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THANK YOU TO OUR DEVICE PACKAGING 2016
EXHIBITORS & SPONSORS!

The full EXHIBITOR DIRECTORY is listed below. Be sure to visit the companies during our Exhibit Hall Hours at DPC - there is no fee for an "exhibits only" pass:

Tuesday, March 15, 2016 - 10:00 AM - 6:30 PM
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 16, 2016 - 10:00 AM - 4:00 PM
Lunch, and Breaks will be held in the Exhibit Hall

GET REGISTERED

Booth:  58
Advance Reproductions Corp.
100 Flagship Drive
North Andover, MA  01845
(P): (978) 552-1221
(E): d.robinson@advancerepro.com
www.advancerepro.com

Advance Reproductions is a leading supplier of high-quality, large-area and optical photomasks and phototools. Advance is an ISO 9001and ITAR registered company. We support manufacturers throughout the world involved in the manufacturing of semiconductor, hybrid, microwave, nanotechnology, medical and electronic packaging devices. Advance Reproductions provides solutions and custom manufacturing services for research and development, custom shaped substrates and engineered tooling.

Booth:  31
AGC Electronics America
4375 NW 235th Avenue
Hillsboro, OR 97124
(P): (714) 745-3193
(E): vstygar@agcem.com
www.agcem.com

AGC is a leader of glass, fluorinated polymers and synthetic quartz for the global automotive and electronics device industries.  AGC provides specialized formulations of alkali-free alumino-borosilicate glass suitable for LED, MEMS, and interposer electronics substrates.  Our high volume capability for glass and value-added services such as drilling vias, AR coatings, and via fill technologies makes AGC a valuable partner for your next generation mobile or Life Science product.  AGC’s fluorinated polymer is ideally suited for dielectric coatings, or creating micro or nano-sized vias for Lab on a Chip applications in the Life Science technologies sector.  AGC’s fluorinated polymer is highly transparent to 250 nanometers.  It has the ability to change from a hydrophilic to a hydrophobic surface.  AGC’s fluorinated material is the ideal candidate for passive and active coatings.  AGC’s premier synthetic quartz with unparalleled formulation controls result in the lowest insertion loss and nearly zero auto fluorescence of any material.  This provides our customers the highest electrical performance loss for high frequency circuits.  In addition, AGC’s synthetic quartz’ low auto fluorescence makes it an excellent substrate for photonic applications in Lab on a Chip reactors.

Booth:  53
AI Technology, Inc.
70 Washington Road
Princeton Junction, NJ  08550
(P): (609) 799-9388 (124)
 (E): agrossman@aitechnology.com
www.aitechnology.com

AI Technology, Inc. (AIT) looks forward to seeing you at booth 53 at DPC next week!

How can AI Technology, Inc. (AIT) solve your problems?

AIT pioneered the use of flexible epoxy technology for microelectronic packaging in 1985 and today, remains committed to, and a leading force in, advanced materials and adhesive solutions for electronic interconnection and packaging. Our newest research has yielded higher performing and lower cost solderable flexible circuit substrate materials to replace polyimide-based organic copper-clad laminates in high frequency microwave circuits. Unique to AI Technology, Inc. (AIT) is our focus on film, not only paste, adhesives. We offer electrically conductive as well as non – electrically conductive variations.

We invite you to visit our booth, 53, to speak with our materials specialists. Introduce yourself. Bring your current applications and project goals. Based on your specific, unique and individual problems or constraints, AI Technology, Inc. (AIT) will identify the precise AIT materials solution. If need be, we will be happy to suggest another company with product offerings better suited to your application. Solving problems, not selling, is the true goal.

AI Technology, Inc. (AIT) specializes in electronic interconnect and microelectronic packaging materials, offering molecularly flexible epoxy adhesives for die and substrate attach and bonding, adhesives and underfills for multi size die bonding, DAF and DDAF for stack-chip packaging and flip-chip bonding and underfilling and high temperature single and multi chip module die bonding past 230ºC.  AIT’s Wafer Processing Adhesive (WPA), only recently introduced to the market, is a temporary film format high temperature bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer.  Additionally, AIT offers a broad range of Thermal Interface Materials (TIM), including pads, greases and gels.  Other products include conformal coatings for ultimate moisture and/or humidity protection as well as UV resistant but PVDF transparent coatings with or without corrosion retardants.

Booth:  02
AkroMetrix, LLC
2700 NE Expressway
Building B, Suite 500
Atlanta, GA  30345
(P): (404) 486-0880 (21)
(E): emoen@akrometrix.com
www.akrometrix.com

Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products. Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes. 

Booth:  26
AMICRA Microtechnologies GmbH
Wernerwerkstr. 4
Regensburg, D  D-93049
Germany
(P): +49 941208209 (80)
(E): johann.weinhaendler@amicra.com
www.amicra.com

AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3ơ). Equipment offering supports both Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Market focus: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP. Other products: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.   

Booth:  38
Amkor Technology
2045 E Innovation Circle
Tempe, AZ  85284
(P): (480) 786-7653
(E): debi.polo@amkor.com
www.amkor.com

Visit Amkor at booth #38 and get the latest updates on our Advanced SiP, 3D and Stacked Die and TSV Packaging Technologies. Amkor staff will be presenting or contributing to the following sessions:

Tues. March 15th - Interposers, 3D IC & Packaging Track 2:00 PM - 2:30 PM - "System Level IC Packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging", Mike Kelly, Sr Director, Adv Package & Technology Integration, Amkor Technology (Dave Hiner, Marnie Mattei, Rick Reed, Paul Silvestri, Ron Huemoeller, Amkor Technology)

2:30 PM - 3:00 PM - "Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages", Rahul Agarwal, Globalfoundries (Sukesh Kannan - GF, Shan Gao - GF; Rick Reed, Yong Song - Amkor Technology, JS Paek - Amkor Technology Korea)

Tues. March 15th - Evening Panel Discussion 5:00 PM - 6:30 PM - "SiP: New Drivers and the Supply Chain", Robert Lanzone, Sr. VP/AWL&PD, Amkor Technology

Wed. March 16th - SiP Track 1:30 PM - 2:00 PM - "Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform", Miguel Jimarez, VP, Adv Package & Technology Integration, Amkor Technology (DongHee Kang, SangYun Ma, Amkor Technology Korea; Rocky Leblanc, Michael Mack, Chang Sohn, Gianlorenzo Masini, Luxtera)

Thurs. March 17th - SiP Track 10:15 AM -10:45 AM - "An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield", Nozad Karim, VP, Electrical Engineering, Amkor Technology (Rong Zhou, Amkor Technology; Jun Fan, Missouri University of Science and Technology)

In addition, Amkor's Curtis Zwenger, Sr Director, Adv Package & Technology Integration, Nozad Karim, VP, Electrical Engineering and Russell Shumway, Director, Automotive MEMS are session chairs for this event.

Amkor Technology is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a global strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator. For more information, visit www.amkor.com.

