Advance Reproductions Corp.
100 Flagship Drive
North Andover, MA 01845
(P): (978) 552-1221
Advance Reproductions is a leading supplier of high-quality, large-area and optical photomasks and phototools. Advance is an ISO 9001and ITAR registered company. We support manufacturers throughout the world involved in the manufacturing of semiconductor, hybrid, microwave, nanotechnology, medical and electronic packaging devices. Advance Reproductions provides solutions and custom manufacturing services for research and development, custom shaped substrates and engineered tooling.
AGC Electronics America
4375 NW 235th Avenue
Hillsboro, OR 97124
(P): (714) 745-3193
AGC is a leader of glass, fluorinated polymers and synthetic quartz for the global automotive and electronics device industries. AGC provides specialized formulations of alkali-free alumino-borosilicate glass suitable for LED, MEMS, and interposer electronics substrates. Our high volume capability for glass and value-added services such as drilling vias, AR coatings, and via fill technologies makes AGC a valuable partner for your next generation mobile or Life Science product. AGC’s fluorinated polymer is ideally suited for dielectric coatings, or creating micro or nano-sized vias for Lab on a Chip applications in the Life Science technologies sector. AGC’s fluorinated polymer is highly transparent to 250 nanometers. It has the ability to change from a hydrophilic to a hydrophobic surface. AGC’s fluorinated material is the ideal candidate for passive and active coatings. AGC’s premier synthetic quartz with unparalleled formulation controls result in the lowest insertion loss and nearly zero auto fluorescence of any material. This provides our customers the highest electrical performance loss for high frequency circuits. In addition, AGC’s synthetic quartz’ low auto fluorescence makes it an excellent substrate for photonic applications in Lab on a Chip reactors.
AI Technology, Inc.
70 Washington Road
Princeton Junction, NJ 08550
(P): (609) 799-9388 (124)
AI Technology, Inc. (AIT) looks forward to seeing you at booth 53 at DPC next week!
How can AI Technology, Inc. (AIT) solve your problems?
AIT pioneered the use of flexible epoxy technology for microelectronic packaging in 1985 and today, remains committed to, and a leading force in, advanced materials and adhesive solutions for electronic interconnection and packaging. Our newest research has yielded higher performing and lower cost solderable flexible circuit substrate materials to replace polyimide-based organic copper-clad laminates in high frequency microwave circuits. Unique to AI Technology, Inc. (AIT) is our focus on film, not only paste, adhesives. We offer electrically conductive as well as non – electrically conductive variations.
We invite you to visit our booth, 53, to speak with our materials specialists. Introduce yourself. Bring your current applications and project goals. Based on your specific, unique and individual problems or constraints, AI Technology, Inc. (AIT) will identify the precise AIT materials solution. If need be, we will be happy to suggest another company with product offerings better suited to your application. Solving problems, not selling, is the true goal.
AI Technology, Inc. (AIT) specializes in electronic interconnect and microelectronic packaging materials, offering molecularly flexible epoxy adhesives for die and substrate attach and bonding, adhesives and underfills for multi size die bonding, DAF and DDAF for stack-chip packaging and flip-chip bonding and underfilling and high temperature single and multi chip module die bonding past 230ºC. AIT’s Wafer Processing Adhesive (WPA), only recently introduced to the market, is a temporary film format high temperature bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Additionally, AIT offers a broad range of Thermal Interface Materials (TIM), including pads, greases and gels. Other products include conformal coatings for ultimate moisture and/or humidity protection as well as UV resistant but PVDF transparent coatings with or without corrosion retardants.
2700 NE Expressway
Building B, Suite 500
Atlanta, GA 30345
(P): (404) 486-0880 (21)
Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products. Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes.
AMICRA Microtechnologies GmbH
Regensburg, D D-93049
(P): +49 941208209 (80)
AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3ơ). Equipment offering supports both Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Market focus: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP. Other products: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.
2045 E Innovation Circle
Tempe, AZ 85284
(P): (480) 786-7653
Visit Amkor at booth #38 and get the latest updates on our Advanced SiP, 3D and Stacked Die and TSV Packaging Technologies. Amkor staff will be presenting or contributing to the following sessions:
Tues. March 15th - Interposers, 3D IC & Packaging Track 2:00 PM - 2:30 PM - "System Level IC Packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging", Mike Kelly, Sr Director, Adv Package & Technology Integration, Amkor Technology (Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, Ron Huemoeller, Amkor Technology)
2:30 PM - 3:00 PM - "Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages", Rahul Agarwal, Globalfoundries (Sukesh Kannan - GF, Shan Gao - GF; Rick Reed, Yong Song - Amkor Technology, JS Paek - Amkor Technology Korea)
Tues. March 15th - Evening Panel Discussion 5:00 PM - 6:30 PM - "SiP: New Drivers and the Supply Chain", Robert Lanzone, Sr. VP/AWL&PD, Amkor Technology
Wed. March 16th - SiP Track 1:30 PM - 2:00 PM - "Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform", Miguel Jimarez, VP, Adv Package & Technology Integration, Amkor Technology (DongHee Kang, SangYun Ma, Amkor Technology Korea; Rocky Leblanc, Michael Mack, Chang Sohn, Gianlorenzo Masini, Luxtera)
Thurs. March 17th - SiP Track 10:15 AM -10:45 AM - "An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield", Nozad Karim, VP, Electrical Engineering, Amkor Technology (Rong Zhou, Amkor Technology; Jun Fan, Missouri University of Science and Technology)
In addition, Amkor's Curtis Zwenger, Sr Director, Adv Package & Technology Integration, Nozad Karim, VP, Electrical Engineering and Russell Shumway, Director, Automotive MEMS are session chairs for this event.
