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Heraeus TFD

:: Corporate Member News ::

:: New Hermetic 38999 BMA RF Connector from PA&E (full story)

:: News from Master Bond (full story)

:: Plasma-Therm and DISCO partner on Plasma Dicing (full story)

:: News from Indium (full story)

:: New Silicone Sealant Technology from Henkel Offers Automotive Module Manufacturers Process Flexibility through Unique Cure Capability (full story)

:: Look who is Signed up to Exhibit at IMAPS 2016 Pasadena... (full story)

:: Job Openings ::

MORE SOON...

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

EMD Performance Materials - Corporate Sponsor

Quik-Pak

ASE US, Inc.

EV Group

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


:: New Hermetic 38999 BMA RF Connector from PA&E

This latest product development combines PA&E's industry-proven hermetic RF connector technology with industry-standard MIL-DTL 38999/23 Series III shell interfaces. The atmospheric side of the connector contains #8 BMA coaxial contacts per MIL-STD-348 while the hermetic side contains SMA contacts per the same MIL-STD.

These new high-performance BMA connectors are available in laser-weld or jam-nut configurations with 1, 2, 4, 6 or 8 contacts. Six key-way patterns and 11-80, 17-75, 21-48, 21-75, 23-06 and 25-08 shell sizes are also available. All formats provide RF performance of ≤1 db insertion loss at 18 GHz and have a hermetic leak rate of ≤1x10-9 cc He@1 ATM.

In laser-weld configuration, these connectors are compatible with materials that hermetically weld to 4032 or 4047 aluminum, 304L stainless steel or grade 2 titanium. The jam-nut versions mount with a stainless steel jam-nut and o-ring.

The shell and SMA barrel are made of 304L stainless while the feedthru insert is Kovar. The BMA outer contract contacts are beryllium copper and the BMA center pins are Kovar sealed with 7070 glass. These connectors have an operating temperature range of -65° C to 200° C.

 

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:: News from Master Bond

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications.

As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as 250°F. This high performance system delivers a tensile strength of 5,000-7,000 psi and a compressive strength of 18,000-20,000 psi. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. This dimensionally stable compound has low shrinkage upon curing.

EP3UF withstands many chemicals, including water, cleaning solvents, oils and fuels. This light yellow colored epoxy is serviceable over the temperature range of -60°F to +250°F [-51°C to +121°C]. It is available for use in 10 cc syringes, 30 cc syringes, ½ pint and pint containers and has a 6 month shelf life at room temperature in its original, unopened containers.


Toughened, One Component Epoxy Features High Bond Strength and Cryogenic Serviceability
Combining simple handling properties with high strength, Master Bond Supreme 10HTF-1 is a single part adhesive/sealant for a variety of applications in the aerospace, electronic, optical, specialty OEM and related industries. At room temperature, this smooth paste system has an “unlimited” working life and cures rapidly at elevated temperatures. For example, typical cure schedules for Supreme 10HTF-1 are 5-10 minutes at 300°F or 15-20 minutes at 250°F.

Supreme 10HTF-1 delivers impressive physical strength values for tensile lap shear, tensile and T-peel of >3,200 psi, 6,500-7,500 psi and 20-25 pli, respectively. This system bonds well to a wide variety of substrates including metals, composites, glass, ceramics, rubbers and many plastics. It has very low shrinkage upon curing, is dimensionally stable and has a Shore D hardness >70. As a toughened system, Supreme 10 HTF-1 is capable of withstanding rigorous thermal cycling as well as mechanical shock and vibration.

Supreme 10HTF-1 offers cryogenic serviceability over the wide temperature range of 4K to +400°F. The adhesive resists an array of chemicals such as water, fuels, acids, bases and many solvents. Also, it is a reliable electrical insulator. Volume resistivity is 1013 ohm-cm.

This compound is gray, but other colors are available. Supreme 10HTF-1 is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including cartridges and syringes.

 

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:: Plasma-Therm and DISCO partner on Plasma Dicing

DISCO Corporation and Plasma-Therm have signed a global distribution agreement for Plasma-Therm’s Singulator® plasma dicing technology, the companies announced recently.

