Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Materion

:: Amkor Technology announces opening of Korean sales office and participation in SiP 2017 (full story)

:: News from Palomar Technologies (full story)

:: Master Bond optically clear UV curable system offers high bond strength and fast cures (full story)

:: News from Indium Corporation (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: News from Amkor Technologies

Amkor Technology Announces Opening of Korean Sales Office

Amkor Technology, one of the world's largest providers of semiconductor packaging, assembly and test services, has opened a new sales office in Seoul, Korea. The establishment of this new location demonstrates Amkor's commitment to support new and existing products for Korean customers and companies with a presence in Korea.

With the addition of the Seoul sales office, Amkor strengthens its presence in Korea, reflecting the changing semiconductor industry and the advanced packaging technology demanded in applications such as: Automotive, Communications, Consumer, Computing, Networking, Industrial and Internet of Things (IoT). This office is a major cornerstone of Amkor's strategy to support and expand semiconductor packaging options for all customers.

To reach the Amkor Seoul sales team, please call +822 3412 4157, email sales@amkor.com or stop by Amkor's new Seoul office located at: 4F C&S Building, 6-15, Kwangpyeong-ro 51gil, Gangnam-gu, Seoul 06349.

Amkor Technology and NANIUM to Present at SiP 2017 Conference

Amkor and NANIUM invite you to join us at IMAPS SiP 2017, June 27-29 at the Doubletree Sonoma Wine Country in Sonoma, California. SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all topics related to SiPs - market trends, system integration/miniaturization and new technology innovation enablers to meet current and future SiP challenges.

Nozad Karim, VP - SiP & Electrical Engineering at Amkor Technology is the General Chair and will  present the opening keynote: "Past, Present and Future of SiP" from 8:00AM - 8:45AM on Tuesday, June 27th.

Steffen Krohnert, Director of Technology at NANIUM will present: "Fan-out SiP Solutions" from 2:00PM - 2:30PM on Tuesday, June 27th.

Amkor is a premier sponsor of this event and will be exhibiting with our technical staff on hand to answer questions and provide information on Amkor and NANIUM SiP solutions.

For registration and for more information on this event, please visit: http://www.imaps.org/sip/

To learn more about NANIUM, please visit: http://www.nanium.com/

 

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:: News from Palomar Technologies

Preventative Maintenance for SST Vacuum Furnace Tooling
The specialized semiconductor grade graphite tooling manufactured by SST Vacuum Reflow Systems can be used for many years with proper maintenance and procedures. What kind of maintenance? The following is a guideline to keep your tooling in the best shape possible. Read the full blog: http://www.sstinternational.com/blog/preventative-maintenance-for-sst-vacuum-furnace-tooling.

Subscribe to the PTI Blogs! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe
http://www.sstinternational.com/blog

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:: Master Bond Optically Clear UV Curable System Offers High Bond Strength and Fast Cures

Specially formulated to optimize bond strength, Master Bond UV15-42C is a UV curable system for bonding, sealing and coating applications. This smooth paste can be applied vertically without sagging. As an optically clear compound, it is often used in the fiber-optic, optical, electronic, aerospace and specialty OEM industries.

This one part system bonds well to a wide variety of substrates including glass, metals, composites, rubbers and most plastics. Adhesion to acrylic and polycarbonates is exceptional. UV15-42C also features a tensile strength of 5,000-6,000 psi and a tensile modulus of 250,000-300,000 psi at room temperature. Its toughness enables it to withstand thermal cycling as well as mechanical shock. UV15-42C is also resistant to chemicals such as water, oils, cleaning agents, acids and bases.

It cures readily in 10-30 seconds upon exposure to a UV light source emitting a 320-365 nm wavelength with an energy output of 20-40 milliwatts/cm2. UV15-42C is not oxygen inhibited and will cure in thicknesses up to ¼ inch. This electrically insulative, dimensionally stable system has low shrinkage upon curing.

UV15-42C is serviceable from -65°F to +300°F and is available for use in syringes and cartridges. It can also be purchased in ½ pint, pint and quart containers.

Master Bond Non-Drip Adhesives
Master Bond UV15-42C is an optically clear, toughened, UV curing system that bonds well to many substrates. This one part formulation is easy to handle with a non-sagging paste viscosity and rapid cures. Read more about Master Bond’s non-drip adhesives at http://www.masterbond.com/properties/non-drip-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

 

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:: News from Indium Corporation

Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.

Dr. Mackie’s presentation, Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications, will review changes foreseen for the automotive industry, their impact on electronics in automotive manufacturing, and how materials suppliers are rising to meet these challenges. Topics will include challenges that materials suppliers face when developing and testing materials for the automotive semiconductor assembly industry; high-temperature, Pb-free solder paste for die-attach in discrete components and modules; sintering materials for die-attach for wide-band gap (GaN and SiC) devices; and controlling bondline thickness in IGBT module die-attach using solder preforms.

Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.

Indium Corporation Expert to Present at IMAPS High Temperature Electronics Network (HiTEN) 2017

Indium Corporation’s Bernard Leavitt, Product Specialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom.

Leavitt’s presentation, Die-Attach Voiding Reduction in Gold Alloy Solder Preforms, discusses the changing requirements of high-temperature solders in RF and power semiconductor device assembly, as both power density and ratings of these devices increase. AuSn20 (Indalloy®182) has been the workhorse for high-temperature, high-reliability, small die-attach applications for many years. However, the gold-tin eutectic solder alloy is beginning to reach its utility limit. Leavitt will review the next options available to RF and power semiconductor manufacturers.

Leavitt is responsible for promoting and growing Indium Corporation’s product line for high-temperature applications. He works with the sales teams to identify current and potential customer accounts, and handles customer communications and product inquiries. Leavitt joined Indium Corporation in 2007. In 2010, he was promoted to Account Coordinator responsible for relationship management. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College.

Indium Corporation Features Gold-Germanium Solder Preforms at IMAPS High Temperature Electronics Network (HiTEN) 2017

Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom.

Semiconductor-grade preforms are designed to meet the challenges faced as RF and power semiconductor devices continue to get smaller.

Indium Corporation’s high melting point AuGe solder preforms perform well at the elevated operating temperatures of smaller dies with increased power densities. In addition, improvements in wetting make semiconductor-grade AuGe solder preforms critical for void reduction efforts.

Gold-based solders have a melting point ranging from 280-1064°C, making them compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation’s gold alloy solder preforms, visit www.indium.com/brazealloys.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Issue 209 ::
June 6, 2017

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services