Heraeus TFD

:: Corporate Member News ::

:: News from Amkor (full story)

:: PA&E Group Welcomes Litron Inc. into Its Corporate Structure (full story)

:: Master Bond’s Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life (full story)

:: Finetech's Lambda Bonder Enhances Advanced Packaging Capabilities at Lurie Nanofabrication Facility (full story)

:: Axus Technology to Distribute Trusval Technology CO2 DI Water Delivery System (full story)

:: SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste (full story)

:: Job Openings ::



Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


Master Bond

Shenmao America, Inc.



All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: News from Amkor

Amkor Technology Opens MEMS Packaging Line in China
Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. has announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed at Amkor’s MEMS packaging line in the Philippines, which has produced more than 2.1 billion units of MEMS and sensors since 2011.

“Because the package influences device performance, MEMS and sensor development requires close collaboration between device technologists and packaging engineers,” said John Donaghey, Amkor’s corporate vice president, Mainstream Products business unit. “Our Shanghai expansion allows us to better serve customers in Greater China and internationally.”

The sensor content of smartphones, Internet of Things devices, and smart automobiles is increasing rapidly. According to Yole Développement, this has spurred unit growth in the MEMS market to an expected 13% compound annual growth rate through 2021. Additionally, miniaturization and the need for advanced MEMS and sensors are driving the need for “sensor fusion,” which integrates more functionality into a single package.
The new MEMS and sensor line in Shanghai uses Amkor’s standard strip-based processes, and offers leading-edge test protocols to speed time-to-market.

Amkor Technology Receives Qualcomm Technologies’ 2015 Supplier of the Year Award

Amkor Technology Inc. has announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, for its performance in 2015. Qualcomm Technologies’ Supplier of the Year award recognizes a key supplier that demonstrates the highest on-time delivery, quality and customer service performance throughout the calendar year. Qualcomm Technologies recognized Amkor for its significant contributions in providing packaging and test support for premium-tier mobile communications products.

“We are honored to receive Qualcomm Technologies’ Supplier of the Year award,” said Steve Kelley, Amkor's president and chief executive officer. “Amkor is fully committed to providing the advanced packaging and test services and superior customer experience that meet the stringent requirements set by Qualcomm Technologies. This award is recognition of the close collaboration between our two companies and the outstanding commitment shown by our teams worldwide.”

“Qualcomm Technologies congratulates Amkor on winning the 2015 Supplier of the Year award,” said Roawen Chen, senior vice president of global operations, Qualcomm Technologies, Inc. “This award acknowledges Amkor’s performance improvements in all major areas, including on-time delivery, quality, customer service and strategic business support. Amkor is an important supplier and was instrumental to our success in the premium tier of the mobile communications ecosystem. We look forward to Amkor becoming a more important supplier in our supply chain strategy.”
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:: PA&E Group Welcomes Litron Inc. into Its Corporate Structure

PA&E has announced that it has joined forces with Agawam, MA-based Litron, Inc. PA&E is a leading manufacturer of hermetic electronic packaging and interconnect products for the defense, space, energy and medical industries. Litron, Inc. is a leading supplier of laser welding systems, laser sealing/welding/cutting and other manufacturing services aerospace, industrial and medical components.

“Welcoming Litron into the PA&E family is a great way to celebrate our 40th year in this industry,” said Nathan Foster, Business Development manager for PA&E. “We have enjoyed a great working relationship with Litron for years, so we are very familiar with their high-quality workmanship and their dedication to meeting customer needs. This new partnership will have a very positive impact on both of our customer bases.”

Litron operates out of its Agawam, MA facilities, that include a complete laser systems fabrication division; state-of-the-art Class 10K clean room environment for sealing in an inert environment as well as a full service electronic package fabrication center complete with gold plating and feed-thru integration services.

PA&E operates out of its Wenatchee, WA headquarters that features 100,000+ square feet of manufacturing space - including recently expanded machining capabilities, plating facilities; brazing operations, laser welding and assembly works.

“PA&E has a long history of innovation in this industry, and our core competencies complement each other very well,” said Mark Plasse, Litron President. “By combining our forces, we can provide new levels of products and services to each of our customer bases in a simple and seamless manner.”

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:: Master Bond’s Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life

Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically.