DISCO executive Noboru Yoshinaga said, “DISCO is keenly aware that plasma dicing is a key enabling technology for advanced packaging, and now we can provide complete Kiru, Kezuru, Migaku (dicing, grinding, polishing) solutions to customers. After a careful evaluation, DISCO determined that Plasma-Therm's technology is the solution of choice, due to its cost of ownership and performance,” he said.

DISCO will install a 300 mm Plasma-Therm Singulator® system in its Tokyo facility this year to support customer demonstrations and semiconductor device packaging evaluations.

Abdul Lateef, Plasma-Therm CEO, said, “We are extremely pleased to be partnering with DISCO, the recognized leader in back-end processing. The industry needs the enabling technology of plasma dicing to overcome today's semiconductor advanced packaging challenges — small and sensitive devices and thin wafers.”

Plasma-Therm has been granted multiple patents for its inventions related to equipment and applications for plasma dicing on tape. Plasma-Therm shipped its first Singulator® plasma dicing system in early 2013. Customers in Europe, Asia, and the United States have been using Singulator® systems in production since then, and have reported up to 30 percent higher die yield per wafer.

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:: News from Indium

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015
Indium Corporation has been recognized by ON Semiconductor for “perfect” quality in 2015.

The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.

“Quality is the number one promise that we make to our customers,” Berntson said. “This award recognizes the skill and precision of our Indium Corporation team, who instill pride and consistency in everything they do.”


Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder
Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.

Returned solder, used in wave and other soldering processes, can be put through Indium Corporation's state-of-the art electrolytic recycling processes that removes both organic and metallic impurities from contaminated tin-lead and lead-free solder and solder dross. 

Recycling materials not only saves costs from unnecessary waste disposal, but also allows the customer to earn a financial credit or exchange the recyclable material for new bar solder in a tolling arrangement – thus increasing the return on their investment.

Indium Corporation also offers reclaim and recycle programs for indium and indium alloys, germanium, and indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) from sputtering targets.

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:: New Silicone Sealant Technology from Henkel Offers Automotive Module Manufacturers Process Flexibility through Unique Cure Capability

A brand new silicone adhesive sealant technology from Henkel Adhesive Electronics provides both high performance and process flexibility. The new material, BERGQUIST TLB 400 SLT, is a two-part silicone sealant designed for automotive module applications. With an adaptable thermal cure profile that enables full cure at temperatures from 25°C to 180°C, the technologically advanced sealant allows automotive specialists to accommodate various manufacturing protocols.

“The cure profile is adjustable based on individual requirements,” explains Jerry Schmitz, Henkel Product Line Manager for Thermal Materials. “For example, if energy savings is a priority, the material can be fully cured and bonded at room temperature. Alternatively, if speed and throughput are important, BERGQUIST TLB 400 SLT can be cured in minutes at higher temperatures to enable optimal process flow and end-of-line testing. This kind of flexibility simply doesn’t exist with other sealant materials.”

In addition to its cure adaptability, BERGQUIST TLB 400 SLT offers high reliability and material compatibility. Even at room temperature and independent of ambient moisture, once the two parts are mixed, BERGQUIST TLB 400 SLT will seal and bond, creating an environmentally protected enclosure. The adhesion strength of the material to various automotive surfaces including aluminum, steel and plasma-treated plastic is robust and its elongation to break is excellent at 400%. Compatibility with other addition cure products such as Henkel’s GAP FILLER materials enables automotive manufacturers to confidently incorporate BERGQUIST TLB 400 SLT into existing processes and product designs.

Henkel’s BERGQUIST TLB 400 SLT has shown superb performance results with a variety of automotive applications including engine control units, hybrid electric and electric vehicle modules, electronic enclosures and integrated brake control modules, among others. The material exhibits high reliability in the application at high temperature and humidity, and is resistant to degradation from exposure to common automotive fluids.

“With the ability to automate the adhesive sealant process to align with existing equipment sets and procedures, BERGQUIST TLB 400 SLT delivers the flexibility automotive module manufacturers have long desired,” says Schmitz in summary. “We expect this innovation to continue, with other time- and energy-conserving Henkel adhesives and sealants to be released later this year.”

