NEWS | JOBS | FAST LINKS

Heraeus TFD

:: Corporate Member News ::

:: Tessera Acquires Ziptronix, Inc. for $39 Million (full story)

:: Brewer Science Presents "Materials For Patterning in Future Nodes" at SEMICON Taiwan (full story)

:: One Component, High Strength Epoxy for Structural Bonding Applications (full story)

:: Nordson EFD Introduces the Latest Innovations in Jet Dispensing Technology (full story)

:: Kulicke & Soffa Introduces the APAMA C2W -- Chip-to-Wafer Thermo-Compression Bonder (full story)

:: Kester Products Pass Bono Tests (full story)

 

MPP

:: Job Openings ::

:: Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

MRSI

Honeywell

ISOLA

Kester

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


:: Tessera Acquires Ziptronix, Inc. for $39 Million

Deal Augments Tessera's 3D-IC Capabilities in Rapidly Growing Market
Ziptronix Technologies Currently Deployed in $8 Billion Image Sensor Market

Tessera Technologies, Inc. ("Tessera" or the "Company") announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera's existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC solutions to semiconductor industry customers.

Ziptronix's patented ZiBond® direct bonding and DBI® hybrid bonding technologies deliver scalable, low total cost-of-ownership manufacturing solutions for 3D stacking. Ziptronix's intellectual property has been licensed to Sony Corporation for volume production of CMOS image sensors - an estimated $8.3 billion market according to Gartner. Ziptronix's technology is also relevant to next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices, among other semiconductor applications. Inclusive of CMOS image sensors, Tessera expects the annual market size to which this technology applies to exceed $15 billion by 2019.

"With this acquisition we're gaining best-in-class technology, along with exceptional people, know-how in the 3D-IC market and a significant patent portfolio," stated Tom Lacey, CEO of Tessera. "With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable to our customers. Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property. I'm confident that aligning our respective capabilities with our development expertise will help create a multi-hundred million dollar revenue opportunity for Tessera over the next decade as the industry continues to shift toward 3D-IC architectures."

"ZiBond and DBI bonding are enabling technologies that provide significant cost and performance benefits," said Craig Mitchell, President of Invensas, a Tessera subsidiary. "There is a great opportunity to further develop these platforms with our technology partners, and we're very excited about their market potential."

Founded in 2000 as a venture-backed spinoff of RTI International, privately held Ziptronix is a pioneer in the development of low-temperature direct bonding technology for 3D integration. Ziptronix is headquartered in Raleigh, North Carolina.

Dan Donabedian, President and CEO of Ziptronix added, "We've taken our technology from concept to commercialization in the backside illuminated image sensor and RF markets. Joining the Tessera family of companies combines our efforts with a proven leader in technology development and licensing in the semiconductor industry. This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets."

The addition of the Ziptronix team will not change Tessera's target operating expense structure. Tessera is making no adjustments to third quarter 2015 revenue or earnings per share guidance.

About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and FotoNation subsidiaries, generates revenue from licensing our technologies and intellectual property to customers and others who implement it for use in areas such as mobile computing and communications, memory and data storage, and 3D-IC technologies, among others. Our technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and computational imaging, including our LifeFocusTM, FaceToolsTM, FacePowerTM, FotoSavvyTM, DigitalApertureTM, face beautification, red-eye removal, High Dynamic Range, autofocus, panorama, and image stabilization intellectual property. For more information call 1.408.321.6000 or visit www.tessera.com.

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Brewer Science Presents "Materials For Patterning in Future Nodes" at SEMICON Taiwan

Brewer Science Senior Technologist Dr. Douglas Guerrero was a featured speaker at SEMICON Taiwan 2015 during the Advanced Technologies in Accelerating Digital Era and IoT Forum. On September 4, Dr. Guerrero shared his findings regarding materials that will enhance extreme ultraviolet lithography (EUVL) and directed self-assembly (DSA) material performance in his presentation called, “Materials For Patterning In Future Nodes.”