Booth:  47
ASE Group
1255 E. Arques Ave.
Santa Clara, CA  94086
(P): (408) 636-9500 (572)
(E): patricia.macleod@aseus.com
www.aseglobal.com

With a proven track record spanning over three decades, ASE, the OSAT market leader, continues its tradition of manufacturing expertise through orchestrated collaboration with customers, suppliers and partners, alike. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit : www.aseglobal.com

Booth:  51
ASM Pacific Assembly Products, Inc.
3440 E. University Dr.
Phoenix, AZ  85034
(P): (602) 437-4688
(E): louis.troche@asmpt.com
www.asmpacific.com/asmpt/index.htm

ASM Pacific Assembly Products is a Sales and Marketing Division of ASM Pacific Technology (ASMPT). ASMPT is the world's leader in back end Assembly Equipment. With a vision of providing cost effective solutions, we offer Assembly Equipment and Leadframe technology that is in the forefront of the Semiconductor Industry.

Booth:  45
AT&S Americas, LLC
1735 N. First Street, Suite #245
San Jose, CA  95112
(P): (408) 573-1211
(E): a.pace@ats.net
Pace Adriana
(P): (408) 573-1211
(E): a.pace@ats.net
www.ats.net

AT&S is a top HDI circuit board and IC package maker offering Embedded Component Packaging technology which embeds passives and/or bare ICs inside the center core of the laminate.   Embedding provides increased component density and smaller size by removing components from the board surface and embedding them inside the board. This also improves signal integrity with embedded discrete capacitors located just microns directly below the IC's. Components can be mounted on the top surface directly above the embedded components and on the bottom surface directly below. AT&S has 6 manufacturing sites in Austria (2), China (2), India, and Korea.

Booth:  32
Atotech USA, Inc.
1750 Overview Drive
Rock Hill, SC  29730
(P): (817) 507-9843
(E): kevin.martin@atotech.com
www.atotech.com

With annual sales of $1.176 billion, Atotech is one of the world's leading manufacturers of processes and equipment for the printed circuit board, IC-substrate and semiconductor industries as well as the decorative and functional surface finishing industries. Committed to sustainability, Atotech develops technologies that minimize waste and reduce environmental impact.

Booth:  06
ATV Technologie GmbH
Johann-Sebastian-Bach-Str. 38
Vaterstetten,   85591
Germany
(P): 49810630500
(E): Siegfried.Kowalsky@atv-tech.de
www.atv-tech.de

SRO VACUUM REFLOW Soldering/Brazing OVENS/RTAs, semi automatic:  SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free, 1100°C, IGBT, CSP, DBCs, Flip Chip, alloying, wafer bump reflow, CPV, MMIC

MEMS/PACKAGE SEALING WITH GETTER ACTIVATION THERMO COMPRESSION BONDER, 450°C:
Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering, Cu pillar/micro bump flip chip soldering

QUARTZ TUBE Furnaces: Fast ramping, multipurpose, ultra-uniform, floor space and energy saving, for: to 300 mm LPCVD, CNT/graphene, VCSEL/AlGaAs/Si oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering, thick film paste firing, Polyimide backing, Poly Si, Epitaxy, Si3N4, LTO, P and N solid source diffusion

THERMO COMPRESSION BONDER, 1 100°C: For constrained LTCC sintering, hot LTCC/glass embossing/imprinting. DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs, etc. IR CVD/ALD System: 1050°C, single wafer, fast temperature and pressure alternation 

Booth:  56
Axus Technology
7001 W. Erie Street, Suite 1
Chandler, AZ  85226
(P): (480) 705-8000
(E): bvandevender@axustech.com
www.axustech.com

Axus Technology delivers end-to-end support, for R&D through volume production, for CMP and substrate thinning applications.  Starting with process design and development in our CMP Foundry, through delivery of production tools and processes; Axus provides industry-leading process and equipment solutions for fabs, 3D integration, and wafer & device packaging users.

Booth:  62
Azimuth Electronics, Inc.
2605 South El Camino Real
San Clemente, CA  92672
(P): (949) 492-6481
(E): mjohnsen@azimuth-electronics.com
www.azimuth-electronics.com

Innovations in Socketry… See you at Booth 62!

Supporting the Electronics Industry in: Medical Telecommunications Automotive Space and Defense We offer the latest in Test and Burn-In Sockets for: QFP, CQFP, MCM, SOIC, Laser Diode, LCC, LGA, BGA, QFN, MLF, MEM, 3D Memory Stack, Medical Substrates, HF Device, PGA, Substrate Modules and Custom Integrated Circuits

Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets, has been providing innovative interconnect solutions for over 50 years.  Our broad experience allows us to tackle the challenges of a constantly evolving industry.  Complete in-house services include design, prototyping, tooling fabrication, and production injection molding.

Booth:  36
Boschman Technologies / Advanced Packaging Center
34522 N. Scottsdale Rd, D-8, PMB 147
Scottsdale, AZ  85266
(P): (480) 488-9898
(E): jhcrane@earthlink.net
www.boschman.nl

Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices.  This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash.  This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials. 

APC, Advanced Packaging Center, serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications.  By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.

Booth: 66
Canon USA

3300 North 1st St.
San Jose, CA 95134
(P): (408) 468-2000
(E): semi-info@cusa.canon.com
www.usa.canon.com/industrial

Canon introduces Lithography and PVD solutions for Advanced Packaging Applications during IMAPS Device Packaging 2016
Canon U.S.A., Inc. (www.usa.canon.com), a leader in digital imaging and industrial products will introduce Lithography and PVD solutions for Advanced Packaging, 3D-IC, Interposer and WLP Applications during IMAPS Device Packaging 2016. To address the challenges presented by next-generation device packaging applications, Canon has developed improvements to the FPA-5510iV stepper platform that is currently providing high-performance, flexibility, stability and low-CoO for mainstream packaging and leading-edge chip-stacking and integration operations around the world. During IMAPS Device Packaging 2016, Canon will also provide information on upgraded Canon Anelva PVD equipment that has been developed to support customers requiring advanced deposition capabilities for backend processes.

Please stop by the Booth #66 during the exhibition for updated information on Canon products supporting Advanced Packaging Applications or contact us anytime at semi-info@cusa.canon.com.

Booth: 46
Coherent, Inc.

5100 Patrick Henry Drive
Suite 110
Santa Clara, CA 95054
(P): +1 720 412 7281
(E): dirk.mueller@coherent.com
www.coherent.com

Founded in 1966, Coherent, Inc. is one of the world’s leading providers of lasers and laser-based technology for scientific, commercial and industrial customers. Our common stock is listed on the Nasdaq Global Select Market and is part of the Russell 2000 and Standard & Poor’s SmallCap 600 Index. For more information about Coherent, visit the company's website at http://www.coherent.com/ for product and financial updates.

Booth: 03
Deweyl Tool Company, Inc.

959 Transport Way
Petaluma, CA 94954
(P): (707) 765-5779
(E): Jpalmer@deweyl.com
www.deweyl.com

DeWeyl provides the finest quality bonding wedges in the world. Located in the Petaluma, CA, DeWeyl's primary business is manufacturing wire bond wedges and custom high precision tooling for the semiconductor, aerospace and medical industry. DeWeyl produces wedges made from ceramic, titanium and tungsten carbide for small and large round wire and ribbon applications.

Booth: 29
Dow Electronic Materials

455 Forest Street
Marlborough, MA 01752
(P): (774) 641-4969
(E): markowski@dow.com
www.dowelectronicmaterials.com

Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, display, photovoltaic, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. Dow’s portfolio includes metallization, dielectric, lithography and assembly materials for advanced semiconductor packaging applications, such as bumping, pillars, RDL, passivation and UBM used for the latest FOWLP, flip chip, SiP, and 3D chip packages.