For more information, visit www.henkel-adhesives.com/thermal or call +1-952-835-2322.

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:: Look who is Signed up to Exhibit at IMAPS 2016 Pasadena...

2016 Exhibiting Companies & Research Labs

LIMITED EXHIBIT BOOTHS STILL AVAILABLE

Exhibitor Booth Booth Type Booth Category
Accu-Tech Laser Processing, Inc. Booth# 608 10 x 10 In-Line
AdTech Ceramics Booth# 713 10 x 10 Corner
Advance Reproductions Corp. Booth# 202 10 x 10 Corner
Advanced Dicing Technologies Booth# 423 10 x 10 Corner
Advanced Semiconductor Microtechnology Corp. Booth# 305 10 x 10 In-Line
AEMtec GmbH Booth# 311 10 x 10 In-Line
AI Technology Booth# 116 10 x 10 In-Line
AIM Solder Booth# 810 10 x 10 In-Line
AkroMetrix, LLC Booth# 312 10 x 10 Corner
AMICRA Microtechnologies GmbH Booth# 527 10 x 10 Corner
ASYS Group Booth# 735 10 x 10 Corner
ATV Technologie GmbH Booth# 711 10 x 10 In-Line
Axus Technology Booth# 606 10 x 10 In-Line
Azimuth Electronics, Inc. Booth# 610 10 x 10 In-Line
Bach Resistor Ceramics GMBH Booth# 531 10 x 10 Corner
BTU International Booth# 835 10 x 10 Corner
Camtek USA Booth# 313 10 x 10 Corner
Canon USA Booth# 830 10 x 10 Corner
Coining, Inc., an AMETEK company Booth# 624 10 x 10 In-Line
Conductive Containers, Inc. Booth# 404 10 x 10 In-Line
Crystal Mark, Inc. Booth# 230 10 x 10 Corner
Deweyl Tool Company, Inc. Booth# 525 10 x 10 Corner
DfR Solutions LLC Booth# 732 10 x 20 Corner
DuPont TBD    
East China Research Institute of Microelectronics (ECRIM) Booth# 122 10 x 10 In-Line
Electronic Production Partners GmbH Booth# 825 10 x 20 Corner
EMD Performance Materials Booth# 819 10 x 10 Corner
Enzo Technology Corp Booth# 307 10 x 10 In-Line
ESL ElectroScience Booth# 402 10 x 10 Corner
Essemtec USA Booth# 224 10 x 10 Corner
F & K Delvotec, Inc. Booth# 222 10 x 10 Corner
Ferro Corporation Booth# 203 10 x 10 Corner
Finetech, Inc. Booth# 612 10 x 10 Corner
Geib Refining Corporation Booth# 504 10 x 10 Corner
GPD GLobal, Inc. Booth# 118 10 x 10 In-Line
Haiku Tech, Inc. Booth# 210 10 x 10 Corner
Hary Manufacturing Incorporated Booth# 605 10 x 10 Corner
Henkel Booth# 834 10 x 10 Corner
Heraeus Electronic Materials Division Booth# 703 10 x 20 Island
Hesse Mechatronics, Inc. Booth# 523 10 x 10 Corner
Hi-Rel Laboratories, Inc Booth# 306 10 x 10 In-Line
HSIO Technologies Booth# 602 10 x 10 Corner
i3 Electronics Booth# 522 10 x 20 Corner
IBM Canada Ltd. Booth# 325 10 x 20 Corner
Indium Corporation Booth# 710 10 x 20 Corner
Infinite Graphics Booth# 113 10 x 10 Corner
Interconnect Systems, Inc. Booth# 503 10 x 10 Corner
Kulicke & Soffa Industries, Inc. Booth# 626 10 x 10 Corner
Kyocera International, Inc. Booth# 422 10 x 20 Corner
LINTEC OF AMERICA, INC Booth# 308 10 x 10 In-Line
Materion Booth# 207 10 x 10 In-Line
Metalor Technologies USA Booth# 809 10 x 30 Corner
Micro Systems Technologies Management AG Booth# 123 10 x 10 Corner
MicroScreen LLC Booth# 603 10 x 10 Corner
Micross Components Booth# 103 10 x 10 Corner
