:: Corporate Member News ::

:: AMKOR Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications (full story)

:: News from MASTER BOND (full story)

:: News from ENrG Inc. (full story)

:: MATERION Corporation Enters into Definitive Agreement to Acquire Heraeus’ Target Materials Business (full story)

:: INDIUM Corporation Releases Video on Indium Tin Oxide’s Impact on Touchscreen Technology (full story)

:: Recent PTI News (full story)

:: TJ GREEN ASSOCIATES, LLC Relaunches Newly Designed Site (full story)

:: TORREY HILLS Establishes Program Allowing Customers to Purchase Ceramic Microwave Package on Amazon (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.






All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: AMKOR Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications

Amkor Technology Inc. announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT™). SWIFT is designed to handle the demanding requirements of today's advanced mobile, networking and system-in-package (SiP) applications.

With its fine-feature photolithography and thin film dielectrics, SWIFT bridges the gap between through silicon via (TSV) and traditional wafer level fan-out (WLFO) packages. Compared to laminate-based substrate technologies, SWIFT offers dramatic improvements in form factor, signal integrity, power distribution and thermal performance. SWIFT incorporates an "RDL first" process that allows SWIFT wafers to be built and yielded ahead of the assembly process - accelerating production cycles and optimizing overall assembly yield.

"The semiconductor industry requires much higher levels of integration in a significantly reduced form factor," said Ron Huemoeller, Amkor's corporate vice president, Research & Development. "Completing the product qualification stage of SWIFT is an important milestone. We achieved success by leveraging our significant fan-out development experience and using our existing cutting-edge equipment. Our package and board-level reliability results demonstrate that SWIFT is ready for sampling by customers."
SWIFT was named the "Device of the Year" at the 3D InCites Awards ceremony earlier this year.  It was recognized for being "uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry." SWIFT was also noted for its ability to deliver 2µm line/space lithography (with up to four layers of RDL) and a very dense network of memory interface vias at a very competitive price.

SWIFT is targeted for production in the second half of 2017 at K5, Amkor's state-of-the-art manufacturing, research and development center in Incheon, South Korea.


About Amkor Technology

Amkor Technology Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes more than 8 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit


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:: News from MASTER BOND

New Epoxy Adhesive Serviceable
At Cryogenic Temperatures

Master Bond Inc., has introduced a new two component epoxy adhesive/sealant for cryogenic applications.  Called EP29LPSP, this compound is able to withstand temperatures as low as 4K.  Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight.  It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours.  EP29LPSP features superior physical strength properties and excellent chemical resistance.  It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics.  When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply.  Its mixed viscosity is 400 cps.  It has a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi.  When cured, EP29LPSP is a superior electrical insulator.  Its volume resistivity is >1015 ohm-cm and its dielectric constant is 3.6.  It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear.  It is available for use in pint, quart, gallon and 5 gallon kits.  It is also available in syringe applicators.

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:: News from ENrG Inc.

Eindhoven and Buffalo (NY) - Dutch R&D institute Holst Centre (set up by imec and TNO) and American ultra-thin ceramics supplier ENrG Inc. have created the first ever ceramic-based, large-area flexible OLED. The device, manufactured on the 20-40 µm thick Thin E-Strate® ceramic substrate, promises a lifetime in excess of 10 years without the formation of blackspots. The ceramic carrier is also easy to handle and capable of withstanding the high temperatures used in display backplane manufacturing and standard sintering processes.

The ceramic substrate used for the 12 cm by 2.5 cm prototype OLED device combines many of the best properties of other flexible OLED carriers. It offers an intrinsic barrier to protect the sensitive OLED from the environment, as with metal foils or flexible glass. But it is much easier to handle than either. Like plastic films, the ceramic offers the potential for semi-transparent devices. In fact, its slight opaqueness actively improves light outcoupling, opening the door to higher devices efficiencies. Unlike plastic films, though, the ceramic can withstand temperatures up to 1000 oC.

“Our Thin E-Strate® ultra-thin ceramic has many plus points over other flexible OLED substrates. It is the only flexible substrate that has both intrinsic moisture barrier properties and high-temperature capabilities, in combination with being both robust and smooth enough to fabricate an OLED device on. The prototype device made by Holst Centre shows the benefits Thin E-Strate® brings new flexible electronics applications,” said Kathy Olenick, Technical Marketing Manager at ENrG Inc.

