NEWS | JOBS | FAST LINKS

Heraeus TFD

THANK YOU TO THE IMAPS 2016 PASADENA
SPONSORS & EXHIBITORS!

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - Metalor
Premier Tech Sponsor - Indium Corp.
Premier Tech Sponsor - NGK NTK

 

:: Corporate Member News ::

:: Thank you to all the IMAPS 2016 Exhibiting Companies - View the List & Plan Your Visit! (full story)

:: View the Full Exhibit Directory to Learn more about the IMAPS 2016 (full story)

:: View the Pasadena Floorplan - A Few Spots Still available! (full story)

:: Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets - See you in Pasadena at Booth 610! (full story)

:: Palomar News - On Disply & Sponsoring IMAPS 2016 (full story)

:: Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing - Visit Us at IMAPS Pasadena (full story)

:: DfR Solutions Announcing Sherlock 5.0 - Learn More at Booth 732 (full story)

:: Make an Appointment to Visit Micro Systems Technologies Group (MST) at IMAPS Symposium on Microelectronics (full story)

:: Zeta is attending IMAPS 2016 (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - Metalor
Premier Tech Sponsor - Indium Corp.
Premier Tech Sponsor - NGK NTK
Event Sponsors:
Dessert "Happy Hour" Sponsor:

Palomar Technologies: Dessert "Happy Hour" Sponsor
Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor
Keynote Sponsor:

Applied Materials - Keynote Sponsor

Lunch Sponsor:
EMD Performance Materials - Corporate Sponsor

Student Programs Sponsor:
Honeywell - Student Programs Sponsor

Coffee Break Sponsor:

Fujifilm Dimatix - Coffee Break Sponsor

Coffee Break Sponsor:
MRSI - Break Sponsor

Coffee Break Sponsor:
Shenmao - Event Sponsor

Golf Sponsors
EMD Performance Materials - Corporate Sponsor
Technic - Golf Hole Sponsor
golf holes still available
 
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Chip Scale Review
     

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets - See you in Pasadena at Booth 610!

Innovations in Socketry…

See you in Pasadena at Booth 610!

azimuth

Supporting the Electronics Industry in:

Medical
Telecommunications
Automotive
Space and Defense

We offer the latest in Test and Burn-In Sockets for:

QFP, CQFP, MCM, SOIC, Laser Diode, LCC, LGA, BGA, QFN, MLF, MEM, 3D Memory Stack, Medical Substrates, HF Device, PGA, Substrate Modules and Custom Integrated Circuits

Azimuth
Azimuth Electronics, Inc., a US manufacturer of Test and Burn-In Sockets, has been providing innovative interconnect solutions for over 50 years. Our broad experience allows us to tackle the challenges of a constantly evolving industry. Azimuth offers complete in-house services facilitating cost-effective solutions from engineering and design, machine shop prototyping, tooling fabrication, and production injection molding. Our company provides state of the art concepts in Socketry with a commitment to excellence and service.
Azimuth

 

www.azimuth-electronics.com

 

 

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:: Palomar News - On Disply & Sponsoring IMAPS 2016

Recent PTI News

A Unified Solution for Microelectronics Packaging
With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment design, manufacturing, and production. In the late 1990s, they began to collaborate, developing motorized die eject stages and eject heads for Palomar bonding systems based on Royce’s die eject technology. By 2009, Palomar and Royce had become OEM partners, offering customers a unified solution to their advanced packaging needs. Read the full blog: http://www.palomartechnologies.com/blog/a-unified-solution-for-microelectronics-packaging

Palomar


Geometric Pattern Matching Technology for Die and Wire Bond
Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a tedious and time consuming process. Increasing efficiency and reducing costs are major goals for any organization. VisionPilot® utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Read the full blog: http://www.palomartechnologies.com/blog/geometric-pattern-matching-technology-die-wire-bond.
 

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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:: Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing - Visit Us at IMAPS Pasadena

Rudolph

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes

Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ system for high-resolution inspection in front- and back-end applications, and the Dragonfly™ system for high-speed two-dimensional (2D) inspection in advanced packaging processes. Both systems leverage newly designed optical and imaging systems optimized for defect type, size, and maximum throughput.
 
