NEWS | FAST LINKS

Materion

:: Corporate Member News ::

:: Palomar News (full story)

:: Indium Corporation’s Lasky Outlines History, Applications, and Future of Indium (full story)

:: News from Master Bond (full story)

:: SHENMAO America, Inc. Exhibits November 14 at MEPTEC Semiconductor Packaging Roadmap Symposium Introduces Semiconductor Packaging Materials (full story)

:: Kester Launches New Website (full story)

:: Introducing MATERION COVERexpress (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Kester

Palomar

Materion

Master Bond

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Palomar News

Improving Software and User Interfaces
The advancements in user interfaces of devices from cell phones to automobiles seem to increase in terms of capabilities on a daily basis. The advancements of the user interfaces of the bonders at Palomar Technologies have been so great that someone who was using a Palomar system several years ago may not recognize many of the new features on a present day system.  Palomar strives to pave the way for new software releases that are easy to implement and to incorporate existing programs. Read the full blog: http://www.palomartechnologies.com/blog/improving-software-and-user-interfaces

Wire Threading and Wedge Tool Change on a Wedge Bonder
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. Read the full blog: http://www.palomartechnologies.com/blog/wire-threading-and-wedge-tool-change-on-wedge-bonder.

Palomar

Benefits and Challenges of Eutectic vs. Epoxy for Die Attach
The differences between eutectic and epoxy die attach are many. There are some obvious trade-offs and benefits to both, most of which pertain to performance requirements. One example is the challenge of managing heat transfer of the die or outgassing of epoxies. Some of the benefits are easily deduced, but others can be a bit more vague. Read the full blog: http://www.palomartechnologies.com/blog/benefits-and-challenges-of-eutectic-vs-epoxy-for-die-attach.

Palomar

In Need of Prototyping, Process Development, or Contract Manufacturing Assistance?
Although the Palomar Technologies Assembly Services™ group has been around for more than 8 years we often get asked if we know somebody that can do prototyping, process development, or low- to mid-volume contract manufacturing for their particular project.

Assembly Services exists to address those particular needs. We do prototyping for several companies every year, from small startups to major industrial and military entities. We also do process development for these same types of clients that are either currently using Palomar Technologies equipment that is busy building production products, or are just not able to dial-in their processes. Read the full blog: http://www.palomartechnologies.com/blog/in-need-of-prototyping-process-development-or-contract-manufacturing-assistance.

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

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:: Indium Corporation’s Lasky Outlines History, Applications, and Future of Indium

Indium Corporation's Dr. Ron Lasky, Senior Technologist, delivers an informative overview of the history of, and insight into the future use of, indium metal in a video available at www.indium.com/blog/phil-zarrow.

As part of the Electronics Assembly with Phil Zarrow series, this video features Lasky and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing historical and unique indium and indium alloy applications. 
“Indium Corporation was the first company to find a practical use for indium in the 1930s, and that was for bearing lubricants in aircraft. It was used in solders and fusible alloys,” Lasky explains. “Today, one of the more interesting applications is that indium can be used as a superconductor, and it has a high nuclear cross-section for neutrons, so it's often used in nuclear control rods.”

Indium

For more information on indium, high-purity indium, and indium alloys, visit www.indium.com/metals/indium.

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.

Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology, and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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:: News from Master Bond

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications

Master Bond

Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries.

Featuring a low volume resistivity of 0.004 ohm-cm, MasterSil 973S-LO is a silver filled compound that has a thermal conductivity of 9-11 BTU•in/ft²•hr•°F [1.30-1.59 W/(m•K)]. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of plastics. As is typical for most silicones, MasterSil 973S-LO is highly flexible and has an elongation of 50-100%. This enables it to withstand thermal cycling and mechanical shock. Serviceability for this product is from -120°F to +400°F [-84°C to +204°C].

MasterSil 973S-LO features a paste consistency with minimal flow, which allows it to be used as a formed-in-place conductive gasketing material. As an addition cured silicone, MasterSil 973S-LO does not require air for cross-linking. Unlike many silicones, it can cure wide cross sections and in depths beyond 1 inch. This formulation offers a variety of cure schedules at elevated temperatures, including 25-45 minutes at 250-300°F or 1-2 hours at 160-200°F.

MasterSil 973S-LO is available for purchase in 50 gram syringe kits. Additional sizes can be obtained upon request. It has a shelf life of 6 months at 75°F in its original, unopened containers.

Master Bond Addition Cured Silicone
MasterSil 973S-LO is an electrically and thermally conductive silicone that meets NASA low outgassing specifications. This two component compound is highly flexible and withstands temperatures up to +400°F. Read more about Master Bond’s addition cured silicones at http://www.masterbond.com/products/two-part-silicone-adhesives-sealants-and-coatings or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

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:: SHENMAO America, Inc. Exhibits November 14, 2016 at MEPTEC Semiconductor Packaging Roadmap Symposium Introduces Semiconductor Packaging Materials

SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

SHENMAO America, Inc. blends Solder Paste in San Jose, CA with Tin smelted from Tin Ore concentrate creating ultrapure virgin powder made at its Facility in Taiwan for distribution in North America and 9 other locations world wide.

For more information, please contact:

SHENMAO America, Inc.  
www.shenmao.com
  
Tel: +1-408-943-1755   
e-mail: usa@shenmao.com

Registration to Symposium and FREE Expo:
http://www.meptec.org/roadmaps/2016semiconduct3.html

 

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:: Kester Launches New Website

Kester is proud to announce the launch of our new website. Please visit our upgraded website, which provides a responsive and overall more user friendly expeirnece for all visitors, at www.kester.com.

For more information contact Michelle O’Brien at mobrien@kester.com

Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.

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:: Introducing MATERION COVERexpress

Packaging Material Delivered in Half the Time

Materion’s Advanced Materials business segment announced today a new service that will halve the existing scheduled delivery time for microelectronic packaging products ordered in smaller quantities. Faster receipt will enable customers to accelerate R&D projects and decrease their time to market.

Through Materion’s COVERexpress service, delivery of Combo-LidsTM and solder preforms can be expedited without compromising product quality. Rather, the time savings is achieved through employing a proprietary process that can swiftly create complex designs or micro-sized products without the lengthier time required to fabricate hard tools. This method reduces manufacturing time, resulting in shortened delivery time. For those customers engaged in product feasibility studies and rapid prototyping, faster delivery of materials will allow work to begin sooner.

“For our customers with critical time restraints or requiring smaller production volumes, the ability to halve delivery time provides a huge advantage,” commented Donald Klimkowicz, President, Materion Advanced Materials. “COVERexpress is just one more way that Materion anticipates and meets our customers’ packaging needs.” 

New Product Development
In addition to the new COVERexpress service, Materion research facilities offer new product development support encompassing a variety of competencies in R&D. Its technical experts assist with prototypes for bench-to-full scale production of custom products. Application engineers are also available for trouble-shooting or to accelerate product development.

Lids for Every Application
For microelectronic packaging needs, Materion is the industry’s cover lid innovator. Its broad product line is tooled for over 8,000 preform shapes with the capability to customize and manufacture Combo-LidTM designs to unique requirements. Combo-LidsTM are available with either metal or ceramic lids, and with the option of non-magnetic construction.

For more information contact: susan.doughtie@materion.com.

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:: Issue 196 ::
November 10, 2016

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services