The materials used to make OLEDs are extremely sensitive to the environment, in particular moisture, and must be protected on both sides. With its intrinsic barrier properties, Thin E-Strate® means OLEDs can be fully protected with just the addition of a top barrier – simplifying production compared to plastic-based OLEDs.

The protection the OLED receives, and hence its potential durability, is typically quantified through its water vapor transmission rate (WVTR). In tests, the Thin E-Strate®-based OLED demonstrated a WVTR below 8.5 x 10-7 g / m2 / day. In addition, while most flexible OLEDs require a multi-layer barrier on both sides, the Holst Centre-ENrG device achieved these values thanks to just the ceramic Thin E-Strate®- at the bottom and a Holst Centre thin film top encapsulation, directly deposited by plasma enhanced chemical vapour deposition (PECVD) and printing of a few layers, on top of the device.

“A WVTR of less than 10-6 g / m2 / day is widely accepted as a minimum requirement for commercial devices. At this level, it takes over 10 years for deterioration due to moisture to lead to visible black spots. But such a rating is difficult to achieve, and many other flexible OLEDs with single-layer barriers have around 10-5 g / m2 / day or higher (equivalent to a 1year lifetime or less). Beating the 10-6 g / m2 / day target with such a simple structure shows the excellent protection of Thin E-Strate® and Holst Centre’s direct thin film encapsulation  stack on top. This approach could help further reduce complexity for flexible OLED production,” said Hylke Akkerman, Senior Scientist at Holst Centre.


Picture: the first ever ceramic-based, large-area flexible OLED

About Holst Centre
Holst Centre is an independent R&D center that develops technologies for wireless autonomous sensor technologies and for flexible electronics, in an open innovation setting and in dedicated research trajectories. A key feature of Holst Centre is its partnership model with industry and academia based around shared roadmaps and programs. It is this kind of cross-fertilization that enables Holst Centre to tune its scientific strategy to industrial needs.

Holst Centre was set up in 2005 by imec (Flanders, Belgium) and TNO (The Netherlands) and is supported by local, regional and national governments.

Located on High Tech Campus Eindhoven, Holst Centre benefits from, and contributes to, the state-of-the-art on-site facilities. Holst Centre has over 200 employees from some 28 nations and a commitment from over 50 industrial partners.

About ENrG Inc.
ENrG markets and manufactures Thin E-Strate®, an ultra-thin flexible fully dense zirconia based ceramic substrate. ENrG licensed this remarkable ceramic technology from Corning Incorporated. There are no other self-supporting ceramic membrane products on the market this thin, with the ability to flex and handle extreme transitions in temperature.  Thin E-Strate® redefines the world of ceramic membranes, available in traditional sheet form now and continuous rolls in 2017. ENrG believes industry trends including wearables, non-planar surfaces, and thinner and lighter weight are in play that provide for rapid market expansion for Thin E-Strate®.

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:: MATERION Corporation Enters into Definitive Agreement to Acquire Heraeus’ Target Materials Business

Materion Corporation announced today that it has entered into a definitive agreement to acquire the principal portion of the high-performance target materials business of the Heraeus Group of Hanau, Germany. The acquisition is expected to be consummated in the first quarter of 2017, subject to the satisfaction of regulatory approvals and customary closing conditions.

Negotiations for Heraeus’ magnetic data storage business in Singapore continue and are not included in the definitive agreement announced today. Materion and Heraeus decided to proceed with the principal portion of the proposed acquisition announced in May 2016 in order to begin the regulatory approval process that is not expected to be required for the magnetic data storage business.

Heraeus’ target materials business generates approximately $60 million in annual value-added sales. The transaction purchase price is approximately $30 million, which represents a 6 times multiple of EBITDA. The target materials business is forecasted to be accretive to earnings in 2017.

Heraeus manufactures precious and non-precious metal target materials for the architectural and automotive glass, electronic display, photovoltaic and semiconductor markets at facilities in Germany, Taiwan, the United States and Singapore. Once acquired, the businesses will operate within the Materion Advanced Materials business segment.
Commenting on the agreement, Donald G. Klimkowicz, President, Materion Advanced Materials, said, “We are excited to have reached this milestone toward acquiring this business. There are both complementary and unique aspects inherent to both Materion’s and Heraeus’ target materials offering and capabilities, which, once combined, will allow us to enhance our position in traditional markets, widen our product breadth and drive additional growth in new markets. This investment underscores our commitment to the long-term future of the target materials business.”

