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:: Corporate Member News ::

- SPECIAL ISSUE -
THANK YOU IMAPS 2015 EXHIBITORS AND SPONSORS!

Plan which of the 138 booths, and these great companies,
you must visit in Orlando on October 27-28!

 

Exhibitor
Booth
Booth Type
Booth Category
5N Plus Inc.
Booth #418
10 x 10
In-Line
AdTech Ceramics
Booth #800
10 x 10
Corner
Advance Reproductions Corp.
Booth #803
10 x 10
Corner
Advanced Dicing Technologies
Booth #310
10 x 10
Corner
Advantest Corporation
Booth #619
10 x 20
In-Line
AEMtec GmbH
Booth #226
10 x 10
Corner
AI Technology, Inc.
Booth #308
10 x 10
In-Line
AkroMetrix, LLC
Booth #820
10 x 10
In-Line
AMADYNE GmbH
Booth #209
10 x 10
In-Line
AMICRA Microtechnologies GmbH
Booth #217
10 x 10
Corner
Applied DNA Sciences
Booth #116
10 x 10
Corner
AT&S Americas, LLC
Booth #309
10 x 10
In-Line
ATV Technologie GmbH
Booth #616
10 x 10
In-Line
Axus Technology
Booth #423
10 x 10
Corner
Besi North America, Inc.
Booth #522
10 x 10
Corner
BGA Technology
Booth #223
10 x 10
Corner
Camtek USA
Booth #111
10 x 10
Corner
Canon USA
Booth #726
10 x 10
Corner
CEA LETI
Booth: RESEARCH LAB: 526
10 x 10
In-Line
Ceradyne, Inc., a 3M company
Booth #804
10 x 10
Corner
Coining, Inc., an AMETEK company
Booth #807
10 x 10
Corner
Conductive Containers, Inc.
Booth #518
10 x 10
In-Line
Criteria Labs
Booth #122
10 x 10
Corner
Deweyl Tool Company, Inc.
Booth #206
10 x 10
In-Line
DfR Solutions LLC
Booth #421
10 x 10
In-Line
DuPont Microcircuit Materials
Booth #701
10 x 10
Corner
East China Research Institute of Microelectronics
Booth #321
10 x 10
In-Line
Electronic Production Partners GmbH
Booth #219
10 x 10
In-Line
Element Six  Technologies US Corp.
Booth #422
10 x 10
Corner
ESL ElectroScience
Booth #806
10 x 10
In-Line
EV Group
Booth #723
10 x 10
Corner
F & K Delvotec, Inc.
Booth #611
10 x 10
Corner
Ferro Corporation
Booth #618
10 x 10
In-Line
Finetech, Inc.
Booth #416
10 x 10
In-Line
Fogale Nanotech
Booth #521
10 x 10
In-Line
Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Booth: RESEARCH LAB: 326
10 x 10
Corner
Geib Refining Corporation
Booth #405
10 x 10
Corner
Georgia Tech 3D Systems Packaging Research Center (PRC)
Booth: RESEARCH LAB: 426
10 x 10
Corner
Good-Ark Semiconductor
Booth #101
10 x 10
Corner
Haiku Tech, Inc.
Booth #419
10 x 10
In-Line
Hary Manufacturing Incorporated
Booth #609
10 x 10
In-Line
HD Microsystems
Booth #817
10 x 20
Corner
Heraeus Electronic Materials Division
Booth #605
10 x 20
Corner
Hesse Mechatronics, Inc.
Booth #208
10 x 20
Corner
Hi-Rel Group (Shared with Applied DNA Sciences)
Booth #116
10 x 10
Corner
Hi-Rel Laboratories, Inc
Booth #708
10 x 10
Corner
Hitachi Chemical Co., Ltd.
Booth #322
10 x 10
Corner
HSIO Technologies
Booth #808
10 x 10
Corner
i3 Electronics
Booth #523
10 x 10
Corner
IBM Canada, Ltd.
Booth #826
10 x 10
Corner
Indium Corporation
Booth #517
10 x 20
Corner
Infinite Graphics
Booth #721
10 x 10
In-Line
Institute for Electronics & Nanotechnology at Georgia Tech
Booth: RESEARCH LAB: 427
10 x 10
In-Line
Interconnect Systems, Inc.
Booth #211
10 x 10
Corner
International Consortium for Advanced Manufacturing Research (iCAMR)
Booth #228
10 x 10
Corner
Inventec Performance Chemicals
Booth #118
10 x 10
In-Line
KOA Speer Electronics, Inc.
Booth #320
10 x 10
In-Line
Kulicke & Soffa Industries, Inc.
Booth #709
10 x 10
Corner
Kyocera America, Inc.
Booth #716
10 x 10
Corner
Metalor Technologies USA
Booth #504
10 x 30
Corner
Metallix Refining
Booth #120
10 x 10
In-Line
Micro Systems Technologies Management AG
Booth #707
10 x 10
In-Line
Microelectronics Assembly Technologies & Polymer Assembly Tech.
Booth #818
10 x 10
In-Line
MicroScreen LLC
Booth #221
10 x 10
In-Line
Micross Components
Booth #318
10 x 10
In-Line
Mini-Systems, Inc.
Booth #623
10 x 10
Corner
Moldex 3D Northern America, Inc. (Shared with Neu Dynamics)
Booth #104
10 x 10
In-Line
MRSI Systems LLC
Booth #400
10 x 10
Corner
NAMICS Corporation
Booth #717
10 x 10
Corner
NCSU Packaging Research in Electronic Energy Systems (PREES)
Booth: RESEARCH LAB: 527
10 x 10
Corner
NEO Tech
Booth #505
Island - 20 x 20
Corner
NETZSCH Instruments N.A. LLC
Booth #719
10 x 10
In-Line
Neu Dynamics Corp.
Booth #104
10 x 10
In-Line
NorCom Systems, Inc.
Booth #617
10 x 10
Corner
Nordson DAGE
Booth #705
10 x 10
Corner
Noritake Co., Inc.
Booth #109
10 x 10
In-Line
Northrop Grumman Corporation
Booth #727
10 x 10
Corner
nScrypt, Inc.
Booth #718
10 x 20
Corner
NTK Technologies, Inc.
Booth #420
10 x 10
In-Line
Ormet Circuits, Inc.
Booth #805
10 x 10
In-Line
PA&E
Booth #311
10 x 10
Corner
Pac Tech Packaging Technologies USA
Booth #201
10 x 10
Corner
Palomar Technologies, Inc.
Booth #511
10 x 20
Corner
Panasonic Factory Solutions Company of America
Booth #102
10 x 10
In-Line
Perfection Products, Inc.
Booth #501
10 x 10
Corner
Plasma-Therm, LLC
Booth #304
10 x 20
Corner
Quik-Pak, a division of Promex Industries
Booth #520
10 x 10
In-Line
relayr
Booth #823
10 x 10
Corner
Reldan Metals Co., Div of AR Metals, LLC
Booth #300
10 x 10
Corner
Riv Inc. ~ Precision Printing Screens
Booth #401
10 x 10
Corner
Royce Instruments, LLC
Booth #305
10 x 10
Corner
Rudolph Technologies
Booth #410
10 x 10
Corner
Sales & Service, Inc.
Booth #319
10 x 10
In-Line
Samtec, Inc.
Booth #105
10 x 20
Corner
SANTIER Thermal Management Solutions
Booth #620
10 x 10
In-Line
Sekisui Chemical
Booth #627
10 x 10
In-Line
Semi Dice, Inc.
Booth #700
10 x 10
Corner
Semiconductor Enclosures, Inc.
Booth #722
10 x 10
Corner
Semiconductor Equipment Corporation
Booth #622
10 x 10
Corner
Shinko Electric America
Booth #821
10 x 10
In-Line
Sikama International, Inc.
Booth #710
10 x 10
In-Line
SMART Microsystems
Booth: RESEARCH LAB: 328
10 x 10
In-Line
SOMACIS
Booth #323
10 x 10
Corner
Sonoscan, Inc.
Booth #516
10 x 10
Corner
SST International
Booth #600
10 x 20
Corner
Stellar Industries Corp.
Booth #500
10 x 10
Corner
Taiyo Ink Mfg. Co., Ltd.
Booth #204
10 x 10
Corner
Tanaka Precious Metals
Booth #106
10 x 20
Corner
Tango Systems, Inc.
Booth #809
10 x 10
Corner
TDK Corporation
Booth #207
10 x 10
In-Line
Technic, Inc.
Booth #316
10 x 10
Corner
Teledyne Microelectronic Technologies, Inc.
Booth #404
10 x 10
Corner
Teledyne Microwave Solutions
Booth #404
10 x 10
Corner
Torrey Hills Technologies, LLC
Booth #816
10 x 10
Corner
TPT Wire Bonder
Booth #406
10 x 10
In-Line
Tresky Corporation
Booth #408
10 x 10
In-Line
Unisem Group
Booth #205
10 x 10
Corner
USF College of Marine Science
Booth: RESEARCH LAB: 327
10 x 10
Corner
Utz Technologies, Inc.
Booth #822
10 x 10
Corner
West Bond, Inc.
Booth #317
10 x 10
In-Line
XYZTEC
Booth #417
10 x 10
Corner
YINCAE Advanced Materials, LLC.
Booth #409
10 x 10
Corner
Yole Developpement
Booth #626
10 x 10
Corner
YXLON Feinfocus
Booth #200
10 x 10
Corner
Zeta Instruments
Booth #407
10 x 10
In-Line

 

 

MPP

:: Job Openings ::

:: Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

MST

Indium Corp - Keynote Presentations Sponsor

Palomar Technologies: Dessert "Happy Hour" Sponsor

Technic

Honeywell - Student Programs Sponsor

Northrop Grumman EC - Poster Session Sponsor

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


:: THANK YOU IMAPS 2015 EXHIBITORS AND SPONSORS!

NEO Tech - Premier Sponsor, Platinum
NEO Tech
Booth #:
  505
9340 Ownesmouth Ave.
Chatsworth, CA 91311
(P) 818-734-6500
(E) info@neotech.com
(W) www.neotech.com
After four decades of growing in experience and expertise, NEO Tech has emerged as North America’s largest assembler of hybrid and microwave microelectronics.  NEO Tech has thrived by offering our customers an unmatched understanding of materials, production equipment, standardized processes and defect-elimination approaches.

Heraeus Materials Technology - Premier Sponsor, Gold
Heraeus Electronics

Booth #:
  605
24 Union Hill Rd
Conshohocken PA 19428 USA
(P) 610-825-6050
(E) electronics@heraeus.com
(W) www.heraeus-electronics.com
Heraeus Electronics is a proud supplier to the electronics industry. This year we are excited to present a bolstered catalogue of products that include Thick Film pastes, LTCC materials, precious metal powders, solder paste, solder powders, adhesives, and a wide variety of bonding wire. This year we will be showcasing various products which are designed to support the need for improved circuit performance in the power electronics industry.  Visit our booth to see our product highlights which include, materials sets for low and high temperature heaters, conductors for use with AlN substrates, and Copper Pastes for high power electronics.

New Au for AlN Substrates
Heraeus is introducing a new Pb- and Cd-free gold conductor paste that offers excellent adhesion on AlN substrates. The paste, C5730, will not peel away from the substrate after the dicing operation has been performed on AlN substrates. C5730 features high conductivity and excellent Al and Au wire bondability, and is ideal for applications that require good adhesion to both alumina and aluminum nitride ceramics. The product is REACH- and RoHS-compliant. For more information on C5730 gold conductor paste, please contact your local Heraeus sales representative.