Mini-Systems, Inc. Booth# 507 10 x 10 In-Line
Mitsubishi Materials Corporation Booth# 832 10 x 10 In-Line
Mitsui Mining & Smelting Co., Ltd. Booth# 204 10 x 10 Corner
MRSI Systems LLC Booth# 709 10 x 10 Corner
NAMICS Corporation Booth# 623 10 x 10 Corner
NETZSCH Instruments N.A. LLC Booth# 808 10 x 10 Corner
Neu Dynamics Corp. Booth# 302 10 x 10 Corner
NorCom Systems, Inc. Booth# 323 10 x 10 Corner
Nordson Dage Booth# 205 10 x 10 In-Line
Noritake Co., Inc. Booth# 304 10 x 10 In-Line
Northrop Grumman Mission Systems Booth# 722 10 x 10 Corner
nScrypt, Inc. Booth# 630 10 x 10 Corner
NTK Technologies, Inc. Booth# 611 10 x 20 Corner
PA&E Booth# 505 10 x 10 In-Line
Pac Tech USA Booth# 634 10 x 10 Corner
Palomar Technologies, Inc. Booth# 702 10 x 20 Corner
Panasonic Factory Solutions Company of America Booth# 213 10 x 10 Corner
Perfection Products, Inc. Booth# 812 10 x 10 Corner
PINK GmbH Thermosysteme Booth# 412 10 x 10 Corner
Plasma-Therm, LLC Booth# 512 10 x 10 Corner
Quik-Pak Booth# 622 10 x 10 Corner
Reldan Metals Booth# 114 10 x 10 In-Line
Riv Inc. ~ Precision Printing Screens Booth# 502 10 x 10 Corner
Royce Instruments, LLC Booth# 403 10 x 20 Corner
Rudolph Technologies Booth# 631 10 x 10 Corner
Sales and Service, Inc. Booth# 330 10 x 10 Corner
Samtec, Inc. Booth# 509 10 x 20 In-Line
Semi Dice, Inc. Booth# 510 10 x 10 Corner
Sentec E&E Co., Ltd. Booth# 821 10 x 10 Corner
Shinko Electric America Booth# 310 10 x 10 In-Line
Sikama International, Inc. Booth# 604 10 x 10 In-Line
SMART Microsystems, LLC Booth# 209 10 x 10 In-Line
SOMACIS Booth# 731 10 x 10 Corner
Sonoscan, Inc. Booth# 413 10 x 10 Corner
Taiyo Ink Mfg. Co., Ltd. Booth# 625 10 x 10 Corner
Tanaka Precious Metals Booth# 303 10 x 10 Corner
Tango Systems, Inc. Booth# 724 10 x 10 Corner
Technic, Inc. Booth# 120 10 x 10 In-Line
TechSearch International, Inc. Booth# 730 10 x 10 Corner
Teikoku Taping Systems, Inc. Booth# 125 10 x 10 Corner
Teledyne Advanced Electronic Solutions &
Teledyne Microwave Solutions
Booth# 803 10 x 10 Corner
Torrey Hills Technologies, LLC Booth# 231 10 x 10 Corner
TPT Wire Bonder Booth# 406 10 x 10 In-Line
Tresky Corporation Booth# 408 10 x 10 In-Line
U.S. Tech Booth# 105 10 x 10 Corner
Unisem Group Booth# 425 10 x 10 Corner
UNITY Booth# 211 10 x 10 In-Line
Utz Technologies, Inc. Booth# 805 10 x 10 Corner
West Bond, Inc. Booth# 513 10 x 10 Corner
XYZTEC Booth# 410 10 x 10 In-Line
YINCAE Advanced Materials Booth# 309 10 x 10 In-Line
Yole Developpement Booth# 426 10 x 10 Corner
YXLON Feinfocus Booth# 212 10 x 10 Corner
Zeta Instruments Booth# 411 10 x 10 Corner
TOTAL BOOTHS: 122

 

 

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:: Job Openings ::

MORE SOON...

 

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( http://jobs.imaps.org ) at no cost - part of corporate membership!

 

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:: Issue 192 ::
August 16, 2016

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services