Booth: 10
EMD Performance Materials
6555 Nancy Ridge Drive, #200
San Diego, CA 92121
(P): (858) 831-0010
(E): jim.haley@ormetcircuits.net
www.emd-performance-materials.com/en/index.html

Performance Materials comprises the entire specialty chemicals business of Merck KGaA, Darmstadt, Germany. The portfolio includes high-tech performance chemicals for applications in fields such as:

• Displays
• Integrated Circuits
• Lighting Applications
• Solar & Energy
• Coatings
• Semiconductor Packaging 


Customer sectors in consumer electronics, lighting, printing technology, plastics applications and integrated circuits make use of materials and solutions from EMD Performance Materials. Thanks to comprehensive investments in research & development, we are constantly extending our leading position as an innovator and reliable partner.

Our future growth integrates key materials consisting of high purity chemicals used in wafer fabrication to sustainable materials for advanced back end solutions.

Booth: 22
EV Group, Inc.

7700 S. River Parkway
Tempe, AZ 85284
(P): (480) 305-2456
(E): k.roe@evgroup.com
www.evgroup.com

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

Booth: 11
F & K Delvotec, Inc.

27182 Burbank Avenue
Foothill Ranch, CA 92610
(P): (949) 595-2200 (247)
(E): Steven.buerki@fkdelvotecusa.com
www.fkdelvotec.com/html_englisch

F&K Delvotec is an industry leader in wire bonding technology. Our broad portfolio of products delivers a solution for any wire bonding application. Over 30 patents in wire bonding technology testify to our continuing emphasis on innovative technology, and our dedicated development, applications and service team provides optimum customer support, worldwide. F&K Delvotec manufactures complete bonding systems including transducers and ultrasonic generators as well as test equipment that has become the industry standard for evaluation of ultrasonic bonding systems.
Whatever wire bonding is required, F&K Delvotec offers a suitable tailored solution – from bond process development to complete automation systems.

Booth: 21
Finetech, Inc.

560 E Germann Rd. #103
Gilbert, AZ 85297
(P): (480) 893-1630
(E): sales@finetechUSA.com
www.finetechusa.com

Finetech - High Accuracy Bonders – Visit us in Booth #21

Finetech offers highest accuracy in bonding and advanced packaging equipment for today’s ever-changing, complex applications. Our bonders offer process flexibility in a single platform for various technologies such as thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), and UV curing. Finetech recently introduced the FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300 mm. This bonder is ideal for high-density array applications, high force bonding (up to 1000N), Wafer Level Packaging (FOWLP, W2W, C2W) and assembly of complex 2.5D / 3D IC packages. The Sigma can also pick up from and bond to 300mm wafers.

Booth: 30
FlipChip International, LLC

A Division of Huatian Technology
3701 E. University Drive
Phoenix, AZ 85034
(P): (602) 431-4780
(E): anthony.curtis@flipchip.com
www.flipchip.com

FlipChip International - Huatian (FCI-HT):
FCI-HT supplies turnkey semiconductor assembly and test services to the consumer, automotive, industrial and medical industries. FCI-HT supports a wide range of customers, frequently partnering with them to engineer customized solutions including expedite bumping of Multi-Project Wafers. FCI-HT is a leader in wafer level packaging with patented technologies spanning from Cu Pillar Bumping, Spheron™ Wafer Level Chipscale Packaging, and ChipsetT™ Embedded Die Packaging. FCI-HT is a division of Tian Shui Huatian Technologies (TSHT). TSHT is among the top three Chinese OSATs and listed on the Shenzhen Stock Exchange Market. TSHT has six ISO/TS16949 factories located in the US and China offering a complete range of semiconductor packaging and turnkey services.

Booth: 25
Geib Refining Corporation

399 Kilvert St.
Warwick, RI 02886
(P): (800) 228-4653
(E): mike@geibrefining.com
www.geibrefining.com

Precious metal reclaim of gold - platinum - palladium - silver - iridium - ruthenium ITAR and EPA compliance means 100% destruction of your intellectual property in a regulated and environmentally responsible manner. We process all types of precious metal scrap including hazardous wastes. We also support thin film technology through shield cleaning to UHV standards. Settlements include bullion, source materials, or check/wire. We have many sound relationships within the IMAPS community and are a major supporter of IMAPS New England. Stop on over and learn why Geib is the most valued precious metals refining source.

Booth:  01
Hesse Mechatronics, Inc.
225 Hammond Ave.
Fremont, CA  94539
(P): (408) 436-9300
(E): jolynn.snell@hesse-mechatronics.us
www.hesse-mechatronics.com

Hesse Mechatronics, founded in 1986 and based in Paderborn, Germany, develops and manufactures fully automatic ultrasonic and thermosonic wire bonders and ultrasonic flip chip bonders together with standard or customer-specific automation solutions for the backend semiconductor industry. Hesse Mechatronics is one of the world’s leading producers of wire bonders using the ultrasonic wedge-wedge and the thermosonic ball-wedge technology and develops customer-specific production processes.

Booth:  54
HSIO Technologies
13400 68th Ave N
Suite #110
Maple Grove, MN  55311
(P): (763) 447-6260
(E): randy.knudsen@hsiotech.com
www.hsiotech.com

HSIO Technologies and HSIO Circuit Technologies mission is to develop new, exciting, and proprietary technology to address high-density and high-speed interconnect challenges faced by our customers and the semiconductor industry.. HSIO is focused on improving the signal channel through the various circuits, connectors and components our customers use to develop, validate and deploy silicon to the market.
 
HSIO’s  Grypper socket products  are unique in that it requires no lid and is the same footprint as the device under test. HSIO Circuit Technologies Flex and Rigid Flex PCB manufacturing  featuring < 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment .

Booth:  15
i3 Electronics
1093 Clark Street
Endicott, NY  13760
(P): (607) 755-1985
(E): James.Orband@i3electronics.com
www.i3electronics.com

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic            solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including            aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative            energy, where highly reliable products built in robust manufacturing operations are critical for success.

Booth:  12
IBM Canada Ltd.
23 Airport Boul.
Bromont, Quebec  J2L 1A3
Canada
(P): (450) 534-6496
(E): lcomtois@ca.ibm.com
www-03.ibm.com/systems/services/packaging

IBM Redefining the Limits at IMAPS DPC

MEET THE EXPERTS AT BOOTH #12
IBM looks forward to meeting you next week at IMAPS. We are pleased to announce that we have opened our doors to service the global semiconductor industry.

This is a dynamic and exciting period for semiconductor packaging. Leverage our deep expertise. We will provide solutions.

We specialize in high-end single and multi-chip packaging and quick-turn custom designs. Get ready to implement packaging innovation designed to address semiconductor scaling challenges and maximize your product's performance!

IBM Bromont is a world leader in semiconductor packaging technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions. Tap into our know-how as the industry continues its shift to custom SoCs and SiPs.  IBM is known for its multi-chip packaging and heterogeneous integration. We offer full turnkey solutions from modelling and simulation to materials and process characterization, as well as optimized substrate design, a broad range of Burn-in and test competencies, and skillful failure analysis. We will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals.

Booth:  05
IMAT, Inc.
12516 NE 95th St. Suite D110
Vancouver, WA  98682
(P): (360) 256-5600 (16)
(E): ericf@imatinc.com
www.imatinc.com

Quality  Custom in-house silicon wafer processing. We offer a wide variety of custom films and Services. Processing on 50mm- up to 450mm wafers. Bump / RDL / and TSV patterning. Thick resist patterning. Metal Deposition. Thermal Oxidation. Warped wafer fabrication. Feel free to contact us for quotations: 360-256-5600 ext.16.