Amkor Technology is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a global strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator. For more information, visit www.amkor.com.
1255 E. Arques Ave.
Santa Clara, CA 94086
(P): (408) 636-9500 (572)
With a proven track record spanning over three decades, ASE, the OSAT market leader, continues its tradition of manufacturing expertise through orchestrated collaboration with customers, suppliers and partners, alike. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit : www.aseglobal.com
ASM Pacific Assembly Products, Inc.
3440 E. University Dr.
Phoenix, AZ 85034
(P): (602) 437-4688
ASM Pacific Assembly Products is a Sales and Marketing Division of ASM Pacific Technology (ASMPT). ASMPT is the world's leader in back end Assembly Equipment. With a vision of providing cost effective solutions, we offer Assembly Equipment and Leadframe technology that is in the forefront of the Semiconductor Industry.
AT&S Americas, LLC
1735 N. First Street, Suite #245
San Jose, CA 95112
(P): (408) 573-1211
(P): (408) 573-1211
AT&S is a top HDI circuit board and IC package maker offering Embedded Component Packaging technology which embeds passives and/or bare ICs inside the center core of the laminate. Embedding provides increased component density and smaller size by removing components from the board surface and embedding them inside the board. This also improves signal integrity with embedded discrete capacitors located just microns directly below the IC's. Components can be mounted on the top surface directly above the embedded components and on the bottom surface directly below. AT&S has 6 manufacturing sites in Austria (2), China (2), India, and Korea.
Atotech USA, Inc.
1750 Overview Drive
Rock Hill, SC 29730
(P): (817) 507-9843
With annual sales of $1.176 billion, Atotech is one of the world's leading manufacturers of processes and equipment for the printed circuit board, IC-substrate and semiconductor industries as well as the decorative and functional surface finishing industries. Committed to sustainability, Atotech develops technologies that minimize waste and reduce environmental impact.
ATV Technologie GmbH
SRO VACUUM REFLOW Soldering/Brazing OVENS/RTAs, semi automatic: SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free, 1100°C, IGBT, CSP, DBCs, Flip Chip, alloying, wafer bump reflow, CPV, MMIC
MEMS/PACKAGE SEALING WITH GETTER ACTIVATION THERMO COMPRESSION BONDER, 450°C:
Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering, Cu pillar/micro bump flip chip soldering
QUARTZ TUBE Furnaces: Fast ramping, multipurpose, ultra-uniform, floor space and energy saving, for: to 300 mm LPCVD, CNT/graphene, VCSEL/AlGaAs/Si oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering, thick film paste firing, Polyimide backing, Poly Si, Epitaxy, Si3N4, LTO, P and N solid source diffusion
THERMO COMPRESSION BONDER, 1 100°C: For constrained LTCC sintering, hot LTCC/glass embossing/imprinting. DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs, etc. IR CVD/ALD System: 1050°C, single wafer, fast temperature and pressure alternation
7001 W. Erie Street, Suite 1
Chandler, AZ 85226
(P): (480) 705-8000
Axus Technology delivers end-to-end support, for R&D through volume production, for CMP and substrate thinning applications. Starting with process design and development in our CMP Foundry, through delivery of production tools and processes; Axus provides industry-leading process and equipment solutions for fabs, 3D integration, and wafer & device packaging users.
Azimuth Electronics, Inc.
2605 South El Camino Real
San Clemente, CA 92672
(P): (949) 492-6481
Innovations in Socketry… See you at Booth 62!
Supporting the Electronics Industry in: Medical Telecommunications Automotive Space and Defense We offer the latest in Test and Burn-In Sockets for: QFP, CQFP, MCM, SOIC, Laser Diode, LCC, LGA, BGA, QFN, MLF, MEM, 3D Memory Stack, Medical Substrates, HF Device, PGA, Substrate Modules and Custom Integrated Circuits
Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets, has been providing innovative interconnect solutions for over 50 years. Our broad experience allows us to tackle the challenges of a constantly evolving industry. Complete in-house services include design, prototyping, tooling fabrication, and production injection molding.
Boschman Technologies / Advanced Packaging Center
34522 N. Scottsdale Rd, D-8, PMB 147
Scottsdale, AZ 85266
(P): (480) 488-9898
Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash. This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials.
