Heraeus TFD

:: Corporate Member News ::


Visit the companies during our Exhibit Hall Hours at DPC:

Tuesday, March 15, 2016 - 10:00 AM - 6:30 PM
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 16, 2016 - 10:00 AM - 4:00 PM
Lunch, and Breaks will be held in the Exhibit Hall


Exhibitor Booth
Advance Reproductions Corp. Booth:  58
AGC Electronics America Booth:  31
AI Technology, Inc. Booth:  53
AkroMetrix, LLC Booth:  02
AMICRA Microtechnologies GmbH Booth:  26
Amkor Technology Booth:  38
ASE US, Inc. Booth:  47
ASM Pacific Technology, Ltd. Booth:  51
AT&S Americas, LLC Booth:  45
Atotech USA, Inc. Booth:  32
ATV Technologie GmbH Booth:  06
Axus Technology Booth:  56
Azimuth Electronics, Inc. Booth:  62
Boschman Technologies / Advanced Packaging Center Booth:  36
Canon USA Booth:  66
Coherent, Inc. Booth:  46
Deweyl Tool Company, Inc. Booth:  03
Dow Electronic Materials Booth:  29
EMD Performance Materials Booth:  10
EV Group, Inc. Booth:  22
F & K Delvotec, Inc. Booth:  11
Finetech, Inc. Booth:  21
FlipChip International, LLC Booth:  30
Geib Refining Corporation Booth:  25
Hesse Mechatronics, Inc. Booth:  01
HSIO Technologies Booth:  54
i3 Electronics Booth:  15
IBM Canada Ltd. Booth:  12
IMAT, Inc. Booth:  05
Infinite Graphics Booth:  04
Invenios Booth:  52
JSR Micro, Inc. Booth:  07
Kulicke & Soffa Industries, Inc. Booth:  60
Kyocera America, Inc. Booth:  48
LB Semicon, Inc. Booth:  18
Mentor Graphics Corporation Booth:  50
Metalor Technologies USA Booth:  65
Micro Hybrid Dimensions, Inc. Booth:  23
Micro Systems Technologies Management AG Booth:  33
Micross Components Booth:  34
Mini-Systems, Inc. Booth:  27
MRSI Systems LLC Booth:  61
NAMICS Corporation Booth:  39
Neu Dynamics Corp. Booth:  59
Pac Tech Packaging Technologies USA Booth:  14
Palomar Technologies, Inc. Booth:  16
Plasma-Therm, LLC Booth:  19
Riv Inc. ~ Precision Printing Screens Booth:  24
Rudolph Technologies Booth:  63
SAES Getters USA Booth:  09
SavanSys Solutions LLC Booth:  35
Sentec E&E Co., Ltd. Booth:  13
SETNA Corporation Booth:  41
Shinko Electric America Booth:  28
Sikama International, Inc. Booth:  40
Sonoscan, Inc. Booth:  64
SPTS Technologies, an Orbotech company Booth:  20
STATS ChipPAC, Inc. Booth:  55
Technic, Inc. Booth:  17
TechSearch International, Inc. Booth:  37
Teikoku Taping System Inc. Booth:  08
Triton Microtechnologies Booth:  57
West Bond, Inc. Booth:  44
XYZTEC Booth:  43
Yole Developpement Booth:  42


:: Job Openings ::

:: Product Manager Thick Film - HET (full story)

:: Application Engineer - AM (full story)

:: Technical Sales Manager AM (full story)

:: Application Engineer (m/f) (full story)

:: Project Manager (m/f) Product Development (full story)


Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Thank you Device Packaging Sponsors!