Booth:  04
Infinite Graphics
4611 East Lake St.
Minneapolis, MN  55406
(P): (612) 728-1321
(E): smcdonough@igi.com
www.igi.com

Infinite Graphics is an end-to-end Precision Imaging Engineering Solutions provider. IGI offers a unique set of photolithography services including grayscale, 3D nano-structures and photomask layout software designed to save you time and money.  IGI will demo Medium and Large Area Masks and the NanoSculpt 3D Solutions Suite.

Booth:  52
Invenios
320 North Nopal
Santa Barbara, CA  93103
(P): (619) 540-5578
(E): ellenk@invenios.com
www.invenios.com

Invenios designs, develops, and manufactures microfluidics, MEMS, and 3D
microstructures. Invenios engineers exclusive processes and custom production equipment that is required to manufacture this range of products. Invenios has a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for both established and emerging companies. Unlike traditional microsystems foundries, Invenios delivers a complete production cycle, which includes design review, process development, manufacturing, and testing within an ISO 9001 environment to support a broad range of micron and sub-micron level products.

Booth:  07
JSR Micro, Inc.
1280 N. Mathilda Avenue
Sunnyvale, CA  94089
(P): (408) 543-8800
(E): pzapffe@jsrmicro.com
www.jsrmicro.com

JSR’s unique THB series of negative tone thick film photoresists for RDL, micron bump, and Cu pillar applications, along with our WPR series of dielectric coatings are ideal for WL-CSP, Flip Chip, TSV, and other packaging technologies. JSR materials provide excellent throughput, large process margins, high aspect ratio solutions for film thicknesses from <10 to >100 micrometers while being processed in standard TMAH developer. Additionally, JSR offers exceptional materials in the temporary bonding space – contact us to learn more.

Booth:  60
Kulicke & Soffa Industries, Inc.
1005 Virginia Drive
Fort Washington, PA 19034
(P): (215) 784-6000
(E): pkeehn@kns.com
www.kns.com

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging (TCB & FOWLP), advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor devices.

Booth:  48
Kyocera America, Inc.
8611 Balboa Avenue
San Diego, CA  92123
(P): (858) 614-2592
(E): iris.labadie@kyocera.com
http://americas.kyocera.com/kai-semiparts

Kyocera America, Inc. (KAI) offers an extensive array of semiconductor packages and high frequency complex modules including mmW, RF, T/R modules, BGAs, SiPs, and High Power GaN packages in a variety of ceramic and organic material sets. KAI has state-of-the-art electrical design, modeling / simulation capability in-house to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing / bumping, vacuum soldering, test and burn-in.

Booth:  18
LB Semicon, Inc.
138, Cheongbuksandan-ro,
Cheongbuk-myeon, Pyontack City,
Kyunggi Province, Korea 451-833
(P): +82-31-680-1793
(E): shokim@lbsemicon.com
www.lbsemicon.com

LB Semicon was established in 2000 and listed Korean Stock Market (KOSDAQ) in 2011. LB Semicon provides LCD Driver IC full turnkey service from 200mm/300mm Wafer Bumping, Probe Test to Backend Assembly process such as Lamination, Back-grinding, Laser marking, Sawing, COG(pick&place), AVI, etc. Besides DDI(Display Driver IC) industry, LB Semicon serves Solder Bumping, Cu Pillar Bumping, WLCSP in fields of CIS, PMIC and other semiconductor applications. There are 200mm/300mm FAB in South Korea for the response of customers’ many new needs & demands.

Booth:  50
Mentor Graphics Corporation
8005 Boeckman Rd.
Wilsonville, OR 97070 
(P): (720) 494-1144
(E): Jennifer_chausse@mentor.com
www.mentor.com

Mentor Graphics® is the worldwide market leader in PCB systems design, advanced IC Packaging solutions and analysis technologies. Mentor Graphics will be showcasing Xpedition Package Integrator with HyperLynx, a holistic solution for IC/Package/Board cross-domain planning, assembly, optimization and electrical analysis . Visit our booth to learn more about Mentor’s technologies and best practices for IC/Package/Board co-design or by attending Mentor Graphics technical presentations.

Booth:  65
Metalor Technologies USA
255 John L. Diestch Blvd.
North Attleboro, MA 02763
(P): (508) 699-8800-8110
(E): tim.tubergen@metalor.com
www.metalor.com

Metalor’s Advanced Coatings Division is uniquely positioned as the only global source of precious metal commodities, plating solutions, and anodes with manufacturing sites and refineries in US, Asia, and Europe.  Product portfolio includes gold, silver, platinum, palladium, rhodium, ruthenium materials designed for use in decorative and electronic applications.  Our comprehensive range of refining services along with our plating processes can be your one-stop-provider for all your precious metal solution needs. 

Booth:  23
Micro Hybrid Dimensions, Inc.
2161 E. 5th Street
Tempe, AZ  85281-3035
(P): (480) 731-3131
(E): greg@micro-hybrid.com
www.micro-hybrid.com

Micro Hybrid Dimensions, Inc., a US company, was founded in 1980. MHD manufacturers and sells a broad line of thick film hybrid substrates, and provides comprehensive design enhancement services. From the beginning our customers have learned that our business is based on high integrity, consistently high quality, leading edge technology, expert employees, and customer oriented service. All this at competitive prices.

Booth:  33
Micro Systems Technologies Management AG
Neuhofstrasse 4
Baar, CH  6341
Switzerland
(P): +41 (43) 2661206
(E): melanie.stutz@mst.com
www.mst.com

Micro Systems Technologies Group (MST) is pleased to invite you to upcoming IMAPS Device Packaging exhibition.

Please visit us at booth #33 and learn more about the comprehensive solutions of the MST companies. Our exhibition team looks forward to meeting you. For an appointment on site, kindly contact us at: info@mst.com

The MST group comprises four technology companies providing innovative products and services for high-reliability/high-performance industries, such as medical technology, aerospace, telecomm-unications, sensor and microwave applications. The offering includes HDI/microvia PCBs, LCP substrates, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging, as well as implantable batteries and feedthroughs.

Booth:  34
Micross Components
7725 North Orange Blossom Trl.
Orlando, FL  32810
 (P): (407) 822-6304
(E): John.Riordan@micross.com
www.micross.com

Micross Components, Inc., a single-source global supplier of advanced high-reliability electronics, manufactures and distributes a wide range of products including discrete bare die and wafers, standard and custom packaged devices and passive components. Our value-added capabilities include a comprehensive list of services spanning assembly, test and mechanical component modifications. With over 35 years’ experience, Micross possesses the design, manufacturing and logistics expertise needed to support an application throughout the program life cycle. For more information about Micross, visit www.micross.com

Booth:  27
Mini-Systems, Inc.
Thick Film Division
20 David Rd.
P.O. Box 69
N. Attleboro, MA  02761-0069
(P): (508) 695-0203 (1305)
(E): mtran@mini-systemsinc.com
www.mini-systemsinc.com

For over 44 years, MSI has been supplying superb quality and on-time deliveries.  Absolute tolerances starting at 0.005% and TCR's at 2ppm/C.  Case sizes start at 0101.  Standard deliveries under 2 weeks.  MSI is ISO 9001 certified and is on the QPL for MIL-PRF-55342 and MIL_PRF-32159.