Low-Temperature Paste for Multilayer Chip Capacitor Applications
Automotive electronics are subjected to high stress through vibration and severe bending. New requirements for enhanced mechanical robustness need new solutions. Heraeus ET2001 is one in a series of polymer end terminations that provides a flexible connection of the component to the circuit board in order to meet the stringent automotive requirements. It eliminates the risk of crack formation in the ceramic which could expose the electrodes and affect the integrity of the board, leading to potential board failures.  This dippable, silver end termination product has a fast-curing polymer system. ET2001 is a Pb- and Cd-free plateable product that is compatible with multilayer ceramic chip capacitors (NPO and X7R bodies). It offers excellent plated adhesion and cosmetics, and can be used in BME/PME applications. Unlike many commercially available polymer-based pastes, ET2001 does not need to be kept frozen; it can be stored at room temperature for up to three months and has a shelf life of six months when stored in a refrigerator. The product is REACH- and RoHS-compliant.
For more information on ET2001 silver end termination paste, please contact your local Heraeus sales representative.

Metalor - Premier Sponsor, Silver
Metalor Technologies USA

Booth #:
  504
255 John L. Diestch Blvd.
North Attleboro, MA 02763
(P) 508-699-8800
(E) gary.nicholls@metalor.com
(W) www.metalor.com/
The Advanced Coatings Division has a number of competitive advantages in the market place: best in class gold, silver and PGM products and solutions, consistency in product quality, product reliability, maximum performance in application and lowest applied cost (via speed, yield, delivery advantages). The division is positioning itself as a one-stop-provider of a comprehensive range of services.

 

5N Plus Micro Powders
Booth #:
  418
4385 Garand St.
Montreal, Quebec, H4R 2B4 Canada
(P) 514-856-0644
(E) sales.micropowders@5nplus.com
(W) www.5nplus.com
5N Plus Micro Powders, invested significantly in developing a high performance atomizing technology to efficiently manufacture fine metallic powders – down to the 1 to 25 micron range.  We have recently established a new production facility at our Montreal headquarters to serve the electronic powders markets.   This unique technology allows for the preparation of spherical powders with low oxygen content and uniform size distribution. Our parent company, 5N Plus Inc, is the leading producer of high purity specialty metals and chemical products with 11 manufacturing operations globally and 16 sales offices in Europe, Asia and the Americas.

AdTech Ceramics
Booth #:
  800
511 Manufacturers Road
Chattanooga, TN  37405     USA
(P) 423-755-5400
(E) sales@adtechceramics.com
(W) www.adtechceramics.com
AdTech Ceramics offers a full line of multilayer co-fired ceramic packages for electronic applications.  With a fully integrated manufacturing facility located in Chattanooga, TN and over 45 years experience producing high temperature co-fire ceramics (HTCC), we are ideally positioned to take on the most challenging packaging designs.  Additionally, our injection molding operation allows for the economical production of complex ceramic components that can be provided bare, with metallization and plating, or as a ceramic-to-metal assembly.  We are certified to AS9100C/ISO9001.

Advanced Dicing Technologies
Booth #:
  310
1155 Business Center Drive, Suite 120
Horsham, PA  19044
(P) (215) 773-9155
(E) ADT-USA-Support@ADT-CO-COM
(W) www.adt-co.com
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).    ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, annular blades and process know-how we bring our customers comprehensive dicing solutions.

Advance Reproductions Corp.
Booth #:
  803
100 Flagship Drive
North Andover, MA  01845 
(P) 978-552-1221
(E) d.robinson@advancerepro.com
(W) www.advancerepro.com
Advance Reproductions is a leading supplier of high-quality, large-area and optical photomasks and phototools. Advance is an ISO 9001and ITAR registered company. We support manufacturers throughout the world involved in the manufacturing of semiconductor, hybrid, microwave, nanotechnology, medical and electronic packaging devices. Advance Reproductions provides solutions and custom manufacturing services for research and development, custom shaped substrates and engineered tooling.

Advantest
Booth #:
  619
3061 Zanker Road
San Jose, CA  95134
(P) 408-456-3600
(E) THz_info@advantest.com
(W) www.advantest.com
A world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments.  The company’s leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world.    The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has recently introduced critical multi-vision metrology scanning electron microscopes and 3D imaging analysis tools for pharmaceutical and industrial applications. Founded in Tokyo in 1954 has subsidiaries worldwide.  More information is available at www.advantest.com

AEMtec GmbH
Booth #:
  226
James-Franck-Str. 10
Berlin 12489  Germany
(P) +49 30 6392-7300
(E) info@aemtec.com
(W) www.aemtec.com
AEMtec GmbH supports their customers by providing cutting edge technologies and services for highly sophisticated applications in various industries and encompassing the whole life cycle of your product – from the first idea through series production. AEMtec offers process development and qualification, industrialization and all-volume production of miniaturized and complex (opto-) electronic microsystems, by using high-end chip-level technologies, such as Chip on Board and Flip Chip, 3D-Integration and Opto-Packaging. Professional supply chain management allows a reduction in total cost of ownership (TCO).

As a result of AEMtec’s integration into the Swiss Exceet Group S.E., you gain from the flexibility of a medium-sized enterprise and benefit from the synergies with, and access to, the comprehensive resources of a strong European group. 

AI Technology, Inc. (AIT)
Booth #:
  308
70 Washington Rd.
Princeton Jct. NJ 08550
(P) 609-799-9388
(E) ait@aitechnology.com
(W) www.aitechnology.com
AI Technology, Inc. (AIT) provides advanced materials and adhesive solutions for microelectronic interconnection and packaging.    Today, AIT’s product line includes patented component, substrate and large die bonding adhesives and underfills, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling, single and multiple-chip module die bonding (230°C and above), and component and substrate bonding adhesives for military and commercial applications.  AIT’s thermal interface materials, including phase-change pads, greases, gels and adhesives, ensure ultimate performance in semiconductors, modules, computers and communication electronics applications.

AkroMetrix, LLC
Booth #:
  820
2700 NE Expressway
Building B, Suite 500
Atlanta, GA 30345
(P) 404-486-0880 (21)
(E) emoen@akrometrix.com
(W) www.akrometrix.com
Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products. Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes. 

AMADYNE GmbH
Booth #:
  209
Draisstrasse 11a
Buehl , 77815 , Germany
(P) +49 (0)7223 2818483
(E) info@amadyne.net
(W) www.amadyne.net
AMADYNE offers compact, flexible solutions for the automation of microelectronic  assembly manufacturing. Our systems are used for the precise production of sophisticated and complex components for microsystems engineering, micro opto-electronics and micro mechanical assemblies .  Our Products are fab1, CAT and EMU machines.  The professional competence of AMADYNE in meeting the challenges of these automation processes is evident in the unique combination of our hardware and software systems.  Our market main focus is to employ our competence to provide customized solutions by utilizing our existing base machines, thereby reducing the system development time and minimizing the overall system costs.

AMICRA Microtechnologies GmbH
Booth #:
  217
Wernerwerkstr. 4
Regensburg, D D-93049 Germany
(P) +49 941208209 (80)
(E) johann.weinhaendler@amicra.com
(W) www.amicra.com
AMICRA Microtechnologies GmbH provides customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS. 

Applied DNA Sciences
(Shared with Hi-Rel Group)
Booth #:
  116
50 Health Sciences Drive
Stony Brook, NY 11790
(P) 631-240-8800
(E) bob.macdowell@adnas.com
(W) www.adnas.com
Applied DNA Sciences makes life real and safe by providing botanical-DNA based security and authentication solutions and services that can help protect products, brands, entire supply chains, and intellectual property of companies, governments and consumers from theft, counterfeiting, fraud and diversion. SigNature® DNA describes the platform ingredient that is at the heart of all of our security and authentication solutions.     Applied DNA Sciences is performing work under an OSD-funded Rapid Innovation Fund, managed by US Defense Logistics Agency, and a Phase II SBIR awarded by Missile Defense Agency.

AT&S
Booth #:
  309
1735 N. First Street, #245
San Jose, CA. 95112  USA
(P) 408-454-5287
(E) f.johnson@ats.net
(W) www.ats.net
AT&S is a top HDI circuit board and IC package maker offering Embedded Component Packaging technology which embeds passives and/or bare ICs inside the center core of the laminate.   Embedding provides increased component density and smaller size by removing components from the board surface and embedding them inside the board. This also improves signal integrity with embedded discrete capacitors located just microns directly below the IC's. Components can be mounted on the top surface directly above the embedded components and on the bottom surface directly below. AT&S has 6 manufacturing sites in Austria (2), China (2), India, and Korea.

ATV Technologie GmbH
Booth #:
  616
Johann-Sebastian-Bach-Str. 38
85591 Vaterstetten
(P) +49-8106-3050-0
(E) sales@atv-tech.de
(W) www.atv-tech.de
Batch type VACUUM REFLOW Soldering OVENS/RTAs:  Void free solder joints, IGBT, DBC, CSP, Flip Chip, CPV, MMIC    In Line VACUUM REFLOW Soldering OVENS    MEMMS cap/Package lid sealing with GETTER activation    THERMO COMPRESSION BONDER up to 450°C:  Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering, Cu pillar/micro bump flip chip soldering     QUARTZ TUBE Furnaces:  LPCVD, CNT/graphene, oxidation, diffusion    THERMO COMPRESSION BONDER up to 1 100°C:  Constrained LTCC sintering, LTCC embossing, glass imprinting/embossing    Manual DIAMOND SCRIBERS: to 200 mm     IR LPCVD/ALD System, 50°C-1050°C, temperature/pressure alternation     BSET EQ GAS PLASMA SYSTEMS:  etching/cleaning/ashing/stripping/surface treatment/RI Etching, nondestructive Cu/Al wire functional de-capsulation,  functional de-layering, isotropic Polyimide removal, anisotropic Si3N4 removal, functional failure analyze

Axus  Technology
Booth #:
  423
7001 W. Erie Street, Suite 1
Chandler AZ 85226 USA
(P) 480-705-8000
(E) bvandevender@axustech.com
(W) www.axustech.com
Axus Technology delivers end-to-end support, for R&D through volume production, for CMP and substrate thinning applications.  Starting with process design and development in our CMP Foundry, through delivery of production tools and processes; Axus provides industry-leading process and equipment solutions for fabs, 3D integration, and wafer & device packaging users.

BE Semiconductor Industries (Besi)
Booth #:
  522
33 East Comstock Dr, Suite 4
Chandler, AZ 85225
(P) +1 480 497 6404
(E) info.chandler@besi.com
(W) www.besi.com
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. The principal brand names for Besi's assembly systems include Datacon, Esec, Fico and Meco. Semiconductor back-end processes supported by Besi equipment include die sort, epoxy and flip chip die attach, molding, trim & form, singluation, and plating.

BGA Technology
Booth #:
  223
116 Wilbur Place
Bohemia, NY 11716
(P): (631) 750-4414
(E): msullivan@bgatechnology.com
(W) www.bgatechnology.com
BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers. Our innovative systems allows us to provide a cost effective, high quality, quick turn solution. We have invested in the very latest technology, equipment and facility to meet all of our customers current and future needs.

Camtek USA, Inc.
Booth #:
  111
2000 Wyatt Drive, Ste. 3
Santa Clara, CA 95054
(P) 408-986-9540
(E) info@camtekusa.com
(W) www.camtek.co.il
Camtek develops and manufactures state-of-the-art Inspection and Metrology systems for the Semiconductor industry. Camtek's Eagle line delivers unparalleled Inspection and Metrology solutions supporting the Semiconductor industry from R&D to the high production volume environment, providing combined 2D and 3D capabilities on the same platform. The Eagle is designed to support the increased requirements for inspection and metrology for the market's most demanding applications, including bumps, surface defects, post dicing, RDL and the emerging advanced packaging segment. Camtek Ltd. provides automated solutions dedicated for enhancing production processes and yield in three industries: Semiconductors, Printed Circuit Board (PCB) and High Density Interconnect Substrates.

