Corporate Bulletin


:: Corporate Member News ::

:: News from MASTER BOND (full story)

:: INDIUM Corporation Releases New Research Kit for Soldering to Gold (full story)

:: Recent PALOMAR News (full story)

:: FERRO Expands Its Electronics Product Portfolio with Acquisition of Electro-Science Laboratories (ESL) (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


Master Bond


Premier Program Sponsor - Heraeus Materials Technology


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: News from MASTER BOND

Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling

Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock. 

Master Bond

EP38CL cures at room temperature or more quickly at elevated temperatures and has low shrinkage upon curing. This low viscosity, two part epoxy has a 100:60 mix ratio by weight and a working life of 40-50 minutes. It bonds well to a variety of substrates including metals, ceramics, glass, composites, many rubbers and plastics. EP38CL features a tensile lap shear strength of 2,500 psi, a compressive strength of 8,000 psi and a tensile strength of 7,500 psi at room temperature.

Additionally, EP38CL is optically clear with a glossy appearance. It is serviceable from -60°F to +250°F. This electrically insulative compound is used in optical, aerospace, opto-electronic and specialty OEM applications. It is available for use in standard packaging options ranging from ½ pint to 5 gallon kits as well as premixed and frozen syringes.

Master Bond Flexibilized and Toughened Adhesives
Master Bond EP38CL is an optically clear, hard and toughened two component epoxy capable of withstanding thermal cycling, mechanical shock and impact. Read more about Master Bond’s flexibilized and toughened epoxies at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

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:: INDIUM Corporation Releases New Research Kit for Soldering to Gold

Indium Corporation has released a new solder research kit designed for soldering to gold plating using indium-based alloys.

Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors. 

The more commonly used tin-based solder alloys rapidly scavenge or dissolve the gold during the reflow process, leading to the destruction of gold conduction patterns. Tin-based alloys also result in crack-inducing platelets within the solidified solder joint. Indium-based alloys, especially those in the indium-lead (InPb) family, cause appreciably less gold scavenging damage than tin-lead (SnPb) solders.


The Soldering to Gold Research Kit allows you to choose three different alloys from seven that are offered for the kit. The alloys come in the form of 0.76mm (0.030”) solid-core wire and represent melting temperatures ranging from 143-310°C. The kit also offers two compatible fluxes - TACFlux®007 and TACFlux®012.

Order your research kit at If you want more information on how to solder to gold, visit For assistance on selecting the best alloys for your application, visit Indium Corporation’s Solder Alloy Selector Guide at or contact our technical support team at

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp

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:: Recent PALOMAR News

New Automated Production Lines and Expanded Service
As you know, the microelectronics industry is always growing and changing. We grow and change along with it, staying ahead of the next technological advancements. As we expand our customer base, we expand our customer service reach to ensure we provide support wherever it is needed. Read the full blog:

Two Processes for Eutectic Die Bonding
Assembly Services has two separate processes available for eutectic bonding available in our lab. We can utilize our 3880 or 6500 Die Bonder with a Pulsed Heat System, or our SST 5100 Vacuum Reflow Oven. Each process has its advantages and specific uses. Read the full blog:

Happy New Year from Palomar Technologies' CEO!
Again, there is much to be thankful for as we close out 2016.  Certainly microelectronics remains one of the key components of our world today, having dramatically changed lives.  The average consumer has no concept of what is inside an electronic device like a cell phone or satellite, and certainly has no understanding of the complex process of building it.  We consider ourselves fortunate at Palomar to be in the core of high-end microelectronics, providing the advanced automation and processes to connect the power and intelligence of the microchip to the outside world. Read the full blog:


Subscribe to the PTI Blog! Join the industry peers who already have!

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:: FERRO Expands Its Electronics Product Portfolio with Acquisition of Electro-Science Laboratories (ESL)

ESL is a recognized leader in niche electronic packaging material applications
• Adds new capabilities in advanced coating material technologies for metal, glass, ceramic and other substrates
• Enhances Ferro’s platform for growth in Performance Colors and Glass

Ferro Corporation today announced that it has acquired Electro-Science Laboratories, Inc. (“ESL”), a leader in electronic packaging materials.

The acquisition of ESL enhances Ferro’s position in the electronic packaging materials space with complementary products, and offers an attractive platform for growth in Ferro’s Performance Colors and Glass business unit.

ESL produces thick-film pastes and ceramic tape systems that enable important functionality in a wide variety of industrial and consumer applications. Its key products are used to build hybrid integrated circuits, modules and sensors that function in harsh conditions. Hybrid integrated circuits using ESL products are used in aerospace and defense applications, such as satellites. The modules and sensors are used in automobile components, including oxygen sensors. ESL paste systems for heaters are used on a wide variety of substrates, including metal, ceramic and glass for appliances such ovens and water heaters.

 ESL, headquartered in King of Prussia, PA, was founded in 1962 and has remained privately owned and associated with the founding family. The business has operations in the United States and United Kingdom and has 86 employees.

Peter Thomas, Chairman, President and CEO of Ferro Corporation, said, “This acquisition gives Ferro a more significant share of the addressable market for electronic packaging materials, and is highly synergistic within our current Ferro business. While ESL and Ferro both employ similar manufacturing processes, the product portfolios, end use applications and customers are complementary. In addition, Ferro is backward integrated into glass production, which will provide raw material synergy opportunities. ESL is aligned with our asset-light and heavy-touch operating philosophy and our commitment to adding value for our niche market customers across the globe. ESL is a recognized leader in a market that is expected to continue to grow as a result of increasing everyday use of electronics and sensors within our homes, vehicles and offices.”


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:: Issue 200 ::
January 6, 2017


Gannon & Scott



Oneida Research Services