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
EMD Performance Materials - Corporate Sponsor
Event Sponsors

Mobile APP Sponsor: SETNA

Mobile "App" Sponsor

Applied Materials - Event Sponsor

Mobile Charging Station &
Evening Panel / Reception

VEECO - Mobile Charging Station & Golf Sponsor

Mobile Charging Station

Shenmao - Event Sponsor

Refreshment Breaks &
Attendee Bag Insert

Poster Session / Happy Hour Sponsor: XIA

Poster Session & Happy Hour Sponsor




Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: Infinite Graphics

Hole #6 - Closest to Pin

MRSI - Break Sponsor

Hole #10

Golf Hole Sponsor: Coining Inc/SPM

Hole #5

Technic - Sponsor - Mobile Charging Station

Hole #7

VEECO - Golf Sponsor

Holes #4 - Longest Putt, #15

ASM Pacific - Hole Sponsor

Hole #11

Golf Hole Sponsor: AGC Electronics America

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: Gore Receives Supplier Appreciation Award

W. L. Gore & Associates, Inc. (Gore) has received a Supplier Appreciation Award from Space Systems Loral (SSL) Palo Alto, CA, the leading provider of geostationary commercial satellites, in recognition of Gore’s dedication in supporting SSL programs.

SSL has a long history of producing reliable satellites and spacecraft systems for commercial and government customers around the world and currently has more geostationary commercial capacity in orbit than any other manufacturer. Gore has been providing SSL with its high-reliability GORE® Spaceflight Microwave/RF Assemblies for more than 20 years. The supplier appreciation award recognizes the dedication of Gore’s employees and management in supporting SSL programs.

“We have had a long standing relationship with SSL,” said Frank Kilday, Gore Product Specialist. “We have continued to provide high quality GORE® Spaceflight Microwave/RF Assemblies to SSL, who are pleased with our demonstrated flexibility and resilience while still maintaining high quality standards.”

“We are in rare company to receive such an award out of the many hundreds of suppliers working with SSL,” added Kim Stanyard, Gore Field Sales Associate, who has been working closely with SSL.

“SSL presented Gore with our supplier appreciation award to acknowledge the value of our close working relationship,” said Kelly Rose, Director, Procurement & Logistics Supply Chain Management for SSL. “Gore consistently provides high quality and rapid turnaround for cable assemblies – always meeting critical deadlines for satellite launchpad dates.”


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Brewer Science Launching its Directed Self-Assembly Technology at 2016 SPIE Advanced Lithography

Brewer Science invites you to join us February 21 – 25 at SPIE Advanced Lithography in San Jose, CA, as we launch our directed self-assembly (DSA) technology, which combines lithography and self-assembly. SPIE is regarded as the premier international event driving the future of lithography research and applications and is the largest gathering of lithography experts in the world.

Brewer Science is launching an informative educational video about DSA, which offers a variety of applications in the industry. DSA will enable semiconductor manufacturers to create smaller features without additional investment in equipment infrastructure.

Join Brewer Science at the following sessions to learn more about technology innovation:

Mary Ann J. Hockey, Senior Program Manager, will present Tunable BCP L0 Achievement (Paper 9777-68) at Conference 9777, Alternative Lithographic Technologies VIII, DSA, during the poster session on Tuesday, February 23, from 6:00 pm to 8:00 pm.    

Dr. Douglas Guerrero, Senior Technologist, serves on the Program Committee for Advances in Patterning Materials and Processes XXXIII. He is a Session Chair for the joint session combining Conference 9779, Session 6, and Conference 9782, Session 5, which will be held on Tuesday, February 23, from 1:20 pm to 3:20 pm and will focus on Patterning Materials and Etch.  

Brewer Science will be at Booth 300 at SPIE. A team of technical experts will be available to discuss next-generation technology.

Learn more about Brewer Science at, follow us on Twitter at @BrewerScience, like us on Facebook at, and subscribe to our blog at
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Master Bond’s Non-Yellowing UV Curable System Has Superior Abrasion Resistance

Master Bond UV15X-6NM-2 is a one component UV curing urethane acrylate system formulated for a variety of bonding, sealing, coating and encapsulation applications. This moderate viscosity product features flexibility, toughness and abrasion resistance. It is widely used for fiber-optic, optical, electronic, semiconductor, microelectronic and laser applications.