Canon USA
Booth #:
  726
3300 North 1st St.
San Jose, CA 95134
(P) 408-468-2000
(E) semi-info@cusa.canon.com
(W) www.usa.canon.com/industrial
Canon U.S.A., Inc. (www.usa.canon.com) is a leader in Digital Imaging and Industrial Products.  Canon USA provides advanced Lithography, Physical Vapor Deposition (PVD) and Panel Process Equipment and technology for advanced packaging, 3D and interposer applications.   Canon continuously developes innovative solutions for demanding applications as demonstrated by the FPA-5510iZs and FPA-5510iV steppers and the Canon Anelva EL3400 inline deposition tool that are designed to deliver advanced process capability while lowering total process costs.

CEA Leti
Booth #:
  526
17 Rue des Martyrs
Grenoble 38000 FRANCE
(P) 33 4 3878 3922
(E) andre.rouzaud@cea.fr
(W) www-leti.cea.fr/en
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. In addition to Leti’s 1,700 employees, there are more than 250 students involved in research activities, which makes Leti a mainspring of innovation expertise. Leti’s portfolio of 2,800 patents helps strengthen the competitiveness of its industrial partners.

Ceradyne, Inc., a 3M company
Booth #:
  804
Seattle Offices, Ceradyne, Inc., a 3M company, 6701 Sixth Ave. So.
Seattle, WA 98108 | USA
(P) 206-763-2170
(E) specialtyglass@mmm.com
(W) www.3m.com/specialtyglass
Ceradyne, Inc., a 3M company has a 50-year history of developing and manufacturing specialty glass compositions for a wide range of markets. Our custom glass compounds and solar metallization paste additives are precision-manufactured for consistent physical properties. Whatever your stage of product development, we are ready to assist you – from glass design and engineering services through scale-up and full-scale production, with analytical support and quality control provided in-house.

Coining, Inc.
Booth #:
  807
15 Mercedes Drive
Montvale, NJ 07645
(P) 201-791-4020
(E) vito.tanzi@ametek.com
(W) www.coininginc.com or
www.ametek-ecp.com
Manufacturer of quality Preforms, Micro stampings and Bonding Wire for low-high temp soldering/brazing. Highly pure alloys of gold, silver, lead, tin, indium, bismuth, palladium,  aluminum.  Lead-free RoHS. Copper, Kovar® & molybdenum, clad, plated stampings. Flux coating. Tape & reel packaging, custom packaging. Cover Assemblies (preform/lid). Extensive tooling library, standard & custom designs.  Quick turnaround. Request our brochure by calling 201-791-4020 or go to our website at www.coininginc.com or www.ametek-ecp.com

Conductive Containers, Inc.
Booth #:
  518
4500 Quebec Ave
New Hope, MN 55428 USA
(P) 763-537-2090
(E) zachb@corstat.com
(W) www.corstat.com
At CCI, we eliminate ESD. Every day we take on ESD problems and wrestle them into submission. From material handling products to shippers and packaging to production process reviews. We know what it takes to eliminate ESD from your manufacturing and handling processes.   Our path to leadership in the static safe packaging  industry has included the invention of Corstat conductive corrugated materials in 1978 and the design of a broad scope of products using that material. Our roots go back to a passion for creating complete packaging materials for static sensitive products.

Criteria Labs

Booth #:
  122
706 Brentwood St
Austin TX 78752
(P) 512-637-4500
(E) info@criterialabs.com
(W) www.criterialabs.com
Criteria Labs is a Back-End Semiconductor services company focused on Reliability testing and Package assembly. We provide SCD package assembly, wafer and package test, reliability testing, device characterization, counterfeit analysis, and failure analysis as well as tape and reel services. Our customer base is comprised of Aerospace, Military, Commercial, Medical, and Fabless Semiconductor industries. Criteria Labs is MIL-PRF-38535 / MIL-STD-883 certified and is DLA Class Q certified for Assembly and Test.

DeWeyl Tool Company
Booth #:
  206
959 Transport Way
Petaluma, CA
(P) 707-765-5779
(E) jpalmer@deweyl.com
(W) www.deweyl.com
DeWeyl provides the finest quality bonding wedges in the world.  Located in the Petaluma, CA, DeWeyl's primary business is manufacturing wire bond wedges and custom high precision tooling for the semiconductor, aerospace and medical industry.  DeWeyl produces wedges made from ceramic, titanium and tungsten carbide for small and large round wire and ribbon applications.

DfR Solutions LLC
Booth #:
  421
9000 Virgina Manor Road, #290
Beltsville, MD 20705
(P): 301-474-0607
(E): amcgrath@ignitionmarketing.com
(W) www.dfrsolutions.com
DfR Solutions is the leading provider of quality, reliability, and safety software and services for the electronics industry.  We support clients across electronic technology markets including aviation and aerospace, automotive, consumer, industrial, medical, military, solar, telecommunications, as well as throughout the electronic component and material supply chain.

DuPont Microcircuit Materials
Booth #:
  701
14 T.W. Alexander Drive
Research Triangle Park, NC 27709
(P) (800) 284-3382
(E) mcmcustomerservice@usa.dupont.com
(W) www.mcm.dupont.com
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film and GreenTape(tm) low temperature co-fired ceramic (LTCC) compositions for a wide variety of printed electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. We deliver solutions that lower the cost of ownership and improve performance, reliability and functionality. For more information on DuPont Microcircuit Materials and Solamet® metallization pastes, please visit http://mcm.dupont.com.

East China Research Institute of Microelectronics
Booth #:
  321
1011 RIver Mist Dr.
Rochester, MI  48307  USA
(P) 248-462-2712
(E) twang@blueoceansllc.com
(W) www.blueoceansllc.com
ECRIM engages in developing, manufacturing and sales of variety of Microelectronic and Pacakge products. ECRIM is known for its technical strength, proven product reliability, innovative solutions, quick response, competitive pricing and overall value. We have seven product lines including LTCC, AIN/HTCC, Thick Film, Thin Film, Metal Hermetic Package and Furnace.

Element Six Technologies US Corp.
Booth #:
  422
3901 Burton Drive
Santa Clara, CA 95054 
(P) 408-986-2410
(E) Thomas.obeloer@e6.com
(W) www.e6.com
E6 fabricates and sells engineered synthetic poly- and single crystal diamond products and diamond composites. Technologies using diamond include thermal management, high power laser optics, beam splitters, IR spectroscopy, high energy particle detectors as well as electrochemistry and scientific applications. Custom engineered configurations are available to meet your requirements.

EPP
Booth #:
  219
Lochhamer Schlag 17
82166 GRAEFELFING
(P) +49-89-8299890
(E) hstenger@epp-germany.com
(W) www.epp-germany.com
AOI Systems in 2D/3D, INLINE & OFFLINE, Manual & Automatic, for inspection of Screen printed, sputtered or electroplated circuitry.  For inspection of Thick/Thin Films, LTCCs, sensors, Wafers, LED ceramics, Automotive, Military, Medical, Telecom Electronics.

ESL ElectroScience
Booth #:
  806
416 E. Church Road
King of Prussia, PA 19406
(P) 610-272-8000
(E) ltimko@electroscience.com
(W) www.electroscience.com
ESL ElectroScience specializes in providing solutions to enable customers to take technologies from concept through high volume production using thick film pastes and ceramic tapes. ESL products can be found in hybrid microcircuits, multilayer microelectronics, transformers, thick film heaters, sensors, and fuel cells. For more information visit us at www.electroscience.com

EV Group, Inc.
Booth #:
  723
7700 S. River Parkway
Tempe, AZ 85284
(P): (480) 305-2456
(E): k.roe@evgroup.com
(W) www.evgroup.com
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

F&K Delvotec
Booth #:
  611
27182 Burbank
Fotthill Ranch, CA 92610 USA
(P): 949-595-2200 (247)
(E): Steven.buerki@fkdelvotecusa.com
(W) www.fkdelvotec.com/html_englisch
F&K Delvotec is an industry leader in wire bonding technology. Our broad portfolio of products delivers a solution for any wire bonding application. Over 30 patents in wire bonding technology testify to our continuing emphasis on innovative technology, and our dedicated development, applications and service team provides optimum customer support, worldwide. F&K Delvotec manufactures complete bonding systems including transducers and ultrasonic generators as well as test equipment that has become the industry standard for evaluation of ultrasonic bonding systems. Whatever wire bonding is required, F&K Delvotec offers a suitable tailored solution – from bond process development to complete automation systems.

Ferro Corporation
Booth #:
  618
6060 Parkland Blvd.
Mayfield Heights, OH 44124
(P) 216-875-5600
(E) Ed.Stadnicar@Ferro.com
(W) www.ferro.com
Ferro Corporation is a leading global supplier of technology-based performance materials, including glass-based coatings, pigments and colors, electronic materials, and polishing materials.  Ferro products are sold into the electronics, building and construction, automotive, appliance, household furnishings, and industrial products markets.  Its electronics portfolio includes electronic packaging and electro-ceramic materials, electronic glass materials, and other engineered products used in the manufacture of hybrid circuits, microelectronics, advanced packaging, multilayer chip components, and other electronic devices. Ferro also produces semiconductor wafer polishing materials.

Finetech
Booth #:
  416
560 E Germann Rd #103
Gilbert, AZ  85297
(P) 480-893-1630
(E) sales@finetechusa.com
(W) www.finetechusa.com
Finetech offers sub-micron accuracy die bonders for advanced packaging and micro assembly, with a portfolio of manual, motorized and automated models. Typical applications include flip chip, VCSELs, laser bars & diodes, sensors, photonics packaging, RFID, Chip to Wafer, Cu pillar, Chip on Glass and 3D.  Process flexibility is suitable for R&D or prototyping environments -- thermo-compression, thermo-sonic, eutectic, epoxy, ACF & Indium bonding.  Finetech also provides advanced rework systems for today’s most challenging applications.  Our experienced staff provides collaborative engineering to assist customers with development and new technologies.

Fogale Nanotech
Booth #:
  521
125, Rue de l'hostellerie
30900 Nimes France  
(P) +33 4 66 62 05 55
(E) g.ribette@fogale.com
(W) www.fogale.com
FOGALE nanotech is the Leader in Metrology & Inspection Tools for 3D Packaging, MEMS and related applications.
It is based on multi-sensor heads which include different technologies in the same integrated tool, capable to measure all required dimensions and defects.
FOGALE has a continuing development effort that has tracked and satisfied customer requirements and stays in front of the next production needs.

Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Booth #:
  326
Winterbergstrasse 28
Dresden, 01277 Germany
(P): 4935125537696
(E): uwe.partsch@ikts.fraunhofer.de
(W) www.ikts.fraunhofer.de
The Fraunhofer Institute for Ceramic Technologies and Systems IKTS covers the complete field of advanced ceramics, from basic research to applications. Our services include the development and application of modern advanced ceramic materials, the development of industrial powder metallurgical technologies, and the manufacturing of prototypical components. Structural ceramics, functional ceramics and cermets are the main focus with emphasis on innovative complex systems which are applied in many industry sectors.

Geib Refining Corp.
Booth #:
  405
399 Kilvert St
Warwick, RI 02886
(P) 1-800-228-4653
(E) Mike@GeibRefining.com
(W) www.GeibRefining.com
Precious metal reclaim of gold - platinum - palladium - silver - iridium - ruthenium    ITAR and EPA compliance means 100% destruction of your intellectual property in a regulated and environmentally responsible manner.    We process all types of precious metal scrap including hazardous wastes. We also support thin film technology through shield cleaning to UHV standards.  Settlements include bullion, source materials, or check/wire.    We have many sound relationships within the IMAPS community and are a major supporter of IMAPS New England.    Stop on over and learn why Geib is the most valued precious metals refining source.

