Heraeus TFD

:: Corporate Member News ::

:: Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control (full story)

:: DuPont Advanced Materials Introduces New Conductive Ink for Digital Printing (full story)

:: The latest from Master Bond (full story)

:: Indium Corporation’s New Indium10.2HF Solder Paste Delivers Superior ICT Performance (full story)

:: Nordson ASYMTEK Wins Service Excellence Award for 12th Time in 13 Years (full story)

:: TJ Green Associates Announces May Trainings (full story)

:: Job Openings ::



Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.






All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders, totaling $5 million, demonstrate early success

Wilmington, Mass. (April 7, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is capable of both high-volume production monitoring and advanced process development.

“The new capability provides a 200-400 percent throughput improvement over our previous Wafer Scanner™ bump metrology system, and when paired with our Discover® Software, provides a complete coplanarity solution for our customers,” said Scott Balak, Rudolph’s director, inspection product management. “With the increasing number of new packaging technologies being developed by foundries, outsourced assembly and test (OSAT) manufacturers, and integrated device manufacturers (IDMs), the flexibility and reliability of this new capability on the trusted NSX Series platform is especially valuable to customers seeking to move rapidly from pilot lines to production.”

Data is collected in seconds from millions of bumps and then analyzed by Rudolph’s Discover Software analysis database. Engineers gain unique insight into critical metrology applications, from both an individual bump point of view or holistically as a wafer, as part of a simultaneous product and process control solution.

“Manufacturers are looking for a more comprehensive and flexible process control solution that provides, not only inspection or bump data, but also usable analytical information about their processes,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Our powerful Discover analysis software provides insight into the process that is otherwise unavailable to process control tool owners. The high-speed 3D bump metrology capability incorporates a three segment optical range, giving our customers the flexibility to control both smaller micro bumps and larger traditional solder bumps with a single inspection and metrology platform. When combined with Rudolph’s advanced automation capability, customers can measure thin and warped wafers without the extra expense of frame and tape mounting.”

Goodrich concluded, “We understand the importance of 3DIC and next-generation packaging processes and we have aggressively pursued development of this comprehensive 3D coplanarity solution to meet our customers’ needs for a cost efficient, multi-functional process control tool.”

For more information about the NSX Series, please visit

   ^ Top

DuPont Advanced Materials Introduces New Conductive Ink for Digital Printing

Robust Printed Electronics Portfolio to be featured at LOPEC and Printed Electronics Europe

DuPont Advanced Materials (DuPont) is launching a new electronic ink for inkjet printing that offers the high conductivity and strong adhesion required for rapid digital design, prototyping and full-scale manufacturing.  The technology will enable digital printing for electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels.

“As the leader in the printed electronics industry, we must stay one step ahead of our customers’ needs,” said Kerry Adams, segment manager, DuPont Advanced Materials.  “Our new conductive ink for digital printing will open the door to the next important wave of innovations enabled by printed electronics.”

DuPont’s newest conductive ink, PE410, enables rapid prototyping and a smooth transition from “lab to fab” with the versatility to scale up to industrial high-volume inkjet print heads and machines. This allows circuit designers to immediately test a new design, quickly make necessary edits, and, due to reduced silver laydown, save on material costs.  The technology also can be adapted to non-planar printing, enabling a series of new and emerging applications.

“Based on industry benchmarks, we find DuPont’s new conductive inkjet ink to provide the best combination of important properties available among competitive products,” said Jeroen van den Brand, program director, Holst Centre. “When considering the low sintering temperature, conductivity, adhesion, print head stability, fine line capability and substrate compatibility, DuPont’s solution is the leader.”

DuPont will feature its new inkjet ink, PE410, along with its other printed electronic technologies during LOPEC (April 6-7, in Munich, Germany, hall B0 booth #310) and Printed Electronics Europe (April 27-28, in Berlin, Germany, booth #D14).  Highlights include:

  • Stretchable inks for wearable electronics that provide a manufacturing-ready alternative to traditional methods of embedding electronics in clothing and are used to create thin, form-fitting circuits that can be seamlessly bonded with many standard fabrics. 
  • A suite of in-mold electronic inks which help create lighter, less expensive and more beautiful electronic devices by reducing the need for rigid circuit boards.  These inks enable circuits to be printed directly onto plastic substrates and allow electronic features such as electronic controls, capacitive switches and LED lighting, to be readily integrated in applications such as home appliances and automobiles. 
  • New low-temperature inks that cure quickly at temperatures as low as 60C, opening up the possibility for printed electronics designers to use a wide range of functional and low-cost plastic films.