APC, Advanced Packaging Center, serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications. By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.
3300 North 1st St.
San Jose, CA 95134
(P): (408) 468-2000
Canon introduces Lithography and PVD solutions for Advanced Packaging Applications during IMAPS Device Packaging 2016
Canon U.S.A., Inc. (www.usa.canon.com), a leader in digital imaging and industrial products will introduce Lithography and PVD solutions for Advanced Packaging, 3D-IC, Interposer and WLP Applications during IMAPS Device Packaging 2016. To address the challenges presented by next-generation device packaging applications, Canon has developed improvements to the FPA-5510iV stepper platform that is currently providing high-performance, flexibility, stability and low-CoO for mainstream packaging and leading-edge chip-stacking and integration operations around the world. During IMAPS Device Packaging 2016, Canon will also provide information on upgraded Canon Anelva PVD equipment that has been developed to support customers requiring advanced deposition capabilities for backend processes.
Please stop by the Booth #66 during the exhibition for updated information on Canon products supporting Advanced Packaging Applications or contact us anytime at email@example.com.
5100 Patrick Henry Drive
Santa Clara, CA 95054
(P): +1 720 412 7281
Founded in 1966, Coherent, Inc. is one of the world’s leading providers of lasers and laser-based technology for scientific, commercial and industrial customers. Our common stock is listed on the Nasdaq Global Select Market and is part of the Russell 2000 and Standard & Poor’s SmallCap 600 Index. For more information about Coherent, visit the company's website at http://www.coherent.com/ for product and financial updates.
Deweyl Tool Company, Inc.
959 Transport Way
Petaluma, CA 94954
(P): (707) 765-5779
DeWeyl provides the finest quality bonding wedges in the world. Located in the Petaluma, CA, DeWeyl's primary business is manufacturing wire bond wedges and custom high precision tooling for the semiconductor, aerospace and medical industry. DeWeyl produces wedges made from ceramic, titanium and tungsten carbide for small and large round wire and ribbon applications.
Dow Electronic Materials
455 Forest Street
Marlborough, MA 01752
(P): (774) 641-4969
Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, display, photovoltaic, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. Dow’s portfolio includes metallization, dielectric, lithography and assembly materials for advanced semiconductor packaging applications, such as bumping, pillars, RDL, passivation and UBM used for the latest FOWLP, flip chip, SiP, and 3D chip packages.
EMD Performance Materials
6555 Nancy Ridge Drive, #200
San Diego, CA 92121
(P): (858) 831-0010
Performance Materials comprises the entire specialty chemicals business of Merck KGaA, Darmstadt, Germany. The portfolio includes high-tech performance chemicals for applications in fields such as:
• Integrated Circuits
• Lighting Applications
• Solar & Energy
• Semiconductor Packaging
Customer sectors in consumer electronics, lighting, printing technology, plastics applications and integrated circuits make use of materials and solutions from EMD Performance Materials. Thanks to comprehensive investments in research & development, we are constantly extending our leading position as an innovator and reliable partner.
Our future growth integrates key materials consisting of high purity chemicals used in wafer fabrication to sustainable materials for advanced back end solutions.
EV Group, Inc.
7700 S. River Parkway
Tempe, AZ 85284
(P): (480) 305-2456
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
F & K Delvotec, Inc.
27182 Burbank Avenue
Foothill Ranch, CA 92610
(P): (949) 595-2200 (247)
F&K Delvotec is an industry leader in wire bonding technology. Our broad portfolio of products delivers a solution for any wire bonding application. Over 30 patents in wire bonding technology testify to our continuing emphasis on innovative technology, and our dedicated development, applications and service team provides optimum customer support, worldwide. F&K Delvotec manufactures complete bonding systems including transducers and ultrasonic generators as well as test equipment that has become the industry standard for evaluation of ultrasonic bonding systems.
Whatever wire bonding is required, F&K Delvotec offers a suitable tailored solution – from bond process development to complete automation systems.
560 E Germann Rd. #103
Gilbert, AZ 85297
(P): (480) 893-1630
Finetech - High Accuracy Bonders – Visit us in Booth #21
Finetech offers highest accuracy in bonding and advanced packaging equipment for today’s ever-changing, complex applications. Our bonders offer process flexibility in a single platform for various technologies such as thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), and UV curing. Finetech recently introduced the FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300 mm. This bonder is ideal for high-density array applications, high force bonding (up to 1000N), Wafer Level Packaging (FOWLP, W2W, C2W) and assembly of complex 2.5D / 3D IC packages. The Sigma can also pick up from and bond to 300mm wafers.