UV15X-6NM-2 features an elongation exceeding 200%, which contributes to its ability to withstand rigorous thermal cycling and mechanical shocks. It is serviceable over the wide temperature range of -80°F to +250°F. It also has very good chemical resistance, especially to water, cleaning agents and oils. With a refractive index of 1.50, this compound is optically clear and has impressive non-yellowing properties.

This special formulation cures readily in 10-30 seconds when exposed to a UV light source. The rate of cure depends upon the system’s distance from the light source, the thickness of the section and the intensity of the light source. It is not oxygen inhibited. Cures can be obtained in sections approaching 1/4 inch thick. As a reliable electrical and thermal insulator, UV15X-6NM-2 is well suited for potting and encapsulation. It also bonds well to a variety of substrates including glass, plastics including polycarbonates and acrylics, composites, metals and many types of rubbers.

UV15X-6NM-2 is available for use in standard packaging options from ½ pints to 5 gallons. For easy dispensing, this product can be purchased in 3 cc to 60 cc syringe applicators.

Master Bond Optically Clear Adhesives
Master Bond UV15X-6NM-2 is an optically clear UV curable system for bonding, sealing, coating and potting applications that require non-yellowing properties, toughness and abrasion resistance. Read more at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

For a full product description, please visit:

Check out new videos on our YouTube channel:

Master Bond

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SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today” Seminar

Seminar will present a complete HBM supply chain solution

SK hynix, Inc. (“SK hynix”), Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This seminar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now.

The seminar will be held on Wednesday, March 9, 2016 at the Computer History Museum in Mountain View, California. The event will begin at 4PM Pacific time and conclude with a wine and beer reception that will include interactive demonstrations from 6PM to 7PM.

“HBM is scaling the DRAM technology to a new level where high performance, low power and small form factor are all delivered with one solution. SK hynix is excited to be in the vanguard of developing the HBM technology and accelerating HBM adoption,” said Kevin Tran, Senior Manager of Technical Marketing at SK hynix America Inc., an US subsidiary of SK hynix.

According to Ron Huemoeller, Amkor Technology, Inc.’s corporate vice president of R&D, “Amkor Technology has worked closely with our customers to implement HBM into their high-performance computing products from the early stages of development through final product launch, as part of our overall 2.5D through-silicon via (TSV) platform. This has allowed us to both have significant impact on determining the supply chain process flow, as well as provide the necessary critical services of MEOL interposer processing and SoC + HBM + interposer assembly and test. We look forward to sharing our expertise in these key areas to help promote a wider adoption of HBM into more products going forward.”

“eSilicon is currently supporting several HBM customers using its HBM PHY and advanced ASIC design and packaging capabilities,” said Mike Gianfagna, eSilicon’s vice president of marketing. “I’m delighted that 2.5D in the form of HBM is really here now. We are proud to present this work alongside our supply chain partners.”

“Northwest Logic’s highly configurable HBM Controller is being used in a wide range of high-performance HBM applications. This seminar provides a great opportunity to quickly get up to speed on HBM and learn how it can be used to create highly differentiated end-market products,” said Brian Daellenbach, president of Northwest Logic.

“Avery provides HBM memory models that enable HBM-based SoC and PHY designs to be robustly verified and performance-optimized quickly and effectively,” said Chris Browy, vice president of sales and marketing for Avery Design.

Seminar registration is now open and may be accessed at

About SK hynix, Inc.
SK hynix, Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at

About Amkor Technology, Inc.
Amkor Technology, Inc. is a leading provider of semiconductor packaging, assembly and test services to the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 7 million square feet of floor space with production facilities, product development centers and sales & support offices located in Asia, Europe and the US. For more information visit

About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results.
The right chip. Right now™

About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit or contact us directly.

About Avery Design Systems
Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of formal analysis applications for RT-level and gate-level X verification; robust core-through-chip-level Verification IP for PCI Express, USB, AMBA, UFS, MIPI, DDR/LPDDR, HBM, HMC, ONFI/Toggle, NVM Express, SCSI Express, SATA Express, eMMC, SD/SDIO, and CAN FD standards. The company is a member of the Mentor Graphics Value Added Partnership (VAP) program and has established numerous Avery Design VIP partner program affiliations with leading IP suppliers. More information about the company may be found at


Kevin Tran

Debi Polo

Sally Slemons

SK hynix America Inc.