Georgia Tech 3D Systems Packaging Research Center (PRC)
Booth #:
  426
813 FERST DRIVE, NW
ATLANTA, GA 30332
(P) 404-894-9097
(E) vs24@mail.gatech.edu
(W) www.prc.gatech.edu
The 3D Systems Packaging Research Center (PRC) at the Georgia Institute of Technology is an Industry-Centric Global Academic Center dedicated to leading-edge system scaling research and inter-disciplinary education in the System-on-a-Package (SOP) vision to enable highly miniaturized, mega-functional systems in a single package. Led by Prof. Rao Tummala, the PRC offers a variety of industry partnerships and consortia research programs which include Electrical, Mechanical, Thermal Designs, Glass  and Organic Packaging, Passives and their Integration with Actives, Panel Embedded Packaging, RF, Power, Optical, MEMS and Sensors Packaging, High- temperature and High-temperature Packaging. Industry benefits include IP rights, technology transfer, access to well-educated students, state-of-the-art 300mm R&D facilities, advanced technology prototypes, and more.

Good-Ark Semiconductor
Booth #:
  101
608-7 Johnson Ave
Bohemia, NY 11716
(P) 631-513-1432
(E) gpendola@goodarksemi.com
(W) www.goodarksemi.com
Good-Ark Semiconductor provides the following product families in various package types from through-hole to surface mount devices as well as wafer/bare die for hybrid applications. Good-Ark has the flexibility and R&D capability of providing custom devices to meet customers' specific requirements.  Diodes / Rectifiers / Bridge Rectifiers / Protection Devices / Thyristors / Transistors / Small Signal MOSFETs / Power MOSFETs / MEMS (Accelerometers & Magnetometers)

Haiku Tech, Inc.
Booth #:
  419
1669 N.W. 79th Avenue
Miami, FL  33126
(P) 305-463-9304
(E) mdemoya@haikutech.com
(W) www.haikutech.com
Customized Technical and equipment solutions for the manufacture of electronic passive components, e.g. LTCC, HTCC, MLCC, etc. Products’ portfolio includes: dielectric powders, binders, tape casters, sheet blankers, mechanical punches, screen printers, stackers, isostatic laminators, green chip (hot knife) dicers, termination equipment, furnaces, optical dilatometers and visual inspection equipment. We also offer ceramic tape development and manufacturing consulting services.

Hary Manufacturing Inc.
Booth #:
  609
24 Cokesbury Road
Lebanon NJ 08833
(P) 908-722-7100
(E) sales@hmiprinters.com
(W) www.hmiprinters.com
Hary Manufacturing, Inc. (HMI) is a premier supplier of Precision Screen Printers for the thick-film, hybrid and other precision deposition applications. Complimenting products include Infrared conveyor dryers and substrate handling automation for a wide range of applications. HMI offers full spare parts and technical support for AMI Presco printers as well as all HMI equipment. Our consumable product lines provide printing squeegee and lint-free cleaning cloths to satisfy the production needs of our customers.  Please visit www.hmiprinters.com for more information

HD MicroSystems, LLC
Booth #:
  817
250 Cheesequake Road
Parlin, NJ 08859
(P) (800) 346-5656
(E) Kevin.T.Demartini@dupont.com
(W) www.hdmicrosystems.com
HD MicroSystems is a joint venture company of Hitachi Chemical and DuPont Electronics specializing in liquid polyimide (PI) and polybenzoxazole (PBO) dielectric coatings.  HDM will highlight new low stress and low temperature cure polymeric materials for advanced packaging technologies with innovative processes for Flip Chip, WLP and 3D/TSV applications, including interlayer dielectrics (ILD), stress buffer materials (SB), redistribution dielectric layers (RDL) and wafer bonding adhesives (temporary and permanent).

Hesse Mechatronics, Inc.
Booth #:
  208
225 Hammond Avenue
Fremont, CA 94539
(P) 408-436-9300
(E) jolynn.snell@hessemechatronics.us
(W) www.hesse-mechatronics.us
Designs and manufactures thin wire bonders for aluminum and gold, and heavy wire bonders for aluminum, gold and copper, round wire and ribbon, including HCR™ (High Current Ribbon). Services include wire bonding equipment training, applications support, development and production of prototypes and pre-production manufacturing at four applications and demonstration labs.

Hi-Rel Group, LLC
(Shared with Applied DNA Sciences)
Booth #:
  116
16 Plains Rd
Essex, CT 06426
(P) 860 767 9031
(E) tschmidt@hi-rel.net
(W) www.hirelgroup.com
The Hi-Rel Group supplies custom designed components and specialized materials to the microelectronic and optoelectronic industries. Our capabilities include component design, CNC machining, plating, assembly, and environmental testing in the manufacture of the following product categories: Microelectronic Getters, Hermetic Package Lids, Microelectronic & Packaging Support Components, Solder & Brazing Preforms and Thermal Management Solutions. We have a long and highly successful history of supporting the microelectronics industry for more than 40 years.

Hi-Rel Laboratories, Inc.
Booth #:
  708
6116 N Freya
Spokane, WA  99217
(P) 509-325-5800
(E) roger@hrlabs.com
(W) www.hrlabs.com
Hi-Rel Laboratories is an independently owned and operated corporation whose main concentration of activity is in the materials evaluation of the micro-electronic oriented phases of commercial, aerospace and defense industries.  We specialize in the solution of process, production and application problems requiring knowledge and experience in microelectronics and materials technology.

Hitachi Chemical
Booth #:
  322
10080 North Wolfe Road, Suite SW3-200,
Cupertino, CA, 95014
(P) 408-873-2200
(E) hca-smg02@hitachi-chemical.com
(W) www.hitachi-chem.co.jp/english/index.html
Hitachi Chemical group makes proposals stepping into the know-how of material combinations and manufacturing processes, in addition to supply of materials, to solve product development problems encountered by customers.     We are aiming to provide total solutions from our customer’s point of view. In 2014, we reinforced our assembly and evaluation equipment that simulates the customer environment and started operations of open laboratory.     By bringing our sample materials and parts supplied by customers to the lab, and by packaging and evaluating them together with our customers, it enables us to shorten development period and to propose new assembly processes.

HSIO Technologies
Booth #:
  808
13300 67th Ave N
Maple Grove, MN 55311
(P) 763-447-6260
(E) randy.knudsen@hsiotech.com
(W) www.hsiotech.com
HSIO Technologies applies advanced design concepts and manufacturing processes to enable interconnect solutions with ever smaller form factors and ever higher performance. The company has developed a patent-pending collection of technologies that eclipse performance and size limitations of traditional methods of electrical interconnect and power management. Combining traditional connector, chip packaging, and printed circuit manufacturing methods with processes used in the production of Photovoltaic, Display, LED, and Printed Electronics devices, the unique set of capabilities provide low cost, yet high performance methods to interconnect and power the components contained in electronic devices.

i3 Electronics, Inc
Booth #:
  523
1701 North Street
Endicott, NY 13760
(P) 866 820-4820
(E) info@i3electronics.com
(W) www.i3electronics.com
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly.
i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

IBM Bromont
Booth #:
  826
23 Airport Boulevard
Bromont, Quebec, Canada  J2L 1A3
(P) 450-534-6496
(E) assembly@ca.ibm.com
(W) www-03.ibm.com/systems/services/packaging/
IBM Bromont is a world leader in semiconductor packaging and test technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions. Tap into our know-how as the industry continues its shift to custom SoCs and SiPs.  IBM is known for its multi-chip packaging and heterogeneous integration. We offer full turnkey solutions from modelling and simulation to materials and process characterization, as well as optimized substrate design, a broad range of Burn-in and test competencies, and skillful failure analysis. We will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals.

iCAMR (International Consortium for Advanced Manufacturing Research
Booth #:
  228
400 W.Emmett Street
Kissimmee, FL
(P) (407) 742-4253
(E) iCAMR@ucf.edu
(W) www.iCAMR.net
iCAMR is an advanced materials manufacturing development center focused on the integration of semiconductor based processes and materials into future products like smart sensors and photonics devices. iCAMR serves as a one-stop shop for the development and integration of advanced devices (processes, tools, prototyping, packaging and EDA), providing access to III-V materials deposition on Silicon wafers, ultra-high density interposers and 3D interconnects.

Indium Corporation
Booth #:
  517
34 Robinson Road
Clinton, NY 13323
(P) 3158534900
(E) cbierstine@indium.com
(W) www.indium.com
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Indium Corporation experts will be presenting five papers at the event:

  • High-Reliability, No-Clean Solder Paste for Designs Where Flux Cannot be Dried by Dr. Ning-Cheng Lee, Vice President of Technology, and Fen Chen, Bench Chemist;
  • Porosity Evolution of Ag-Sintering at Die-Attach by Dr. Ning-Cheng Lee;
  • Types of Solder Preforms and Difficult Geometries by Herbert Ludoweig, Product Specialist for Engineered Solders;
  • The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process by Brandon Judd, Technical Support Engineer, Southwest/Rocky Mountains, U.S.;
  • Optimal SMT Electronics Assembly Guidelines for Stencil Printing by Ed Briggs, Senior Technical Support Engineer

Indium Corporation experts will also serve as chairs for the following sessions:

  • 3D Solutions for Specific Applications with Maria Durham, Technical Support Engineer, Semiconductor and Advanced Assembly Materials;
  • Materials and Processes with Tim Jensen, Senior Product Manager for Engineered Solders 

Jensen will also lead a professional development course titled Improving Mechanical, Electrical, and Thermal Reliability of Electronics. This course is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of the electronics assemblies.
IMAPS is the largest technical society dedicated to the advancement and growth of microelectronics and electronics packaging. Their 48th Symposium on Microelectronics will cover three tiers of electronics: systems and applications; design and related measurements; and materials, process, and reliability. Indium Corporation will be exhibiting at booth 517. For more information, visit www.imaps2015.org.

Infinite Graphics
Booth #:
  721
4611 East Lake St.
Minneapolis, MN 55406 
(P) 860-459-5085
(E) smcdonough@igi.com
(W) www.igi.com
Infinite Graphics provides precision imaging and software solutions. We offer high quality quick turn photomask services including non-stick mask coating. We can produce 3D microstructures on substrates up to 800mm x 800mm. Ask about our new solderpaste stencil software. Take stencil edits down from hours to minutes.

Institute for Electronics and Nanotechnology, Georgia Tech
Booth #:
  427
345 Ferst Dr. N.W.
Atlanta, Ga. 30332
(P) 404 894 3847
(E) dean.sutter@ien.gatech.edu
(W) ien.gatech.edu
The Institute for Electronics and Nanotechnology is an interdisciplinary research institute at Georgia Tech. IEN is purposed with the advancement of the micro and nano-enabled electronic systems for the benefit of mankind.     IEN provides an intellectual environment, shared-user infrastructure, and research support team available to industry and academia that enables and promotes interdisciplinary research, education, training, and technology transfer via the cooperative coalescence of academia, industry, and government programs.