Booth:  61
MRSI Systems LLC
101 Billerica Ave, Bldg 3
North Billerica, MA  01862-1256
(P): (978) 667-9449
(E): jon.medernach@mrsisystems.com
www.mrsisystems.com

MRSI Systems designs and manufactures precision die bonding and dispensing equipment including fully automated, ultra-high precision die attach and epoxy dispensing tools used for the fabrication of complex micro-assemblies in a variety of end markets, such as Telecom/Datacom, Aerospace & Defense, Health and Life Sciences and Industrial.

Booth:  39
NAMICS Corporation
2055 Gateway Place, Suite 480
San Jose, CA  95110
(P): (603) 560-5350
(E): mclaughlin@namics-usa.com
www.namics.co.jp/e

NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

Booth:  59
Neu Dynamics Corp.
110 Steamwhistle Dr.
Ivyland, PA  18974
(P): (215) 355-2460
(E): kevinhartsoe@neudynamics.com
www.neudynamics.com

NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronic components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications.  We offer specialized equipment built for today’s high-tech semiconductor, assembly processes.  Find out what the NDC companies can do to make your products better and your life easier.

Booth:  14
Pac Tech Packaging Technologies USA
328 Martin Avenue
Santa Clara, CA  95050
(P): (408) 368-1431
(E): richard.mckee@pactech.com
www.pactech.com

PacTech USA Packaging Technologies, Inc. (Santa Clara, California) offers contract wafer bumping services using low-cost UBM (electro-less Ni/Au), solder stencil printing, and solder ball placement for quickturn and mass production.  PacTech USA also provides product demonstrations, training, and sales support.  PacTech designs and manufactures wafer bumping and assembly equipment for flip chip, WLCSP, and interposers.  PacTech is the worldwide leader in laser reflow and heating technology, implemented in systems for solder jetting (SB2) and flip chip attachment (LAPLACE), including 3D soldering for advanced packaging applications like Head-Gimbal Assembly (HGA), MEMS, Opto-electronic packaging, IR detectors, various sensor products, and LCD drivers.

Booth:  16
Palomar Technologies, Inc.
2728 Loker Avenue West
Carlsbad, CA  92010
(P): (760) 931-3680
(E): kfinney@bonders.com
www.palomartechnologies.com

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Booth:  19
Plasma-Therm, LLC
10050 16th St, North
St. Petersburg, FL  33716
(P): (727) 577-4999
(E): nancy.messineo@plasmatherm.com
www.plasmatherm.com

Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company's Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Plasma-Therm’s Singulator® systems brings the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Plasma-Therm’s status as a preferred supplier of plasma process equipment has been recognized with 17 consecutive VLSIresearch industry awards, including #1 rankings for customer satisfaction in the last three years.

Booth:  24
Riv Inc. ~ Precision Printing Screens
31 Railroad Ave.
Merrimack, NH  03054-4121
(P): (603) 424-0510
(E): tania@rivinc.com
www.rivinc.com

Riv Inc. is a leading manufacturer of high quality printing screens; we cater to the Thick Film Hybrid Microelectronics, Flex Circuitry, Membrane Switches, RFID Antennas, Solar Cell Manufacturing and any other related industries.  Since 1986 we have been helping our customers Print with Quality.  With our 28+ years of experience we can help screen printers find the perfect combination of Mesh and Emulsion maximize their printing skill. We use nothing but the highest quality material available in the industry.   Service and Quality is what Riv Inc is.  Let us help you

Booth:  63
Rudolph Technologies
4900 W. 78th St
Bloomington, MN  55435
(P): (952) 259-1794
(E): amy.shay@rudolphtech.com
www.rudolphtech.com

Visit Rudolph at booth 63 to learn more about advanced packaging panel lithography
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices.  Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization.

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market

Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation of competitive offerings, and will be used for next-generation fan-out processing on rectangular panels. The system is scheduled to ship in mid-2016.

Mike Plisinski, Rudolph’s chief executive officer, stated, “We view the move from reconstituted wafers to chips-on-panels as a logical and necessary transition in the advanced packaging industry as product volumes increase. We are pleased that our lithography and panel solutions are able to play an integral role in this transition and look forward to partnering with these early leaders.”

According to Yole Dèveloppement’s November 2015 report, Status of Panel-Level Packaging & Manufacturing1, the demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from (round) wafers to a larger-size panel format. Yole describes the cost advantages and economy of scale benefits as key enablers propelling the growth of fan-out, interposers and embedded die panel packages. “Building on more than 25 years of flat panel lithography experience, we are confident the JetStep Lithography System is a premier solution for advanced packaging panel manufacturing,” said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. “Fully capable of handling rectangular glass or organic substrates up to approximately 700mm, the JetStep System is equipped with unique features to address the challenges of lithography on panels. On-the-fly autofocus and magnification compensation enable high yields, addressing a critical challenge of fan-out to be cost effective.”

Plisinski concluded, “We have an established market presence in both fan-out wafer level packaging and radio frequency (RF) devices, which we believe will be transitioning to glass panel interposers. Our early success in advanced packaging allows us to bring a wealth of experience and knowledge to this emerging industry shift from wafers to panels. As we have partnered with our wafer customers, Rudolph will partner with panel customers, leveraging our broad range of products and resulting application expertise to not only provide lithography, but a comprehensive solution that will significantly contribute to enabling advanced packaging on panels.” For more information about Rudolph’s JetStep Lithography systems, please visit www.rudolphtech.com.

Booth:  09
SAES Getters USA
1122 E. Cheyenne Mt. Blvd
Colorado Springs, CO  80906
(P): (719) 527-4130
(E): debbie_eastman@saes-group.com
www.saes-group.com

The SAES Getters Group is the world leader in a variety of scientific and industrial applications where stringent vacuum conditions or ultra-high purity gases are required.  SAES Getters provides products and services that allow customers to achieve lifetime vacuum integrity of their sensors.  In addition to offering many configurations of getter solutions available for integration inside a device ranging from SAES' thin film Page material to larger porous getters utilizing ST 171, ST 172, ST 175, or other varieties of getter alloys, SAES offers hermetic vacuum packaging services to the market as well as Residual Gas Analysis and Leak Rate testing.

Booth:  35
SavanSys Solutions LLC
10409 Peonia Court
Austin, TX  78733
(P): (512) 402-9943
(E): amyp@savansys.com
www.savansys.com

At SavanSys Solutions LLC, our business is electronics manufacturing cost modeling. With the SavanSys Solution—a combination of expert consulting services and our unique SavanSys modeling technology—we provide the electronics industry with solutions for: supply chain cost modeling; new technology adoption cost analysis; size, yield, and cost design planning; product cost reductions; and more.

Booth:  13
Sentec E&E Co., Ltd.
No. 32, Gong 5rd
Lungtan, Taoyuan  32559
Taiwan
(P): 88634892377
(E): sentecjason@gmail.com
www.sentecee.com/taiwan.asp

Sentec has been developing vehicle pollution control technology since it funded, and we are proud to say that we gather rich experience in this area.  We are...

-The first one which succeed in developing the catalyst technique for motorcycle by itself and then realize mass-production in Taiwan.
-The first one with stand-alone development technologies and produce the Engine Management System in China.

-The first one which can manufacture Non-shrinkage Low Temperature Co-Fire Ceramic (LTCC for short) substrate in China.