Amkor Technology, Inc.

eSilicon Corporation







Brian Daellenbach


Chris Browy

Northwest Logic


Avery Design Systems

503-533-5800 x309




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Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

In addition to outstanding print transfer and response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days. 

Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability and a wide process window, accommodating various board sizes and throughput requirements, minimizing potential defects.

Indium8.9HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void™. For more information about Indium8.9HF, email or visit

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.



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Nordson ASYMTEK Takes Piezo-Driven Jet Dispensing Technology to a New Level

Introducing Spectrum II Premier with IntelliJet Jetting System

Gives precise, consistent jet dispensing performance over long production runs for the manufacture of advanced electronic packages

Nordson Asymtek

Nordson ASYMTEK, has introduced the Spectrum™ II Premier with the IntelliJet® jetting system for dispensing small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for advanced packaging applications. The IntelliJet system incorporates ASYMTEK’s patent-pending 2-piece ReadiSet™ jet cartridge for fast and simple cleaning and maintenance. Taking advantage of piezo-driven jet dispensing technology, the system jets a wide range of fluids in dot sizes from one to hundreds of nanoliters. The Spectrum II Premier system's closed-loop process controls integrate enhanced features for IntelliJet setup, calibration, and control to ensure consistent dispensing performance, reliability, and durability far above other piezo-driven jets on the market today.

"Advanced package designs requiring small dots in tight spaces and their high cost demand an extraordinary degree of dispense-volume accuracy to ensure high production yield. To maintain productivity goals with these small dot sizes and target fluid flow rates, a high jetting frequency is needed," said Garrett Wong, product manager for Nordson ASYMTEK. "Piezo technology is excellent for producing small dots, but its use for high-volume production has been complicated by the short life of the consumable parts and less than ideal consistency across multiple installations. The Spectrum II Premier and IntelliJet system further advance piezo-jetting technology with long-term reliability two to four times longer than any other piezo-driven jet and combines that with automatic calibration features that produce a consistent jetting process across large-scale production lines."

The Spectrum II Premier system is built on the award-winning Spectrum II fluid dispensing platform and leverages ASYMTEK's 30+ years of experience as the global leader in designing and manufacturing precision fluid dispensing equipment for high-volume production environments.

The IntelliJet system's self-calibration features and the platform's patented closed-loop process controls ensure that dispense results remain consistent despite variances in consumable hardware, setup, and wear. Users can reliably transfer their dispense processes across multiple Spectrum II Premier platforms and achieve identical performance in fluid break-off, eliminating satellites and accumulation. The ReadiSet jet cartridge maximizes up-time because only the wetted fluid path parts are changed, allowing the jet actuator to remain on the platform. Individual components of the ReadiSet cartridges are easily exchanged, minimizing cost-of-ownership.

"The Spectrum II Premier and IntelliJet system are truly a leap forward in jet dispensing technology," said Wong. "With ASYMTEK's focus on total system solutions, the Spectrum II Premier unites industry-leading wet dispense accuracy with feature-rich software and leading-edge vision and jet hardware to take fluid dispensing to a whole new level."

For information or to schedule an appointment, contact Nordson ASYMTEK at, call +1 760-431-1919, or visit our website: and




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Rudolph Announces Win in Patent Infringement Lawsuit against Camtek

Rudolph Technologies, Inc. (NYSE: RTEC) has announced that the U.S. Court of Appeals for the Federal Circuit has affirmed a lower court decision that Camtek, Ltd. infringed Rudolph’s U.S. Patent No. 6,826,298. The U.S. District Court of the District of Minnesota reinstated a finding of infringement against Camtek’s Falcon inspection system, a decision that Camtek had appealed in 2015. The District Court awarded damages in excess of $14.5 million and imposed a permanent injunction that prohibits Camtek from “making, using, selling and offering to sell any of its Falcon machines and any machines that are colorable imitations thereof in the United States, intended for sale and use within the United States, until the expiration of the ‘6,298 patent.”