FlipChip International, LLC
A Division of Huatian Technology
3701 E. University Drive
Phoenix, AZ 85034
(P): (602) 431-4780
FlipChip International - Huatian (FCI-HT):
FCI-HT supplies turnkey semiconductor assembly and test services to the consumer, automotive, industrial and medical industries. FCI-HT supports a wide range of customers, frequently partnering with them to engineer customized solutions including expedite bumping of Multi-Project Wafers. FCI-HT is a leader in wafer level packaging with patented technologies spanning from Cu Pillar Bumping, Spheron™ Wafer Level Chipscale Packaging, and ChipsetT™ Embedded Die Packaging. FCI-HT is a division of Tian Shui Huatian Technologies (TSHT). TSHT is among the top three Chinese OSATs and listed on the Shenzhen Stock Exchange Market. TSHT has six ISO/TS16949 factories located in the US and China offering a complete range of semiconductor packaging and turnkey services.
Geib Refining Corporation
399 Kilvert St.
Warwick, RI 02886
(P): (800) 228-4653
Precious metal reclaim of gold - platinum - palladium - silver - iridium - ruthenium ITAR and EPA compliance means 100% destruction of your intellectual property in a regulated and environmentally responsible manner. We process all types of precious metal scrap including hazardous wastes. We also support thin film technology through shield cleaning to UHV standards. Settlements include bullion, source materials, or check/wire. We have many sound relationships within the IMAPS community and are a major supporter of IMAPS New England. Stop on over and learn why Geib is the most valued precious metals refining source.
Hesse Mechatronics, Inc.
225 Hammond Ave.
Fremont, CA 94539
(P): (408) 436-9300
Hesse Mechatronics, founded in 1986 and based in Paderborn, Germany, develops and manufactures fully automatic ultrasonic and thermosonic wire bonders and ultrasonic flip chip bonders together with standard or customer-specific automation solutions for the backend semiconductor industry. Hesse Mechatronics is one of the world’s leading producers of wire bonders using the ultrasonic wedge-wedge and the thermosonic ball-wedge technology and develops customer-specific production processes.
13400 68th Ave N
Maple Grove, MN 55311
(P): (763) 447-6260
HSIO Technologies and HSIO Circuit Technologies mission is to develop new, exciting, and proprietary technology to address high-density and high-speed interconnect challenges faced by our customers and the semiconductor industry.. HSIO is focused on improving the signal channel through the various circuits, connectors and components our customers use to develop, validate and deploy silicon to the market.
HSIO’s Grypper socket products are unique in that it requires no lid and is the same footprint as the device under test. HSIO Circuit Technologies Flex and Rigid Flex PCB manufacturing featuring < 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment .
1093 Clark Street
Endicott, NY 13760
(P): (607) 755-1985
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success.
IBM Canada Ltd.
23 Airport Boul.
Bromont, Quebec J2L 1A3
(P): (450) 534-6496
IBM Redefining the Limits at IMAPS DPC
MEET THE EXPERTS AT BOOTH #12
IBM looks forward to meeting you next week at IMAPS. We are pleased to announce that we have opened our doors to service the global semiconductor industry.
This is a dynamic and exciting period for semiconductor packaging. Leverage our deep expertise. We will provide solutions.
We specialize in high-end single and multi-chip packaging and quick-turn custom designs. Get ready to implement packaging innovation designed to address semiconductor scaling challenges and maximize your product's performance!
IBM Bromont is a world leader in semiconductor packaging technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions. Tap into our know-how as the industry continues its shift to custom SoCs and SiPs. IBM is known for its multi-chip packaging and heterogeneous integration. We offer full turnkey solutions from modelling and simulation to materials and process characterization, as well as optimized substrate design, a broad range of Burn-in and test competencies, and skillful failure analysis. We will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals.
12516 NE 95th St. Suite D110
Vancouver, WA 98682
(P): (360) 256-5600 (16)
Quality Custom in-house silicon wafer processing. We offer a wide variety of custom films and Services. Processing on 50mm- up to 450mm wafers. Bump / RDL / and TSV patterning. Thick resist patterning. Metal Deposition. Thermal Oxidation. Warped wafer fabrication. Feel free to contact us for quotations: 360-256-5600 ext.16.
4611 East Lake St.
Minneapolis, MN 55406
(P): (612) 728-1321
Infinite Graphics is an end-to-end Precision Imaging Engineering Solutions provider. IGI offers a unique set of photolithography services including grayscale, 3D nano-structures and photomask layout software designed to save you time and money. IGI will demo Medium and Large Area Masks and the NanoSculpt 3D Solutions Suite.
320 North Nopal
Santa Barbara, CA 93103
(P): (619) 540-5578
Invenios designs, develops, and manufactures microfluidics, MEMS, and 3D
microstructures. Invenios engineers exclusive processes and custom production equipment that is required to manufacture this range of products. Invenios has a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for both established and emerging companies. Unlike traditional microsystems foundries, Invenios delivers a complete production cycle, which includes design review, process development, manufacturing, and testing within an ISO 9001 environment to support a broad range of micron and sub-micron level products.
