Heraeus TFD

:: Corporate Member News ::

:: Amkor Technology earns CSO50 Award for Security Innovation and Initiatives (full story)

:: Anaren Awarded a $7 Million Contract to Provide Advanced Beamforming Technology for Airbus Defence and Space in Support of the Eutelsat Quantum Satellite Program (full story)

:: Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016 (full story)

:: Master Bond’s Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications (full story)

:: Thermacore showcases heat transfer technology at IMAPS (full story)

:: KISCO Ltd., an international supplier of high-quality materials, products and services, has announced its acquisition of Specialty Coating Systems, Inc. (full story)

:: Kester Launches NP545 Solder Paste (full story)

:: Finetech's New Sigma Bonder 0.5µm Accuracy for Large Die on Wafer Level Substrates and High Force Applications (full story)

:: i3 Electronics, Inc. Earns “Preferred Supplier” Status from Raytheon (full story)

:: Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals (full story)

:: Job Openings ::


Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.



Master Bond



All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: Amkor Technology earns CSO50 Award for Security Innovation and Initiatives

SAP compliance module upgrade focuses on system security, risk mitigation.
Amkor Technology Inc. (Nasdaq: AMKR), has announced it has received IDG Enterprise’s 2016 CSO50 Award, which recognizes leadership in developing and implementing security initiatives that drive business value.

IDG received hundreds of nominations for the annual award; the top 50 were chosen by the publisher’s award committee. To help security leaders and organizations in building security strategies, Mike Forman, Amkor’s VP of Information Security, will join other honorees in sharing their case studies at the CSO50 Conference in April 2016.

“Amkor is committed to protecting intellectual property owned by the company and its customers,” said Umesh Manathkar, Amkor’s CIO. “Information security is a key part of our corporate value proposition.”

In their recent release, IDG offered this statement: “Security continues to be elevated in business strategy conversations, from the board to the CEO and throughout the organization. CSOs are leading the charge to protect their organization’s assets while the organization innovates and continues to stay agile,” said Bob Bragdon, vice president and publisher, CSO. “I am extremely impressed with the security innovation our honorees have demonstrated and their stories will encourage other organizations to grow and embrace innovation without sacrificing security.”

About the CSO50 Awards

Launched in 2013, the CSO50 Awards recognizes 50 organizations for security projects and initiatives that demonstrate outstanding business value and thought leadership. The CSO50 Awards are scored according to a uniform set of criteria by a panel of judges that includes security leaders, industry experts, and academics. The 2016 awards will be presented at the CSO50 Conference + Awards, April 18-20, 2016, at the Wigwam Resort outside Phoenix, Arizona.

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Anaren Awarded A $7 Million Contract To Provide Advanced Beamforming Technology For Airbus Defence And Space In Support Of The Eutelsat Quantum Satellite Program

Under the contract, the Syracuse-based Company will deliver its first flight-set hardware to Airbus Defence and Space in 2017.

Anaren, Inc. has announced that it has received a $7 million contract award from Airbus Defence and Space for an advanced beamforming assembly to be deployed on the Eutelsat Quantum Satellite program, which Airbus Defence and Space is developing for Eutelsat, as part of a Public-Private funded partnership with the European Space Agency. The Eutelsat Quantum program will feature the world’s first fully reconfigurable commercial satellite, allowing Eutelsat to adapt the satellite in response to new demands in coverage, bandwidth, power, frequency, and even changes in its orbital position. Anaren will deliver its first flight-set hardware to Airbus Defence and Space in calendar year 2017, with additional system tests and production anticipated over subsequent years.

“Anaren’s experience and demonstrated ability to design and produce high-performance, functionally flexible phased array beamforming assemblies put us in a position to provide Airbus Defence and Space with one of the key technologies they were looking for on the Eutelsat Quantum program,” said Mark Kosalek, Vice President of Business Development for Anaren’s Space & Defense Group. “Given the stated goal of in-orbit adaptability, our solution fully integrates active RF beam-shaping and control functionality into a package which will meet the demanding size, weight and power requirements needed for this new platform.”

Eutelsat Quantum is a first for the commercial satellite industry, featuring software-defined ‘receive’ and ‘transmit’ coverages in the Ku-band; on-board jamming detection and mitigation; and flexible beam-steering, frequency adjustments, and bandwidth reassignment functionality in order to accommodate customers’ needs or market demands.

Eutelsat Communications is one of the world’s leading operators of communications satellites used by broadcasting organizations, telcos, internet service providers, government agencies, and other customers. Based in Paris and with offices around the world, the company has a workforce of approximately 1,000 employees in 32 countries worldwide.

Parties interested in learning more about Anaren’s role in the Eutelsat Quantum satellite program may contact Mr. Kosalek by emailing

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Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif.

AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Gold-based solder has a high melting point, ranging from 280C to 1064C (depending on the alloy), making it compatible with subsequent reflow processes. This alloy has the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength. 

Indium Corporation’s Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs. 

Indium Corporation’s precision manufacturing processes and technologies ensure repeatable success in a production process. In addition, Indium Corporation partners with die-bonding equipment manufacturers to ensure that its preforms are engineered to work with equipment from assembly through reflow.

For more information about AuSn preforms, email, visit, or stop by Indium Corporation’s booth #311.

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Master Bond’s Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications

Master Bond MasterSil 972TC-LO passes the rigorous requirements for low outgassing per ASTM E595 specifications. It is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This two part silicone system offers convenient handling for bonding, sealing, coating and potting.

MasterSil 972TC-LO is an electrically insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)]. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of and plastics. Highly flexible, MasterSil 972TC-LO has an elongation of 40-80%, withstands aggressive thermal cycling and resists mechanical shock. This heat dissipative silicone system has a wide service temperature range is -120F to +400F.

This addition cured system does not require air for cross-linking. It features low shrinkage upon curing even in thick or wide cross sections. MasterSil 972TC-LO has a moderate viscosity of 30,000-40,000 cps with good flow properties and has a one to one mix ratio by weight. It has a long working life of 6-10 hours at room temperature. This compound is 100% solids and has a white color. Mastersil 972TC-LO is available in 50 gram syringe kits with additional sizes upon request.

Master Bond Low Outgassing Adhesives
MasterSil 972TC-LO is high temperature resistant, thermally conductive system offers excellent flexibility and elongation. This two part silicone also passes NASA low outgassing requirements. Read more about Master Bond’s low outgassing adhesives at or contact Tech Support.

Phone: +1-201-343-8983
Fax: +1-201-343-2132

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Thermacore showcases heat transfer technology at IMAPS

Advanced heat transfer technology will be on show by leading thermal management solutions company Thermacore Europe Ltd at the International Microelectronics Assembly and Packaging Society’s (IMAPS) workshop on micropackaging and thermal management in La Rochelle, France (4–5 February).

Thermacore’s k-Core features encapsulated Annealed Pyrolytic Graphite (APG) to provide rapid, reliable and effective high-conductivity thermal spreading for a wide range of heat transfer and cooling applications in the aerospace, transportation and defence sectors.

Samples of the technology, which provides up to three times the conductivity (k) of solid copper with lower mass than aluminium, will feature as the centrepiece of the company’s presence at IMAPS where Mark Small, Thermacore’s area sales manager, will be presenting a paper to delegates on APGs.

He said: “With ever increasing global electronics’ power and miniaturisation, IMAPS provides an ideal platform to demonstrate directly the advantages and benefits of our k-Core technology to customers who require advanced generation heat transfer solutions.”

With its state-of-the-art ISO-certified manufacturing facility in Northumberland, UK, Thermacore Europe Ltd is able to provide diverse technologies which include intelligent thermal management systems (ITMS), heat spreaders, heat pipe assemblies and liquid cooling systems alongside material development and testing programmes. More at

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KISCO Ltd., an international supplier of high-quality materials, products and services, has announced its acquisition of Specialty Coating Systems, Inc.

KISCO Ltd., an international supplier of high-quality materials, products and services, has announced its acquisition of Specialty Coating Systems, Inc., a global leader in Parylene coating services and technologies. Both well-recognized brands, KISCO has been operating in the Parylene market for over 18 years with a strong background in materials science and development, and SCS has notable roots back to the origination of Parylene and has been a leading contributor in the expansion of the worldwide Parylene market.

Over the coming year, the merged Parylene organization will begin to operate globally as Specialty Coating Systems, a KISCO company, and will build upon the legacies and strengths that the companies have built over their cumulative 63 years of Parylene experience. The acquisition represents a significant milestone in the industry as it further positions the company as the industry leader with enhanced manufacturing capabilities around the world and unmatched research, development and applications experience.

President of KISCO Ltd. Takekazu Kishimoto said of the announcement, “We are pleased to welcome Specialty Coating Systems into the KISCO family. The management teams at KISCO and SCS are committed to continuing our strong leadership positions in the industry by providing high quality Parylene services and technologies to our customers through a combined 21 regionally positioned facilities throughout the Americas, Europe and Asia. We are also committed to expanding the market by developing and commercializing new, cutting-edge materials, processes and technologies, which will be made possible by the consolidation of our highly successful engineering teams.”

Terry Bush, SCS President & CEO, added, “This is an exciting time for our company and customers. I am proud of what Specialty Coating Systems has accomplished in the market throughout our company’s long history and am confident that the consolidation of our two companies will create an even stronger entity to better serve our customers in the future. SCS and KISCO remain committed to the highest level of quality products and customer service experiences, and we are excited about the opportunity to offer customers additional resources, locations and coating options to help make their innovations successful.”

