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:: Corporate Member News ::

:: Finetech’s Sigma Die Bonder Available for Demonstration (full story)

:: Indium Corporation Technology Expert to Present at IMAPS ATW on Advances in Semiconductor Packaging (full story)

:: Advance Reproductions Corporation Expands Its Photomasking Capabilities With The Installation of Mycronic AB’s FPS5500 Next Generation Mask Writer (full story)

:: Yole Report on Fan-Out: Technologies & Market Trends 2016 (full story)

:: News from PALOMAR: Gold Ball Bumping Factors and Benefits & High-Precision Eutectic Die Attach Process (full story)

:: UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators to Improve Data Center Energy Efficiency (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Finetech

MRSI

UTAC Group

NGK NTK

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Finetech’s Sigma Die Bonder Available for Demonstration

The semi-automated, high-accuracy Sigma bonder is now in Finetech’s Manchester, New Hampshire lab and available for customer specific demonstrations.
The Sigma features:

  • Sub-micron placement accuracy
  • Handles substrates 450 x 300 mm 
  • Bonding forces up to 1000 N
  • FPXvisionTM - high resolution for all magnifications
  • Die size up to 100x100mm
  • Software guided alignment verification
  • Touch screen GUI
  • Vacuum bonding option
  • Modular design for rapid process development

For scheduling, contact the New Hampshire facility:  603-627-8989

And check out the Sigma video showing sensor assembly

Finetech

 

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:: Indium Corporation Technology Expert to Present at IMAPS ATW on Advances in Semiconductor Packaging

Indium Corporation’s Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.

Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices. Her presentation will cover ultra-fine pitch solder paste printing to meet the needs of system-in-package (SiP) mobile devices, with a focus on attachment of 01005 and 008004 passive devices.


Additionally, Derrick Herron, Technical Support Engineer, will serve as chair for the Test/Reliability/Modeling session.

Indium
Durham serves as technical liaison between Indium Corporation’s customers and internal departments, such as sales, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor’s degree in physics and applied mathematics from Clarkson University, Potsdam, N.Y.

Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years developing solder paste and flux technologies in Indium Corporation’s research and development laboratory. Herron earned his bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Okla. He received his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is certified in IPC-A-600 and IPC-A-610-D.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Advance Reproductions Corporation Expands Its Photomasking Capabilities With The Installation of Mycronic AB’s FPS5500 Next Generation Mask Writer

Advance Reproductions Corporation, a worldwide manufacturer of large-area and optical photomasks and phototools, is pleased to announce the installation of its next-generation laser writer for photomask manufacturing. The Mycronic FPS5500 is the latest technology offering from Mycronic AB, Täby, Sweden. Installation was completed in July 2016 and is currently in production for photomask manufacturing.

The FPS5500 is a multi-beam laser system capable of generating photomasks up to 1.1 meters in size with geometries as small as .75µm. With multiple resolution levels available, the FPS5500 offers high throughput and accuracy for all of your critical photomask applications.

According to Michael DeBruyckere, President of Advance, “The FPS5500 puts Advance in the forefront of photomask manufacturing technology. Bringing together the FPS’s versatility and Advance’s technical resources, combined with our outstanding customer service organization, Advance is well positioned to meet the most challenging applications customers can offer.”

The FPS5500 mask writer is based on technology from Mycronic’s market-leading LCD mask writers and provides a unique combination of extreme productivity, outstanding image quality and stable operation. Designed for maximum flexibility, the FPS5500 can produce photomasks for a large variety of applications such as light emitting diodes, touch panels and advanced packaging.

ABOUT ADVANCE REPRODUCTIONS CORPORATION
Advance Reproductions Corporation, an ISO 9001 and ITAR registered company, is a leading supplier of high-quality, large-area and optical photomasks and phototools. Incorporated since 1968, Advance supports companies throughout the world involved in the manufacture of semiconductor, hybrid, microwave, nanotechnology, display and electronic packaging devices. In addition, Advance takes pride in supporting the high precision photomask requirements of colleges and universities both nationally and internationally. We offer a variety of custom manufacturing services for research and development applications, custom shaped substrates, vacuum deposition, engineered tooling and custom finishing. Advance Reproductions has direct sales representatives nationwide, and a dedicated support staff to assist with technical questions, job status updates, and pricing information.