JSR’s unique THB series of negative tone thick film photoresists for RDL, micron bump, and Cu pillar applications, along with our WPR series of dielectric coatings are ideal for WL-CSP, Flip Chip, TSV, and other packaging technologies. JSR materials provide excellent throughput, large process margins, high aspect ratio solutions for film thicknesses from <10 to >100 micrometers while being processed in standard TMAH developer. Additionally, JSR offers exceptional materials in the temporary bonding space – contact us to learn more.
JSR Micro, Inc.
1280 N. Mathilda Avenue
Sunnyvale, CA 94089
(P): (408) 543-8800
Kulicke & Soffa Industries, Inc.
1005 Virginia Drive
Fort Washington, PA 19034
(P): (215) 784-6000
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging (TCB & FOWLP), advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor devices.
Kyocera America, Inc.
8611 Balboa Avenue
San Diego, CA 92123
(P): (858) 614-2592
Kyocera America, Inc. (KAI) offers an extensive array of semiconductor packages and high frequency complex modules including mmW, RF, T/R modules, BGAs, SiPs, and High Power GaN packages in a variety of ceramic and organic material sets. KAI has state-of-the-art electrical design, modeling / simulation capability in-house to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing / bumping, vacuum soldering, test and burn-in.
LB Semicon, Inc.
Cheongbuk-myeon, Pyontack City,
Kyunggi Province, Korea 451-833
LB Semicon was established in 2000 and listed Korean Stock Market (KOSDAQ) in 2011. LB Semicon provides LCD Driver IC full turnkey service from 200mm/300mm Wafer Bumping, Probe Test to Backend Assembly process such as Lamination, Back-grinding, Laser marking, Sawing, COG(pick&place), AVI, etc. Besides DDI(Display Driver IC) industry, LB Semicon serves Solder Bumping, Cu Pillar Bumping, WLCSP in fields of CIS, PMIC and other semiconductor applications. There are 200mm/300mm FAB in South Korea for the response of customers’ many new needs & demands.
Mentor Graphics Corporation
8005 Boeckman Rd.
Wilsonville, OR 97070
(P): (720) 494-1144
Mentor Graphics® is the worldwide market leader in PCB systems design, advanced IC Packaging solutions and analysis technologies. Mentor Graphics will be showcasing Xpedition Package Integrator with HyperLynx, a holistic solution for IC/Package/Board cross-domain planning, assembly, optimization and electrical analysis . Visit our booth to learn more about Mentor’s technologies and best practices for IC/Package/Board co-design or by attending Mentor Graphics technical presentations.
Metalor Technologies USA
255 John L. Diestch Blvd.
North Attleboro, MA 02763
(P): (508) 699-8800-8110
Metalor’s Advanced Coatings Division is uniquely positioned as the only global source of precious metal commodities, plating solutions, and anodes with manufacturing sites and refineries in US, Asia, and Europe. Product portfolio includes gold, silver, platinum, palladium, rhodium, ruthenium materials designed for use in decorative and electronic applications. Our comprehensive range of refining services along with our plating processes can be your one-stop-provider for all your precious metal solution needs.
Micro Hybrid Dimensions, Inc.
2161 E. 5th Street
Tempe, AZ 85281-3035
(P): (480) 731-3131
Micro Hybrid Dimensions, Inc., a US company, was founded in 1980. MHD manufacturers and sells a broad line of thick film hybrid substrates, and provides comprehensive design enhancement services. From the beginning our customers have learned that our business is based on high integrity, consistently high quality, leading edge technology, expert employees, and customer oriented service. All this at competitive prices.
Micro Systems Technologies Management AG
Baar, CH 6341
(P): +41 (43) 2661206
Micro Systems Technologies Group (MST) is pleased to invite you to upcoming IMAPS Device Packaging exhibition.
Please visit us at booth #33 and learn more about the comprehensive solutions of the MST companies. Our exhibition team looks forward to meeting you. For an appointment on site, kindly contact us at: firstname.lastname@example.org
The MST group comprises four technology companies providing innovative products and services for high-reliability/high-performance industries, such as medical technology, aerospace, telecomm-unications, sensor and microwave applications. The offering includes HDI/microvia PCBs, LCP substrates, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging, as well as implantable batteries and feedthroughs.
7725 North Orange Blossom Trl.
Orlando, FL 32810
(P): (407) 822-6304
Micross Components, Inc., a single-source global supplier of advanced high-reliability electronics, manufactures and distributes a wide range of products including discrete bare die and wafers, standard and custom packaged devices and passive components. Our value-added capabilities include a comprehensive list of services spanning assembly, test and mechanical component modifications. With over 35 years’ experience, Micross possesses the design, manufacturing and logistics expertise needed to support an application throughout the program life cycle. For more information about Micross, visit www.micross.com
Thick Film Division
20 David Rd.
P.O. Box 69
N. Attleboro, MA 02761-0069
(P): (508) 695-0203 (1305)
For over 44 years, MSI has been supplying superb quality and on-time deliveries. Absolute tolerances starting at 0.005% and TCR's at 2ppm/C. Case sizes start at 0101. Standard deliveries under 2 weeks. MSI is ISO 9001 certified and is on the QPL for MIL-PRF-55342 and MIL_PRF-32159.