”We are pleased that the Federal Court of Appeals affirmed the lower court’s decision in this case so quickly after the hearing held on February 1,” commented Robert Koch, Rudolph’s vice president and general counsel. “As we have asserted from the beginning of this matter, Camtek has been using Rudolph’s proprietary technology. This decision is extremely gratifying in that it clearly validates Rudolph’s position and holds Camtek accountable for its use of our patented technology in its tool offering.”

Rudolph continues to assert its intellectual property rights against Camtek to ensure that their prohibited use of Rudolph’s proprietary, patented technology ends. Rudolph is actively prosecuting additional lawsuits against Camtek over their Condor, Gannet and Eagle products both under the judicially validated ‘6,298 patent and an additional patent. In these further lawsuits, Rudolph seeking both monetary damages and a permanent injunction against the sale of those items in the United States.

For more information about Rudolph, please visit


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Upcoming Microelectronics/Packaging Training Courses by TJ Green Associates

Introduction to Microelectronics Packaging
Phoenix, AZ
March 14, 2015

This is a Professional Development Course offered at the IMAPS International Conference and Exhibition on Device Packaging 

This training class is a great introduction to the world of microelectronic  packaging including recent trends such as FO-WLP (Fan Out-Wafer Level Packaging)

course outline 


Microwave Packaging Technology
Boxborough, MA                                                        
May 4-6, 2016
This three-day technical training seminar is for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and similar devices.
Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military, aerospace and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective including a brief review of MMIC fab technology, substrate and package selection (e.g. thin film, PTFE, LTCC) Ag epoxy and AuSn die attach, deep access Au wire and ribbon bonding, hermetic laser seal and testing. 

Full Course Outline
Registration Form

The course begins the day after the IMAPS New England Microelectronics Symposium at the Holiday Inn in Boxborough, MA.


Wire Bonding Certification
Bethlehem, PA
May 24-26, 2016 

This is an intense three-day course that combines classroom activities and "hands-on" skills at the wire bonder. It's an opportunity to really learn wirebonding and interact one-on-one with skilled instructors. Students have to demonstrate a basic level of wire bonding proficiency and pass a written test at the end. Newer model TPT wire bonders and older KNS machines are used along with basic pull test equipment plus low and high mag optical inspection microscopes. The goal is to teach basic wire bond principles and hands-on techniques that can then be broadly applied. Visual inspection criteria is in accordance with MIL-STD-883 TM 2017. Class size is limited to 6 students.
Students are encouraged to bring samples to class.

Full Course Outline
Registration Form


Microelectronic Packaging Courses- Singapore
May 16-20, 2016
Participate in an entire week of professional training classes focused on microelectronics packaging and testing of microcircuits, hybrids, RF microwave modules and integrated microwave assemblies for high reliability applicaitons. Learn about MIL-STD-883 test methods, including hermeticity  and visual inspection per TM 2017 and TM 2010. Understand the reliability issues in context of the associated performance specifications. Pick and choose from 5 different full day training classes. Train with TJ Green LLC during the day, and enjoy the beautiful city of Singapore at night. 
The training classes will be held at:  
Singapore Marriott Tang Plaza Hotel, in downtown Singapore. 

Full Course Outline
Registration Form


Process Certification And Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules
Bethlehem, PA
June 23-26, 2016

This process certification is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy to understand format.

Full Course Outline
Registration Form


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Recent PTI Blog Posts - Celebrating 20 Years as Palomar Technologies and more...

