Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Materion

:: Universal Instruments Installs Finetech Multipurpose Bonder In its Advanced Process Laboratory (full story)

:: Brewer Science Welcomes Dr. Srikanth (Sri) Kommu to Join Their Senior Executive Leadership Team (full story)

:: Kester's NP545 Solder Paste Available with Tin-Lead T4 Powder (full story)

:: GPD Global Setting Up East Coast Demo Center (full story)

:: TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends (full story)

:: F&K Delvotec Reaches Exclusive Sales Partnership with Geringer (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Universal Instruments Installs Finetech Multipurpose Bonder In its Advanced Process Laboratory

Finetech, a global supplier of micro-assembly equipment and Universal Instruments announce the addition of a FINEPLACER® Pico bonding system to the Universal Instruments Advanced Process Laboratory .

The Universal Advanced Process Laboratory (APL) in Conklin, New York, offers comprehensive electronic assembly process research, advanced assembly services and supporting material analyses.  It enables OEMs and contract manufacturers to realize rapid product introduction, maximize yield and optimize reliability.  The APL has long played an influential role in the electronics community, partnering with industry leaders, engaging academia and executing consortium research to develop new and emerging assembly technologies.   It services a wide variety of corporate clients representing many electronics industry sectors.  The versatile Pico bonder is a great fit for the breadth of the APL mission, providing a broad range of electronics bonding technologies:   thermocompression, thermosonic and ultrasonic bonding, soldering (AuSn, eutectic SnPb, Indium, C4), adhesive technologies, UV curing and mechanical assembly.

“Our research staff has been anxiously awaiting the installation of our new Finetech Pico bonder; they‘ve been queuing up critical experiments for months now,“ remarked Jim Wilcox, manager of the APL AREA Research Consortium.  “The versatility of this bonding system is perfect for the range of packaging assembly challenges we tackle routinely.  Our near-term Pico projects include controlled silver sintering for attachment of power devices, low temperature joining for flexible hybrid electronics and precision thermopression bonding of fine pitch, large die, copper pillar interconnects.  We put it to work on that very first day. “

The FINEPLACER® Pico is a versatile platform used in a wide range of micro assembly applications – such as high accuracy die attach and assembly of components that require a novel bonding approach.  It provides a placement accuracy of 5 µm, fast, easy process development, and supports bonding forces up to 700 N.
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:: Brewer Science Welcomes Dr. Srikanth (Sri) Kommu to Join Their Senior Executive Leadership Team

Brewer Science is pleased to announce the addition of Dr. Srikanth (Sri) Kommu to its senior executive leadership team. As an Executive Director, Dr. Kommu will be responsible for running the semiconductor business.

Dr. Kommu has over 20 years of stellar leadership experience in the semiconductor industry. He is very well known as a visionary leader who is passionate about solving tough problems, adding significant value to the technology industry and making a positive change to the world.

Dr. Kommu began his career as a research scientist and has most recently served as the Chief Technology Officer (CTO) and Senior Vice President (SVP) at MEMC/SunEdison Semiconductor. As CTO and SVP, Dr. Kommu strategically defined and flawlessly executed highly differentiating product, capability and cost roadmaps. He has also been serving as an Advisory Board member at Washington University since 2012, and worked at Intel and SUMCO earlier in his career.

Dr. Kommu completed the executive General Management Program at Harvard Business School, received his Doctorate and Masters degrees in Chemical Engineering from Washington University, and received his Bachelors degree in Chemical Engineering from the Indian Institute of Technology.

Dr. Kommu said, “The highly talented people and the innovation culture at Brewer Science provide the company with its competitive advantage, and Brewer Science is better positioned than ever before to supply high-value products to its customers, enabling the growth of the technology industry.”

Learn more about Brewer Science at www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook at http://www.facebook.com/BrewerScience, and subscribe to our blog at http://blog.brewerscience.com/

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:: Kester's NP545 Solder Paste Available with Tin-Lead T4 Powder

Kester’s NP545, the zero-halogen, no-clean solder paste formula designed for consistency and repeatability is now available in a Tin-Lead T4 powder. For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/np545-solder-paste.

For any questions or additional information, please contact Fil Marcial, Global Product Manager at fmarcial@kester.com.

 

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:: GPD Global Setting Up East Coast Demo Center

GPD Global is in the process of setting up a demonstration center on the East coast of the United States. Rapid Coatings, located in Woburn Massachusetts, will be the East coast demo coating center. A GPD Global conformal coating system (SimpleCoat) configured with spray, precision dispense, and volumetric progressive cavity displacement technology will be used for Rapid Coatings production and customer demonstration. We believe the partnership between GPD Global and Rapid Coatings will bring Conformal Coating product business to the next level with great success.



In addition to a conformal coating demo machine for our customers to perform test-runs, Rapid Coatings will also use this conformal coating system for customer projects.

Over the last twenty years, GPD Global has built a significant Northeast customer base with its lineup of precision fluid dispensers and looks forward to expanding those relationships through an agreement with Rapid Coatings.

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:: TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today.  Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors.  Package types include land grid arrays (LGAs,), leadframe packages such QFNs, and wafer level packages (WLPs.).  Apple is expected to account for 28 percent of the total smartphone sensor market as a result of increased sensor adoption.  With the trend toward smart factories, industrial applications are also expected to account for increased sensor demand.

New FO-WLP versions are targeting high-performance applications including networking, data centers, and artificial intelligence.  Fan-out on substrate versions such as ASE’s Fan-Out Chip-on-Substrate (FOCoS), TSMC’s InFO_oS, and Amkor’s Silicon Wafer Integrated Fan-out Technology (SWIFTÔ) are being considered as a low-cost heterogeneous integration alternative to silicon interposers.  FO-WLP on substrate fills the interconnect gap between lower-density FO-WLP and the highest density silicon interposers.    

The analysis is provided in the latest Advanced Packaging Update, an 84-page report with full references and an accompanying set of 46 PowerPoint slides.  The report also provides results from TechSearch International’s annual survey on substrate design rules.  The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. 
 
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or visit www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch

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:: F&K Delvotec Reaches Exclusive Sales Partnership with Geringer

F&K Delvotec is proud to announce that the company has an exclusive sales partnership with Geringer Halbleitertechnik GmbH. Effective immediately, F&K Delvotec will be providing demonstrations, sales and service support for Geringer’s die bonders in the U.S. and Canada.

Geringer designs and builds extremely versatile multi-chip die bonders for demanding applications in the semiconductor and electronics industries. The two main variants, a single-head and a double-head model, can process many different die types on large substrates or other package types, using adhesive, solder paste or even eutectic attachment processes. With this equipment, which is targeted especially towards high-mix/low-volume applications, Geringer is continuing an earlier tradition of F&K Delvotec. These die bonders are a perfect complement to Delvotec’s range of wire bonders for the toughest quality requirements and challenging technologies in the electronics and semiconductor industries.

About F&K Delvotec
F&K Delvotec is the worldwide leader in innovative wire bonding technology. F&K Delvotec's expansive portfolio of products deliver intelligent one-stop shop solutions for any wire bonding application, from lab bond process development to completely automated systems. Over 40 patents in wire bonding technology, and award-winning new products and customer satisfaction, attest to the continuing emphasis on providing innovative solutions that drive the industry forward. Whatever bonding is required, F&K Delvotec delivers smart technology that follows the "staying ahead" philosophy that is the heart of the company. F&K Delvotec's main office is in Germany, with satellite offices in Singapore and the U.S. For more information, please visit www.fkdelvotec.com/en. 

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:: Issue 211 ::
July 21, 2017

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services