MRSI Systems LLC
101 Billerica Ave, Bldg 3
North Billerica, MA 01862-1256
(P): (978) 667-9449
MRSI Systems designs and manufactures precision die bonding and dispensing equipment including fully automated, ultra-high precision die attach and epoxy dispensing tools used for the fabrication of complex micro-assemblies in a variety of end markets, such as Telecom/Datacom, Aerospace & Defense, Health and Life Sciences and Industrial.
2055 Gateway Place, Suite 480
San Jose, CA 95110
(P): (603) 560-5350
NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.
Neu Dynamics Corp.
110 Steamwhistle Dr.
Ivyland, PA 18974
(P): (215) 355-2460
NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronic components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications. We offer specialized equipment built for today’s high-tech semiconductor, assembly processes. Find out what the NDC companies can do to make your products better and your life easier.
Pac Tech Packaging Technologies USA
328 Martin Avenue
Santa Clara, CA 95050
(P): (408) 368-1431
PacTech USA Packaging Technologies, Inc. (Santa Clara, California) offers contract wafer bumping services using low-cost UBM (electro-less Ni/Au), solder stencil printing, and solder ball placement for quickturn and mass production. PacTech USA also provides product demonstrations, training, and sales support. PacTech designs and manufactures wafer bumping and assembly equipment for flip chip, WLCSP, and interposers. PacTech is the worldwide leader in laser reflow and heating technology, implemented in systems for solder jetting (SB2) and flip chip attachment (LAPLACE), including 3D soldering for advanced packaging applications like Head-Gimbal Assembly (HGA), MEMS, Opto-electronic packaging, IR detectors, various sensor products, and LCD drivers.
Palomar Technologies, Inc.
2728 Loker Avenue West
Carlsbad, CA 92010
(P): (760) 931-3680
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
10050 16th St, North
St. Petersburg, FL 33716
(P): (727) 577-4999
Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company's Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Plasma-Therm’s Singulator® systems brings the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Plasma-Therm’s status as a preferred supplier of plasma process equipment has been recognized with 17 consecutive VLSIresearch industry awards, including #1 rankings for customer satisfaction in the last three years.
Riv Inc. ~ Precision Printing Screens
31 Railroad Ave.
Merrimack, NH 03054-4121
(P): (603) 424-0510
Riv Inc. is a leading manufacturer of high quality printing screens; we cater to the Thick Film Hybrid Microelectronics, Flex Circuitry, Membrane Switches, RFID Antennas, Solar Cell Manufacturing and any other related industries. Since 1986 we have been helping our customers Print with Quality. With our 28+ years of experience we can help screen printers find the perfect combination of Mesh and Emulsion maximize their printing skill. We use nothing but the highest quality material available in the industry. Service and Quality is what Riv Inc is. Let us help you
4900 W. 78th St
Bloomington, MN 55435
(P): (952) 259-1794
Visit Rudolph at booth 63 to learn more about advanced packaging panel lithography
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization.
Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market
Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation of competitive offerings, and will be used for next-generation fan-out processing on rectangular panels. The system is scheduled to ship in mid-2016.
Mike Plisinski, Rudolph’s chief executive officer, stated, “We view the move from reconstituted wafers to chips-on-panels as a logical and necessary transition in the advanced packaging industry as product volumes increase. We are pleased that our lithography and panel solutions are able to play an integral role in this transition and look forward to partnering with these early leaders.”
According to Yole Dèveloppement’s November 2015 report, Status of Panel-Level Packaging & Manufacturing1, the demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from (round) wafers to a larger-size panel format. Yole describes the cost advantages and economy of scale benefits as key enablers propelling the growth of fan-out, interposers and embedded die panel packages. “Building on more than 25 years of flat panel lithography experience, we are confident the JetStep Lithography System is a premier solution for advanced packaging panel manufacturing,” said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. “Fully capable of handling rectangular glass or organic substrates up to approximately 700mm, the JetStep System is equipped with unique features to address the challenges of lithography on panels. On-the-fly autofocus and magnification compensation enable high yields, addressing a critical challenge of fan-out to be cost effective.”
Plisinski concluded, “We have an established market presence in both fan-out wafer level packaging and radio frequency (RF) devices, which we believe will be transitioning to glass panel interposers. Our early success in advanced packaging allows us to bring a wealth of experience and knowledge to this emerging industry shift from wafers to panels. As we have partnered with our wafer customers, Rudolph will partner with panel customers, leveraging our broad range of products and resulting application expertise to not only provide lithography, but a comprehensive solution that will significantly contribute to enabling advanced packaging on panels.” For more information about Rudolph’s JetStep Lithography systems, please visit www.rudolphtech.com.