For more information about Parylene conformal coatings and these companies, visit


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Kester Launches NP545 Solder Paste

Kester is proud to announce the launch of NP545, a zero-halogen, lead-free, no-clean solder paste designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 6 months with no print or solderability degradation. Shelf life is 1 year from the date of manufacture when refrigerated. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as ROL0 per IPC J-STD-004B.

For additional information on this product including technical and safety data sheets, please visit

To learn more about Kester’s product offering and capabilities, please visit our website at

For any questions or additional information, please contact:
Michelle O’Brien

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Finetech's New Sigma Bonder 0.5µm Accuracy for Large Die on Wafer Level Substrates and High Force Applications

Finetech introduces the new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300 mm. The FINEPLACER® Sigma is ideally suited for high-density array applications and high bond force (up to 1000N) requirements, coupled with Finetech’s renowned sub-micron placement accuracy.

The system is the ideal choice for a wide variety of Wafer Level Packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging. This includes assembly of complex 2.5D and 3D IC packages that require high accuracy across the entire surface of large substrates. The FINEPLACER® Sigma can also pick up from and bond to 300mm wafers.

The cornerstone element of the new bonder is FPXvisionTM, the newest generation of Finetech’s Vision Alignment Systems (VAS). The FPXvisionTM provides the highest resolution at all magnification levels and real-time optimized camera images. It enables the smallest devices and features to be clearly observed across the entire field of view, even with large components and substrates. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras' full resolution potential is tapped. FPXvisionTM is the first vision system to introduce pattern recognition to a semi-automated die bonding platform.

The FINEPLACER® Sigma allows endless fields of application to users working with medical technologies, R&D, mil/aero, semiconductor, and automotive industries. The optimal process environment can be configured for each type of application, including the latest technologies such as vacuum bonding, sintering or metal diffusion (Cu/Cu).

Neil O’Brien, General Manager of Finetech USA, states, “It is very exciting to offer such a flexible bonding platform to address the needs of large or small die, with high density I/O bonded to virtually any size substrate. We have always been known for our sub-micron technology, but to offer this in a semi-automated system that can handle 300mm wafers and apply forces up to 1000N is incredible. Our new FPXvisionTM technology with pattern recognition and alignment verification, will help increase yields for today’s most demanding applications.”

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i3 Electronics, Inc. Earns “Preferred Supplier” Status from Raytheon

i3 Electronics, Inc. has announced that it has recently been added to Raytheon’s “Preferred Supplier List” (PSL). i3 Electronics has earned this “Preferred Supplier” status by continuously delivering a high level of performance and value-add to Raytheon. Designation of this prestigious “Preferred Supplier listing” will allow i3 to work even more closely with Raytheon and their world-class team of engineers, scientists and problem solvers.

“The designation of “Preferred Supplier’ from Raytheon is a progressive step for our company. i3 has demonstrated time and again that our technical capabilities and value are unmatched in the industry. We are excited to work with Raytheon on future projects that provide real-world solutions”, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

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Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Remtec Inc. has been acquired by LTI (, a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.

In making the announcement to employees and customers, Remtec President Nahum Rapoport said, “I am pleased to announce that Remtec has been acquired by LTI, Inc., a company that addresses similar markets and customers that should greatly help in continuing product enhancements and development. Remtec will remain an independent company operating under the existing management team at the present location. I will continue to serve as President of Remtec and as a Remtec and LTI Board member. Remtec’s customers will continue to interact with the same professionals from our customer service, engineering, and application engineering teams.”

Bruce Diggett, LTI president and CEO, said “the acquisition will benefit LTI’s domestic and international customers, as the combined companies will have even greater resources for product innovation, manufacturing efficiencies and customer service.”

Rapoport added, “The acquisition creates a synergistic partnership between ceramic and glass-to-metal packaging companies who can now share their engineering expertise and manufacturing capabilities, as well as similar marketing and sales strategies.” With both companies participating in similar markets, product innovations in those markets can be expected.

LTI manufactures glass-to-metal seal hermetic packages, high reliability precision quartz crystal holders and specialized solutions for aerospace, defense, telecommunications, medical, automotive and sensor applications. LTI is a RoHS and ISO compliant and ITAR registered company located in Mission, Kansas.

Remtec provides custom and semi-custom packaging solutions using PCTF (Plated Copper on Thick Film) metallization on alumina, AIN and BeO ceramics. Applications include sensors and detectors, laser and photo diode submounts, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military industries. Remtec is a RoHS compliant ISO 90001:2008 registered and ITAR compliant company operating in a manufacturing facility totaling 33.000 sq. ft. in Norwood, MA.

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:: Job Openings ::

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( ) at no cost - part of corporate membership!


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:: Issue 182 ::
January 19, 2016


Gannon & Scott



Oneida Research Services