Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: 3D InCites and IMAPS Partner to Co-Host the 2018 3D InCites Awards at the 2018 Device Packaging Conference (full story)

:: Recent Palomar Technologies News (full story)

:: Master Bond Offers Thermally Conductive, Electrically Insulative One Part Epoxy for Die Attach Applications (full story)

:: Torrey Hills Technologies Donates Thick Film Slow Roller Machine to Binghamton University (full story)

:: News from Indium (full story)

:: Kester Wins Global Technology Award (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: 3D InCites and IMAPS Partner to Co-Host the 2018 3D InCites Awards at the 2018 Device Packaging Conference

Proceeds to Benefit IMAPS Foundation and Phoenix Children’s Hospital

3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration technologies. Historically held during SEMICON West, the 2018 edition of the 3D InCites Awards reflects changes in venue, award categories, and benefit charities.

“The IMAPS Device Packaging Conference is known worldwide as the leading forum in which to exchange knowledge with industry peers regarding the advancement of heterogeneous integration technologies. Due to the synergies between the IMAPS membership and 3D InCites audience, we felt it was the optimal venue for holding our sixth annual 3D InCites Awards,” said Françoise von Trapp, Queen of 3D, 3D InCites. “We are excited about this collaboration, and we thank the IMAPS committee for hosting this year’s event.”

In 3D InCites’ ongoing commitment to STEM education and finding kid-size cures for childhood cancer, proceeds from this year’s event will benefit two charities: the IMAPS Microelectronics Foundation, which exists to support student activities related to the study of microelectronic packaging, interconnect, and assembly; and Phoenix Children’s Hospital pediatric oncology programs, the only institution in Arizona conducting Phase I trials, giving pediatric cancer patients access to the latest and most advanced treatments. Sponsorship opportunities for 2018 3D InCites Awards are now available.

“IMAPS is proud to expand our growing partnership with 3D InCites for this worthy awards program,” said Michael O'Donoghue, Executive Director, IMAPS.  “The 2018 3D InCites Awards are a welcome addition to the Device Packaging Conference program, and will present a positive opportunity to the industry award beneficiaries and the two fundraising recipient foundations. The society looks forward to the debut of this impactful collaboration.”

Established in 2013 to acknowledge excellence in 3D integration technologies, the 3D InCites Awards program has evolved over the years to be a most coveted prize that recognizes technologies, individuals, and companies that have made significant contributions to the advancement of the heterogeneous integration roadmap. Winners are chosen by industry peers through an online voting process.

Online nominations will be accepted from January 8 to February 12, 2018. Voting is open February 14-28, 2018. Winners will be announced Wednesday, March 7, during an awards ceremony and cocktail reception at the 2018 IMAPS Device Packaging Conference at We-Ko-Pa Resort in Fountain Hills, Arizona.

The 2018 3D InCites Awards will be presented in the following categories:
•             Device of the Year
•             Process of the Year
•             Manufacturer of the Year (fabless, fab, OSAT)
•             Startup of the Year
•             Equipment Supplier of the Year
•             Materials Supplier of the Year
•             EDA Provider of the Year
•             Research Institute of the Year
•             Engineer of the Year

Full details about the 2018 3D InCites Awards are available here.

About 3D InCites
The premier content platform for heterogeneous integration technologies, 3D InCites brings to life the people, personalities, and the minds behind heterogeneous integration in a uniquely personal way. The goal is to inform key decision-makers about trends, applications, progress in technology development, design, standards, infrastructure, and implementation.

About IMAPS International
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and international members around the world.

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:: Recent Palomar Technologies News

New Processes and Technologies Drive Micro/Optoelectronics Packaging
The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen products like automated/autonomous vehicles forces automation and those providers to remain on their toes.  For example LIDAR, RADAR, and cameras are being brought together to enable fleets of autonomous vehicles to drive safely through a tangle of highways and streets.  And of course, package shrink and cost reductions are always a requirement.  The challenge is constantly changing and increasing, and automated manufacturing equipment providers like Palomar Technologies are on the job.  Read the full blog: http://www.palomartechnologies.com/blog/new-processes-and-technologies-drive-micro/optoelectronics-packaging.


Manual Load, Island of Automation, or In-Line: What is the Right Solution for my Process?
Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, independent automated work cells, or an entire line of automation? There are many factors to consider, but one of the most common is your throughput requirement. Palomar Technologies is the exception in our market in that we can offer total solutions to our microelectronics assembly customers. We offer manual load, “islands of automation”, and full in-line solutions—not only for our own equipment, but also through alliances and partnerships with other companies that allow us to integrate and provide the entire automated line. Read the full blog: http://www.palomartechnologies.com/blog/manual-load-island-of-automation-or-in-line-what-is-the-right-solution-for-my-process.

