Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Materion

:: Torrey Hills Technologies Launches Maintenance and Repair Service Business for Exakt Thick Film Paste Three Roll Mills (full story)

:: GPD Global offers industry largest standard PCB dispensing system platform (full story)

:: TechSearch International Analyzes High-Performance Packaging Trends (full story)

:: Recent PTI News (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Torrey Hills Technologies Launches Maintenance and Repair Service Business for Exakt Thick Film Paste Three Roll Mills

Three Roll Mill manufacturer Torrey Hills Technologies, LLC (THT) announces plans to provide diagnostic services and repair capabilities for thick film paste mills produced by Exakt Technologies, especially the Exakt 50 and 80 models. With an unwavering focus on helping end-users achieve every possible success, THT has become an award-winning manufacturer and kept a solid record of putting the customer first. Their range of expertise also allows for well-rounded support for customers who use mills produced by rival companies.

The source of user frustration can be traced to rollers that need an adjustment, or gears and bearings that should be replaced. Whether the problem involves leakage, material splash, loud noises, uneven dispersion, short throughput, or something else entirely, the qualified THT team of experienced engineers will accurately diagnose the issue and perform a professional repair. Determined to provide high quality and efficient service, THT will stock a large inventory of original OEM and aftermarket spare parts to minimize any production downtime.

For a limited time, roller adjustment service for Exakt 50 and 80 models is offered free of charge.

"We understand that uninterrupted production is a top priority for all industries," said Ken Kuang, president of THT. "We are equipped with the right knowledge and expertise to quickly resolve and repair problems that customers may experience with Exakt machines."

Torrey Hills Technologies, LLC (http://www.threerollmill.com) develops and delivers quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to mixing equipment and furnace equipment manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.

 

 

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:: GPD Global Offers Largest Dispensing Platform in the Industry

GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production, offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

Inline and Stand-Alone Large Dispensing Platforms
The inline and stand-alone DS Series System for large PCB or Pallets dispensing delivers uncompromising quality and versatility for demanding liquid dispensing applications. With a standard, large work area up to 24" x 24" (610 mm x 610 mm) and an optional increment feature to handle boards 36" (914 mm) and larger, the platform is excellent for larger format projects. DS Series handles up to three dispense pumps for application flexibility including two part mixing and dispense applications such as adhesives, solder paste, underfills, conductive adhesive, potting compounds, and more.



DS Series system construction is based on a welded steel frame carefully manufactured for high accuracy manufacturing. During assembly, the system is subjected to a number of alignments and set ups processes to ensure the highest level of precision. After manufacturing, systems undergo a contour mapping process for proof of accuracy.

Heated Applications & Large PCB or Pallets on Large Dispensing Platform
For applications requiring heat, the work table may be heated to 200° C (392° F). All three zones of a conveyor may be heated via convection or conduction. Pumps may also be configured with heat for fluids that perform better in an elevated temperature environment. Convection heating is very versatile and not subject to bottom-side board geometry.

For more information, contact us at request@gpd-global.com or call +1.970.245.0408 to learn about our Large Format Liquid Dispensing System for PCB and pallet dispensing.

GPD Global is an equipment manufacturer of high-quality, precision, automated fluid dispensing, conformal coating, and component-prep machines and systems. The company is an international, state-of-the-art equipment supplier for the PCB assembly and semiconductor industries. We design and manufacture a wide variety of Automatic Fluid Dispensing Systems and Conformal Coating Systems. We also manufacture an SMT Cover Tape Peel Tester and Component Prep equipment for Thru-Hole applications.

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:: TechSearch International Analyzes High-Performance Package Trends

A variety of alternatives are challenging silicon’s role in advanced packaging interposers for high-performance applications. The first applications using silicon interposers with through silicon vias (TSVs) were field programmable gate arrays (FPGAs), followed by graphic processor units (GPUs).  Though unit volumes have been small, the vast knowledge gained from these early pioneers is being applied to new generations of products.  This year will see expansion into applications including networking systems and artificial intelligence applications.  Future applications could include servers and datacenters, automotive electronics such as Advanced Driver Assistance Systems (ADAS), and virtual reality.  However, shipments are lower than previously expected because lower cost alternatives are emerging.      

The high cost of silicon interposers with TSVs has driven companies to develop alternatives that do not include the expensive process for TSVs.  For example, Xilinx developed the Silicon-less Interconnect Technology (SLIT) solution.  Amkor has introduced its version of the technology called Silicon Interposer-less Integrated Module (SLIM™).   Intel’s Embedded Multi-die Interconnect Bridge (EMIB) uses a small silicon bridge embedded in an organic substrate, eliminating the need for a large silicon interposer with TSVs.  Several companies are investigating the use of fan-out wafer level package (FO-WLP) for data centers and other high-performance applications.    

The analysis is provided in the latest Advanced Packaging Update, a 42-page report with full references and an accompanying set of more than 40 PowerPoint slides.  A forecast for silicon interposers is provided in units and wafers.  The report also examines trends in memory packaging, including the future for top memory packages in the package-on-package (PoP) configuration and DRAM stacks with TSVs.  Flash memory trends such as the joint Micron/Intel non-volatile memory architecture (3D XPoint™) and Toshiba’s Flash memory stack with TSVs are described.  New developments in FO-WLP panel processing are discussed, including activities at Nepes, Powertech Technologies, Samsung Electro-Mechanics, and Unimicron.  OSAT financial trends are also analyzed.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.

 

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:: Recent PTI News

Optoelectronics Drive Advanced Packaging
Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months.  They each had a unique presence, but both had plenty of optoelectronic modules and sensors.  Devices operating at up to 400Gb/s were being presented, and many were built on Palomar’s fine line of die bonders and wire bonders.  There is a big push for low-power, high-speed modules of all types. Read the full blog: http://www.palomartechnologies.com/blog/optoelectronics-drive-advanced-packaging.

Vacuum Reflow System Basic Processing Techniques
Typical applications for the family of SST Vacuum Reflow Systems are: Package Assembly, Lid Attach, Die Attach, Glass to Metal Seals, and Brazing. These process profiles share a common sequence.

Chamber Preparation
Most process cycles begin by removing as much of the ambient atmosphere as possible and diluting what remains with an inert gas. Vacuum is turned on until the chamber reaches a low pressure. Inert gas, usually dry nitrogen, is then introduced into the chamber. This vacuum/pressure step can be repeated to further increase the cleanliness of the sealing environment and reduce the overall moisture level. Read the full blog: http://www.sstinternational.com/blog/vacuum-reflow-system-basic-processing-techniques.

SST at SEMICON China
SST Vacuum Reflow Systems recently exhibited its systems and services at SEMICON China in Shanghai. At the show, we introduced a new product, Model 518, a mid-range, radiant heat single chamber system to create void free, flux free microelectronics packages. We had a lot of fun with a customer quiz/drawing, and we gave Bose Headphones away to some lucky winners! Read the full blog: http://www.sstinternational.com/blog/sst-at-semicon-china.

Subscribe to the PTI Blog! Join the industry peers who already have!
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:: Issue 206 ::
April 18, 2017

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services