“The advancement of EUVL and DSA strongly depends on material design and performance,” said Dr. Guerrero. “Brewer Science’s ongoing research and investigation of materials has led to some interesting preliminary results in both technologies.” This was presented:

“Materials For Patterning In Future Nodes”
Advanced Technologies in Accelerating Digital Era and IoT Forum
Friday, September 4, 2015
Taipei Nangang Exhibition Hall 1 in Taipei, Taiwan

About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, LED lighting, and flexible technology products. In 1981, Brewer Science revolutionized lithography processes with its invention of ARC® materials. Today, Brewer Science continues to expand its technology portfolio to include products enabling advanced lithography, thin wafer handling, 3-D integration, and chemical and mechanical device protection and products based on nanotechnology. Brewer Science recently unveiled a new high-volume manufacturing facility at the Rolla National Airport to accommodate increased product demand and demonstrate the company’s commitment to continuous improvement. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe, and Asia.

Email: mwallis@brewerscience.com

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One Component, High Strength Epoxy for Structural Bonding Applications

Formulated primarily for high performance structural bonding applications, Master Bond EP13SPND-2 is a one part, high temperature resistant epoxy for the aerospace and specialty OEM industries. As a single component system, this product is easy to handle and does not require mixing prior to use. It also has an unlimited working life at room temperature. EP13SPND-2 has a paste consistency for non-drip application and it will not flow when curing.

Featuring an impressive strength profile, EP13SPND-2 offers a tensile lap shear strength, compressive strength and tensile modulus of over 3,000 psi, 18,000 psi and 500,000-550,000 psi, respectively. This dimensionally stable epoxy bonds well to many substrates including metals, glass, ceramics, composites, rubbers and most plastics. Typical cured bond line thickness is 0.002-0.008 inches.

EP13SPND-2 is a competent electrical insulator and features a volume resistivity exceeding 1014 ohm-cm. It resists a variety of chemicals such as fuels, oils, acids, bases and many solvents. This system is serviceable over the wide temperature range of -60F to +500F and is available for use in pints, quarts, gallons and 5 gallon containers.

Master Bond Structural Adhesives
Master Bond EP13SPND-2 is high temperature resistant epoxy with superior strength properties. This dimensionally stable, paste system has excellent electrical properties and chemical resistance. Read more about Master Bond’s structural bonding adhesives at http://www.masterbond.com/applications/structural-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

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Nordson EFD Introduces the Latest Innovations in Jet Dispensing Technology

The PICO Pµlse non-contact jet valve and PICO Toµch controller with intuitive touch screen interface offer greater dispensing capabilities for superior process control

High resolution photo available at:
http://www.nordsonefd.com/images/releases/Nordson_EFD_Pulse_Touch.jpg

Video available at: https://www.youtube.com/watch?v=rjGG8iYwNOE

Nordson EFD, a Nordson company, the world's leading precision fluid dispensing systems manufacturer, introduces innovative piezoelectric jetting technology that removes the barrier between speed and accuracy. EFD's new PICO® Pµlse™ valve and PICO Toµch™ controller make it possible to dispense very exact, repeatable micro-deposits as small as 0.5 nL at up to 500Hz continuous, with 1500Hz maximum bursts - an industry best.

The PICO Pµlse non-contact jet valve's modular design makes it possible to jet low- to high-viscosity fluids onto any surface, including uneven and tough-to-reach substrates. Exchangeable parts provide versatility, making the valve adaptable to a wider range of applications, so it can meet changing production demands. Its innovative tool-free latch mechanism allows for easy removal of the fluid body for faster serviceability and maintenance - reducing downtime and increasing productivity. Variable stroke, improved close time, and faster full stroke open time makes Pµlse one of the most robust jet dispensing valves on the market.

The PICO Toµch controller features an easy-to-use intuitive touch screen interface for precise control of the PICO Pµlse valve. Users can set extremely precise operating parameters, such as ramp open and close, and stroke control to fine-tune dispensing performance. Pulse time can be adjusted in increments as small as .01 ms. Better slope control delivers more repeatable deposits while preventing turbulence and air bubbles from entering the fluid - preventing deposit variation.

"The PICO Toµch controller's intuitive touch screen interface allows precise programming of the PICO Pµlse valve setup parameters to give customers a vastly improved jetting solution," said Claude Bergeron, global product manager, Nordson EFD. "As a leader in innovative jet dispensing systems, EFD is dedicated to working closely with manufacturers to provide the best process control possible."