The new Firefly inspection and metrology system has been designed to detect defects smaller than one micron in multiple applications, including: fan-out wafer level packaging (FOWLP), CMOS image sensors, microelectromechanical systems (MEMS) and radio frequency (RF) sensors. Device manufacturers are facing challenges such as detecting faint residue on CMOS imagers, and residue on bump top and bond-pads that lead to field failures, but are almost impossible to detect using current inspection technologies. The Firefly system, configurable for either wafer (round) or panel (rectangular) substrates, includes Rudolph’s recently-introduced Clearfind™ Technology, one of the multiple imaging modes designed to address these challenges.

Clearfind Technology is a patented technique for enhancing the detection of defects by fluorescing organic materials that often escape conventional illumination techniques and are a source of yield-robbing interconnect failures. The Firefly system’s unique combination of defect sensitivity and substrate flexibility, in a single platform, reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes. The system will begin shipping in September to key customers in Asia.

The new Dragonfly inspection and metrology system targets large die, multi-chip advanced packaging applications, with 2D inspection sensitivity down to two microns, a modular approach to integrated metrology and defect analysis software. This unique combination of technology allows the system to quickly detect, image, and analyze defects on a broad range of devices and packages. The Dragonfly system will deliver critical in-process inspection and metrology for wafer reconstitution, after develop, after etch and at each level of redistribution. Integration with Rudolph’s Discover® yield management system and automated defect classification quickly turns defect data into actionable process control, improves classification and reduces manual review.  The system’s new time delay and integration (TDI) based inspection capability has already been qualified for production by a major foundry in Asia. The Dragonfly 2D systems are targeted for shipment in the fourth quarter of this year.

“The Dragonfly system complements Rudolph’s flagship NSX® 330 inspection system by extending defect sensitivity and resolution for advanced applications on a platform optimized for cost of ownership,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Flexibility and upgradeability are at the core of the Dragonfly system design, allowing Rudolph to respond rapidly to the next-generation 3D and metrology needs of our development partners.”

“Automotive, mobility and the Internet of Things (IoT) markets are fueling demand for low-cost, high-performance devices packaged in complex multichip modules. This dynamic has driven creative packaging approaches that mix and match various technologies and require advanced inspection and metrology for shrinking redistribution lines (RDL) and other interconnect features, as well as inspection for smaller defects and organic contaminants. The Firefly and Dragonfly systems offer our customers the most comprehensive and flexible inspection platforms available on the market today and reflect an emphasis on increasing our R&D cadence, while maintaining high standards of quality and usability,” said Mike Plisinski, chief executive officer, Rudolph Technologies.

Rudolph

 

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:: DfR Solutions Announcing Sherlock 5.0 - Learn More at Booth 732

DfR

Announcing Sherlock 5.0
With Advanced PCB Modeling Regions for More Detailed FEA Analysis

DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced a major release of Sherlock Automated Design Analysis™ software, Version 5.0.  Advanced features include Modeling Regions, Attached Heat Sinks, NX Nastran support, and an IMEC Plated Through-Hole Fatigue Model.

This latest release of Sherlock provides new and advanced tools that enable manufacturers to create more sophisticated, real-world simulations, quickly and accurately. In addition to the new features, Sherlock includes upgrades and improvements to more than 10 existing features. Combined, the entire suite of Sherlock capabilities empowers companies to design better products faster and more efficiently.

About the Advanced Features:

Modeling Regions
Sherlock 5.0 includes added support for user-defined PCB modeling regions for FEA analysis or model export.  Areas of particular interest can be viewed with greater detail, while other areas of the design remain less detailed, saving on computational resources.  This new feature enables users to specify different meshing properties for different PCB areas, increasing model accuracy in certain areas without significantly increasing the overall FEA model complexity. This approach is useful when users want to create custom meshes for key areas of the PCB, but want the convenience of using mesh elements generated by Sherlock for everything else. Modeling regions can also be used to export only a subset of the PCB or to exclude one or more regions from the PCB model. This allows users to more easily integrate the models generated by Sherlock into larger custom created models.