SAES Getters USA
1122 E. Cheyenne Mt. Blvd
Colorado Springs, CO 80906
(P): (719) 527-4130
The SAES Getters Group is the world leader in a variety of scientific and industrial applications where stringent vacuum conditions or ultra-high purity gases are required. SAES Getters provides products and services that allow customers to achieve lifetime vacuum integrity of their sensors. In addition to offering many configurations of getter solutions available for integration inside a device ranging from SAES' thin film Page material to larger porous getters utilizing ST 171, ST 172, ST 175, or other varieties of getter alloys, SAES offers hermetic vacuum packaging services to the market as well as Residual Gas Analysis and Leak Rate testing.
SavanSys Solutions LLC
10409 Peonia Court
Austin, TX 78733
(P): (512) 402-9943
At SavanSys Solutions LLC, our business is electronics manufacturing cost modeling. With the SavanSys Solution—a combination of expert consulting services and our unique SavanSys modeling technology—we provide the electronics industry with solutions for: supply chain cost modeling; new technology adoption cost analysis; size, yield, and cost design planning; product cost reductions; and more.
Sentec E&E Co., Ltd.
No. 32, Gong 5rd
Lungtan, Taoyuan 32559
Sentec has been developing vehicle pollution control technology since it funded, and we are proud to say that we gather rich experience in this area. We are...
-The first one which succeed in developing the catalyst technique for motorcycle by itself and then realize mass-production in Taiwan.
-The first one with stand-alone development technologies and produce the Engine Management System in China.
-The first one which can manufacture Non-shrinkage Low Temperature Co-Fire Ceramic (LTCC for short) substrate in China.
343 Meadow Fox Lane
Chester, NH 03036
(P): (603) 548-7870
High-accuracy Bonding Experience, Equipment, and Materials
SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required, for more than twenty years the FC150 Series has been the tool of choice. The Ontos7 is our atmospheric plasma system designed for and dedicated exclusively to the semiconductor manufacturing and packaging industry. Our patented (and patent pending) equipment and processes provide a unique advantage to our customers to enable low-cost, high yield, high-speed, chip-to-chip interconnect bonds at room temperature with minimal force.
Shinko Electric America
1280 E. Arques Ave
Sunnyvale, CA 94085
(P): (408) 232-0482
Shinko Electric Industries CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. Shinko manufactures a full line of Organic Substrate structures including coreless options offering enhanced electrical performance and package size reduction. Shinko can also provide subcontract assembly services with an emphasis on packaging solutions such as POP, SIP and Camera Modules utilizing our advanced package assembly technologies, including our molded core embedded package, MCeP™. Shinko is located in Nagano, Japan and provides the ultimate in service and solutions for our customers with Sales and Engineering support worldwide. For more about Shinko please visit our website at www.shinko.com.
Sikama International, Inc.
118 East Gutierrez Street
Santa Barbara, CA 93101-2314
(P): (805) 962-1000 (108)
For the past 33 years Sikama International has been in the business of designing, manufacturing and marketing solder reflow & curing systems, wafer flux coaters and wafer washers. We are recognized around the world for our reliable small footprint machines. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Epoxy Curing and many other applications. Please stop by Sikama booth number 710 to discuss your reflow soldering or curing requirements.
2149 E. Pratt Boulevard
Elk Grove Village, IL 60007-5914
(P): (847) 437-6400 (200)
Sonoscan® is a leader and innovator in Acoustic Micro Imaging (AMI) technology. Sonoscan manufactures acoustic microscope systems and provides laboratory services to nondestructively inspect and analyze products. Our C-SAM®
microscopes provide unmatched accuracy for the inspection of products for hidden internal defects in SMT devices, ceramic capacitors and resistors, hybrids, MEMs, etc.
SPTS Technologies, an Orbotech company
Newport, NP18 2TA
(P): +44 1633 414000
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.
The solutions offered by SPTS include market-leading silicon etch, dielectric etch, dry-release etch, PVD, and PECVD process technologies and equipment, available with a range of wafer-handling options applicable to R&D, pilot production, or volume production. Comprehensive service and spare parts support are offered through a worldwide network of service centers and qualified local agents. For more information, go to: www.spts.com
STATS ChipPAC, Inc.
46429 Landing Parkway
Fremont, CA 94538
(P): (208) 867-9859
We invite you to join us at the IMAPS Device Packaging Conference on March 15-17, 2016 where we will be sharing the latest information on our advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, System-in-Package (SiP), 2.5D and 3D integration which meet the increasing market demand for higher levels of performance, increased functionality and miniaturization.
STATS ChipPAC is pleased to be partnering with Qualcomm Technologies to present a paper on fan-out wafer level packaging on Tuesday March 15th from 4:30 – 5:00 PM entitled:
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
We will also have a presentation on SiP technology by Hamid Eslampour, Director of Advanced Technology Marketing, on Wednesday, March 16th from 4:00 – 4:30 PM entitled:
SiP Technology Trends
Please plan to attend our technical presentations or stop by booth #55 to discuss our products and services.