庆祝 Palomar Technologies 成立20 周年! (Celebrating 20 Years as Palomar Technologies)
[For a version of this blog in English, click here]
在上世纪70年代,当Palomar Technologies 还未成立之前,我们是休斯飞机公司工业产品事业部在装配和测试产品的一个单位。


Read More

Maintain Peak Performance with Intelligent Interactive Graphical Interface®
Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. Programming can become a nightmare, particularly when the number of wires runs into the hundreds and thousands. Our user-friendly Intelligent Interactive Graphical Interface® (i2Gi®) is an unparalleled feature implemented on the 9000 Wedge Bonder and the 8000i Wire Bonder that enables application engineers, programmers and operating technicians to work smarter, faster and with more control. This feature allows the management from part design and development, to process validation and finally to intuitive operations control.


Read more:


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:: Job Openings ::

Product Manager Thick Film - HET
Heraeus Electronics (HET) is searching for an experienced Product Manager to support the Thick Film Business Line of the Heraeus Electronics Global Business Unit (HET).  This position can report out of Conshohocken, PA in the US or Hanau, Germany.  The role of the Product Manager in HET is to manage the product portfolio, develop and implement product strategy based on HET strategy and monitor marketing activities against targets.
Essential Duties and Responsibilities:

  • Define HET product portfolio and go to market strategy per customer segment and steer HET innovation projects to assure that new products meet customer needs and are competitive in the market.
  • Actively drive market and innovation dialogue with customers.
  • Define performance metrics for sales and marketing, monitor status with respect to metrics and drive actions if targets are not met.
  • Perform scouting of market & technology trends, monitor competitors’ directions, explore and propose partnerships and M&A targets.
  • Monitor HET operational performance against top competitors and future market requirements.
  • Collaborate with innovation teams to achieve customer oriented and results driven innovation program. Steer innovation project portfolio and new product development.
  • Provide support to meet sales, profitability, and market share targets for each sales region and for HET globally.
  • Support Regional Sales Managers for all client relationships in sales regions. Provide support in developing pricing and sales strategies of products.


  • Advanced University Degree (Master equivalent)
  • A minimum of 10-15 years within the function with a minimum of 5 years managerial experience
  • Extensive experience in Electronics and automotive industry, knowing the customers, known and respected by the customers
  • Detailed knowledge in assembly, joining and packaging processes and technologies used in electronics industry
  • Pragmatic personality with a strong view for optimizing of product portfolio: stringent activity management and transparent monitoring processes
  • Courage for change and for challenging old procedures and standards
  • Ability and ambition to lead multi-site and multi-cultural teams
  • Good English skills: Chinese language skills helpful
Apply to this job now...


Application Engineer - AM
Application Engineer - AM
Location Conshohocken - Pennsylvania
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Heraeus Precious Metals North America Conshohocken, LLC, (HPMC) is searching for an experienced Applications Engineer to join the Heraeus Elecronics team.  The primary responsibility of this position is to act as the customer liaison for technical discussions regarding products, applications, and issues, servicing and qualifying both new product introductions and existing Heraeus Assembly Materials products.
Essential Duties and Responsibilities include the following (other duties may be assigned):

  • Provide technical support to domestic and international sales team for current Heraeus products
  • Analyze, identify, and resolve technical problems or complaints from customers in order to maintain and increase business
  • Plan and conduct laboratory processes supporting the modification of existing products for new applications
  • Lead cross-functional teams to address complex technical problems or customer complaints
  • Act as the technical “voice” of the customer internally - function as a resource to sales, marketing, research and development, engineering and production by providing detailed product information and advanced application knowledge
  • Promote new products and company to customers and industry
  • Create and provide updates to product data sheets and technical data packages
  • Author and/or present technical reports, technical papers, project updates, and technical overviews for internal presentation, journals, and conferences
  • Attend technical conferences, trade shows, and educational courses to remain current in the field as it relates to existing and future technologies
  • Demonstrate an advanced knowledge of the materials science used in the application of finished goods and the effect on performance
  • Identify new technology and applications and communicate to supervisor
  • Handle confidential information with care
  • Record precise results and findings in laboratory book, database and/or files
  • Maintains or supervises assigned laboratory areas and equipment
  • Follow safety guidelines for handling materials with the use of protective equipment as required
  • Travel in the field as necessary