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:: Yole Report on Fan-Out: Technologies & Market Trends 2016

2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of Fan-Out packages.

Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new report entitled Fan-Out: Technologies & Market Trends 2016.

Yole

TSMC investment in FO WLP and development of InFO changed the WLP landscape. Following high volume adoption of InFO and further development of eWLB technology, a wave of new players and FO WLP technologies may enter the market. TSMC’s FO WLP solution called InFO will be used to package the Apple A10 application processor, implemented in the new iPhone 7 series… The success of FO packaging platforms is so undeniable today. What will be the status of the market tomorrow? What are the next steps of the leading FO players? Which technology will be the winning solutions? Yole’s analysts tell you today the story.

“Production starts in 2016 and represents a big change in the Fan-Out industry for several reasons”, confirms Jérôme Azémar, Market & Technology Analyst, Advanced Packaging & Manufacturing at Yole... And he explains: first of all, in terms of volume, capturing the Apple processor market is a big asset for Fan-Out technology. iPhone 7 phones are expected to be sold in more than 200 million units...

 
Yole

According to Yole’s advanced packaging & semiconductor manufacturing team, the market will actually be split in two types: the "core" FO market and the  “high-density” FO market...

More information about Yole Développement’s activities, click Yole

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:: News from PALOMAR: Gold Ball Bumping Factors and Benefits & High-Precision Eutectic Die Attach Process

Gold Ball Bumping Factors and Benefits
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated circuit (IC) and substrate. With the ball connected, the wire is fed out and attached to a second surface, and then torn off to complete the connection. Read the full blog:
http://www.palomartechnologies.com/blog/gold-ball-bumping-factors-and-benefits

Palomar

High-Precision Eutectic Die Attach Process
Hybrid components and high-power communication devices are classified as high-performance and high-capacity die attach applications. These types of applications are well suited for automated eutectic process techniques. Eutectic die attach is a highly controlled die attach process. To achieve high yield, sophisticated heating and cooling mechanisms are employed. This includes software that heats and cools according to a very strict parameter line. Read the full blog: http://www.palomartechnologies.com/blog/high-precision-eutectic-die-attach-process.

Palomar


 
Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

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:: UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators to Improve Data Center Energy Efficiency

Sarda’s Heterogeneous Integrated Power Stage (HIPS) Employs UTAC’s 3D SiP using the Embedded Component Packaging (ECPâ) Technology from AT&S for Granular Power Delivery

Sarda Technologies (Sarda), a disruptive power management component supplier and UTAC Holdings Ltd (UTAC), one of the leading semiconductor assembly and test services providers in Asia, today announced that Sarda will implement its Heterogeneous Integrated Power Stage (HIPS) in UTAC’s three-dimensional system-in-package (“3D SiP”) based on ECP technology from AT&S to improve data center's energy efficiency.

Designed to address the rapidly escalating power consumption in data centers, Sarda’s HIPS replaces silicon switches with gallium arsenide (GaAs) in voltage regulators that increase switching frequency by 10 times, improve transient response by 5 times and reduce size by 80%.  With these fast, small voltage regulators, it enables granular power delivery to reduce data center power consumption by 30%.

The collaboration was announced at the International Symposium on 3D Power Electronics, Integration and Manufacturing Symposium (www.3D-PEIM.org) in Raleigh, North Carolina, USA. 

“UTAC’s 3D SiP enables Sarda to integrate GaAs switches, silicon driver and passive components in a compact, low-profile package that minimizes parasitics for efficient, high speed operation,” said Bob Conner, CEO and co-founder of Sarda. UTAC’s collaboration with AT&S also provides a full turnkey supply chain assembly and test flow withmuch needed alignment of roadmaps as well as design rules for 3D SiP solutions with embedded chip in substrate technology.”

