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:: Corporate Member News ::

PLATINUM PREMIER SPONSOR

DPC/GBC Premier Sponsor: ASE US, Inc.

:: Plan your visit to the Sold Out Device Packaging Exhibition - See all the Key Companies Under One Roof! (full story)

:: Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits, packages and PCBs (full story)

:: Visit Nikon Precision at the 13th International Conference and Exhibition on Device Packaging (full story)

:: Visit MacDermid Enthone Electronics Solutions in Booths #7-8 (full story)

:: TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP (full story)

:: Booth #44 - MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems (full story)

:: Please come visit TMS Representatives, LLC and CPS Technologies at Booth # 30 (full story)

:: EV Group, Inc. on Display in Booth # 24 (full story)

:: IBM Bromont - We invite you to booth #11 to discuss your next generation requirements (full story)

:: Visit Booth #10 - StratEdge Corporation designs and manufactures a wide range of high performance semiconductor packages for GaAs and GaN devices (full story)

:: Nanomaterials at Scale. Guaranteed Monodispersity (full story)

:: Visit Shinko at booth #56 to learn more about our latest product offerings for fine pitch interconnection, miniaturization and high density mounting for 3D assembly (full story)

:: PacTech is your Global Partner for Wafer Level Packaging Services and Equipment (full story)

:: About the Micro Systems Technologies Group (full story)

 

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PLATINUM PREMIER SPONSOR

DPC/GBC Premier Sponsor: ASE US, Inc.

GOLD PREMIER SPONSORS
DPC Premier Gold Sponsor: Amkor Technology
DPC Premier Gold Sponsor: NAMICS
DPC Premier Gold Sponsor: Nanium
DPC Premier Gold Sponsor: Cadence

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits, packages and PCBs

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits, packages and PCBs. Cadence® IC packaging and cross-domain co-design automation provide efficient solutions in system-level co-design and advanced mixed-signal packaging, delivering the automation and accuracy to expedite the design process. Cadence also offers an integrated system design solution for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology. The solution includes implementation, signoff, and electro-thermal analysis tools that enable concurrent multi-chip optimization for designs incorporating InFO technology.

With complex advanced packages, designers are faced with power integrity (PI) and signal integrity (SI) issues driven by increasing IC speeds and data transmission rates combined with decreases in power-supply voltages and denser, smaller geometries. Stacked die and packages, higher pin counts, and greater electrical performance constraints are making the physical design of semiconductor packages more complex. To address these issues, Cadence provides advanced PI and power-aware SI Sigrity™ tools that can be used throughout the design process.  

For more information, visit www.cadence.com

 

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:: Visit Nikon Precision at the 13th International Conference and Exhibition on Device Packaging

Meet with Nikon Representatives at IMAPS 2017 Booth #20, March 7-9, in Fountain Hills, AZ to learn about the latest lithography solutions for advanced MEMS applications. 

Nikon MEMS Steppers provide extremely diverse processing capabilities. They are successful in meeting customers’ unique requirements for not only Air Bearing Surface (ABS) fabrication and MEMS applications, but also for light emitting diodes (LEDs), discretes, and more. MEMS Steppers are also well-suited for patterning Cu Pillar insulating layers as well as the insulating layers used in bumping processes.

MEMS Steppers use low numerical aperture lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus. Nikon MEMS Steppers also provide a high degree of alignment flexibility, and the majority of MEMS Steppers support critical Backside
Alignment (BSA) capabilities as well.

Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. Newly developed systems maximize productivity, support substrates up to 200 mm, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield are available.

Nikon is excited to announce our new NES2W-i10. This system features a reduction lens with a 44mm x 44mm field size, optimal cost of ownership, and enhanced overlay to offer customers a superior alternative to Mask Aligners, which have historically been used in back-end and packaging processes.

