:: Corporate Member News ::

:: ADVANTECH U.S., Inc. recognized with Kurt J. Lesker, III Manufacturing Innovator of the Year Award (full story)

:: INDIUM Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016 (full story)

:: News from MASTER BOND (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


Canon USA




All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: ADVANTECH U.S., Inc. recognized with Kurt J. Lesker, III Manufacturing Innovator of the Year Award

Advantech U.S.,Inc., a Pittsburgh-based advanced manufacturing company, was recently presented the Kurt J. Lesker, III Manufacturing Innovator of the Year Award by Petra Mitchell, CEO of Catalyst Connection. The recognition and award, which was given at the Wyndham Grand Hotel in Pittsburgh on November 3rd, were part of the Pittsburgh Technology Council’s annual Tech 50 Awards.

“We could not be more proud,” said Whit Little, CEO of Advantech U.S. “This award means so much to Advantech U.S. and all our employees, who are the true innovators in this company. Receiving the Kurt J. Lesker, III award has special meaning since Kurt III and the Kurt J. Lesker Company were an early champion and partner of ours. Our companies have successfully collaborated on and co-developed technology for the additive manufacturing of electronic devices.”

Advantech U.S., founded in 2004, has developed a type of printing technology, called Evaporation Printing, to additively manufacture, or print, electronic sensors, devices, systems, and circuits for the electronics industry. Like building blocks, this additive process deposits materials layer-by-layer to build up a complete electronic device.

This technology is used to print the Red, Green and Blue (RGB) color material that form the pixels for mobile displays such as cell phones and tablets. The technology is also used to print metal conducting lines, resistors, capacitors, transistors, etc. on a single layer to form a Printed Circuit Board (PCB). A PCB manufactured in this way is thin and light – and can be flexible. 

In short, Advantech U.S.’s technology will enable tech companies to make electronic devices, including computers, smart phones, and tablets, that are thinner, faster, lighter, cheaper, and more environmentally friendly.

“Advantech is a long time client and partner of Catalyst Connection,” said Petra Mitchell, President and CEO of Catalyst Connection, SWPA’s leading economic development organization for manufacturing. “Advantech represents our region’s strong historical strength in manufacturing materials and processes, coupled with advanced technology for the future.  We are extremely proud of our affiliation with Advantech”

“We are excited to congratulate our long time customer and partner Advantech U.S. on winning the Kurt J. Lesker III award for Excellence in Advanced Manufacturing,” said Kurt J. Lesker IV, President and CEO of the Kurt J. Lesker Company.  “Whit Little and the talented team at Advantech have developed an innovative approach to circuit board manufacturing that will significantly improve the next generation of smart devices.  We wish them continued success in the future."

About Advantech, U.S.
Advantech U.S. is a Pittsburgh-based company with decades of expertise in precision shadow mask technology and a vertically integrated provider of additive manufacturing solutions for embedded electronics.

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:: INDIUM Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016


Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany. 

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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:: News from MASTER BOND

Low Viscosity, Two Component Epoxy is Optically Clear with Non-Yellowing Properties

Master Bond EP112LS is a two part epoxy that is well suited for impregnation, potting, encapsulation, sealing and coating applications, particularly in the aerospace and optoelectronics industries.

Master Bond

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. EP112LS is serviceable over the temperature range of -60°F to +450°F.

This system features a working life exceeding 2-3 days at room temperature and requires oven curing. Post curing will enhance its properties. With a mixed viscosity of 50-200 cps, EP112LS bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many rubbers and plastics. Bonds feature a tensile strength, compressive strength and tensile modulus of 11,000 psi, 20,000 psi and 400,000 psi at room temperature, respectively. Dimensional stability is outstanding.

EP112LS has a shelf life of one year in original, unopened containers and is available in ½ pint, pint, quart, gallon and 5 gallon container kits.

Master Bond Electrically Insulative Adhesive Systems

Master Bond 112LS is an optically clear, low viscosity epoxy that has been formulated for a variety of high performance applications. This two component, heat curing system is also a competent electrical insulator, even at elevated temperatures. Read more about Master Bond’s electrically insulative adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100 to 50 ratio by weight. The mixed system is a malleable paste, with an exceedingly long open time of more than 5 days for a 100 gram batch. The curing is straightforward; 3-4 hours at 300°F or 2-3 hours at 350°F.

Master Bond

EP126 adheres well to many substrates including metals, composites, glass, ceramics, rubbers and many plastics. It offers a high tensile lap shear strength, tensile modulus and compressive strength of over 2,800 psi, 425,000-475,000 psi and 32,000-34,000 psi, respectively. This epoxy compound resists a variety of chemicals such as water, oils, acids, bases and many solvents. Additionally, it is formulated as a toughened system allowing it to withstand rigorous thermal cycling.

EP126 is dimensionally stable, has low shrinkage upon curing and is machineable. It also is a very good electrical insulator, especially as it retains high dielectric strength at elevated temperatures. When used as an adhesive and sealant, EP126 can be conveniently applied with a spatula or knife. This product has a service temperature range of -80°F to +600°F. EP126 features a shelf life of 6 months in its original, unopened containers and is available in kits ranging from ½ pints to 5 gallons.

Master Bond High Temperature Resistant Adhesives
Master Bond EP126 is a toughened, high temperature resistant epoxy with superior strength properties. This chemical resistant system has excellent electrical insulation properties. Read more about Master Bond’s high temperature resistant adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

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:: Issue 198 ::
December 2, 2016


Gannon & Scott



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