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/blog

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:: Master Bond Offers Thermally Conductive, Electrically Insulative One Part Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond Supreme 3HTND-2DA is a fast curing, high performance one component epoxy system. It cures in 5-10 minutes at 150°C and has unlimited working life at room temperature. It is available in syringes and has a shelf life of 6 months when stored at 40-50°F.

Supreme 3HTND-2DA has a die shear strength of 19-21 kg-f and performed very well in 85/85 testing. This epoxy has excellent adhesion to metals, ceramics and silicon dies. It is serviceable over the wide temperature range of -100°F to+400°F. As a toughened system, it offers the ability to withstand rigorous thermal cycling and shock.

In accordance with die attach application requirements, this product passes NASA low outgassing test specifications. Supreme 3HTND-2DA has low ionics, particularly chlorine (<15 ppm). It also features dimensional stability, superior thermal conductivity, electrical insulation properties and a glass transition temperature of 100-105°C.

Unlike many other die attach systems, Supreme 3HTND-2DA is not premixed and frozen, but it requires refrigeration for storage. This system dispenses smoothly or without any tailing. It well suited for automatic dispensing equipment. With a viscosity of over 300,000 cps (thixotropic), it can be applied to a defined area without running.

Master Bond Toughened Epoxy Compounds
Master Bond Supreme 3HTND-2DA is a NASA low outgassing system for die attach applications featuring thermal conductivity, high temperature resistance and toughness. Read more at http://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.


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:: Torrey Hills Technologies Donates Thick Film Slow Roller Machine to Binghamton University

Torrey Hills Technologies, LLC (THT) recently donated a slow roller machine to Binghamton University, for use in their School of Pharmacy and Integrated Electronics Engineering Center (IEEC) lab. The IEEC is a New York State Center for Advanced Technology in Electronics Packaging. The IEEC has been dedicated to the advancement of electronic packaging technology and the electronics industry since 1991.

"We are happy that Binghamton University can use our slow roller for their solder and thick film pastes, as well as pharmaceutical ointments," said Ken Kuang, president of THT. "We know that it will serve their IEEC lab well.”

THT’s slow rollers can be used for many different applications, including those requiring that the uniformity of solder and thick film paste is strictly maintained. The machines feature an adjustable shaft distance to accommodate containers of different sizes, and the jar speed is adjustable from 0-5 rpm. Due to engineering precision, THT slow rollers can thoroughly de-air to avoid paste separation. With all stainless steel casing for easy cleaning as well as a safety emergency stop button, these slow rollers are designed with the success of the end-user in mind.

Also donated were 5 copies of Kuang’s Amazon Best Selling book, From Startup to Star, to help stimulate ideas among students.

Torrey Hills Technologies, LLC (http://www.threerollmill.com) develops and delivers quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to mixing equipment and furnace equipment manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.
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:: News from Indium

Indium Corporation Promotes Brown to Associate Director, Marketing Communications

Indium Corporation has named Anita Brown as Associate Director, Marketing Communications.
 
Brown is responsible for managing the strategic planning initiatives for the Marcom Department, driving vendor selection, and managing customer, media, community, and internal communications. She also works closely with Indium Corporation’s product managers to create impactful product branding and communication programs.

Brown joined Indium Corporation in 2004 and has served in a variety of roles in the marketing communications department, most recently as Senior Marketing Communications Manager. She has been instrumental in nearly every single regional and global marketing communication initiative over the past decade.
 
Brown earned her bachelor’s degree in Business & Public Management and her MBA in Technology Management, both from the State University of New York’s Polytechnic Institute. She was recognized with the Dean’s award from SUNY Poly School of Business in 2009, the Women in Business Award from the Mohawk Valley Business Journal in 2005, and the Follow the Leaders Award from Leadership Mohawk Valley in 2005. In 2017, she was recognized as one of the Mohawk Valley’s outstanding women in business by the YWCA’s Salute to Outstanding Women. Brown serves as chairperson for the SUNY Poly Foundation for the State University of New York’s Polytechnic Institute and has been recognized three times as a Paul Harris Fellow by Rotary International.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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:: Kester Wins Global Technology Award

Kester was awarded Global SMT’s Global Technology Award in the category of Flux for SELECT-10™ Selective Solder Flux. The award was presented during Productronica.

SELECT-10™ Selective Solder Flux is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog the fluxer head. For additional information on this product including technical and safety data sheets, please visit: http://www.kester.com/products/product/SELECT-10-Selective-Solder-Flux.

For any questions or additional information, please contact: Michelle O’Brien at mobrien@kester.com.

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:: Issue 219 ::
December 21, 2017

Nordson ASYMTEK

JC Cherry