Interconnect Systems
Booth #:
  211
759 Flynn Road
Camarillo, CA 93012
(P) 805-482-2870
(E) info@isipkg.com
(W) www.isipkg.com
Interconnect Systems, Inc. (ISI), specializes in high-density module packaging and advanced system-level interconnect solutions. ISI offers design, qualification, and testing, coupled with fully integrated in-house manufacturing. Capabilities include: high-density PCB design, fine pitch SMT, flip chip, wirebond assembly, IC packaging, custom molding, over molding, and automated optical inspection. www.isipkg.com

Inventec Performance Chemicals
Booth #:
  118
Rio Conchos 1757, El Rosario
Guadalajara, Jalisco 44890 Mexico
(P) 523338388866
(E) rhernandez@inventec.dehon.com
(W) www.inventec.dehon.com/en/
INVENTEC Electronic Business Unit is a company specialized in developing, producing and delivering soldering, cleaning and coating materials for the assembly of printed circuit boards and semiconductor packaging.    Our materials deliver a balanced added value integrating reliability, sustainability and compatibility between materials.     Solder paste for SMT, Package on Package, Jet Printing, wafer Bumping and die attach.  Solder fluxes for Wave Soldering, Package on Pachage and flip chip  Aqueous cleaners for PCBA defluxing and maintenance cleaning  Solvent cleaners for PCBA defluxing and maintenance cleaning  Coatings for protection of PCBA.    The markets we mainly serve are automotive, aerospace, LED lighting, semiconductor, energy, rail and industrial.

KOA Speer Electronics, Inc
Booth #:
  320
199 Bolivar Drive
Bradford, PA 16701 USA
(P) 814-362-5536
(E) dmcgriff@koaspeer.com
(W) www.koaspeer.com
As you search for surface mount passive components that will ensure the optimum performance of your circuit design, count on the broad line of products from KOA Speer. Our engineering teams are developing a wide range of new smaller sizes and integrated packages to accommodate higher clock speeds and product downsizing. Our world class manufacturing facilities are poised to ramp up with new designs, allowing us to take them to market with the shortest of lead times. And our sophisticated warehousing and distribution system ensures the availability of components when you need them.

Kulicke & Soffa
Booth #:
  709
1821 E. Dyer Rd. #200
Santa Ana, CA 92705 USA
(P) 949-660-0440
(E) sfrese@kns.com
(W) www.kns.com
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. K&S has expanded its product offerings in advanced packaging through the acquisition of Assembleon, which diversifies K&S’ participation in the automotive and industrial markets via advanced SMT. K&S solutions include ball bonding, wedge bonding, wafer level bonding, thermo-compression bonding, flip chip, FOWLP, WLP, SIP, PoP and Embedded Die. Combined with its expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor, LED devices and high quality printed circuit board assembly.

Kyocera America, Inc.
Booth #:
  716
8611 Balboa Ave.
San Diego, CA 92123
(P) 800-468-2957
(E) iris.labadie@kyocera.com
(W) americas.kyocera.com/kai-semiparts/
Kyocera America, Inc. (KAI) offers an extensive array of semiconductor packages and high frequency complex modules including mmW, RF, T/R modules, BGAs, SiPs, and High Power GaN packages in a variety of ceramic and organic material sets. KAI has state-of-the-art electrical design, modeling / simulation capability in-house to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing / bumping, vacuum soldering, test and burn-in.

Metallix Refining, Inc.
Booth #:
  120
59 Avenue at the Commons, # 201
Shrewsbury, NJ 07702
(P) 800-327-7938
(E) sales@metallixrefining.com
(W) www.metallixrefining.com
Metallix Refining Inc. has been in the precious metals refining business since 1968. We process and purchase scrap materials containing gold, silver, platinum, palladium and rhodium from small and large businesses alike, in the jewelry, medical, dental, electronics, specialty chemical, automotive and many other industries.

Micro Systems Technologies, Inc.
Booth #:
  707
1839 S. Alma School Road, Suite 270
Mesa, AZ 85210-3024, USA
(P) 480) 775 6878
(E) info@mst.com
(W) www.mst.com
The Micro Systems Technologies group comprises four technology companies providing innovative products and services for medical devices, especially implants, and other high-reliability/high-performance industries. The offering includes HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging technologies, batteries and hermetic feedthroughs for implants.

Visit Micro Systems Technologies (MST) at booth# 707 during the IMAPS 2015 exhibition in Orlando and find out about our comprehensive solutions in the field of microelectronics and electrical components for high-reliability / high-performance industries.

The offering includes HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging technologies, as well as batteries and hermetic feedthroughs for medical implants.

Susan Bagen, Application Development Manager at MST, will present some of the latest information on «Liquid Crystal Polymer (LCP) Substrates for Advanced RF Packaging» on Thursday, October 29, 2015, 10:45 am – 11:10 am. Futhermore, Dr. Rainer Dohle, a member of the R&D team at MSEB, will hold a presentation on «Study on Electromigration in Flip Chip Lead-Free Solder Connections with 30 µm or 40 µm Diameter on Thin Film Ceramic Substrates» on October 29, 2015, 03:00 pm – 03:25 pm.

We invite you to attend these presentations or visit us at booth# 707.

MicroScreen LLC
Booth #:
  221
1106 S. High Street
South Bend, IN  46601
(P) 574/232-4358
(E) hollyw@microscreen.org
(W) www.microscreen.org
MicroScreen LLC manufactures thick film screens and large format/solar screens in a wide variety of mesh and frame sizes, with highly controlled coating machines for uniform emulsion.  MicroScreen also offers laser cut and electroformed stencils for solder paste deposition.  All stencils are 100% inspected using ScanCheck AOI.  Options include Nano Coating, Fine Grain Metal, Invar Metal, MicroWeld step stencils, and Wizard frame and Space Saver frame systems.    MicroScreen is ITAR Registered.

Micross Components
Booth #:
  318
7725 N. Orange Blossom Trail
Orlando, FL 32810
(P) 407-298-7100
(E) sales@micross.com
(W) www.micross.com
Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state-of-the-art electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish.

Mini-Systems, Inc.
Booth #:
  623
20 David Rd.  P.O. Box 69
N. Attleboro, MA  02761-0069 
(P) 508-695-0203
(E) ctourgee@mini-systemsinc.com
(W) www.mini-systemsinc.com
For over 44 years, MSI has been supplying superb quality and on-time deliveries.  Absolute tolerances starting at 0.005% and TCR's at 2ppm/C.  Case sizes start at 0101.  Standard deliveries under 2 weeks.  MSI is ISO 9001 certified and is on the QPL for MIL-PRF-55342 and MIL_PRF-32159.

Moldex3D (Shared with Neu Dynamics)
Booth #:
  104
27725 Stansbury Blvd., Suite 190
Farmington Hills, MI 48334
(P) 248-946-4570
(E) susanvaaler@moldex3d.com
(W) www.moldex3d.com
About CoreTech System (Moldex3D)  CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995, and the current product “Moldex3D” is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI). More information can be found at www.moldex3d.com.

MRSI Systems
Booth #:
  400
101 Billerica Ave
N.Billerica, MA 01862
(P) 9786679449
(E) sales@mrsisystems.com
(W) www.mrsisystems.com
MRSI Systems Die Attach and Dispense Systems.   MRSI Systems is a leading supplier of high precision assembly and dispense equipment for the semiconductor and microelectronics industry offering systems for the manufacture of Microwave, Optical, MCM’s and MEM’s devices. With three decades of advanced packaging application experience, MRSI Systems products support multiple interconnect technologies, including epoxy die bonding, eutectic attach, thermo-compression and flip chip. The ultra-precision MRSI-M3 with 1 micron capability and the MRSI-705 Assembly Work Cells specialize in thin die handling and 3D packaging and the MRSI Systems  MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing including 125 micron dots. Supported dispense technologies include auger style pumps, precision time/ pressure, stamping and jetting.

NAMICS Corporation
Booth #:
  717
2055 Gateway Place, Suite 480
San Jose/CA/95110
(P) 408-516-4611
(E) info@namics-usa.com
(W) www.namics.co.jp/e
NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

NETZSCH Instruments North America LLC
Booth #:
  719
129 Middlesex Turnpike
Burlington, MA 01803 USA
(P) 781-272-5353
(E) nib_sales@netzsch.com
(W) www.netzsch.com
Thermal analysis & thermal properties measurement instruments plus contract testing services; Thermal diffusivity & thermal conductivity of electronic packaging materials according to ASTM E1461 by the Laser Flash Method, DSC, TGA, STA (true DSC-TGA), Dynamic Mechanical Analysis DMA, thermal expansion by TMA and Dilatometry, specific heat capacity by DSC, DEA - dielectric analysis for thermoset cure monitoring, and more.

Neu Dynamics Corporation (Shared with Moldex3D)
Booth #:
  104
110 Steamwhistle Drive
Ivyland, PA 18974
(P) 215-355-2460
(E) kevinhartsoe@neudynamics.com
(W) www.neudynamics.com - www.ndc-int.com
NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronic components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications.  We offer specialized equipment built for today’s high-tech semiconductor, assembly processes.  Find out what the NDC companies can do to make your products better and your life easier.

NorCom Systems, Inc.
Booth #:
  617
1055 West Germantown Pike
Norristown/ PA/19403 USA
(P) 610-592-0167
(E) caubertin@norcomsystemsinc.com
(W) www.norcomsystemsinc.com
NorCom Systems, Inc. manufactures optical leak test equipment for inspecting hermetically sealed packages.  The NorCom 2020 provides automated, in-line, full matrix gross and fine leak testing performed simultaneously with direct measurement of package leak rates in cc-atm/sec.  Package types inspected with the equipment include MEMS, PC board-mounted devices, Hybrids, crystal oscillators, and Hi-Rel.

Nordson Dage
Booth #:
  705
2370 Oak Ridge Way, Suite B
Vista CA 92081
(P) 510-683-3930
(E) aram.kardjian@nordsondage.com
(W) www.nordsondage.com
Nordson DAGE is the market leading provider of award winning test and inspection systems and is recognized as the industry standard.  The 4000Plus includes pneumatic Z control and Paragon™ GUI, performs pull/peel tests to 100Kg shear tests to 200Kg push tests to 50kg hot bump pull for PCB pad cratering (IPC9708) and Micro Materials. It has optional camera assist automation ideally suited for wire pull and ball/bump shear testing.
The 4000Optima is an all purpose pull and shear tester  including pneumatic Z control and Paragon™ GUI. The
The newest 4800 is for 200mm, 300mm, 450mm wafers and large board pull and shear testing.

Noritake
Booth #:
  109
2635 Clearbrook Drive
Arlington Heights, IL 60005
(P) 8474399020
(E) kawabata.cer@noritake.com
(W) www.noritake.co.jp/eng/products/ceramic/index.html
Over 100 years of experience, lessons learned, and no-how. "Noritake" is the leading industrial ceramics and materials company in all of Asia and other points locally. This allows "Noritake" and its partners to share in development and innovation. New innovations include, any kinds of ceramics materials based PCB for Pressure sensors, LED and Power Electronics...

North Carolina State University - PREES
Booth #:
  527
1791 Varsity Dr., Suite 100
Raleigh, NC 27606
(P) 919-513-5929
(E) DCHopkins@NCSU.Edu
(W) www.PREES.Org
The Laboratory for Packaging Research in Electronic Energy Systems (PREES) at the NSF-ERC FREEDM Systems Center at North Carolina State University, focuses on R&D in very high density, high frequency power electronic circuits. The lab uses advanced capabilities in multiphysics modeling and circuit fabrication to investigate the use of 3D printing of ceramics, plastics and metals, of Wide Bandgap SiC and GaN power semiconductors and advanced composites for thermal management, in applications such as telecom supplies, EV & Medium Voltage motor drives, and high voltage (>10kV) power semiconductor testing. The PREES program also develops students with multi-disciplinary studies in power electronic systems.

