Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.
Dr. Mackie’s presentation, Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications, will review changes foreseen for the automotive industry, their impact on electronics in automotive manufacturing, and how materials suppliers are rising to meet these challenges. Topics will include challenges that materials suppliers face when developing and testing materials for the automotive semiconductor assembly industry; high-temperature, Pb-free solder paste for die-attach in discrete components and modules; sintering materials for die-attach for wide-band gap (GaN and SiC) devices; and controlling bondline thickness in IGBT module die-attach using solder preforms.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
Indium Corporation Expert to Present at IMAPS High Temperature Electronics Network (HiTEN) 2017
Indium Corporation’s Bernard Leavitt, Product Specialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom.
Leavitt’s presentation, Die-Attach Voiding Reduction in Gold Alloy Solder Preforms, discusses the changing requirements of high-temperature solders in RF and power semiconductor device assembly, as both power density and ratings of these devices increase. AuSn20 (Indalloy®182) has been the workhorse for high-temperature, high-reliability, small die-attach applications for many years. However, the gold-tin eutectic solder alloy is beginning to reach its utility limit. Leavitt will review the next options available to RF and power semiconductor manufacturers.
Leavitt is responsible for promoting and growing Indium Corporation’s product line for high-temperature applications. He works with the sales teams to identify current and potential customer accounts, and handles customer communications and product inquiries. Leavitt joined Indium Corporation in 2007. In 2010, he was promoted to Account Coordinator responsible for relationship management. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College.
Indium Corporation Features Gold-Germanium Solder Preforms at IMAPS High Temperature Electronics Network (HiTEN) 2017
Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom.
Semiconductor-grade preforms are designed to meet the challenges faced as RF and power semiconductor devices continue to get smaller.
Indium Corporation’s high melting point AuGe solder preforms perform well at the elevated operating temperatures of smaller dies with increased power densities. In addition, improvements in wetting make semiconductor-grade AuGe solder preforms critical for void reduction efforts.
Gold-based solders have a melting point ranging from 280-1064°C, making them compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation’s gold alloy solder preforms, visit www.indium.com/brazealloys.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.