3D Northern America, Inc. (Shared with Neu Dynamics)
Booth #104
10 x 10
In-Line
MRSI Systems LLC
Booth #400
10 x 10
Corner
NAMICS Corporation
Booth #717
10 x 10
Corner
NCSU Packaging Research in Electronic Energy Systems (PREES)
Booth: RESEARCH LAB: 527
10 x 10
Corner
NEO Tech
Booth #505
Island - 20 x 20
Corner
NETZSCH Instruments N.A. LLC
Booth #719
10 x 10
In-Line
Neu Dynamics Corp.
Booth #104
10 x 10
In-Line
NorCom Systems, Inc.
Booth #617
10 x 10
Corner
Nordson DAGE
Booth #705
10 x 10
Corner
Noritake Co., Inc.
Booth #109
10 x 10
In-Line
Northrop Grumman Corporation
Booth #727
10 x 10
Corner
nScrypt, Inc.
Booth #718
10 x 20
Corner
NTK Technologies, Inc.
Booth #420
10 x 10
In-Line
Ormet Circuits, Inc.
Booth #805
10 x 10
In-Line
PA&E
Booth #311
10 x 10
Corner
Pac Tech Packaging Technologies USA
Booth #201
10 x 10
Corner
Palomar Technologies, Inc.
Booth #511
10 x 20
Corner
Panasonic Factory Solutions Company of America
Booth #102
10 x 10
In-Line
Perfection Products, Inc.
Booth #501
10 x 10
Corner
Plasma-Therm, LLC
Booth #304
10 x 20
Corner
Quik-Pak, a division of Promex Industries
Booth #520
10 x 10
In-Line
Reldan Metals Co., Div of AR Metals, LLC
Booth #300
10 x 10
Corner
Riv Inc. ~ Precision Printing Screens
Booth #401
10 x 10
Corner
Royce Instruments, LLC
Booth #305
10 x 10
Corner
Rudolph Technologies
Booth #410
10 x 10
Corner
Sales & Service, Inc.
Booth #319
10 x 10
In-Line
Samtec, Inc.
Booth #105
10 x 20
Corner
SANTIER Thermal Management Solutions
Booth #620
10 x 10
In-Line
Sekisui Chemical
Booth #627
10 x 10
In-Line
Semi Dice, Inc.
Booth #700
10 x 10
Corner
Semiconductor Enclosures, Inc.
Booth #722
10 x 10
Corner
Semiconductor Equipment Corporation
Booth #622
10 x 10
Corner
Shinko Electric America
Booth #821
10 x 10
In-Line
Sikama International, Inc.
Booth #710
10 x 10
In-Line
SMART Microsystems
Booth: RESEARCH LAB: 328
10 x 10
In-Line
SOMACIS
Booth #323
10 x 10
Corner
Sonoscan, Inc.
Booth #516
10 x 10
Corner
SST International
Booth #600
10 x 20
Corner
Stellar Industries Corp.
Booth #500
10 x 10
Corner
Taiyo Ink Mfg. Co., Ltd.
Booth #204
10 x 10
Corner
Tanaka Precious Metals
Booth #106
10 x 20
Corner
Tango Systems, Inc.
Booth #809
10 x 10
Corner
TDK Corporation
Booth #207
10 x 10
In-Line
Technic, Inc.
Booth #316
10 x 10
Corner
Teledyne Microelectronic Technologies, Inc.
Booth #404
10 x 10
Corner
Teledyne Microwave Solutions
Booth #404
10 x 10
Corner
Torrey Hills Technologies, LLC
Booth #816
10 x 10
Corner
TPT Wire Bonder
Booth #406
10 x 10
In-Line
Tresky Corporation
Booth #408
10 x 10
In-Line
Unisem Group
Booth #205
10 x 10
Corner
USF College of Marine Science
Booth: RESEARCH LAB: 327
10 x 10
Corner
US Tech (Media Trade)
Booth #307
10 x 10
In-Line
Utz Technologies, Inc.
Booth #822
10 x 10
Corner
West Bond, Inc.
Booth #317
10 x 10
In-Line
XYZTEC
Booth #417
10 x 10
Corner
YINCAE Advanced Materials, LLC.
Booth #409
10 x 10
Corner
Yole Developpement
Booth #626
10 x 10
Corner
YXLON Feinfocus
Booth #200
10 x 10
Corner
Zeta Instruments
Booth #407
10 x 10
In-Line

 

View the FLOORPLAN to plan which companies to visit next week!

