Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Materion

:: Master Bond Low Viscocity, Two Component Epoxy is Optically Clear with Non-Yellowing Properties (full story)

:: Brewer Science Invites Visual Artists to Submit Art for Pure Enjoyment Exhibit in Springfield, MO (full story)

:: Rudolph Expanding its Presence in China for AMOLED Display Lithography (full story)

:: Indium Corporation Launches New Solder Paste for Fine Feature Printing (full story)

:: Recent Palomar Technologies News (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


::Master Bond Low Viscocity, Two Component Epoxy is Optically Clear with Non-Yellowing Properties

Master Bond EP112LS is a two part epoxy that is well suited for impregnation, potting, encapsulation, sealing and coating applications, particularly in the aerospace and optoelectronics industries.

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. EP112LS is serviceable over the temperature range of -60°F to +450°F.

This system features a working life exceeding 2-3 days at room temperature and requires oven curing. Post curing will enhance its properties. With a mixed viscosity of 50-200 cps, EP112LS bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many rubbers and plastics. Bonds feature a tensile strength, compressive strength and tensile modulus of 11,000 psi, 20,000 psi and 400,000 psi at room temperature, respectively. Dimensional stability is outstanding.

EP112LS has a shelf life of one year in original, unopened containers and is available in ½ pint, pint, quart, gallon and 5 gallon container kits.

Master Bond Electrically Insulative Adhesive Systems
Master Bond 112LS is an optically clear, low viscosity epoxy that has been formulated for a variety of high performance applications. This two component, heat curing system is also a competent electrical insulator, even at elevated temperatures. Read more about Master Bond’s electrically insulative adhesives at http://www.masterbond.com/properties/electrically-insulative-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

For a full product description, please visit: http://www.masterbond.com/tds/ep112ls
Check out new videos on our YouTube channel: http://www.youtube.com/user/MasterBondVideo 

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::Brewer Science Invites Visual Artists to Submit Art for Pure Enjoyment Exhibit in Springfield, MO

Brewer Science, Inc. invites visual artists to submit original art during the month of August for consideration in Pure Enjoyment, an eclectic exhibit of original art.  The exhibit, sponsored by Brewer Science, will be held at the Creamery Arts Center, located at 411 N. Sherman Parkway, Springfield, MO, during the month of October. 

Artists interested in submitting their work for consideration must do so by August 31 in .jpg format; submission instructions and additional information can be found at http://www.brewerscience.com/art-show.

Pure Enjoyment will include approximately 100 original works of art, including photography, mixed media, and dimensional art.  Denene Taliaferro from Springfield, MO, has been chosen as the juror for this year’s exhibit.  Selected artwork will be on display from October 6 through October 27, Monday through Friday from 9:00 AM to 5:00 PM, and Saturday from 10:00 AM to 4:00 PM.



The public is invited to the opening reception, which will be a part of the First Friday Art Walk. The opening reception will be held at the Creamery Arts Center, located at 411 N. Sherman Parkway, Springfield, MO, on October 6 between the hours of 5:00 PM and 8:00 PM.

For more information, please contact Leslie Forrester at the Springfield Regional Arts Council at (417) 862-2787 or Loretta Wallis at Brewer Science at (573) 364-0300, extension 1357. 

 

About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, and processes for the fabrication of semiconductors and microelectronic devices. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe, and Asia. Learn more at http://www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook at http://www.facebook.com/BrewerScience, and subscribe to our blog at http://blog.brewerscience.com/

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::Rudolph Expanding its Presence in China for AMOLED Display Lithography

Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for a JetStep® G lithography system from a second customer in China for pilot line manufacturing of next-generation AMOLED (active-matrix organic light-emitting diode) displays.