EP29LPAO delivers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] and superb electrical insulation values, including a volume resistivity exceeding 1015 ohm-cm. Additionally it offers an outstanding high strength profile, with a tensile modulus of 450,000-500,000 psi and a compressive strength of 24,000-26,000 psi at 75°F. This product bonds well to a wide range of substrates such as metals, glass, ceramics and many plastics. EP29LPAO cures at room temperature or more rapidly at elevated temperatures. An optimum cure schedule is overnight at 75°F followed by 4-5 hours at 150°F.

Often used in the aerospace, electronic, electrical and specialty OEM industries, EP29LPAO is serviceable from -60°F to +250°F. It resists chemicals including water, fuels and oils. This off-white colored system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits as well as premixed and frozen syringes.

Master Bond Low Exotherm Adhesives
EP29LPAO is a low viscosity epoxy system that features a long working life, reliable electrical insulation and low exotherm suitable for large potting and encapsulation applications. Read more about Master Bond’s low exotherm adhesives at

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:: Finetech's Lambda Bonder Enhances Advanced Packaging Capabilities at Lurie Nanofabrication Facility

Finetech and the University of Michigan in Ann Arbor, Michigan, announce the installation of a FINEPLACER® Lambda bonding system in the university's Lurie Nanofabrication Facility (LNF). This sub-micron accuracy bonder is designed to position and attach micro-electronic or opto-electronic components on various substrates, including flex circuits, glass, silicon, ceramic, etc.

LNF selected the Lambda bonder to support advanced packaging activities in its state-of-the-art micro and nanofabrication center. The 13,500 sf facility, comparable to the best in the world, is used by hundreds of students and researchers at the University of Michigan, other academic institutions, national labs and industry. This lab excels at combining technologies and materials within a single device, for example, optical or mechanical sensors with integrated processing circuitry and on board power generation.

With a wide base of installations at many prestigious institutions and research centers, Finetech's die bonders provide unmatched solutions for advanced technology environments utilizing diverse applications. The Lambda is a semi-automated bonding platform that is ideal for product and process development of photonics devices, sensors, LED bonding, MEMs, flip chip and micro optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, Indium, eutectic).

"We chose the Finetech Lambda based on the system's process flexibility, accuracy, ease of use, and reliability - important factors in an active multi-user environment," stated Pilar Herrera-Fierro, User Services Director at LNF. "The sub-micron placement capability is critical for our research being done in areas such as silicon integrated circuits, optoelectronics, MEMS, Bio-MEMS and microfluidics."

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:: Axus Technology to Distribute Trusval Technology CO2 DI Water Delivery System

Axus Technology has been selected by Trusval Technology as the exclusive distributor for the Trusval CO2-DI Water delivery system in North America and Europe. Used for wet cleaning applications, the Trusval CO2-DIW provides high purity DI water that is also conductive, eliminating ESD risk in wet cleaning and grinding applications, where SOI and other devices might otherwise be prone to damage.

Much more efficient than membrane-based technology or CO2 bubbling, a single Trusval CO2-DIW system can deliver up to 80 liters per minute of conductive CO2 charged water for use in critical wet process steps where the stability of the water conductivity is critical. For certain process steps the CO2-charged water has proven to be an effective replacement for NMP, while also delivering improved process performance.

The system relies on a CO2 concentration technology that is 100% efficient in the use of CO2 and DI water inputs, delivering exceptionally consistent water at a high volume.

First shipments of the Trusval CO2-DIW system for Taiwan and Asia began in 2015, and in association with Axus Technology, is now sold and supported worldwide. Axus is pleased to be exhibiting this tool at the upcoming Semicon West 2016 conference in San Francisco. The tool and representatives from both Axus Technology and Trusval Technology will be at the Moscone Center, Booth 2305 in the South Hall.

"We are pleased to be working with Axus Technology," said Trusval Technology president, Eric Chien. "While Trusval has established a strong customer base in Taiwan and Asia, Axus Technology has the technical capability and engineering expertise needed to support our North American and European customers. Axus has a strong history in supporting process development work and will help us apply the Trusval CO2-DIW system in both proven applications and new processes."

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:: SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

For more information, please contact:

SHENMAO America, Inc.
Tel: 408-943-1755 e-mail:

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:: Job Openings ::



Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( ) at no cost - part of corporate membership!


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View the Corporate Bulletin Archives



:: Issue 191 ::
July 7, 2016


Gannon & Scott



Oneida Research Services