Northrop Grumman Corporation
Booth #:  727
7323 Aviation Blvd
Baltimore, MD
(P) 410-765-9399
(E) erica.folk@ngc.com
(W) www.ngc.com
Northrop Grumman is a leading global security company providing innovative systems, products and solutions in unmanned systems, cyber, C4ISR, and logistics and modernization to government and commercial customers worldwide. Please visit www.northropgrumman.com for more information.

nScrypt Inc.
Booth #:
  718
12151 Research Parkway, #150
Orlando, FL 32826
(P) 407-275-4720
(E) info@nscrypt.com
(W) www.nscrypt.com
nScrypt sells 3D printing and micro-dispensing platforms with 3 to 6 axis of motion.  nScrypt’s SmartPump™ technology dispenses a wide range of materials to include epoxies, solders, conductive polymers and pastes.  The fine line ability to reach 50 microns and less in line widths and dots of 75 microns and less enables many next generation packaging applications.  They also excel at printed conformal antennas.

NTK Technologies
Booth #:
  420
3979 Freedom Circle Drive, Suite 320
Santa Clara, CA 95054
(P) 408- 562-5124
(E) mstoops@ntktech.com
(W) www.ntktech.com
NTK Technologies is a leader in IC Organic and Ceramic Packaging. With global service centers, NTK offers a wide range of packaging materials and design services for Opto, LED, MCM, RF, CMOS Image Sensors, Hi-Rel, Satellite, FCBGA, FCCSP, FPGA, CPU, MPU, Automotive and Medical applications. Monolithic package designs for Medical and Mobile applications.  Optimum package designs for 10G, 40G, and 100/400G. Large and small scale Ceramic and Organic STFs are manufactured for high-speed probe-cards for semiconductor wafer test. Large and small scale ceramic substrates can be configured with narrow pitches and a wide range of pin count capabilities. NTK supports fast paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.

Ormet Circuits,Inc
Booth #:
  805
6555 Nancy Ridge Drive #200
San Diego, CA 92121
(P) 858-831-0010
(E) support@ormetcircuits.net
(W) www.ormetcircuits.com
Ormet Circuits, Inc. welcomes you to visit booth 805 for their introduction on next generation lead-free die attach materials for power semiconductor packages. Ormet’s lead-free sintering pastes are being used in semiconductor packaging, printed circuit boards, and as a solder alternative. The need for environmentally friendly, complex circuit boards and semiconductor packages is growing and the new methods of forming electrical and thermal interconnections are essential. Ormet Circuits is located in San Diego and is a privately held company engaged in the design, manufacture, and sale of electrically conductive interconnect materials.

PA&E
Booth #:
  311
434 Olds Station Rd
Wenatchee, WA 98802
(P) 509.664.8000
(E) sales@pacaero.com
(W) www.pacaero.com
Hermetic connectors and integrated electronic packages from PA&E protect sensitive electronics under the harshest conditions. Our components are widely used in military aircraft, missile systems, satellites, down-hole oil and implantable medical applications. We use unique materials and manufacturing processes and can optimize designs in a number of areas including: electrical performance, thermal transfer, size/weight reduction and more. We provide offers a range of manufacturing capabilities – machining, plating, vacuum brazing, laser welding, and more -- at a single location. This integrated manufacturing approach can reduce complexity and risk on your next project. Visit us in booth 311 to learn more.

PacTech USA Inc.
Booth #:
  201
328 Martin Avenue
Santa Clara, CA 95050, USA
(P) 408-588-1925
(E) teutsch@pactech.com
(W) www.pactech.com
PacTech USA Packaging Technologies, Inc. (Santa Clara, California) offers contract wafer bumping services using low-cost UBM (electro-less Ni/Au), solder stencil printing, and solder ball placement for quickturn and mass production.  PacTech USA also provides product demonstrations, training, and sales support.  PacTech designs and manufactures wafer bumping and assembly equipment for flip chip, WLCSP, and interposers.  PacTech is the worldwide leader in laser reflow and heating technology, implemented in systems for solder jetting (SB2) and flip chip attachment (LAPLACE), including 3D soldering for advanced packaging applications like Head-Gimbal Assembly (HGA), MEMS, Opto-electronic packaging, IR detectors, various sensor products, and LCD drivers.

Palomar Technologies
Booth #:
  511
2728 Loker Avenue West
Carlsbad, CA 92010 USA
(P) 760-931-3681
(E) csalerno@bonders.com
(W) www.palomartechnologies.com/
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Panasonic Factory Solutions Company of America
Booth #:
  102
1701 Golf Road, Suite 3-1200
Rolling Meadows, IL 60008  USA
(P) 847-637-9600
(E) PFSAmarketing@us.panasonic.com
(W) www.panasonicfa.com
Panasonic Factory Solutions Company of America (PFSA) develops and supports innovative manufacturing processes around the core of circuit manufacturing technologies and computer-integrated manufacturing software—thereby, contributing to the growth and prosperity of our customers’ businesses regardless of their mix or volume.

Perfection Products, Inc.
Booth #:
  501
1320 Indianapolis Avenue
Lebanon IN 46052
(P) 765-482-7786
(E) sales@perfection-products.com
(W) www.perfection-products.com
Perfection Products manufactures Process Magazines and Carriers.  Such products are Film Frames, Grip Rings, Magazines for Frames and Rings.  Lead Frame Magazines, Process Boats (formed & flat style) & Magazines, Antistatic Shippers for Frames and Rings.  Also, available are the 12.0” (300 mm) Wafer Frames and Magazines.    Perfection – Accept Nothing Less

Plasma-Therm
Booth #:
  304
10050 16th St. North
St. Petersburg, FL 33716
(P) 727-577-4999
(E) sales@plasmatherm.com
(W) www.plasmatherm.com
Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company's Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Plasma-Therm’s MDS-100 Singulator™ system brings the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Plasma-Therm’s status as a preferred supplier of plasma process equipment has been recognized with 17 consecutive VLSIresearch industry awards, including #1 rankings for customer satisfaction in the last three years.

Polymer Assembly Technology, Inc. & Microelectronics Assembly Technologies, Inc.
Booth #:
  818
104 TW Alexander Drive, PO Box 13279
Research Triangle Park, NC 27709
(P) 919-314-5520
(E) jclayton@polymerassemblytech.com jclayton@microassemblytech.com
(W) www.polymerassemblytech.com www.microassemblytech.com
Polymer Assembly Technology (PAT) provides prototype and low-volume flip chip assembly of high-density pixel imaging devices and temperature sensitive II-VI and III-V group materials, including: optical, radiation, and bio-medical sensors, and optical/polymer-MEMS. PAT offers a low-temperature alternative with electrically conductive and non-conductive polymer inks that can be stencil-printed and cured at temperatures as low as 70°C.    Microelectronics Assembly Technologies (MAT) has developed a unique multichip packaging technology using flexible circuits that may be enclosed within protective heat spreaders, compatible with DIMM-sockets for memory applications, or mated directly to pads arrayed on the motherboard with compression contacts for high-density microserver applications.

Quik-Pak, a division of Promex Industries
Booth #:
  520
10987 Via Frontera
San Diego, CA 92127
(P) 858-521-3607
(E): casey@icproto.com
(W) www.icproto.com
Quik-Pak, a division of Promex Industries, provides IC packaging, assembly, and wafer preparation services in its ISO 9001:2008 registered facility in San Diego, California.  Quik-Pak manufactures overmolded and pre-molded open cavity QFN packages that provide a fast, inexpensive solution for prototype to full production needs.  Same-day assembly services are provided to shorten time to market.  In addition to wire bond assembly for MW/RF applications, the company assembles flip chips, BGAs, sensors, MEMS, and chip-on-board and chip-on-flex assemblies.

relayr gmbh
Booth #:
  823
Tempelhofer Ufer 17
Berlin 10963 Germany
(P) +49 1792989866
(E) jackson@relayr.io
(W) www.relayr.io
relayr is providing the “middleware” or the “operating system” for the IoT. Our three pillar platform (including cloud, SDKs and prototyping hardware) allows easy, reliable and secure hardware onboarding for mobile, enterprise application or cloud development.    The key attributes for our architecture are openness and interoperability. Our goal is to become the center of gravity for the connected world, enabling IoT adoption across the globe.

Reldan Metals, Co div of Abington Reldan Metals, LLC
Booth #:
  300
550 Old Bordentown Road
Fairless Hills
(P) 800-764-9222
(E) sales@armetals.com
(W) www.armetals.com
Reldan Metals Co. Div. of Abington Reldan Metals, LLC refinery has been operating and handling precious metal scrap for over 35 years. Our goal is to maximize the value of your precious metal scrap. The company’s State of the Art, LEED certified facility is ISO 14001:2004 certified, OHSAS 18001:2007,   e-Steward 2.0:2013 , R2:2013 certified, GreenCircle certified , CHWMEG reviewed and ITAR registered.  LEED certification sets forth strict standards for energy-efficient and environmentally responsible workplaces. Abington Reldan Metals reflects its commitment to environmental sustainability at every step of the refining process. Our expertise, knowledge and skills help us serve many customers in an ever changing industry as well as providing the highest level of service for your precious metal recovery program.

Riv Inc ~ Precision Printing Screens
Booth #:
  401
31 Railroad Ave
Merrimack NH
(P) 603-424-0510
(E) tania@rivinc.com
(W) www.rivinc.com
Since 1986 Riv Inc. has been a leading manufacturer of high quality printing screens. We cater to: Thick Film Hybrid Electronics, Flex Circuitry, Membrane Swiches, RFID Antennas, Solar Cell Manufacturing and other Emerging Industries. We use only the finest mesh and emulsions available in our industry. This gives us the advantage of manufacturing the finest screen possible for your screen printing needs and lets us help you Print With Quality.

Royce Instruments, LLC
Booth #:
  305
831 Latour Court, Suite C
Napa, CA 94558
(P) 707-255-9078
(E) sales@royceinstruments.com
(W) www.royceinstruments.com
Celebrating over thirty years of US design and manufacturing, Royce Instruments’ products have earned excellent reputations for performance and reliability.  The 600 Series Bond Test Instruments offer extensive SPC and data sharing options (see in action with trinocular microscope at booth 305), as well as express module support to minimize down-time.  Quick change-over die sorters excel with critical geometry, fragile die.  Semi-automatic (DE35-ST) or fully-automatic with wafer-mapping (AutoPlacer MP300), both are designed to handle a high mix of applications.  Visit Royce booth 305 to discuss how the MP300’s touchscreen software platform can handle your latest die sorting requirements.

Rudolph Technologies
Booth #:
  410
One Rudolph Road P.O. Box 1000
Flanders, NJ 07836
(P) 973-691-1300
(E) info@rudolphtech.com
(W) www.rudolphtech.com
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.

Sales & Service Inc.
Booth #:
  319
4883 E. La Palma Ave. #505
Anaheim, CA.  92807
(P) 714-696-5332
(E) amy@salesandserviceinc.com
(W) www.salesandserviceinc.com
Manufacturer's Rep and Distributor

Samtec, Inc.
Booth #:
  105
520 Park East Blvd.
New Albany, Indiana 47150
(P) 812-944-6733
(E) glenn.dixon@samtec.com
(W) www.samtec.com
Known as the worldwide service leader for electronic connectors and cables, Samtec has focused on leading edge high speed products and services for the last 2 decades. The tremendous success in these areas has driven Samtec to further move into faster and smaller arenas. They now provide full turnkey solutions for your entire signal chain from IC, through the package, and through substrates, connectors and cables. Samtec can help you design, model, layout, and assemble your IC package with highest level of Signal Integrity.

SANTIER Thermal Management Solutions
Booth #:
  620
10113 Carroll Canyon Road
San Diego, CA  92131
(P) 858-348-1211
(E): brian.kopp@santier.com
(W) www.santier.com
SANTIER is a center of excellence for the design and manufacture of microelectronic housings and assemblies.  With our facilities in San Diego, we are integrated to manufacture metal matrix composites, multilayer high temperature co-fired ceramic, assembly and plating for customer thermal management products that span the aerospace, defense, medical, telecom, communications and many other industries around the world.