STATS ChipPAC is a leading provider of semiconductor design, bump, probe, assembly, test and distribution solutions for the communications, computer and consumer markets. With a broad portfolio of services and advanced process technology in wafer level, flip chip and 2.5D/3D packaging, STATS ChipPAC provides innovative and cost effective semiconductor solutions.
47 Molter Street
Cranston, RI 02910
(P): (401) 781-6100
Technic supplies some of the most advanced chemistry solutions for semiconductor packaging applications in the industry. High performance product development with application specific characteristics and unparalleled analytical expertise provides customers with the essential tools to meet the challenges of today’s semiconductor manufacturing. Technic’s semiconductor advanced packaging electrodeposition chemistries, marketed under the name Elevate, are well respected for innovation and high quality and are used in many applications including RDL, pillars, microbumps and LED packaging. In addition Technic supplies photoresist strippers for liquid and dryfilm resist as well as metal etchants for a variety of metals. Technic also offers analytical control systems. Technic's RTA (Real Time Analyzer) has become the leading analytical control system for damascene copper processes. The capability of the RTA system has now been successfully expanded into backend packaging applications for controlling TSV and copper pillar processes.
Technic Inc is a Rhode Island based privately held corporation with over 900 employees worldwide and currently operates over 20 global facilities in 14 countries within North America, Asia and Europe.
TechSearch International, Inc.
4801 Spicewood Springs Road
Austin, TX 78759
(P): (512) 372-8887
TechSearch International has a 28-year history of quality market research and technology trend analysis focusing on: WLP, FO-WLP, Flip chip, CSPs including stacked die, BGAs, 3D ICs with TSVs, 2.5D interposers, and System-in-Package (SiP), embedded components, and panel-based processing. We partner with SavanSys Solutions offering cost models for WB, FC, WLP, and 2.5 & 3D ICs. Our extensive network consists of more than 16,000 contacts in North America, Asia, and Europe.
Teikoku Taping System Inc.
5090 North 40th Street, Suite 140
Phoenix, AZ 85018
(P): (480) 794-1926
For more than 25-years Teikoku Taping System has been an innovative leading custom equipment supplier for the backend semiconductor industry.
Teikoku’s backend semiconductor products include Wafer Mounting Systems, UV Irradiation Systems, Tape Removal Systems, Backgrind Tape Laminators, and Dry Film Resist Laminators. TTS will continue to revolutionize the semiconductor industry and exceed industry expectations with new and innovative equipment designs.
Triton MicroTech, Inc.
2726 Loker Avenue, West
Carlsbad, CA 92010
(P): (919) 649-8221
Triton Microtechnologies is the leader in the design and manufacture of high-performance 2.5D and 3D Through Glass Via (TGV) interposers.
As we rapidly approach the barrier and performance limits of silicon, the need increases for a greater number of components in smaller package areas and the need for non-silicon based materials to better support this next generation assembly.
Triton's proprietary technology offers faster cycle times, KGD testing at higher packaging integration levels, and the lowest cost/unit in the marketplace.
West Bond, Inc.
1551 South Harris Ct.
Anaheim, CA 92806
(P): (714) 978-1551
50Th ANNIVERSARY … This year, 2016 will mark a significant time in our company’s history. West•Bond Inc. will officially celebrate our 50th Anniversary on October 31st 2016. We know and recognize that our success is due to several factors : design, craftsmanship, service and sales. All of these elements are vitally important to any manufacturer. We thank you for considering West Bond Inc. in your manufacturing supply chain.
WEST•BOND offers a Wedge Bonder / Ball Bonder combination machine in three different configurations…Manual, Semi-automatic in motorized “Z”, and motorized “Z” & “Y”. WEST•BOND also manufactures a Die Bonder that combines both Epoxy and Eutectic methods in one chassis. Between these two series you can bond most any product in the microelectronic industry.
Since 1966, West Bond Inc. has been a Design and Manufacturer of Assembly and Test Equipment for the Microelectronic Industry here in Southern California. Including Automatic, Semiautomatic, and Manual ESD protected bonders, with Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon capability. Included in product line are Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers with our patented X-Y-Z, 8/1 ratio micromanipulator.
In addition, we design and manufacture accessories such as LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers, as well as full a complement of machine shop services.
36 Balch Ave
Groveland, MA 01834
If you are looking for a bond tester that offers the latest technology advancements, clever innovations and the utmost flexibility, XYZTEC is your solution. Technology---fiducial pattern recognition, automation, high sample rate 24 bit ADC and high speed (50mm/sec) axes speed Innovation---Rotating Measurement Unit (RMU) that holds up to 6 sensors that are software selectable. Change from test to test in seconds. No more cartridges and their inherent wear issues! Flexibility---Support for 25+ test types, 12” fully automated wafer test system, up to 500Kg shear capability and the most advanced software available.
75 cours Emile Zola
Meet with Yole Développement analysts at booth #42, and discuss with them the latest Advanced Packaging dynamic market trends!