Booth:  41
SETNA Corporation
343 Meadow Fox Lane
Chester, NH  03036
(P): (603) 548-7870
(E): mphillips@set-na.com
www.set-na.com

High-accuracy Bonding Experience, Equipment, and Materials
SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required, for more than twenty years the FC150 Series has been the tool of choice. The Ontos7 is our atmospheric plasma system designed for and dedicated exclusively to the semiconductor manufacturing and packaging industry. Our patented (and patent pending) equipment and processes provide a unique advantage to our customers to enable low-cost, high yield, high-speed, chip-to-chip interconnect bonds at room temperature with minimal force.

Booth:  28
Shinko Electric America
1280 E. Arques Ave
Sunnyvale, CA  94085
(P): (408) 232-0482
(E): rick.macdonald@shinko.com
www.shinko.com

Shinko Electric Industries CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such  as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. Shinko   manufactures a full line of Organic Substrate structures including coreless options offering enhanced   electrical performance and package size reduction. Shinko can also provide subcontract assembly services with an   emphasis on packaging solutions such as POP, SIP and  Camera Modules utilizing our advanced package assembly   technologies, including our molded core embedded package, MCeP™. Shinko is located in Nagano, Japan and   provides the ultimate in service and solutions for our customers with Sales and Engineering support  worldwide.   For more about Shinko please visit our website at www.shinko.com.

Booth:  40
Sikama International, Inc.
118 East Gutierrez Street
Santa Barbara, CA  93101-2314
(P): (805) 962-1000 (108)
(E): phil@sikama.com
www.sikama.com

For the past 33 years Sikama International has been in the business of designing, manufacturing and marketing solder reflow & curing systems, wafer flux coaters and wafer washers. We are recognized around the world for our reliable small footprint machines. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Epoxy Curing and many other applications. Please stop by Sikama booth number 710 to discuss your reflow soldering or curing requirements.

Booth:  64
Sonoscan, Inc.
2149 E. Pratt Boulevard
Elk Grove Village, IL  60007-5914
(P): (847) 437-6400 (200)
(E): jlykowski@sonoscan.com
www.sonoscan.com

Sonoscan® is a leader and innovator in Acoustic Micro Imaging (AMI) technology. Sonoscan manufactures acoustic microscope systems and provides laboratory services to nondestructively inspect and analyze products. Our C-SAM®
microscopes provide unmatched accuracy for the inspection of products for hidden internal defects in SMT devices, ceramic capacitors and resistors, hybrids, MEMs, etc.

Booth:  20
SPTS Technologies, an Orbotech company
Ringland Way
Newport, NP18 2TA
United Kingdom
(P): +44 1633 414000
(E): Lisa.Mansfield@orbotech.com
www.spts.com

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.
The solutions offered by SPTS include market-leading silicon etch, dielectric etch, dry-release etch, PVD, and PECVD process technologies and equipment, available with a range of wafer-handling options applicable to R&D, pilot production, or volume production.  Comprehensive service and spare parts support are offered through a worldwide network of service centers and qualified local agents. For more information, go to: www.spts.com

Booth:  55
STATS ChipPAC, Inc.
46429 Landing Parkway
Fremont, CA  94538
(P): (208) 867-9859
(E): lisa.lavin@statschippac.com
www.statschippac.com

We invite you to join us at the IMAPS Device Packaging Conference on March 15-17, 2016 where we will be sharing the latest information on our advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, System-in-Package (SiP), 2.5D and 3D integration which meet the increasing market demand for higher levels of performance, increased functionality and miniaturization.

STATS ChipPAC is pleased to be partnering with Qualcomm Technologies to present a paper on fan-out wafer level packaging on Tuesday March 15th from 4:30 – 5:00 PM entitled:

Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

We will also have a presentation on SiP technology by Hamid Eslampour, Director of Advanced Technology Marketing, on Wednesday, March 16th from 4:00 – 4:30 PM entitled:

SiP Technology Trends

Please plan to attend our technical presentations or stop by booth #55 to discuss our products and services.

STATS ChipPAC is a leading provider of semiconductor design, bump, probe, assembly, test and distribution solutions for the communications, computer and consumer markets. With a broad portfolio of services and advanced process technology in wafer level, flip chip and 2.5D/3D packaging, STATS ChipPAC provides innovative and cost effective semiconductor solutions.

Booth:  17
Technic, Inc.
47 Molter Street
Cranston, RI 02910
(P): (401) 781-6100
(E): agallegos@technic.com
www.technic.com

Technic supplies some of the most advanced chemistry solutions for semiconductor packaging applications in the industry.  High performance product development with application specific characteristics and unparalleled analytical expertise provides customers with the essential tools to meet the challenges of today’s semiconductor manufacturing.  Technic’s semiconductor advanced packaging electrodeposition chemistries, marketed under the name Elevate, are well respected for innovation and high quality and are used in many applications including RDL, pillars, microbumps and LED packaging.  In addition Technic supplies photoresist strippers for liquid and dryfilm resist as well as metal etchants for a variety of metals. Technic also offers analytical control systems.  Technic's RTA (Real Time Analyzer) has become the leading analytical control system for damascene copper processes. The capability of the RTA system has now been successfully expanded into backend packaging applications for controlling TSV and copper pillar processes.   
Technic Inc is a Rhode Island based privately held corporation with over 900 employees worldwide and currently operates over 20 global facilities in 14 countries within North America, Asia and Europe.

Booth:  37
TechSearch International, Inc.
4801 Spicewood Springs Road
Suite 150
Austin, TX  78759
(P): (512) 372-8887
(E): tsi@techsearchinc.com
www.techsearchinc.com

TechSearch International has a 28-year history of quality market research and technology trend analysis focusing on:  WLP, FO-WLP, Flip chip, CSPs including stacked die, BGAs, 3D ICs with TSVs, 2.5D interposers, and System-in-Package (SiP), embedded components, and panel-based processing.  We partner with SavanSys Solutions offering cost models for WB, FC, WLP, and 2.5 & 3D ICs. Our extensive network consists of more than 16,000 contacts in North America, Asia, and Europe.

Booth:  08
Teikoku Taping System Inc.
5090 North 40th Street, Suite 140
Phoenix, AZ  85018
(P): (480) 794-1926
(E): andre.kirkland@teikoku-taping.com
www.teikoku-taping.com

For more than 25-years Teikoku Taping System has been an innovative leading custom equipment supplier for the backend semiconductor industry.

Teikoku’s backend semiconductor products include Wafer Mounting Systems, UV Irradiation Systems, Tape Removal Systems, Backgrind Tape Laminators, and Dry Film Resist Laminators. TTS will continue to revolutionize the semiconductor industry and exceed industry expectations with new and innovative equipment designs.

Booth:  57
Triton MicroTech, Inc.
2726 Loker Avenue, West
Carlsbad, CA  92010
(P): (919) 649-8221
(E): tmobley@tritonmicrotech.com
www.tritonmicrotech.com

Triton Microtechnologies is the leader in the design and manufacture of high-performance 2.5D and 3D Through Glass Via (TGV) interposers.

As we rapidly approach the barrier and performance limits of silicon, the need increases for a greater number of components in smaller package areas and the need for non-silicon based materials to better support this next generation assembly.

Triton's proprietary technology offers faster cycle times, KGD testing at higher packaging integration levels, and the lowest cost/unit in the marketplace.