Sekisui Chemical Co., Ltd.
Booth #:
  627
32 Wadai
Tsukuba, Ibaraki, 300-4292
(P) +1(408)453-0880
(E) bu-film@sekisui.com
(W) www.sekisuichemical.com
Sekisui Chemical utilizes its unique fine particle, adhesion and precise synthesis technologies to develop and provide high-performance and intermediate materials for wide variety of fields such as electronics, automobiles and transportation, buildings and infrastructures, life sciences and industries. During IMAPS 2015, Sekisui Chemical will be showcasing advanced build-up dielectric materials that enable lower insertion loss and lower warpage for next generation FC-BGA and FC-CSP substrate needs.

Semiconductor Enclosures Incorporated
Booth #:
  722
85 Parker Street
Newburyport, MA 01950
(P) 9784621880
(E) Chrism@semiconductorenclosures.com
(W) www.semiconductorenclosures.com
Semiconductor Enclosures Incorporated (SEI) is a powder to package, fully integrated HTCC technical ceramics manufacturer located in Newburyport, Massachusetts. SEI provides ceramic tape systems, ceramic substrates, multilayer ceramic substrates, metallization services, metal to ceramic assemblies, and microelectronic ceramic packaging. We specialize in variety of aluminas, ZTA, and AlN. SEI provides ceramic based products and services to customers in microwave, RF, power, Hi-Rel, military, communications, aerospace, medical, optical and industrial markets. We manufacture here in the USA with Conflict Free Minerals and RoHS compliant materials.

Semiconductor Equipment Corp.
Booth #:
  622
5154 Goldman Avenue
Moorpark, CA 93021
(P) 805-529-2293
(E) sales@semicorp.com
(W) www.semicorp.com
Manufacturer and distributor of manual, semiautomatic, and automatic equipment for the Photonics, Semiconductor, MEMS, SMT and Hybrid Industries.  Back end products include flip-chip bonders, ultrasonic die bonders, laser diode bonders, eutectic die bonders, manual pick & place, epoxy die bonders, die rework, dicing tape, manual and automatic dicing tape applicators, UV tape curing system, backgrinding tape, backgrinding tape applicators, backgrinding tape peelers, and die ejectors.  Front end products include semiautomatic and fully automatic cassette, SMIF, RSP, FOSB, FOUP, and EUV pod cleaning systems and cleaning wafers for vacuum and e-chucks.

SemiDice, Inc
Booth #:
  700
10961 Bloomfield Street
Los Alamitos Ca 90720
(P) 562-594-4631
(E) dminter@semidice.com
(W) www.semidice.com
SemiDice is the only global wafer processor with a High Reliability Division Dedicated to providing bare die for medical aerospace, military and robust industrial applications. Whether your requirements are for bare die to meet the manufacturer data sheet or your own specification, SemiDice can react quickly to provide solutions for qualified components at a fair market price.

Shinko Electric America
Booth #:
  821
2880 Zanker Road #204
San Jose, CA, 95134 
(P) 408-232-0499
(E) rick.macdonald@shinko.com
(W) www.shinko.com
Shinko Electric Industries CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such  as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. Shinko   manufactures a full line of Organic Substrate structures including coreless options offering enhanced   electrical performance and package size reduction. Shinko can also provide subcontract assembly services with an   emphasis on packaging solutions such as POP, SIP and  Camera Modules utilizing our advanced package assembly   technologies, including our molded core embedded package, MCeP™. Shinko is located in Nagano, Japan and   provides the ultimate in service and solutions for our customers with Sales and Engineering support  worldwide.   For more about Shinko please visit our website at www.shinko.com.

Sikama International Inc.
Booth #:
  710
118 E. Gutierrez Street
Santa Barbara, CA 93101
(P) 805-962-1000
(E) sales@sikama.com
(W) www.sikama.com
For the past 33 years Sikama International has been in the business of designing, manufacturing and marketing solder reflow & curing systems, wafer flux coaters and wafer washers. We are recognized around the world for our reliable small footprint machines. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Epoxy Curing and many other applications. Please stop by Sikama booth number 710 to discuss your reflow soldering or curing requirements.

SMART Microsystems
Booth #:
  328
141 Innovation Drive
Elyria, OH 44035
(P) 440-865-0352
(E) kasey@smartmicrosystems.com
(W) www.smartmicrosystems.com
SMART Microsystems creates turn-key solutions for customer’s microelectronic sensor assembly and packaging hurdles in order to move technology from development to manufacturing.  Leveraging a highly experienced engineering team along with state-of-the-art facilities and equipment, SMART Microsystems accelerates prototyping, test, and the transition of new microelectronic sensor product to manufacturing

SOMACIS Inc.
Booth #:
  323
13500 Danielson Street
Poway, 92064 CA, USA
(P) 858-513-2200
(E) info@somacis.com
(W) www.somacis.com
For more than forty years, SOMACIS has been a dynamic company producing high-tech PCBs and delivering innovative solutions.  SOMACIS, headquartered in Italy, is one of the leading PCB manufacturers, with more than 800 employees and production plants in Italy (SOMACIS SpA), USA (SOMACIS Inc.) and China (DSG PCB Co., Ltd.).  SOMACIS is a worldwide partner supplying HDI, rigid, rigid-flex and flex PCBs for time critical and mass production requirements.

Sonoscan, Inc.
Booth #:
  516
2149 E. Pratt Blvd.,
Elk Grove Village, IL  60007 USA
(P) 847-437-6400
(E) jlykowski@sonoscan.com
(W) www.sonoscan.com
Founded in 1973 and headquartered in Chicago, IL, Sonoscan®, Inc. is a worldwide leader and innovator in Acoustic Micro Imaging (AMI) technology.  Sonoscan manufactures and markets acoustic microscope instruments and accessories to nondestructively inspect and analyze products.  Our C-SAM® scanning acoustic microscope provides unmatched accuracy and robustness setting the standard in AMI for the inspection of products for hidden internal defects such as poor bonding, delaminations between layers, cracks and voids.  In addition, Sonoscan offers analytical services through regional testing laboratories in Asia, Europe and the U.S. and educational workshops for beginners to advanced on AMI technology.

SST International
Booth #:
  600
9801 Everest Street
Downey, CA  90242
(P) 562-803-3361
(E) Sales@sstinternational.com
(W) www.sstinternational.com
SST International manufactures vacuum/pressure furnaces for high-reliability microelectronic package assembly. SST’s furnaces create void-free solder joints without flux. Applications include eutectic die attach, hermetic package sealing, lead-free soldering, fiber-optic component soldering, glass-to-metal sealing, high temperature brazing, high vacuum MEMS package sealing with getter activation, wafer bonding and solar cell attach.     Let SST International partner with you to assist you in achieving the highest reliability processes possible. This partnership offers over 50 years of soldering experience of SST International and the dedication to provide you with state of the art equipment and the best process support available, worldwide.

Stellar Industries Corp.
Booth #:
  500
50 Howe Avenue
Millbury, MA 01527
(P) 508-865-1668
(E) jasong@stellarind.com
(W) www.stellarind.com
Stellar’s custom products include precision lapped  and polished electronic grade ceramics composed  of Alumina, Beryllium Oxide, Aluminum Nitride,  and other specialty dielectrics. Stellar also provides  custom/design specific metallization services on  these ceramics using a variety of thick film, thin  film, refractory, plated, and Direct Bond Copper  technologies.  Stellar is ITAR Registered and AS9100 Certified.  We’ve been in business for over 30 years and our  vertically integrated facility provides both the  agility and flexibility to help bring your ideas to  market.  We’ll work with you from initial consultation  and design phases though prototype and full  production manufacturing. We have the capacity,  the equipment, the team, and the experience to  support your requirements now and in the future.

Taiyo Ink Mfg. Co., Ltd.
Booth #:
  204
2675 Antler Drive
Carson City, NV 89701
(P) 775-885-9959
(E) dano@taiyo-america.com
(W) www.taiyoink.co.jp/english/index.html
Taiyo Ink is the market leader in the solder mask field.  Printed wiring boards are used in a variety of electronics products, from cellular phones, PCs, and other IT equipment, to digital household appliances and in-vehicle electronic equipment. Solder mask is an essential element in these printed wiring boards. Taiyo Ink is a chemical manufacturer that boasts a 50% share in the global solder resist industry.

Tanaka Precious Metals
Booth #:
  106
235 Vineyard Court, Suite 150
Morgan Hill, CA 95037
(P) 408-779-0461
(E) tki-usa@ml.tanaka.co.jp
(W) www.tanaka.co.jp/english
Tanaka Precious Metals started out as a gold and silver exchange 130 years ago, expanding rapidly into industrial products. Tanaka’s products can be found in many areas such as automobiles, electrical appliances, smart phones, networking equipment, and medical devices. Semiconductor package interconnect technology, physics of sputtering technology and precious metal film formation methods are few of the technologies Tanaka Precious Metals developed and produced over the years and specialize in today. An example of products dominating global markets today; Bonding wires, Rivet contact materials and Fuel cell catalysts.  We are keeping an eye on the future…The Future is Precious.

Tango Systems, Inc.
Booth #:
  809
2363 Bering Drive
San Jose, CA 95131  USA
(P) 408-526-2330
(E) hmueller@tangosystems.com
(W) www.tangosystems.com
Based in the heart of Silicon Valley, Tango Systems, Inc., a leading innovator in high-performance, cost-effective PVD systems has been supplying EMI Shielding process equipment for over 10 years. The focus on application areas include PVD process solutions in the Advanced Packaging, Hard Disk Drive, Ultra-thin films, Interposers and TSV markets. Customers benefit from Tango Systems’ TSV processing through ease of maintenance, high throughput, lowest Cost-of-Ownership (CoO), high tool availability, active wafer cooling and low temperature PVD processing.

TDK Corporation
Booth #:
  207
475 Half Day Road, Suite 300
Lincolnshire, IL 60069
(P) 847-795-2163
(E) philip.couts@us.tdk.com
(W) www.tdk.com/fa.php
TDK, a leader in Factory Automation solutions for both Front End & Back End, offers the  AFM-15 Flip Chip Ultrasonic Gold-to-Gold Interconnect (GGI) Bonder which provides a low temperature, precision, high reliability, die assembly process. TDK flip chip GGI process provides up to a 70% form factor size reduction and superior electrical high frequency performance compared to other methods. Applications include mobile phones, wireless devices, RF, sensors & more.  TDK TAS N2 Purge 300mm loadports, purge shelves, and stand-alone CAVs reduces FAB wafer process oxidation and cross contamination.   TDK has over 10 years’ experience with this process and has worked with leading FOUP manufactures to provide the best process solution.

Technic, Inc.
Booth #:
  316
300 Park East Drive
Woonsocket, RI 02895
(P) 401-769-7000
(E) jfrick@technic.com
(W) www.technic.com
Certified facility, manufactures metal powders and  flakes for the electronics, electrical, jewelry, medical,  dental and other industries. Our team of customer  driven chemists, engineers, and technicians operate  out of a 93,000 Sq. ft. (8,640 Sq. m.) facility located in  Woonsocket, Rhode Island, USA. With over 60 years  of experience in the industry, Technic can analyze  your application requirements and develop new or  customized products as well as modify existing  products to fit your specific application needs.

Technic Engineered Powders Division an ISO 2001:2008 certified facility, manufactures metal powders and flakes for the electronics, electrical, jewelry, medical, dental and other industries. Our team of customer driven chemists, engineers, and technicians located in Woonsocket, RI. With over 75 years of experience in the industry, Technic can analyze your application requirements and develop new or customized products as well as modify existing products to fit your specific application needs.

The Engineered Powders Division continues to excel in providing precious metal powders and flakes to various manufacturers around the globe.