Nikon Precision provides sales, marketing, and unparalleled support for Nikon Lithography systems worldwide. Our extensive product portfolio includes specialized solutions for MEMS/LED, and flat panel display (FPD) processing, as well as advanced i-line, KrF, ArF, and immersion lithography systems used throughout the semiconductor and thin-film magnetic head (TFH) industries. Please visit our website at
https://www.nikonprecision.com or contact:

Brenden Wells
Key Account Manager
Nikon Precision Inc.
brenden.wells@nikon.com

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:: Visit MacDermid Enthone Electronics Solutions in Booths #7-8

MacDermid Enthone Electronics Solutions is a division of the MacDermid Performance Solutions, a subsidiary of Platform Specialty Products Corporation, which supplies innovative, environmentally sound products to a rapidly changing electronics marketplace. Working with our customers, we research, formulate and deliver specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation providing a critical component for maintaining the finished product’s overall performance. From wireless devices and computers to automotive and military electronics, our products are an integral part of the electronics manufacturing industry.

MacDermid Enthone Electronics Solutions is a leading supplier of specialty chemicals for fabricators, assemblers, and original equipment manufacturers. We are a proven innovator in the field of chemical processing, with a passion for providing application-specific solutions for our customers' most difficult manufacturing challenges and unsurpassed technical support.

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:: TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% growth rate from 2015 to 2020. Starting from shipments of a few hundred million packages in 2015, FO-WLP shows a staggering growth rate of 82% over the five-year period. The use of FO-WLP for RF, audio CODEC, and power management ICs, coupled with Apple’s adoption of TSMC’s InFO FO-WLP as the bottom package-on-package (PoP) in Apple’s iPhone 7, is driving unit volume shipments. Automotive radar, connectivity modules, and other applications promise continued growth for FO-WLPs. Cost-reduction pressures are driving the development of alternatives to reconstituted wafer FO-WLP in the form of large area panel processing and flip chip on coreless or thin core substrates. Chip package interaction (CPI) is analyzed for WLPs and flip chip.

TechSearch International’s new study, Flip Chip and WLP: Market Forecasts and Technology Analysis, provides detailed analysis of the drivers for fan-in WLP, FO-WLP, and flip chip. The detailed analysis is based on the company’s 29-year history of studying markets and critical technology and infrastructure issues.

Driven by small size devices such as filters, low noise amplifiers, power amplifiers, and switches found in smartphones, flip chip growth shows >13% CAGR in unit volume from 2015 to 2020. Documentation of the continued transition to Cu pillar is provided. Flip chip applications, bump types, and pitch trends are based on extensive interviews and research. Flip chip assembly options are discussed. Growth in gold bumping for LCD driver ICs is included. A critical analysis of planned capacity and utilization is provided for each geographic region, showing projections for strong growth in China.

The 115-page report with full references provides forecasts for the flip chip wafer bumping market by application, device type, number of wafers, and die shipments. Merchant and captive capacity is included. Forecasts for fan-in and FO-WLP demand are projected in number of die and wafer shipments. Bumping, wafer level packaging, substrate suppliers, assembly equipment, underfill material, and contract assembly service providers are listed. A set of 78 PowerPoint slides accompanies the report.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.

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:: Booth #44 - MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems

MRSI

Come visit us at Device Packaging Booth #44! MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput and uptime by building systems that use our unique expertise. Our solutions deliver the best financial returns in the industry, while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide.

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:: Please come visit TMS Representatives, LLC and CPS Technologies at Booth # 30

Please come visit TMS Representatives, LLC and CPS Technologies at Booth # 30 to learn more about AlSiC based thermal management technology, hermetic packaging and other thermal solutions for electronics. 

TMS

 

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:: EV Group, Inc. on Display in Booth # 24

EV Group, Inc.
7700 S. River Parkway
Tempe, AZ  85284
(P): (480) 305-2456
(E): k.roe@evgroup.com
www.evgroup.com

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

 

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:: IBM Bromont - We invite you to booth #11 to discuss your next generation requirements

IBM Bromont

IBM Bromont is a world leader in semiconductor packaging technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions. Tap into our deep competencies as the industry continues to shift to custom SoCs and SiPs.  IBM is known for its multi-chip packaging and heterogeneous integration.