Attached Heat Sinks
Sherlock has the capability to model various types of heat sinks in addition to the PCB, components, and mount points for Finite Element Analysis (FEA) purposes. In this new feature we’ve added the ability to create attachment points for heat sinks from mount points and modified the Heat Sink Editor to allow properties for multiple heat sinks to be modified at the same time. This new feature now allows for fast and easy staking on more complex boards with greater accuracy. 

NX Nastran Support
In addition to its Abaqus FEA engine integration, Sherlock 5.0 now includes support for the NX Nastran FEA engine, of particular value to the Aerospace industry.  Now Sherlock users can perform FEA analysis tasks using the NX Nastran engine and export mesh models to that engine using the NX Nastran Bulk Data File (BDF) format. This important addition enables aerospace engineers to reap the benefits of incorporating Sherlock analyses into their designs, significantly improving overall reliability.

Printed Through-Hole Analysis IMEC Model
Complementing the IPC-TR-579 model, Sherlock version 5.0 now incorporates the IMEC Plated Through-hole Fatigue model.  This model can be used to predict failures of layered vias, eliminating the possibility of false positive results. 
 “Sherlock version 5.0 is yet another step toward creating model simulations that match the real world conditions and provide highly relevant, actionable information,” stated DfR Solutions CEO Craig Hillman.  “Without requiring a huge staff of experts, spending hours and hours creating these complex models, manufacturers are now able to quickly and accurately predict and mitigate product failure. This significantly decreases product development time and increases productivity and profitability,” said Hillman.

About Sherlock Automated Design Analysis™ Software
Sherlock is the first-of-its-kind Automated Design Analysis software for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. Based on the science of Physics or Failure, it is used by the electronics industry across all markets. Sherlock continues to evolve, incorporating new innovations and enhancements allowing users to manage increasingly complex analyses faster and more efficiently than ever before. For more information about Sherlock version 5.0, please stop by booth #732 at the upcoming IMAPS meeting in Pasadena California.

About DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit www.dfrsolutions.com.

DfR

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:: Make an Appointment to Visit Micro Systems Technologies Group (MST) at IMAPS Symposium on Microelectronics

Micro Systems Technologies Group (MST) is pleased to invite you to upcoming exhibition at IMAPS Symposium on Microelectronics.

Please visit us at Booth 123 and learn more about the comprehensive solutions of the MST companies.

Our exhibition team looks forward to meeting you. For an appointment on site, kindly contact us at: info@mst.com

Micro Systems Technologies, Inc.
Booth # 123
(W) www.mst.com

The Micro Systems Technologies group comprises four technology companies providing innovative products and services for high-reliability/high-performance industries, like medical technology, aerospace & defense, telecommunication and various industrial segmants. The offering includes HDI/microvia PCBs, LCP substrates, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging technologies, as well as batteries for active implants.

 

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:: Zeta is attending IMAPS 2016

Zeta

Zeta Instruments is excited to be participating as an exhibitor this year at IMAPS 2016. Each year IMAPS offers us the unique opportunity to connect with our customers and discuss the newest technologies in the industry. Come visit us to learn more about our recent advances in metrology solution for FOWLP and WLCSP applications. Zeta now has automated solutions for wafers as well as flat panel substrates. We look forward to discussing your UBM, Copper Pillar, RDL, Copper Plating and other metrology requirements.

Zeta

To register for a complimentary pass to the show, click here. Zeta will be at Booth #411 October 11th, 11am-5pm and October 12th, 11am-6pm and are available for meetings. Click here to schedule a meeting* or call us at (855) 405-8008

About Zeta
Zeta Instruments designs, manufactures, sells and services Multi-Mode optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage. Zeta has delivered consistent growth and has installed over 200 systems in 20 countries. Its locations include headquarters in San Jose, CA, a regional office in Shanghai, China, and sales and service representatives worldwide.

 

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:: Issue 194 ::
September 21, 2016

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services