IMAPS 2015 Floorplan

:: Job Openings ::

:: Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
NEO Tech - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
CORPORATE Sponsors:
Honeywell - Student Programs Sponsor
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
NEO Tech - Premier Sponsor, Platinum

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Conference Proceeding USB Drives:
Indium Corp - Keynote Presentations Sponsor
Dessert "Happy Hour" Sponsor:
Palomar Technologies: Dessert "Happy Hour" Sponsor
Student Programs Sponsor:
Honeywell - Student Programs Sponsor
Lunch Sponsor:
Applied Materials - Event Sponsor
Keynote Session Sponsor:
Enthone - Keynote Session Sponsor
Posters & Pizza Sponsor:
Northrop Grumman EC - Poster Session Sponsor
Bag Insert Sponsor:
American Elements - Bag Insert Sponsor
   
Golf Sponsors
Golf Hole Sponsor: Infinite Graphics
Golf Hole Sponsor
Golf Hole Sponsor: Coining/Ametek
Golf Hole Sponsor
Technic - Golf Hole Sponsor
Golf Hole Sponsor
 
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Semiconductor Packaging News
Media Sponsor: YOLE
   

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


 

 

 

:: Job Openings ::

Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer

JOB DESCRIPTION
The National Security Campus (NSC) is a U.S. Department of Energy (DOE), National Nuclear Security Administration (NNSA) facility managed and operated by Honeywell Federal Manufacturing & Technology (FM&T). Our primary business is to manufacture sophisticated mechanical, electronic, and engineered material components for our nation’s defense system. Our goal is to seek innovative solutions that surpass our customers’ expectations. To accomplish this, we research, develop, and deploy some of the most advanced design and manufacturing technologies in use in the United States today.

The Microelectronics Department has an opening for an experienced process engineer to provide hands-on support of our Low Temperature Cofired Ceramic (LTCC) fabrication line. The successful candidate will have an engineering degree from an ABET accredited institution and prior process engineering experience. The candidate will drive yield improvement and process control activities using Six Sigma and SPC tools.

Summary of Duties:
• Applies mathematical, physical science, and advanced engineering technologies in accomplishing engineering objectives.
• Exercises considerable latitude in determining technical objectives of assignments.
• Conducts research and development experiments to resolve complex engineering and quality problems involving highly technical and scientific methods.
• As needed, performs support functions for project planning and managing project resources, including multiple individuals and disciplines, to achieve quality, delivery schedules, and cost objectives.
• Writes technical reports on results and conclusions drawn from experiments conducted and incorporates findings in formal specifications.
• Estimates set-up times, flow-times, costs of production and acceptance equipment, and compiles cost estimates and delivery quotations, monitors performance, and prepares reports, statistics, and recommendations for management review.
• Participates in establishing operating procedures on new products and components.
• Defines and recommends new designs, design changes, and alternate designs of instruments, and test equipment, and orders tooling, gauging, and equipment necessary to assure product quality.
• Plans and performs engineering testing and development programs and uses advanced statistical and scientific methods to address and resolve critical engineering and production problems to assure product manufacturability.
• Originates, refines, and releases complex manufacturing or inspection work directions.
• Determines acceptability of processes and materials with other organizations as needed, such as design agencies, quality, and other affected organizations.
• Based on research, applies, develops and recommends innovative methodologies and technologies which are equal to the industry's state of the art to resolve processing and design problems.
• Provides technical consultation to management and others, and leads technical project teams.
• Responsible for strategic technical support that may involve longer range and/or complex business objectives in field of expertise.
• Evaluates and implements innovations and technological advances that improve quality, reduce flow time, improve productivity, and enhance operational surety.

Basic Qualifications:
• Must be an U.S. Citizen in order to obtain a DOE “Q” Level security clearance
• B.S. in Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Chemical Engineering or equivalent 4-year engineering degree from an ABET accredited program.
• 5+ years of microelectronics/ semiconductor process engineering experience.

Additional Qualifications:
• Advanced degree in Electrical Engineering, Materials Science Engineering, or Mechanical Engineering from an ABET accredited program.
• Self motivated, proactive, and the ability to handle multiple tasks and changing priorities.
• Expert level knowledge of LTCC processes, including thick film and thin film technologies.
• Significant experience in process characterization, and use of Control Plans, FMEAs, Paretos and other tools to drive and document yield improvement activities.
• Significant experience with applying statistical analysis methods to product/process development (SPC).
• Significant experience with setting up and executing Design of Experiments (DOE) and performing capability analysis.
• Familiarity with reliability, failure analysis and characterization processes.
• Familiarity with MIL & JEDEC standards.
• Excellent verbal and written communication and team skills.
• Demonstrated experience in project leadership. • High level trouble shooting skills and failure analysis skills
• Six Sigma green belt or black belt certification.

Note: Candidates with greater or lesser experience may apply and may be considered for an engineering job level commensurate with experience credentials and as warranted by current business requirements.

Interested in Honeywell but this isn't the right job for you? Join Honeywell's Talent Network to receive updates on other Honeywell employment opportunities, news and more. Click here to sign up: http://careersathoneywell.com/en/Newsletternew.aspx

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.

Apply Online

 

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( http://jobs.imaps.org ) at no cost - part of corporate membership!

 

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:: Issue 181 ::
October 21, 2015

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services