Booth:  44
West Bond, Inc.
1551 South Harris Ct.
Anaheim, CA  92806
(P): (714) 978-1551
(E): sales@westbond.com
www.westbond.com

50Th ANNIVERSARY … This year, 2016 will mark a significant time in our company’s history. West•Bond Inc. will officially celebrate our 50th Anniversary on October 31st 2016. We know and recognize that our success is due to several factors : design, craftsmanship, service and sales. All of these elements are vitally important to any manufacturer. We thank you for considering West Bond Inc. in your manufacturing supply chain.

WEST•BOND  offers a Wedge Bonder / Ball Bonder combination machine in three different configurations…Manual, Semi-automatic in motorized “Z”, and motorized “Z” & “Y”. WEST•BOND also manufactures a Die Bonder that combines both Epoxy and Eutectic methods in one chassis. Between these two series you can bond most any product in the microelectronic industry.

Since 1966, West Bond Inc. has been a Design and Manufacturer of Assembly and Test Equipment for the Microelectronic Industry here in Southern California. Including Automatic, Semiautomatic, and Manual ESD protected bonders, with Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon capability. Included in product line are Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers with our patented X-Y-Z,   8/1 ratio micromanipulator. 
 
In addition, we design and manufacture accessories such as LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers, as well as full a complement of machine shop services.

Booth:  43
XYZTEC
36 Balch Ave
Groveland, MA  01834
(P): 978-880-2598
(E): tom.haley@xyztec.com
www.xyztec.com

If you are looking for a bond tester that offers the latest technology advancements, clever innovations and the utmost flexibility, XYZTEC is your solution.    Technology---fiducial pattern recognition, automation, high sample rate 24 bit ADC and high speed (50mm/sec) axes speed    Innovation---Rotating Measurement Unit (RMU) that holds up to 6 sensors that are software selectable. Change from test to test in seconds. No more cartridges and their inherent wear issues!    Flexibility---Support for 25+ test types, 12” fully automated wafer test system, up to 500Kg shear capability and the most advanced software available.

Booth:  42
Yole Developpement
75 cours Emile Zola
Villeurbanne,   69006
France
(P): 33-472-83-01-80
(E): fabre@yole.fr
www.yole.fr

Meet with Yole Développement analysts at booth #42, and discuss with them the latest Advanced Packaging dynamic market trends!

 

:: Job Openings ::

:: Product Manager Thick Film - HET (full story)

:: Application Engineer - AM (full story)

:: Technical Sales Manager AM (full story)

:: Application Engineer (m/f) (full story)

:: Project Manager (m/f) Product Development (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Thank you Device Packaging Sponsors!

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: ASE US, Inc.

PREMIER SPONSOR:
Golf Hole Sponsor: Amkor Technology

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
EMD Performance Materials - Corporate Sponsor
Event Sponsors

Mobile APP Sponsor: SETNA

Mobile "App" Sponsor

Applied Materials - Event Sponsor

Mobile Charging Station &
Evening Panel / Reception

VEECO - Mobile Charging Station & Golf Sponsor

Mobile Charging Station

Shenmao - Event Sponsor

Refreshment Breaks &
Attendee Bag Insert

Poster Session / Happy Hour Sponsor: XIA

Poster Session & Happy Hour Sponsor

 

 

 

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: Infinite Graphics

Hole #6 - Closest to Pin

MRSI - Break Sponsor

Hole #10

Golf Hole Sponsor: Coining Inc/SPM

Hole #5

Technic - Sponsor - Mobile Charging Station

Hole #7

VEECO - Golf Sponsor

Holes #4 - Longest Putt, #15

ASM Pacific - Hole Sponsor

Hole #11

Golf Hole Sponsor: AGC Electronics America

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
     

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


 

 

:: Job Openings ::

Product Manager Thick Film - HET
Heraeus Electronics (HET) is searching for an experienced Product Manager to support the Thick Film Business Line of the Heraeus Electronics Global Business Unit (HET).  This position can report out of Conshohocken, PA in the US or Hanau, Germany.  The role of the Product Manager in HET is to manage the product portfolio, develop and implement product strategy based on HET strategy and monitor marketing activities against targets.
Essential Duties and Responsibilities:

  • Define HET product portfolio and go to market strategy per customer segment and steer HET innovation projects to assure that new products meet customer needs and are competitive in the market.
  • Actively drive market and innovation dialogue with customers.
  • Define performance metrics for sales and marketing, monitor status with respect to metrics and drive actions if targets are not met.
  • Perform scouting of market & technology trends, monitor competitors’ directions, explore and propose partnerships and M&A targets.
  • Monitor HET operational performance against top competitors and future market requirements.
  • Collaborate with innovation teams to achieve customer oriented and results driven innovation program. Steer innovation project portfolio and new product development.
  • Provide support to meet sales, profitability, and market share targets for each sales region and for HET globally.
  • Support Regional Sales Managers for all client relationships in sales regions. Provide support in developing pricing and sales strategies of products.

Qualifications:

  • Advanced University Degree (Master equivalent)
  • A minimum of 10-15 years within the function with a minimum of 5 years managerial experience
  • Extensive experience in Electronics and automotive industry, knowing the customers, known and respected by the customers
  • Detailed knowledge in assembly, joining and packaging processes and technologies used in electronics industry
  • Pragmatic personality with a strong view for optimizing of product portfolio: stringent activity management and transparent monitoring processes
  • Courage for change and for challenging old procedures and standards
  • Ability and ambition to lead multi-site and multi-cultural teams
  • Good English skills: Chinese language skills helpful
Apply to this job now...

 

Application Engineer - AM
Application Engineer - AM
Location Conshohocken - Pennsylvania
Permanent
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Heraeus Precious Metals North America Conshohocken, LLC, (HPMC) is searching for an experienced Applications Engineer to join the Heraeus Elecronics team.  The primary responsibility of this position is to act as the customer liaison for technical discussions regarding products, applications, and issues, servicing and qualifying both new product introductions and existing Heraeus Assembly Materials products.
                                               
Essential Duties and Responsibilities include the following (other duties may be assigned):

  • Provide technical support to domestic and international sales team for current Heraeus products
  • Analyze, identify, and resolve technical problems or complaints from customers in order to maintain and increase business
  • Plan and conduct laboratory processes supporting the modification of existing products for new applications
  • Lead cross-functional teams to address complex technical problems or customer complaints
  • Act as the technical “voice” of the customer internally - function as a resource to sales, marketing, research and development, engineering and production by providing detailed product information and advanced application knowledge
  • Promote new products and company to customers and industry
  • Create and provide updates to product data sheets and technical data packages
  • Author and/or present technical reports, technical papers, project updates, and technical overviews for internal presentation, journals, and conferences
  • Attend technical conferences, trade shows, and educational courses to remain current in the field as it relates to existing and future technologies
  • Demonstrate an advanced knowledge of the materials science used in the application of finished goods and the effect on performance
  • Identify new technology and applications and communicate to supervisor
  • Handle confidential information with care
  • Record precise results and findings in laboratory book, database and/or files
  • Maintains or supervises assigned laboratory areas and equipment
  • Follow safety guidelines for handling materials with the use of protective equipment as required
  • Travel in the field as necessary

Responsible for compliance with the Heraeus Code of Conduct, reporting the violations of the Code to the supervisor or the compliance officers

Qualifications:

A minimum of a Bachelors Degree in Material or Ceramic Science and Engineering or related field and a minimum of 4 to 6 years of laboratory experience are required. Experience should be working with assembly materials products such as solder pastes, solder powders, sinter pastes, fluxes, SMT Adhesives, Conductive Adhesives, Non-conductive Adhesives, or related. The equivalent combination of education and experience will be considered.  Self-starter with an attention to detail required. Demonstrate a high level of professionalism; exhibit a high level of motivation and initiative.  Must be able to travel 30 - 50% in order to visit customers worldwide, present technical papers, and attend conferences.  Must have experience with the application of Six Sigma methodology such as Design of Experiment and statistical analysis.  Knowledge of processing and analytical test equipment is required. 