The use of AMOLED displays in smartphones and wearables is growing rapidly because of their superior performance and form factor. Given the wide variety and rapid proliferation of consumer devices, an R&D or pilot line facility that can quickly and cost-effectively implement new processes allows manufacturers to bring new products to market faster. As these products continue to evolve, the need persists for low-power, low-cost, and conformity. Rudolph’s lithography solutions provide customers with the ability to develop these new processes with lower tooling costs and quicker product change-over.

Elvino da Silveira, vice president of marketing at Rudolph Technologies, said, “The AMOLED panel market is currently experiencing rapid growth, and in fact, UBI Research expects it to grow by close to 40 percent on an annual basis until 2020. We are seeing more and more companies enter this market by developing their own intellectual property, especially in China.”

“Customers continue to invest in Rudolph’s unique lithography solution for their R&D and pilot lines because it enables them to prove-out new processes more easily and at lower cost,” da Silveira continued. “The JetStep system is especially beneficial in pilot line environments where there is a high level of product change-over and pressure to minimize cost. A JetStep mask set, for example, is a fraction of the cost of a mask set for scanner-based photolithography tools, making it an ideal choice for new product development.”

The JetStep G lithography system addresses the AMOLED displays’ requirement for higher performance transistors by delivering finer resolution and tighter overlay. Additionally, the proprietary real-time magnification compensation and autofocus capabilities enable flexible substrate lithography. These capabilities are exactly what FPD manufacturers in China are looking for as they invest in capacity for next-generation AMOLED. Beyond the technology, Chinese manufacturers are looking for comprehensive and localized services. Rudolph is expanding capabilities in this area through the use of localized partnerships.

“With these technological advantages and local presence, we are poised to capture orders from additional China-based manufacturers,” da Silveira concluded.

For more information about Rudolph’s systems and software, please visit www.rudolphtech.com.  

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

 

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::Indium Corporation Launches New Solder Paste for Fine Feature Printing

Indium Corporation Launches New Solder Paste for Fine Feature Printing

Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.

Indium11.8HF-SPR specifically addresses the move toward type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance. 

Indium11.8HF-SPR benefits:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • High-transfer efficiency through small apertures
    (≤ 0.66AR)
  • Long stencil life (>12 hours)
  • Eliminates hot and cold slump to inhibit bridging and solder beading defects
  • Avoids the potential for HIP and graping defects with a unique oxidation barrier

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Recent Palomar Technologies News

History of Ball Bonding Flame-Off and Advanced Concepts
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced topics. But first, let’s discuss the evolution of the flame-off system that evolved into electronic flame-off systems that wire (ball) bonders use today.
The original Hughes Model 360 was “the Mean Green Machine”, a manual ball bonder that used a hydrogen flame to form the ball.  That’s where the acronym “flame-off” comes from, as it was an actual H2 flame that melted the gold wire into a very small ball. Its era was the 1960s; H2 flame-off was typical during this period.  The process engineers that used one of these bonders remember them well, as when hydrogen burns it is colorless; many a hand has wandered into the invisible flames’ path for a fraction of a second.  H2 burns hot–it has to in order to melt solid gold!  It did a fair job at forming the ball with little contamination, but free-air ball size was very difficult to control. Read the full blog: http://www.palomartechnologies.com/blog/history-of-ball-bonding-flame-off-and-advanced-concepts.

Automatic Systems Require Superior Vision
When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual or semi-automatic bonder and a fully automatic bonder is the ability to find and identify specific features, fiducials, or components on the parts. This is critical for accurate placement of die as well as wire bonds. Read the full blog: http://www.palomartechnologies.com/blog/automatic-systems-require-superior-vision.


Consequences of High Voids in Hermetically Sealed Devices
High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable. Read the full blog: http://www.sstinternational.com/blog/if-you-are-creating-high-value-hermetically-sealed-devices-what-are-the-consequences-of-experiencing-high-voids-in-the-package-seal-ring.

Subscribe to the PTI Blogs! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe
http://www.sstinternational.com/blog

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:: Issue 212 ::
August 4, 2017

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services