Heraeus TFD

:: Corporate Member News ::

:: Master Bond’s Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties (full story)

:: Rudolph Technologies Appoints Debbora Ahlgren as Vice President of Global Customer Operations (full story)

:: Kester Launches SELECT-10™ Selective Solder Flux (full story)

:: News from Indium (full story)

:: Amkor Technology Presented at Goldman Sachs First Annual Leveraged Finance Conference (full story)

:: DYCONEX celebrates its 25th anniversary (full story)

:: Job Openings ::



Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Kyocera America



Specialty Coating Systems


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

:: Master Bond’s Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties

Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries.

Featuring an ultra low mixed viscosity of 80-140 cps, EP113 can be readily mixed using a 100 to 80 ratio by weight. It has a long working life of 2-3 days for a 100 gram batch. It should be noted that EP113 requires oven curing. Its low viscosity combined with its superb electrical insulation profile makes this product well suited for potting, encapsulating, coating and sealing. EP113 adheres well to many substrates including metals, composites, glass, ceramics and plastics.

As a toughened system, it has good resistance to rigorous thermal cycling and shock. EP113 offers a high strength profile with a tensile strength ranging from 12,000-13,000 psi and a compressive strength of 24,000-26,000 psi. This formulation is serviceable over the wide temperature range of -100°F to +450°F. Additionally, EP113 offers chemical resistance to water, oils, acids, bases and fuels.

EP113 is available for use in ½ pint, pint, quart, gallon and 5 gallon kits. It has a shelf life of 1 year at room temperature in its original, unopened containers.

Master Bond Dimensionally Stable Adhesives

EP113 is a low viscosity, optically clear, toughened system for potting and encapsulation applications. This nanosilica filled epoxy offers excellent toughness and dimensional stability.

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Rudolph Technologies Appoints Debbora Ahlgren as Vice President of Global Customer Operations

Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the appointment of Debbora Ahlgren as vice president of global customer operations, leading the company’s sales and service organization.

“Debbora’s extensive field operations experience for both large and small fast-growing companies brings a wide range of knowledge and resources to Rudolph,” said Mike Plisinski, Rudolph’s chief executive officer. “With more than 25 years of experience in the semiconductor and related electronics industries, she brings a comprehensive perspective to strengthen Rudolph’s value proposition of coupling equipment with software for a unique total solution for many processing challenges facing semiconductor manufacturers today.”

“I’m pleased to be joining Rudolph at a pivotal point in the company’s growth,” said Debbora Ahlgren, vice president, global customer operations at Rudolph. “With multiple exciting growth markets in our path, I am excited to lead Rudolph’s strong field operations teams to optimize our solutions to best serve our customers.”

Prior to joining Rudolph Technologies, Ahlgren served in a variety of executive roles, including vice president and general manager for field operations for Agilent Technologies, and vice president of sales and marketing for OptimalPlus. In these roles, Ahlgren was responsible for the sustained and profitable growth of the organizations through strong relationships with integrated device manufacturers (IDMs), outsourced assembly and test (OSAT) suppliers, foundries and fabless design firms. Her experience spans both capital equipment and enterprise software for the semiconductor industry.

Ahlgren’s expertise in capital equipment encompasses the semiconductor and printed circuit board industries. She has prior experience working directly for Agilent Technologies, Cascade Microtech, KLA-Tencor, Schlumberger and Verigy (now part of Advantest). As a consultant, she provided technical and strategic marketing guidance to Hewlett-Packard, Xerox Corporation and NEC Corporation of America.

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Kester Launches SELECT-10™ Selective Solder Flux

Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.

For additional information on this product including technical and safety data sheets, please visit:

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News from Indium

Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.

Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. He was recently the recipient of the top 10 innovative patents for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Indium Corporation’s Germanium Reclaim and Recycle Program Optimizes Process Efficiency
Indium Corporation's germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream.

Germanium, used in the production of fiber optic cables, optical lenses and wafers, and catalysts in polyethylene (plastic) production, is typically not completely consumed during the process. The remaining germanium can be reclaimed and recycled, enhancing process efficiency and providing a financial return.

Indium Corporation also offers reclaim and recycle programs for indium and indium alloys, solder pot dross and contaminated solder, and indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) from sputtering targets.

For information about Indium Corporation’s reclaim and recycling program, call 866-INDIUM1, email or visit For more information on Indium Corporation’s indium and indium alloy reclaim and recycle programs, visit


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Amkor Technology Presented at Goldman Sachs First Annual Leveraged Finance Conference

Amkor Technology, Inc. (Nasdaq: AMKR), a leading outsourced semiconductor packaging and test service provider, recently participated in the Goldman Sachs First Annual Leveraged Finance Conference on Tuesday, May 17, 2016. Amkor’s presentation occured at 4:25 pm Pacific Time (7:25 pm Eastern Time) at the Terranea Resort in Rancho Palos Verdes, CA. An audio-only webcast of the presentation will be made available, both live and by replay, on the Investor Relations section of Amkor’s website.

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DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company will celebrate its 25th anniversary in September 2016. Even so, the company can look back upon more than 50 years of experience in the fabrication of printed circuit boards. Back in 1964, a new division within Oerlikon-Contraves devoted to the manufacturing of circuit boards was established. Brought about by the transition from the electronic tube to the transistor, printed circuits became necessary, but only limited supplies were available on the market. This situation led to Contraves developing this technology on its own. At the end of the 1970s the division had already grown to more than 200 employees and was manufacturing at three Swiss locations in Seebach, Lenzburg and Gams.

“It was an exciting and fascinating time,” reports Dr. Walter Schmidt, who joined Contraves in 1979. “There was only a scarce supply of manufacturing machinery and materials, so we had to find solutions on our own.”

In 1991, at the end of the Cold War, Contraves decided to concentrate on its core businesses, which led to a management buyout. Together with a small team, Dr. Walter Schmidt founded DYCONEX in Seebach and served as its CEO until 1999.

From the very beginning, DYCONEX has focussed on technologies that enabled the miniaturization of end-user applications. For instance, the DYCOstrate® process was developed and introduced to the public in 1992 – at that time a revolutionary technology for printed circuit board fabrication. The process is based on plasma etching and enables the fabrication of thousands of microvias simultaneously. This technology opened the door for entering into new markets such as for hearing aids.

As a result of this boom it was necessary to look for new manufacturing facilities, and this led to a move from Seebach to Bassersdorf in 2001/2002. In July 2002, the new fabrication facility running two shifts and with a significantly higher level of automation started operation at the current site in Bassersdorf.

The 21st century, with the new challenges it brings to this industry segment, has also led DYCONEX to make some strategic realignments. In 2008 the decision was made to become part of the Micro Systems Technologies (MST) Group – part of a unit that makes it possible for the company to position itself as a strong global player.

Skilled employees, continuous technological developments and investments in the latest fabrication processes make DYCONEX the leading manufacturer of highly complex circuit boards which are used in a variety of industries. Among them are applications in medical technology, telecommunications, industrial electronics plus aeronautics and aerospace.

“Our goal is to remain the world's leading supplier of complex, miniaturized solutions with extreme reliability in interconnect technology and further expand our position over the next 25 years," emphasizes Dr. Hubert Zimmermann, CEO of DYCONEX AG. “First, though, we look forward to celebrate these first 25 years with all our employees this coming September.”

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:: Job Openings ::



Corporate Members - Don't Forget you can post your job openings in this bulletin distributed to 20,000 global emails as well as our **ALL NEW** online JOBS Board ( ) at no cost - part of corporate membership!


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:: Issue 188 ::
May 19, 2016


Gannon & Scott



Oneida Research Services