Heraeus TFD

:: Corporate Member News ::

:: SemiDice Launches New Website (full story)

:: News from SST/Palomar (full story)

:: W. L. Gore & Associates, Inc. Introducing High-Frequency Solutions (full story)

:: MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction (full story)

:: SHENMAO Exhibits and Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes (full story)

:: Job Openings ::



Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.




Master Bond


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: SemiDice Launches New Website

SemiDice, Inc., launched their new website,, this month that has many new features to aid engineers that design hybrids with bare die semiconductors. By registering on their site engineers and buyers can search their bare die needs filtering by part number and/or manufacturer. Also, a Design Support section will highlight new part numbers available as bare die, or wafers, along with direct links to the manufacturer’s website pages that support bare die.

   ^ Top

News from SST/Palomar

SST introduces its Strategic Service Plan
Maximizing system productivity, controlling costs and gaining premium access to technical resources are just three of the reasons SST International is launching a Strategic Service Plan for customers of its vacuum reflow systems.

The contracted service plan becomes effective after system warranties expire, and provides regular preventative maintenance visits and emergency service calls for a period of one to three years.

“Our customers tell us that their customers require them to have a support plan to main system reliability and productivity, ensuring maximum throughput” said Alex Voronel, Director of Global Sales for SST, “This plan fills that requirement by combining preventative maintenance with emergency services, thus providing peace of mind to all systems users.”

In addition to the benefits above, discounts on spare parts purchases and priority overnight shipping help manage maintenance costs and minimize any unanticipated system downtime.

More information on SST’s Strategic Service Plan can be found on our website, under the “Support” tab, or from SST representatives around the world.

Organization Announcement

Dr. Adrienne Williams

SST International of Downey, Ca, is pleased to announce that Dr. Adrienne Williams has joined the company as Process Engineer.

Dr. Williams earned her Ph.D. in Engineering Physics and Materials Science from Wright State University, Dayton Ohio. She worked as a materials scientist at Wright Patterson Air Force Base Air Force Research Laboratory Materials and Manufacturing Directorate and was a Science Teaching Fellow at Vanderbilt University.

In her role at SST Dr. Williams will focus on developing and extending the company’s core application technologies and develop new processes and materials to benefit SST’s worldwide customer base.


   ^ Top

W. L. Gore & Associates, Inc. Introducing High-Frequency Solutions

New cable assembly products solve 70 GHz challenges.
W. L. Gore & Associates (Gore) has continuously expanded the company’s microwave/RF solutions at higher frequencies by designing cable assemblies that are reliable and will perform over time, and Gore is now addressing industry requirements for enhanced performance in the 60-70 GHz rangeAt the 60-70 GHz range, there is increased need to maintain measurement accuracy, especially in Network Analyzers, Oscilloscopes, Analog Signal Generators, Communication Testing, Chamber Testing, and mm-Wave to name a few key applications.  To address these challenges, Gore has developed a new 70 GHz VNA cable assembly; prototypes are currently available for evaluation.

   ^ Top

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship MRSI-M3 precision die bonding assembly work cell to the Fabrinet West facility in Santa Clara, CA, USA.

Advanced optoelectronic and microelectronic component and module products are experiencing record volumes driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the internet-of-things. This high volume and high growth trend has challenged component and module providers to produce prototypes quickly during product development and subsequently to scale to high volume manufacturing, fast and risk free. To respond to these challenges, Fabrinet is setting up an advanced optical packaging center in its facility in Santa Clara to provide fast prototyping and process development capability for customers of both Fabrinet and MRSI Systems. This application center, equipped with the MRSI-M3 die bonder along with many other capabilities, such as active optical alignment, wire bond, epoxy underfill, laser dicing, and various metrology tools, will further assist our customers in advanced product development and fast ramping to volume manufacturing. Fabrinet and MRSI Systems have agreed to form a partnership to provide the best support to customers on the West Coast, with both easy access to a state-of-the-art packaging facility and the ability to accelerate new product development and risk-free scaling to volume production.

MRSI-M3 delivers an industry-leading combination of accuracy, speed and reliability for complex eutectic bonding with scrubbing and/or force, integrated epoxy dispensing and stamping, thermal and UV epoxy bonding, and flip chip bonding. It provides the best flexibility in the industry handling multiple die sizes and carrier geometries for complex multi-die packaging or fabrication of multiple products. The system’s real-time closed-loop force control enables placement of delicate components either mechanically fragile or structurally complex for photonics, RF and microwave, sensor, MEMS and other applications. Die can be picked from waffle pack, Gel-Pak™, wafer, and tape and reel. The MRSI-M3 can be configured for flexible applications during prototyping or more dedicated processes during volume manufacturing.

“MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-two years. Fabrinet is the industry leader in contract manufacturing for advanced packaging of complex products and has been a great customer to us. Both companies also serve the same customer base and market segments,” said Mr. Michael Chalsen, President of MRSI Systems. “We are very pleased to partner with Fabrinet in creating an application center in Silicon Valley to help our customers accelerate advanced product development and risk-free scaling to volume manufacturing.”

“Fabrinet is very pleased to partner with MRSI Systems to support our shared customer base in our new Fabrinet West facility located at the heart of the Silicon Valley. MRSI Systems is the industry leader in providing equipment and solutions for one of the most critical processes in advanced packaging – ultra- precision and high speed die bonding,” said Dr. Hong Hou, Executive Vice President and Chief Technology Officer of Fabrinet. “Fabrinet and its customers have been working with MRSI Systems for many years because of their product’s performance, reliability, and field service, particularly their platform design in meeting unique needs from prototyping to high volume manufacturing. We are looking forward to further our collaboration in this application center with their advanced equipment and expertise to serve our customers.”

About MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput and uptime by building systems that use our unique expertise. In summary this includes, our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable from prototype to volume manufacturing. Our solutions deliver the best financial returns in the industry, while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. Our headquarters is located in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States. For more information visit:

   ^ Top

SHENMAO Exhibits and Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

SHENMAO PF606-P116 Low Viscosity (easy to apply – Long Stencil Life), High Tackiness (slump resistant), consistent printability with Superior Wetting Characteristics for LED Die Bonding, BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC in Air or Nitrogen) create Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.

SHENMAO PF606-P128 Halogen Free Water Soluble LED Die Bonding Solder Paste, available for dispensing in Syringes in Medium Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, stable tackiness force with great Transfer Rate and excellent wash ability, it is available in T3 to T8 Powder Size.

SHENMAO PF606-XP Halogen Free Water Soluble Low Viscosity LED BGA and Micro BGA Ball Dipping Solder Paste has great Slump Characteristics and stable Tackiness Force exhibiting extremely uniform Dipping Volume for consistent High Quality Joints.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

For more information, please contact:

SHENMAO America, Inc. 
Tel: 408-943-1755   
   ^ Top




:: Job Openings ::



Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( ) at no cost - part of corporate membership!


   ^ Top



View the Corporate Bulletin Archives



:: Issue 189 ::
June 1, 2016


Gannon & Scott



Oneida Research Services