Technic Engineered Powders Division is also the North American Distributor for Mazerustar planetary mixers. Mazerustar Mixers perform mixing and deaeration simultaneously by continually revolving and rotating the container. The machine is useful for processing materials with high viscosities that are generally impossible to mix, combining two or more liquids with widely different specific gravities, homogeneously mixing liquids and powders (filler), and processing materials without contaminants. The Mazerustar mixer applies to a variety of industries including, chemical, electronic, auto, aerospace, medical, cosmetic, and many more.

Teledyne Microelectronic Technologies
Booth #:
  404
1425 Higgs Road
Lewisburg, TN 37091
(P) 931.359.4531
(E) microelectronics@teledyne.com
(W) www.teledynemicro.com
For half a century, Teledyne Microelectronics has produced millions of microelectronic hybrids that have contributed to countless hours of history. We continue to build on our rich heritage of advanced manufacturing technologies. Our microelectronics packaging experience is combined with circuit card assembly manufacturing and printed circuit board manufacturing.  Together, we provide a complete, vertically integrated advanced electronic manufacturing solution.

Teledyne Microwave Solutions
Booth #:
  404
1274 Terra Bella Avenue
Mountain View, CA  94043
(P) 650.962.6944
(E) microwave@teledyne.com
(W) www.teledynemicrowave.com
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening/testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.

Torrey Hills Technologies, LLC
Booth #:
  816
6370 Lusk Blvd, Suite F-111
San Diego/CA/92121 USA
(P) 858-558-6666
(E) sales@torreyhillstech.com
(W) www.torreyhillstech.com
Torrey Hills Technologies, LLC is a leader in developing and delivering high-quality yet extremely affordable materials, fabricated parts, and equipment for multiple industries. The company's core business includes refractory metal heat sinks (CuW, CuMo, CMC, CPC); fabricated microelectronics packaging components; molybdenum, tungsten and their alloy materials; belt furnace equipment for electronics and solar cell industry; mixing equipment like three roll mills and planetary ball mills.

TPT Wire Bonder
Booth #:
  406
704 Ginesi Dr., Suite 11a
Morganville, NJ 07751-1249
(P) 732-536-3964
(E) tptwirebonder@cwitechsales.com
(W) www.tpt-wirebonder.com/start.html
TPT Wire Bonders’ are used in many leading Universities, Institutes, Aerospace & Medical Device companies and Semiconductor Laboratories around the world. Relying on over 25 years of wire bonding knowhow, TPT designs and manufactures a complete range of manual and semi-automatic wire bonder machines. These all digital Bench Top systems use one bond head for bonding in Ball/Wedge or Wedge/Wedge bonding modes. With only a tool change, TPT’s HB05/HB10/HB16 models are all capable of Ball/Bump, Wedge, and Ribbon bonding for Fine Wire applications and TPT’s HB30 model is for Heavy Wire Wedge bonding applications. Ideal for start-ups, R&D Laboratories, pilot and small scale production lines.

Tresky Corporation
Booth #:
  408
704 Ginesi Drive, Suite 11A
Morganville, NJ 07751
(P) 732-536-8600
(E) sales@tresky.com
(W) www.tresky.com
For more than 30 years, Tresky has been providing pick & place and die bonding solutions.  It's flagship FC3 platform can deliver alignment accuracy of 0.5um, forces up to 50kg, and run applications such as eutectic die attach, flip chip, thermosonic, epoxy die attach with bondline thickness, 2.5/3D, and many more.  The T-6000L (8um @ 3s) and T-8000 (5um @ 3s) are full-automated platforms targeted at R&D, low and medium volume production capable of running the same applications.

Unisem
Booth #:
  205
1284 Forgewood Ave.
Sunnyavle, CA 94089
(P) 1-408-734-3222
(E) info@unisemgroup.com
(W) www.unisemgroup.com
Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 7,000 employees worldwide, Unisem has factory locations in Ipoh, Malaysia; Chengdu, People’s Republic of China and Batam, Indonesia. The company is headquartered in Kuala Lumpur, Malaysia.

University of South Florida Marine Sciences
Booth #:
  327
140 7th ave so
St Petersburg, FL 33701
(P) 727-480-5135
(E) dfries@usf.edu
(W) www.marine.usf.edu
Educational and Research in Marine Technology, Sensors, and Mobile Autonomous Systems

UTZ Technologies, Inc
Booth #:
  822
4 Peckman rd
Little Falls, NJ 07424
(P) 973-339-1100
(E) cad@utz.com
(W) www.utz.com
UTZ is premier manufacture of Thick Film Screens (PE) and Solder Paste Stencils (SMT). Established in 1968 UTZ has the most diverse manufacturing capabilities inside the US, which leads to more comprehensive solutions to printing problems and allow's UTZ to utilize multiple manufacturing avenues to insure our customers get the best technology for their application. UTZ's focus is to solve the challenges and drawbacks in the industry and to bring solutions and new products to the industry.

West Bond, Inc.
Booth #:
  317
1551 S. Harris Court
Anaheim, CA  92806 
(P) 714-978-1551
(E) sales@westbond.com
(W) www.westbond.com
Design and Manufacturer of Automatic, Semiautomatic, and Manual ESD protected Microelectronic Assembly and Test Equipment and Accessories since 1966.  Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon Bonders, Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers, LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers.  Visit: www.westbond.com

XYZTEC, Inc
Booth #:
  417
36 Balch Ave
Groveland, MA 01834
(P) 978-880-2598
(E) tom.haley@xyztec.com
(W) www.xyztec.com
If you are looking for a bond tester that offers the latest technology advancements, clever innovations and the utmost flexibility, XYZTEC is your solution.    Technology---fiducial pattern recognition, automation, high sample rate 24 bit ADC and high speed (50mm/sec) axes speed    Innovation---Rotating Measurement Unit (RMU) that holds up to 6 sensors that are software selectable. Change from test to test in seconds. No more cartridges and their inherent wear issues!    Flexibility---Support for 25+ test types, 12” fully automated wafer test system, up to 500Kg shear capability and the most advanced software available.

YINCAE Advanced Materials, LLC
Booth #:
  409
19 Walker Way
Albany, NY, 12205
(P) 518-452-2880
(E) info@yincae.com
(W) www.yincae.com
Founded & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in electronic & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.   Products:   •Solder Joint Encapsulants  •Underfill Materials   •Die Attach Adhesives  •Conformal Coatings  •TIM   •Optical Adhesive  •Board Level Assembly  •Anti-Warpage Materials   •Nanofilm

Yole Développement
Booth #:
  626
75 cours Emile Zola
69110 Villeurbanne, France
(P) +33 472 83 01 80
(E) robert@yole.fr
(W) www.yole.fr
About Yole Développement  Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.  CONTACTS  - Consulting & Financial Services: Jean-Christophe Eloy( eloy@yole.fr)  - Reports business: David Jourdan (jourdan@yole.fr)  - Press relations: Sandrine Leroy (leroy@yole.fr)

YXLON FeinFocus
Booth #:
  200
5675 Hudson Industrial Parkway
Hudson, OH  44236
(P) 234-284-7881
(E) sheri.martin@yxlon.com
(W) www.yxlon.com
YXLON is a leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. The YXLON product portfolio includes the Y.Cheetah and Y.Cougar which offer effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Y.Cheetah and Y.Cougar combine proprietary FeinFocus technology with advanced high-speed flat panel detector technology. Within seconds, the systems adapt between inspection tasks-failure analysis, research and development, process control and product testing including QuickScan mode.

Zeta Instruments, Inc
Booth #:
  407
2528 Qume Drive Suite 12
San Jose, CA 94546
(P) 408-573-7285
(E) marketing@zeta-inst.com
(W) www.zeta-inst.com

Zeta Instruments designs and manufactures Multi-Mode optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage.  Our optical profilers are used for roughness, step height and other surface metrology applications.
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:: Job Openings ::

Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer

JOB DESCRIPTION
The National Security Campus (NSC) is a U.S. Department of Energy (DOE), National Nuclear Security Administration (NNSA) facility managed and operated by Honeywell Federal Manufacturing & Technology (FM&T). Our primary business is to manufacture sophisticated mechanical, electronic, and engineered material components for our nation’s defense system. Our goal is to seek innovative solutions that surpass our customers’ expectations. To accomplish this, we research, develop, and deploy some of the most advanced design and manufacturing technologies in use in the United States today.

The Microelectronics Department has an opening for an experienced process engineer to provide hands-on support of our Low Temperature Cofired Ceramic (LTCC) fabrication line. The successful candidate will have an engineering degree from an ABET accredited institution and prior process engineering experience. The candidate will drive yield improvement and process control activities using Six Sigma and SPC tools.

Summary of Duties:
• Applies mathematical, physical science, and advanced engineering technologies in accomplishing engineering objectives.
• Exercises considerable latitude in determining technical objectives of assignments.
• Conducts research and development experiments to resolve complex engineering and quality problems involving highly technical and scientific methods.
• As needed, performs support functions for project planning and managing project resources, including multiple individuals and disciplines, to achieve quality, delivery schedules, and cost objectives.
• Writes technical reports on results and conclusions drawn from experiments conducted and incorporates findings in formal specifications.
• Estimates set-up times, flow-times, costs of production and acceptance equipment, and compiles cost estimates and delivery quotations, monitors performance, and prepares reports, statistics, and recommendations for management review.
• Participates in establishing operating procedures on new products and components.
• Defines and recommends new designs, design changes, and alternate designs of instruments, and test equipment, and orders tooling, gauging, and equipment necessary to assure product quality.
• Plans and performs engineering testing and development programs and uses advanced statistical and scientific methods to address and resolve critical engineering and production problems to assure product manufacturability.
• Originates, refines, and releases complex manufacturing or inspection work directions.
• Determines acceptability of processes and materials with other organizations as needed, such as design agencies, quality, and other affected organizations.
• Based on research, applies, develops and recommends innovative methodologies and technologies which are equal to the industry's state of the art to resolve processing and design problems.
• Provides technical consultation to management and others, and leads technical project teams.
• Responsible for strategic technical support that may involve longer range and/or complex business objectives in field of expertise.
• Evaluates and implements innovations and technological advances that improve quality, reduce flow time, improve productivity, and enhance operational surety.

Basic Qualifications:
• Must be an U.S. Citizen in order to obtain a DOE “Q” Level security clearance
• B.S. in Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Chemical Engineering or equivalent 4-year engineering degree from an ABET accredited program.
• 5+ years of microelectronics/ semiconductor process engineering experience.

Additional Qualifications:
• Advanced degree in Electrical Engineering, Materials Science Engineering, or Mechanical Engineering from an ABET accredited program.
• Self motivated, proactive, and the ability to handle multiple tasks and changing priorities.
• Expert level knowledge of LTCC processes, including thick film and thin film technologies.
• Significant experience in process characterization, and use of Control Plans, FMEAs, Paretos and other tools to drive and document yield improvement activities.
• Significant experience with applying statistical analysis methods to product/process development (SPC).
• Significant experience with setting up and executing Design of Experiments (DOE) and performing capability analysis.
• Familiarity with reliability, failure analysis and characterization processes.
• Familiarity with MIL & JEDEC standards.
• Excellent verbal and written communication and team skills.
• Demonstrated experience in project leadership. • High level trouble shooting skills and failure analysis skills
• Six Sigma green belt or black belt certification.

Note: Candidates with greater or lesser experience may apply and may be considered for an engineering job level commensurate with experience credentials and as warranted by current business requirements.

Interested in Honeywell but this isn't the right job for you? Join Honeywell's Talent Network to receive updates on other Honeywell employment opportunities, news and more. Click here to sign up: http://careersathoneywell.com/en/Newsletternew.aspx

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.

Apply Online

 

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:: Issue 180 ::
October 8, 2015

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services