As provided by the Americans with Disabilities Act, the company is committed to discussing and providing reasonable accommodations to its employees to help them fulfill the essential functions of their jobs.


Our recruiting team will carefully review and consider each individual application. Qualified candidates will be contacted for further discussion. We thank you for your consideration and appreciate your interest in Heraeus.

For more information, please visit www.heraeus.com/careersusa.

 

Technical Sales Manager AM
Heraeus Precious Metals North America Conshohocken, LLC (HPMC) is searching for an experienced Technical Sales Manager to work within the Heraeus Electronics team.  The primary responsibility of this position is to oversee the business development of AM products and act as the Key Account Manager for the Americas. The primary responsibility is to conduct product planning and execution throughout the product lifecycle, including: gathering and prioritizing product and customer requirements, defining the product vision to ensure revenue and customer satisfaction goals are met.

Essential Duties and Responsibilities include the following (other duties may be assigned):

  • Work closely with the Director of Marketing and Sales – Americas to develop strategies to grow the AM product line in the Americas by providing market information to ensure a consistent revenue stream, sales forecasting, and balance of resources.
  • Analyze the Americas market for AM products.Decide where fully customized solutions are required, bring in R&AE and develop time-line for milestone achievements. Track R&AE solution development time-line, production processes and identify critical processes.
  • Seek new opportunities by building and maintaining client relationships, utilizing existing relationships, working with internal resources, and managing proposal responses for newly identified work. Evaluates deal value potential and probability to win based on technical understanding of customer need and benefit.
  • Engage in research and analysis and competitive intelligence-gathering for strategic planning, competitive firm positioning, and business development activities. Leverage industry knowledge to identify profitable new opportunities.
  • Direct the sales team in the implementation of strategies for the promotion of new and existing products and company to customers and industry. Organize and/or manage potential outside sales organizations.
  • Participate as a member of a team of sales people to increase revenue within the product line.
  • Coordinates with Application Engineering to interact with technical experts (e.g., R&D) of customer to establish technical characteristics of the problem/customer need and explain benefits of solution offering.
  • Work with AM Product Managers to support the Americas sales team with sales tools and information flow to and from the production sites.
  • Handle confidential information with care.
  • Communicates with customers face-to-face, by phone, and via email.
  • Travel domestically and internationally in the field as necessary.
  • Adherence to Code of Conduct as applicable to job function:  CoC Guideline No. 1:  Guideline for the Procurement of Products and Services, No. 2:  Guideline for the Prevention of Bribery in Commercial Transactions, No. 3:  Guideline for the Acceptance of Precious Metals and No. 4:  Guideline for the Prevention of Money Laundering and Participation in Criminal Acts.

Qualifications:
A minimum of a Bachelors Degree in Material Science and Engineering or related field and 10 years of experience within circuits & components, chemical, electronic component or related field.  Experience with assembly materials such as Solder Pastes, Solder Wire, Solder Powders, Sinter Pastes, Fluxes, SMT Adhesives, Conductive Adhesives, Non-conductive Adhesives or related products is required.  A minimum of 5 years of experience in a technical sales role is required.  The equivalent combination of education and experience will be considered.  Self-starter with an attention to detail is required. Demonstrate a high level of professionalism, customer orientation and leadership ability; exhibit a high level of project management, negotiation, and presentation skills.  Must be able to travel up to 50% in order to visit customers worldwide, present technical papers, and attend conferences.  Must have previous experience dealing with global customers.

As provided by the Americans with Disabilities Act, the company is committed to discussing and providing reasonable accommodations to its employees to help them fulfill the essential functions of their jobs.

Apply to this job now...

Application Engineer (m/f)

Application Engineer (m/f)
Location Hanau
Permanent
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Your role and responsibilities:
You will be responsible for the technical customer support at home and abroad of the Business Unit HET-Thick Film. Therefore, you will prepare test circuits by screen printing and also analyse chemical and physical properties of the test circuits. You will handle complaints for thick film materials as well as the presentation of lectures for your customers. Additionally, you will benchmark and challenge developed pastes to serve a continuous improvement.
 
What is required for this role:
You have successfully completed a university degree in the field of materials technology or similar. Ideally, you have gained some professional experience with customer contact for technical products. Knowledge of Six Sigma, DoE and Root Cause Analysis techniques is an advantage. Furthermore, you have good MS Office skills and a basic knowledge of SAP / R3. Of course you have excellent communication skills in English across all levels. If you possess a strong assertiveness and are a teamplayer, we are looking forward to your application.

What you can expect:
You can look forward to working for a highly advanced, innovative employer who will assign responsibility to you at an early stage and where you will be able to drive forward both our company and your career. For more information, please visit www.heraeus.com/careers.

Send us your documents by reference code 11585 via our online application portal. Any questions? If so, please contact our Recruiting Team, Heraeus Electronics, +49 6181/35-8877.

Apply to this job now...

Project Manager (m/f) Product Development
Project Manager (m/f) Product Development
Location Hanau
Permanent
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Your role and responsibilities:
You will be responsible for the management of development projects as well as being technically involved (including hands-on) in them. Furthermore, you will coordinate with local and worldwide Sales and Innovation teams in order to justify, prioritize and plan the execution of R&D projects. You will report on project status and progress and evaluate new technologies and product ideas. In addition, you will advise the organization on appropriate R&D investments and therefore monitor costs and effectiveness of R&D activities in respective development projects to optimize resources, prioritise spending and maintain professional standards. Moreover, you will organise and participate in knowledge and expertise exchanges with the Global Heraeus R&D community. You will support sales in their technical contacts with potential customers and conduct your business in compliance with legal requirements.

What is required for this role:
You have successfully completed a university degree in Physics, Chemistry, Material Science, Electrical Engineering or equivalent. At least 3 years of professional experience in a relevant field and detailed knowledge in ISO 9001 and ISO/TS 16949 is considered a plus. Furthermore, you possess knowledge of Core Tools like APQP, MSA, FMEA, PPAP as well as of thick film technologies and processes. You have a basic knowledge of SAP and sound knowledge of MS Office applications. Of course you are enthusiastic, willing to learn and a good problem solver with experience of specific tools. You have excellent communication skills in German and English across all levels. Thus, you have the ability to clearly define and communicate project relevant information.
What you can expect:
You can look forward to working for a highly advanced, innovative employer who will assign responsibility to you at an early stage and where you will be able to drive forward both our company and your career. For more information, please visit www.heraeus.com/careers.

Send us your documents by reference code 9930 via our online application portal. Any questions? If so, please contact our Recruiting Team, Heraeus Electronics, +49 6181/35-8877.

Apply to this job now...

 

Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( http://jobs.imaps.org ) at no cost - part of corporate membership!

 

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:: Issue 186 ::
March 10, 2016

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services