DuPont Advanced Materials is a leading innovator and high-volume supplier of electronic inks and pastes that offers a broad range of printed electronic materials commercially available today. The growing portfolio of DuPont Advanced Materials electronic inks is used in many applications, including forming conductive traces, capacitor and resistor elements, and dielectric and encapsulating layers that are compatible with many substrate surfaces including polymer, glass and ceramic. 

Advanced Materials has over 40 years of experience in the development, manufacture, sale and support of specialized thick film compositions for a variety of electronic applications in the consumer electronics, automotive, photovoltaic, biomedical, military and telecommunications markets.  For more information on DuPont Advanced Materials, visit


   ^ Top

The latest from Master Bond

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life
Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile.

Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli, respectively in the shear and peel mode. This compound bonds well to a wide variety of substrates, including metals, glass, ceramics, composites, rubbers and plastics. Its toughness also allows it to withstand aggressive thermal cycling as well as impact and shock. Serviceable over the wide temperature range of -100°F to +400°F is outstanding.

Supreme 11HTLP has a one to one mix ratio by weight or volume along with a working life of 90-120 minutes for a 100 gram batch. Thorough mixing is facilitated by color coding as Part A is gray and Part B is amber. It has a high viscosity, but maintains flow properties. This system can be cured at room temperature or more rapidly at elevated temperatures. Upon curing, Supreme 11HTLP exhibits low shrinkage and dimensional stability. Additionally, it is readily machinable.

Featuring a volume resistivity exceeding 1013 ohm-cm, Supreme 11HTLP delivers reliable electrical insulation values. Resistance many chemicals, including water, oil and fuels is excellent. 100% reactive, this adhesive/sealant is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.

Master Bond High Strength Adhesives
Supreme 11HTLP is a high strength, toughened system that cures at room temperature and is able to withstand elevated temperatures. Read more about Master Bond’s high strength adhesive systems at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

Flexible, One Component, Fast Curing Silicone for Medical Device Applications
Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO.

As a silicone, MasterSil 910Med delivers high flexibility and has an elongation of 400-600%. This imparts reliable thermal cycling and mechanical shock resistance. Bond strength to metals, composites, glass ceramics, rubbers, plastics and other silicone substrates is excellent. It is serviceable over the broad temperature range of -75°F to +400°F. It is also a competent electrical insulator with a volume resistivity of >1015 ohm-cm.

Easy to handle, this single component system cures at room temperature and has a tack free time of 10-20 minutes. Curing is based on the humidity level, where the higher the humidity, the faster the cure. Additionally, thinner sections cure more quickly than thicker ones. MasterSil 910Med is available in 80 gram tubes and has a shelf life of 6 months.

Master Bond Biocompatible Adhesives
MasterSil 910Med is high temperature resistant, flexible one part silicone that complies with USP Class VI and ISO 10993-5 requirements. This sterilization resistant formulation also features impressive electrical insulation properties. Read more about Master Bond’s medical grade adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

   ^ Top

Indium Corporation’s New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.

In addition to outstanding print transfer for increased yields, and resistance to head-in-pillow (HIP) and non-wet open (NWO) defects, this no-clean solder paste is ideal for customers who want a clear residue that quickly breaks away after in-circuit testing.
Indium10.2HF also helps to Avoid the Void™ by delivering low voiding in QFNs, BGAs, and CSPs. This solder paste is perfectly suited for a variety of printing applications, even with small components. It also has superior HIP and NWO resistance, slump resistance, and ICT/flying probe testability.