System manufacturers are moving from use of discrete components to highly integrated power management solutions to improve power density and energy efficiency.  UTAC is very excited in working closely with Sarda and AT&S to demonstrate the benefits of using 3D SiP to reduce footprint and improve electrical and thermal performance,” said Lee Smith, UTAC Vice President of Advanced Package Product Line.

“Our collaboration with UTAC maximizes the benefits of utilizing AT&S’ ECP technology for the Sarda HIPS Solution”, stated Michael Lang, CEO of Advanced Packaging at AT&S.The major ECP advantages compared to standard IC packaging and PCB assembly include a significant form factor reduction, higher reliability, improved thermal management and a fast and easy system integration with high efficiency.”

Reducing Data Center Cost-Per-Workload

Servers, routers and communications systems require new power management technology to keep up with the growth in data consumption and mobile connectivity. But power delivery and heat removal issues constrain system performance. Moreover, each system board uses dozens of voltage regulators which consume precious board space.

Designers can no longer rely solely on Moore’s Law to deliver the needed gains in energy efficiency.  Leading edge processors now operate at less than one volt, which prevents designers from reducing operating voltage enough to keep power consumption constant while increasing transistor density. Instead, developers are turning to “More-than-Moore Scaling,” which heterogeneously integrates different materials and components to improve system performance-per-watt.

Small, fast voltage regulators enable granular power which reduces system power consumption through dynamic power management of each load. Miniaturizing the voltage regulators also frees up board space for more processors and memory to increase system performance. Increasing system performance-per-watt decreases the system cost-per-workload.

 

About the International Symposium on 3D Power Electronics Integration and Manufacturing

The first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org), held June 13-15, 2016, in Raleigh, North Carolina, brings together designers and manufacturers to address the future of integrated power electronics and advance the 3D power electronics systems designs of the future.

The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by the International Microelectronics Assembly and Packaging Society (IMAPS); the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); North Carolina State University; the University of Maryland; and Virginia Tech.

 

About Sarda Technologies

Sarda Technologies provides disruptive power management components to reduce data center cost-per-workload by reducing power consumption through granular power delivery. The venture-backed company is located in Durham, NC. Please visit www.sardatech.com for more information or contact:

Bob Conner                                                              
CEO and Co-Founer                                                                            
+1 919 757-6825
bconner@sardatech.com

Quint PR
Media Contact:
Matthew Quint
+1 650 218-0763
mquint@quintpr.com

 

About UTAC Holdings Ltd

UTAC Holdings Ltd (UTAC) is a leading independent provider of assembly and test services for a broad range of semiconductor chips and we offer a full range of semiconductor assembly and test services in the following key product categories: analog, mixed-signal and logic, and memory. Our customers are primarily fabless companies, integrated device manufacturers and wafer foundries. UTAC is headquartered in Singapore, with production facilities located in Singapore, Thailand, Taiwan, China, Indonesia and Malaysia, in addition to its global sales network focused on five regions: United States, Japan, China and Taiwan, rest of Asia and Europe, with sales offices located in each of these regions.

For more information, please visit http://www.utacgroup.com or contact:

Roger NG
Director, Investor Relations and Communications
DID: +65 6714 2245; Mobile: +65 9005 0132
 roger_ng@utacgroup.com

Sherena LIEW
Manager, Communications
DID: +65 6714 2280; Mobile: +65 9742 1436
sherena_liewls@utacgroup.com

 

About AT & S Austria Technologie & Systemtechnik AG - First choice for advanced applications

AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. In 2016, AT&S produces two new, leading-edge technologies at the new site in Chongqing (China) – IC substrates and substrate-like printed circuit boards for high-end applications. As an international growth enterprise, AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of 8,759 people as in the financial year 2015/16.

For more information, please visit www.ats.net or contact:

Marina Konrad
Head of Corporate Communications
Tel: +43 3842 200 5423; Mobile: +43 676 8955 5423
m.konrad@ats.net

Elke Koch
Director Investor Relations & Communications
Tel: +43 3842 200 5925; Mobile +43 676 8955 5925
e.koch@ats.net

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:: Issue 193 ::
September 2, 2016

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services