Responsible for compliance with the Heraeus Code of Conduct, reporting the violations of the Code to the supervisor or the compliance officers


A minimum of a Bachelors Degree in Material or Ceramic Science and Engineering or related field and a minimum of 4 to 6 years of laboratory experience are required. Experience should be working with assembly materials products such as solder pastes, solder powders, sinter pastes, fluxes, SMT Adhesives, Conductive Adhesives, Non-conductive Adhesives, or related. The equivalent combination of education and experience will be considered.  Self-starter with an attention to detail required. Demonstrate a high level of professionalism; exhibit a high level of motivation and initiative.  Must be able to travel 30 - 50% in order to visit customers worldwide, present technical papers, and attend conferences.  Must have experience with the application of Six Sigma methodology such as Design of Experiment and statistical analysis.  Knowledge of processing and analytical test equipment is required. 

As provided by the Americans with Disabilities Act, the company is committed to discussing and providing reasonable accommodations to its employees to help them fulfill the essential functions of their jobs.

Our recruiting team will carefully review and consider each individual application. Qualified candidates will be contacted for further discussion. We thank you for your consideration and appreciate your interest in Heraeus.

For more information, please visit


Technical Sales Manager AM
Heraeus Precious Metals North America Conshohocken, LLC (HPMC) is searching for an experienced Technical Sales Manager to work within the Heraeus Electronics team.  The primary responsibility of this position is to oversee the business development of AM products and act as the Key Account Manager for the Americas. The primary responsibility is to conduct product planning and execution throughout the product lifecycle, including: gathering and prioritizing product and customer requirements, defining the product vision to ensure revenue and customer satisfaction goals are met.

Essential Duties and Responsibilities include the following (other duties may be assigned):

  • Work closely with the Director of Marketing and Sales – Americas to develop strategies to grow the AM product line in the Americas by providing market information to ensure a consistent revenue stream, sales forecasting, and balance of resources.
  • Analyze the Americas market for AM products.Decide where fully customized solutions are required, bring in R&AE and develop time-line for milestone achievements. Track R&AE solution development time-line, production processes and identify critical processes.
  • Seek new opportunities by building and maintaining client relationships, utilizing existing relationships, working with internal resources, and managing proposal responses for newly identified work. Evaluates deal value potential and probability to win based on technical understanding of customer need and benefit.
  • Engage in research and analysis and competitive intelligence-gathering for strategic planning, competitive firm positioning, and business development activities. Leverage industry knowledge to identify profitable new opportunities.
  • Direct the sales team in the implementation of strategies for the promotion of new and existing products and company to customers and industry. Organize and/or manage potential outside sales organizations.
  • Participate as a member of a team of sales people to increase revenue within the product line.
  • Coordinates with Application Engineering to interact with technical experts (e.g., R&D) of customer to establish technical characteristics of the problem/customer need and explain benefits of solution offering.
  • Work with AM Product Managers to support the Americas sales team with sales tools and information flow to and from the production sites.
  • Handle confidential information with care.
  • Communicates with customers face-to-face, by phone, and via email.
  • Travel domestically and internationally in the field as necessary.
  • Adherence to Code of Conduct as applicable to job function:  CoC Guideline No. 1:  Guideline for the Procurement of Products and Services, No. 2:  Guideline for the Prevention of Bribery in Commercial Transactions, No. 3:  Guideline for the Acceptance of Precious Metals and No. 4:  Guideline for the Prevention of Money Laundering and Participation in Criminal Acts.

A minimum of a Bachelors Degree in Material Science and Engineering or related field and 10 years of experience within circuits & components, chemical, electronic component or related field.  Experience with assembly materials such as Solder Pastes, Solder Wire, Solder Powders, Sinter Pastes, Fluxes, SMT Adhesives, Conductive Adhesives, Non-conductive Adhesives or related products is required.  A minimum of 5 years of experience in a technical sales role is required.  The equivalent combination of education and experience will be considered.  Self-starter with an attention to detail is required. Demonstrate a high level of professionalism, customer orientation and leadership ability; exhibit a high level of project management, negotiation, and presentation skills.  Must be able to travel up to 50% in order to visit customers worldwide, present technical papers, and attend conferences.  Must have previous experience dealing with global customers.