Indium10.2HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.2HF, email or visit


   ^ Top

Nordson ASYMTEK Wins Service Excellence Award for 12th Time in 13 Years

Received top score in all service categories

Nordson ASYMTEK, a Nordson company, announces that it has been honored with the Circuits Assembly 2016 Service Excellence Award (SEA). Nordson ASYMTEK was recognized for receiving the highest customer service ratings for companies in the dispensing category. Each company was judged by its own customers in five service categories - quality, value, responsiveness, dependability/on-time delivery, and technology. Nordson ASYMTEK has won every year they entered the award.

"The Service Excellence Awards is the only recognition program in the electronics assembly industry where the customers not only have a say, they have all the say. To win 12 times in 13 years, as Nordson ASYMTEK has done, is a remarkable show of sustained excellence," said Mike Buetow, editor of Circuits Assembly, who presented the award at a ceremony held during the IPC APEX Expo in Las Vegas, NV on March 15, 2016.

"The Service Excellence Award is one that we are particularly proud of because providing our clients with the highest quality products, service, and support has been a foundation of Nordson ASYMTEK since its inception in 1983," said Roberta Foster-Smith, global marketing manager for Nordson ASYMTEK. "It is our goal to provide this service through our global network so our customers can receive the same high level of support no matter where in the world they are located."

The awards program is sponsored by Circuits Assembly, part of UP Media Group Inc., which serves the global printed circuit board community. Nordson ASYMTEK is a world leader in precision fluid dispensing, conformal coating, and jetting technologies.

For information contact Nordson ASYMTEK at, call +1 760-431-1919, or visit our website


   ^ Top

TJ Green Associates Announces May Trainings

Rare opportunity for engineers, technicians, and inspectors to get specialized training in microelectronics packaging which is normally only offered on-site at major fortune 500 companies in the aerospace, defense and medical device industry. Train with TJ Green LLC during the day, and enjoy the beautiful city of Singapore at night.

TJ Green Associates, LLC ( has announced their May training lineup. Courses offered will include:

Spring Microwave Packaging Technology Course in Boston, MA from May 4 – 6, 2016.
This three-day technical training seminar is for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and similar devices.

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military, aerospace and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective including a brief review of MMIC fab technology, substrate and package selection (e.g. thin film, PTFE, LTCC) Ag epoxy and AuSn die attach, deep access Au wire and ribbon bonding, hermetic laser seal and testing.
For more information or to register, see our course outline or course registration form.

Spring Microelectronic Packaging Training Week to occur in Singapore from May 16 – 20, 2016.
Attendees will participate in an entire week of professional training classes focused on microelectronics packaging and testing of microcircuits, hybrids, RF microwave modules and integrated microwave assemblies for high reliability applications. Learn about MIL-STD-883 test methods, including hermeticity and visual inspection per TM 2017 and TM 2010. Understand the reliability issues in context of the associated performance specifications.

When registering, attendees can pick and choose from five different full day training classes including:

  • Overview of Microcircuit Test Methods MIL-STD-883
  • Visual Inspection per MIL-STD-883
  • Microwave Assembly and Packaging Technology  
  • Overview of Performance Specifications for Hybrids and Monolithic ICs                                         
  • Hermeticity Testing and RGA (Residual Gas Analysis)

For more information or to register, see our course outline or course registration form.

Mr. Green concluded, “Companies and professionals who invest in our training gain immediate access to specialized knowledge from industry experts that you just won’t find anywhere else. We’re expecting heavier than usual demand this year and our limited number of openings will fill up quickly.”

About TJ Green Associates, LLC
TJ Green Associates, LLC is the global leader in training and consulting Microelectronics, Military, Space & Class III Medical Implants. TJ Green Associates specializes in teaching and consulting services to companies that assemble and package hybrids, multichip modules, and other types of packaged microcircuits. Learn more at:

Besides public courses and specialized consulting TJ Green Associates also offers remote educational opportunities via their online semiconductor training center. View the complete listing of courses available at

   ^ Top




:: Job Openings ::



Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( ) at no cost - part of corporate membership!


   ^ Top



View the Corporate Bulletin Archives



:: Issue 187 ::
April 25, 2016


Gannon & Scott



Oneida Research Services