"Our goal is to provide equipment that dispenses the most accurate deposits at faster cycle rates, with less fluid waste and easier maintenance, to increase bottom-line profitability and help our customers stay ahead of changing market demands," Bergeron said. "Our new PICO line does exactly that and more."

For more information visit Nordson EFD on the web at www.nordsonefd.com/PICO, www.facebook.com/NordsonEFD, or www.linkedin.com/company/nordson-efd

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Kulicke & Soffa Introduces the APAMA C2W -- Chip-to-Wafer Thermo-Compression Bonder

Kulicke and Soffa Industries, Inc. introduces a new addition to the APAMATM Series of highly adaptive Thermo-Compression (TC) Bonders, the C2W (Chip-to-Wafer) bonder. The APAMA C2W is the second in the series to be launched, following the C2S (Chip-to-Substrate) bonder introduced in 2014.

The APAMA series TC Bonders deliver industry-leading throughput, placement accuracy, metrology and cost-of-ownership advantages to the high growth Advanced Packaging market. The APAMA C2W and C2S systems offer fully automated solutions for Thermo-Compression-Bonding (TCB), and a common platform, leveraging an advanced bond head design. The addition of the new dual head C2W system enables the advantages of the unique APAMA high throughput architecture to be applied to 2.5D and 3D packages using silicon or glass interposers. The introduction of the C2W platform combined with the capability of the existing C2S platform, enable the APAMA TCB systems to support assembly for the full range of stacked TSV products. The modular design of the new C2W system also creates a highly adaptable manufacturing platform that is able to address future applications requiring highly accurate placement of die for High Density Fan-Out Wafer Level Packaging (FOWLP). Upon its introduction, the APAMA C2W becomes one of the best performing TC Bonders in the industry with exceptional cost-of-ownership, process control and data integration capability.

This C2W launch further transforms K&S into a leading equipment supplier for the advanced packaging sector. With the acquisition of Assembleon earlier this year, K&S has a complete offering of advanced packaging solutions ranging FOWLP, Wafer Level Packaging (WLP), Flip Chip, System-in-a-Package (SiP), Package-on-Package (PoP), Embedded die and TCB.

Tong Liang Cheam, Kulicke & Soffa’s Vice President of the Advanced Packaging Business Line and Corporate Strategy, said, “K&S is proud to add the APAMA C2W to our rapidly expanding portfolio of Advanced Packaging equipment. This new C2W dual head system provides a highly capable manufacturing solution for the most advanced 2.5D and 3D products. As the features and functionalities of ICs increase, there is a trend toward reduced pitch and higher I/O count requiring assembly equipment with much higher accuracy. K&S APAMA solutions are designed from the start with performance and accuracy in mind to enable this next generation of fine pitch products to be bonded with market leading throughput.”

The APAMA C2W debuted at the SEMICON Taiwan show at the Taipei Nangang Exhibition Center, K&S Booth #616 Level 4, from September 2-4, 2015.

Sheila Frese, Marketing Communications Manager
Kulicke & Soffa
Email: sfrese@kns.com | Website: www.kns.com

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Kester Products Pass Bono Tests

Kester is proud to announce three products, NP505-HR, NF372-TB and 985M, passed Bono Testing. Third party laboratory testing certified that all products passed the Bono test criteria with corrosion factor (Fc) values of less than 2.0%, indicating no corrosion in the residues.

Kester 985M has been Kester’s top selling no-clean flux for several years. NP505-HR is a new zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NF372-TB is a new zero-halogen, no-clean, low solids liquid flux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies. “These two new products were each designed to meet the industry’s increased demand for high reliability in demanding applications, and passing the Bono test is another positive endorsement for our innovative portfolio,” stated Dr. Bruno Tolla, Kester’s Global R&D Director.

In the Bono test, the resistance measurements are used to calculate the corrosion factor (Fc) that is given as a percentage. While SIR and ECM tests are recognized by IPC as a way to evaluate paste or flux residue corrosiveness after reflow, the Bono test was developed and implemented in some French companies as an extra qualification criteria. The Bono test also quantifies the corrosion, unlike current SIR or ECM tests. In addition to characterizing solder paste residues, the Bono test can be performed for wave soldering fluxes, repair fluxes, and tacky fluxes using the same method and same board.

For more information on these products, please visit our website or contact your Kester representative.

Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

Contact: Michelle O’Brien, Marketing & Communications Specialist.

 

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:: Job Openings ::

Honeywell FM&T - Microelectronics Process Engineer (285997) - Senior Engineer

JOB DESCRIPTION
The National Security Campus (NSC) is a U.S. Department of Energy (DOE), National Nuclear Security Administration (NNSA) facility managed and operated by Honeywell Federal Manufacturing & Technology (FM&T). Our primary business is to manufacture sophisticated mechanical, electronic, and engineered material components for our nation’s defense system. Our goal is to seek innovative solutions that surpass our customers’ expectations. To accomplish this, we research, develop, and deploy some of the most advanced design and manufacturing technologies in use in the United States today.

The Microelectronics Department has an opening for an experienced process engineer to provide hands-on support of our Low Temperature Cofired Ceramic (LTCC) fabrication line. The successful candidate will have an engineering degree from an ABET accredited institution and prior process engineering experience. The candidate will drive yield improvement and process control activities using Six Sigma and SPC tools.

Summary of Duties:
• Applies mathematical, physical science, and advanced engineering technologies in accomplishing engineering objectives.
• Exercises considerable latitude in determining technical objectives of assignments.
• Conducts research and development experiments to resolve complex engineering and quality problems involving highly technical and scientific methods.
• As needed, performs support functions for project planning and managing project resources, including multiple individuals and disciplines, to achieve quality, delivery schedules, and cost objectives.
• Writes technical reports on results and conclusions drawn from experiments conducted and incorporates findings in formal specifications.
• Estimates set-up times, flow-times, costs of production and acceptance equipment, and compiles cost estimates and delivery quotations, monitors performance, and prepares reports, statistics, and recommendations for management review.
• Participates in establishing operating procedures on new products and components.
• Defines and recommends new designs, design changes, and alternate designs of instruments, and test equipment, and orders tooling, gauging, and equipment necessary to assure product quality.
• Plans and performs engineering testing and development programs and uses advanced statistical and scientific methods to address and resolve critical engineering and production problems to assure product manufacturability.
• Originates, refines, and releases complex manufacturing or inspection work directions.
• Determines acceptability of processes and materials with other organizations as needed, such as design agencies, quality, and other affected organizations.
• Based on research, applies, develops and recommends innovative methodologies and technologies which are equal to the industry's state of the art to resolve processing and design problems.
• Provides technical consultation to management and others, and leads technical project teams.
• Responsible for strategic technical support that may involve longer range and/or complex business objectives in field of expertise.
• Evaluates and implements innovations and technological advances that improve quality, reduce flow time, improve productivity, and enhance operational surety.

Basic Qualifications:
• Must be an U.S. Citizen in order to obtain a DOE “Q” Level security clearance
• B.S. in Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Chemical Engineering or equivalent 4-year engineering degree from an ABET accredited program.
• 5+ years of microelectronics/ semiconductor process engineering experience.

Additional Qualifications:
• Advanced degree in Electrical Engineering, Materials Science Engineering, or Mechanical Engineering from an ABET accredited program.
• Self motivated, proactive, and the ability to handle multiple tasks and changing priorities.
• Expert level knowledge of LTCC processes, including thick film and thin film technologies.
• Significant experience in process characterization, and use of Control Plans, FMEAs, Paretos and other tools to drive and document yield improvement activities.
• Significant experience with applying statistical analysis methods to product/process development (SPC).
• Significant experience with setting up and executing Design of Experiments (DOE) and performing capability analysis.
• Familiarity with reliability, failure analysis and characterization processes.
• Familiarity with MIL & JEDEC standards.
• Excellent verbal and written communication and team skills.
• Demonstrated experience in project leadership. • High level trouble shooting skills and failure analysis skills
• Six Sigma green belt or black belt certification.

Note: Candidates with greater or lesser experience may apply and may be considered for an engineering job level commensurate with experience credentials and as warranted by current business requirements.

Interested in Honeywell but this isn't the right job for you? Join Honeywell's Talent Network to receive updates on other Honeywell employment opportunities, news and more. Click here to sign up: http://careersathoneywell.com/en/Newsletternew.aspx

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.

Apply Online

 

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:: Issue 178 ::
September 8, 2015

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services