As provided by the Americans with Disabilities Act, the company is committed to discussing and providing reasonable accommodations to its employees to help them fulfill the essential functions of their jobs.

Apply to this job now...

Application Engineer (m/f)

Application Engineer (m/f)
Location Hanau
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Your role and responsibilities:
You will be responsible for the technical customer support at home and abroad of the Business Unit HET-Thick Film. Therefore, you will prepare test circuits by screen printing and also analyse chemical and physical properties of the test circuits. You will handle complaints for thick film materials as well as the presentation of lectures for your customers. Additionally, you will benchmark and challenge developed pastes to serve a continuous improvement.
What is required for this role:
You have successfully completed a university degree in the field of materials technology or similar. Ideally, you have gained some professional experience with customer contact for technical products. Knowledge of Six Sigma, DoE and Root Cause Analysis techniques is an advantage. Furthermore, you have good MS Office skills and a basic knowledge of SAP / R3. Of course you have excellent communication skills in English across all levels. If you possess a strong assertiveness and are a teamplayer, we are looking forward to your application.

What you can expect:
You can look forward to working for a highly advanced, innovative employer who will assign responsibility to you at an early stage and where you will be able to drive forward both our company and your career. For more information, please visit

Send us your documents by reference code 11585 via our online application portal. Any questions? If so, please contact our Recruiting Team, Heraeus Electronics, +49 6181/35-8877.

Apply to this job now...

Project Manager (m/f) Product Development
Project Manager (m/f) Product Development
Location Hanau
Full Time

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. We create high value solutions for our customers, strengthening their competitiveness for the long term. Our portfolio ranges from components to coordinated material systems, which are used in a wide variety of industries, including steel, electronics, chemical, automotive and telecommunications. In the 2014 financial year, Heraeus generated product revenues of €3.4 billion and precious-metal revenues of €12.2 billion. We offer our 12,600 employees the freedom to develop and promote their own ideas. Open Space. For Open Minds.®

Your role and responsibilities:
You will be responsible for the management of development projects as well as being technically involved (including hands-on) in them. Furthermore, you will coordinate with local and worldwide Sales and Innovation teams in order to justify, prioritize and plan the execution of R&D projects. You will report on project status and progress and evaluate new technologies and product ideas. In addition, you will advise the organization on appropriate R&D investments and therefore monitor costs and effectiveness of R&D activities in respective development projects to optimize resources, prioritise spending and maintain professional standards. Moreover, you will organise and participate in knowledge and expertise exchanges with the Global Heraeus R&D community. You will support sales in their technical contacts with potential customers and conduct your business in compliance with legal requirements.

What is required for this role:
You have successfully completed a university degree in Physics, Chemistry, Material Science, Electrical Engineering or equivalent. At least 3 years of professional experience in a relevant field and detailed knowledge in ISO 9001 and ISO/TS 16949 is considered a plus. Furthermore, you possess knowledge of Core Tools like APQP, MSA, FMEA, PPAP as well as of thick film technologies and processes. You have a basic knowledge of SAP and sound knowledge of MS Office applications. Of course you are enthusiastic, willing to learn and a good problem solver with experience of specific tools. You have excellent communication skills in German and English across all levels. Thus, you have the ability to clearly define and communicate project relevant information.
What you can expect:
You can look forward to working for a highly advanced, innovative employer who will assign responsibility to you at an early stage and where you will be able to drive forward both our company and your career. For more information, please visit

Send us your documents by reference code 9930 via our online application portal. Any questions? If so, please contact our Recruiting Team, Heraeus Electronics, +49 6181/35-8877.

Apply to this job now...


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:: Issue 185 ::
March 4, 2016


Gannon & Scott



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