We offer full turnkey solutions from modelling and characterization through Burn-in and test. Our test capability spans digital, analog, mixed signal, RF as well as multi-site programming, test pattern conversion, and load board design. We provide high quality mechanical, thermal and electrical design (including high speed/SERDES, signal integrity and power integrity), ensuring effective execution of new and updated platforms. Services include materials and process characterization, optimized substrate design, and failure analysis while package platforms range from large organic substrates to silicon and glass interposers, and the newest coreless technologies.

We invite you to booth #11 to discuss your next generation requirements – our developments in areas such as silicon photonics are unrivaled. IBM will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals.

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:: Visit Booth #10 - StratEdge Corporation designs and manufactures a wide range of high performance semiconductor packages for GaAs and GaN devices

StratEdge Corporation designs and manufactures a wide range of high performance semiconductor packages for GaAs and GaN devices.  Don’t forget to ask about our assembly services! 

Come visit us at Booth #10! 

StratEdge

 

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:: Nanomaterials at Scale. Guaranteed Monodispersity

NANOMATERIALS AT SCALE. GUARANTEED MONODISPERSITY.
Superior Silica LLC is a chemistry-first company based out of Phoenix, AZ that specializes in manufacturing highly monodisperse silica nanoparticles and microspheres at industrial scales.  Our proprietary process enables us to target a particular size better and more consistently than anyone in the world. We can also provide particles with customizable surface chemistries to couple with specific polymeric matrices in device packaging applications. We are extremely cost-competitive and our manufacturing facility is located in Mesa, AZ. We look forward to meeting prospective customers at Device Packaging 2017.

Superior Silica
Figure 1: A sample SEM of our 350nm silica nanoparticles. We have the ability to reproduce such quality at industrial scales.

www.superiorsilica.com
2450 W Broadway Rd, #117 Mesa, AZ, 85202

 

*SEM image adapted from minerals.gps.caltech.edu

©2016 Superior Silica LLC

 

 

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:: Visit Shinko at booth #56 to learn more about our latest product offerings for fine pitch interconnection, miniaturization and high density mounting for 3D assembly

Shinko

SHINKO Electric Industries Co., LTD., is a leading manufacturer of products used in the assembly of IC’s such as Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. We manufacture a full line of Organic Substrate structures including coreless options offering enhanced electrical performance and package miniaturization. SHINKO also provides subcontract IC assembly services with an emphasis on packaging solutions such as PoP, SiP as well as advanced technologies such as Molded Core Embedded Package (MCeP®) and Camera Module assembly and test. Our headquarters and primary production plants are located in the greater Nagano, Japan area. In addition to our production facilities we also provide the ultimate in service and solutions for customers, with Sales and Engineering support Worldwide.

Come visit us at booth #56 to learn more about our latest product offerings for fine pitch interconnection, miniaturization and high density mounting for 3D assembly.

 

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:: PacTech is your Global Partner for Wafer Level Packaging Services and Equipment

Pac Tech

 

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:: About the Micro Systems Technologies Group

About the Micro Systems Technologies Group:
The Micro Systems Technologies Group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.

The globally active companies that make up the MST Group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

DYCONIX successfully achieves EN 9100:2009 certification

DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

DYCONEX has been certified to ISO 9001 since 1993, and to ISO 13485 since 2012. The company maintains an extensive quality management system with digitally networked development and manufacturing processes, which guarantee the highest product reliability and 100% traceability. Certification to EN 9100 confirms the effectiveness of the processes that DYCONEX and its quality system meet the demanding requirements of customers and public authorities in the aviation and aerospace industries.

DYCONEX was audited by Bureau Veritas Certification (Switzerland) AG, an internationally recognized certification institute that has been reviewed and accredited by numerous public authorities.

About DYCONEX AG:
With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.
With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

 

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:: Issue 201 ::
February 1, 2017

Panel Session organized by YOLE

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services