Added Richard J. Hipple, Materion Chairman, President and CEO, “This planned acquisition is a compelling fit with our global growth strategy and our criteria for investment by adding critical mass in target materials underpinned by a broadened manufacturing presence in Europe, Taiwan and the U.S., as well as the addition of some highly differentiated technologies that will strengthen Materion’s offering to global customers. We are looking forward to welcoming Heraeus’ very talented target materials employees into the Materion family.”

Materion Corporation is headquartered in Mayfield Heights, Ohio. The Company, through its wholly owned subsidiaries, supplies highly engineered advanced enabling materials to global markets. Products include precious and non-precious specialty metals, inorganic chemicals and powders, specialty coatings, specialty engineered beryllium alloys, beryllium and beryllium composites, and engineered clad and plated metal systems.
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:: INDIUM Corporation Releases Video on Indium Tin Oxide’s Impact on Touchscreen Technology

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a video available at

As part of the Electronics Assembly with Phil Zarrow series, Lasky and SMT manufacturing expert Phil Zarrow, President and Principal Consultant for ITM Consulting, review how ITO is used to enable flat panel and touchscreen technologies. 

“Indium metal and ITO are among the most important materials in the modern world,” according to Lasky. “The very nature of metals is that they're opaque; it's a matter of physics. So, scientists had to find a material that both conducts electricity and is transparent – and ITO is the solution. ITO’s transparency enables flat panel displays and touchscreen technology.”


For more information on indium, high-purity indium, and indium alloys, visit

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at

Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology, and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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:: Recent PTI News

Die Bonding: It’s All in the Family
In March 2015, Palomar Technologies acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing and wafer bonding of microelectronic packages and components.  SST International, now known as SST Vacuum Reflow Systems, compliments Palomar’s existing line of wire and die bonders to provide customers the premier “one-stop shop” for precision assembly and hermetic packaging of electronic components. So, how do Palomar and SST converge and complement one another? Read the full blog:

Why Gold-Tin is the Best Solder Alloy
There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to over 1000°C. Yet, there is one alloy in particular that stands out and is most commonly used by the majority of users for die attach and lid seal applications. Read the full blog:


Subscribe to the PTI Blog! Join the industry peers who already have!

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:: TJ GREEN ASSOCIATES, LLC Relaunches Newly Designed Site

TJ Green Associates, LLC has relaunched their website providing easy access to consulting requests, expert witness services, public seminars, in-plant training and online training through white papers and webinars.

TJ Green Associates, LLC ( announced their relaunched website designed for easy access to training materials, public seminars and expert witness and consulting services.

Public Seminars - TJ Green offers a number of microelectronics training seminars throughout the year, the next seminar scheduled is a one day training program Introduction To Microelectronics Packaging Technologies taking place April 14, 2017 in Bethlehem, PA.

Online Training - TJ Green Associates offers a number of online training materials including on-demand webinars, free white papers and their unique Semiconductor Packaging Training and Certification program.

Mr. Green concluded, “Companies who invest in our training gain immediate access to specialized knowledge from industry experts that you just won’t find anywhere else. We’re expecting heavier than usual demand this year and our limited number of openings will fill up quickly.”

About TJ Green Associates, LLC
TJ Green Associates, LLC is global provider of teaching and consulting services to companies that assemble and package hybrids, multichip modules, and other types of packaged microcircuits. Learn more at:


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:: TORREY HILLS Establishes Program Allowing Customers to Purchase Ceramic Microwave Package on Amazon

Torrey Hills Technologies, LLC (THT) Torrey Hills Technologies is proudly announcing the launch of Ceramic Package products that will be readily available to businesses of all types and sizes!
"Many customers experienced difficulties in ordering a small quantity of RF/MW ceramic packages, since almost all manufacturers have a minimum lot charge of $5000 or more. " said Ken Kuang, president of THT. "Torrey Hills Technologies decided to start a new business model, offering standard RF/MW packages online in Amazon."

So far 7 standard models have been launched on Amazon. Whether you wish to place customized bulk order, or purchase stock items online, we have just the right solution for you.

Torrey Hills Technologies, LLC (,, is a leader in developing and delivering quality yet extremely affordable materials, fabricated parts, and equipment for multiple industries. The company's core business includes refractory metal heat sinks (CuW, CuMo, CMC, CPC), fabricated microelectronics packaging components, molybdenum, tungsten and their alloy materials, and furnace equipment for electronics and solar cell industry. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.

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:: Issue 199 ::
December 16, 2016


Gannon & Scott



Oneida Research Services