Corporate Bulletin
:: Corporate Member News ::


DPC/GBC Premier Sponsor: ASE US, Inc.

:: Plan your time at Device Packaging - view the Final Program & Exhibitor Directory (full story)

:: View the Updated Floorplan (full story)

:: Thank you to all the 2017 SPONSORS (full story)

No Charge to Visit the Exhibit Hall - Get Registered

Tuesday, March 7, 2017 - 10:00 AM - 6:30 PM (Subject to Change)
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 8, 2017 - 10:00 AM - 4:00 PM (Subject to Change)
Lunch, and Breaks will be held in the Exhibit Hall

:: Palomar on Display Next Week - Recent PTI News (full story)

:: Micross invites you to visit us at IMAPS Device Packaging, Booth 45 (full story)

:: Materion Corporation Completes Heraeus Target Materials Acquisition - Learn More Next Week at Device Packaging (full story)

:: Strama-MPS Maschinenbau GmbH & Co. KG Acquires 100% of F&K Delvotec (full story)





AGC Electronics America

Booth# 36

AkroMetrix LLC

Booth# 28

AMICRA Microtechnologies GmbH

Booth# 27

Amkor Technology

Booth# 38


Booth# 47

ASM Pacific

Booth# 16


Booth# 29

Axus Technologies

Booth# 66 (TABLETOP)

Boschman Technologies / Advanced Packaging Center

Booth# 34

Cadence Design Systems

Booth# 50

Chalman Technologies

Booths# 2-3

DeWeyl Tool Company

Booth# 19

Dow Electronic Materials

Booth# 46

EMD Performance Materials

Booth# 37

EV Group

Booth# 24

Evatec AG

Booth# 49

F&K Delvotec

Booth# 13

FlipChip International

Booth# 63

Geib Refining Corp

Booth# 62

Hesse Mechatronics, Inc.

Booth# 1

HSIO Technologies

Booth# 12

i3 Electronics

Booth# 65

IBM Canada Ltd.

Booth# 11


Booth# 5


Booth# 26

JSR Micro, Inc.

Booth# 6

Kulicke and Soffa Industries, Inc.

Booth# 53

Kyocera America

Booth# 21-22

MacDermid Enthone Electronics Solutions

Booths# 7-8

Materion Corp.

Booth# 4


Booth# 23

Micro Systems Technologies

Booth# 14

Micross Components

Booth# 45

Mini-Systems, Inc.

Booth# 31

MRSI Systems

Booth# 44


Booth# 39


Booth# 61

Neu Dynamics Corp.

Booth# 59

NGK / NTK Technologies

Booth# 48

Nikon Precision Inc.

Booth# 20

PacTech USA Inc.

Booth# 60

Palomar Technologies

Booth# 51

Plasma Therm, LLC

Booth# 54

Riv, Inc.

Booth# 43

Rudolph Technologies, Inc.

Booth# 32


Booth# 9


Booth# 41

Shinko Electric America

Booth# 56

Sikama International, Inc.

Booth# 18


Booth# 33

SPTS Technologies, an Orbotech company

Booth# 42


Booth# 55

StratEdge Corporation

Booth# 10

Superior Silica, LLC

Booth# 52

Takaoka Toko Co., Ltd.

Booth# 40

Technic Inc.

Booth# 25

TechSearch International

Booth# 35

Teikoku Taping System Inc.

Booth# 17

TMS Representatives, LLC

Booth# 30


Booth# 57


Booth# 64

Yole Developpement

Booth# 15

Yxlon FeinFocus

Booth# 58



Advertisement: Smoltek

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


DPC/GBC Premier Sponsor: ASE US, Inc.

DPC Premier Gold Sponsor: Amkor Technology
DPC Premier Gold Sponsor: NAMICS
DPC Premier Gold Sponsor: Nanium
DPC Premier Gold Sponsor: Cadence


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: Palomar on Display Next Week - Recent PTI News

Where is the Future of the Semiconductor Industry Headed?
The semiconductor industry saw the highest-ever annual sales in 2016, totaling $338.9 billion, according to the Semiconductor Industry Association. An article in states that “while the industry as a whole may appear sluggish, there are solid opportunities waiting to be picked”, providing hope and optimism within the industry. John Nueffer, the president and CEO of the Semiconductor Industry Association, stated: “Market growth was driven by macroeconomic factors, industry trends, and the ever increasing amount of semiconductor technology in devices the world depends on for working, communicating, manufacturing, treating illness, and countless other applications”. Read the full blog:

Void-Free Eutectic Die Attach Solutions
SST International was acquired by Palomar Technologies as a partner in providing our customers with total solutions. There are many areas where our different capabilities complement each other. One area that both SST and Palomar concentrate on is void-free die attach. Also known as eutectic die attachvoid-free die and substrate soldering is key to the reliability of many advanced microelectronic products. This assembly process is used when heat must be transferred away from the die or other critical components to avoid thermal failure. The presence of voids increases the die operating temperature by inhibiting efficient heat transfer through the thermal interface material (TIM). Voids may be created by flux residue, surface oxides, trapped gas, and poor wetting. Read the full blog:


Why Upgrade from a 2200 to a SST 3130? From an Operator’s Perspective
In August last year, we discussed the life cycle cost savings that can be enjoyed by upgrading from old DAP 2200 series soldering furnaces. Saving money and having the peace of mind that comes from owning a reliable, well supported machine are important, but so are the performance enhancements you can use to support your customers’ requirements.

In this blog, we compare the specifications of the two system series so you can see the differences. Read the full blog:

Subscribe to the PTI Blog! Join the industry peers who already have!


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:: Micross invites you to visit us at IMAPS Device Packaging, Booth 45


Micross will be showcasing our extensive Packaging &Assembly capabilities plus our most recent development…innovative next-gen packaging solutions.

Learn more about how Micross can be your one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products. For the last 35 years+, we’ve been serving the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.



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:: Materion Corporation Completes Heraeus Target Materials Acquisition - Learn More Next Week at Device Packaging

Materion Corporation (NYSE:MTRN) announced today that it has completed the previously announced acquisition of the target materials business of the Heraeus Group, of Hanau, Germany, for approximately $30 million.

The acquisition strengthens Materion's position in precious and non-precious target materials for the architectural and automotive glass, photovoltaic, display and semiconductor markets. The business, now operating within the Materion Advanced Materials business segment, is expected to generate approximately $50 to $60 million in new value-added sales on an annualized basis and be accretive to 2017 earnings. Materion Advanced Materials reported value-added sales of $176.3 million in 2016.

Through this transaction, Materion's Advanced Materials segment gains target manufacturing capability in Europe, Asia and the U.S., as well as new technologies and a highly specialized workforce of 135 employees.

Donald G. Klimkowicz, President, Materion Advanced Materials, commented, "Beyond accelerating and solidifying our global materials offering in semiconductor and display, the acquisition provides diversification, critical mass and new opportunities in other growing target-related areas where Materion has not enjoyed as strong a position including glass and photovoltaic. This truly is a winning combination."

Added Materion Chief Executive Officer Richard J. Hipple, "This transaction is the latest in a series of advanced materials acquisitions made by Materion since 2005 to augment our growth and further our diversification into a leading advanced materials organization. I am very excited about the prospects for future growth that this acquisition brings us in existing and new markets, and how closely the values and culture of the Heraeus employees who join us match with our own. We welcome them to the Materion family."

Materion Corporation is headquartered in Mayfield Heights, Ohio. The Company, through its wholly owned subsidiaries, supplies highly engineered advanced enabling materials to global markets. Products include precious and non-precious specialty metals, inorganic chemicals and powders, specialty coatings, specialty engineered beryllium alloys, beryllium and beryllium composites, and engineered clad and plated metal systems.

             Media Contact:
Patrick S. Carpenter, 216-383-6835

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:: Strama-MPS Maschinenbau GmbH & Co. KG Acquires 100% of F&K Delvotec

Strama-MPS Maschinenbau GmbH & Co. KG (Strama-MPS), located in Germany, took over 100% ownership in F&K Delvotec. In 2014, Strama-MPS took over 51% of the company shares in F&K Delvotec with plans to fully acquire the company within three years. The synergies between the two companies are already proven with projects in the automotive EV market in Germany and the U.S. The acquisition enlarges access to a variety of markets, enabling a one-stop-shop solution for many large scale customers.

Mr. Herbert Wittl of Strama-MPS is now the CEO of F&K Delvotec as well as Managing
Director of Strama-MPS. Dr. Farassat, previous owner and CEO of F&K Delvotec, will
remain with the company until April 2017, lending his expertise and experience to
guarantee a smooth transition for both organizations. The F&K Delvotec brand name
and office locations in Germany, Singapore, China and the U.S., will remain unchanged.
The two companies are already working together in sales and marketing activities and
recently F&K started to use the perfect production capability of Strama-MPS in

Strama-MPS has been very successful in providing large and complex automation
solutions for various industry segments, especially in the highly demanding automotive
industry. F&K Delvotec provides highly regarded and leading-edge technologies in wire

Mr. Wittl said, “The cohesiveness between the two companies over the previous three
years has expanded our ability to be a single source supplier and we look forward to
providing more complex and more highly automated projects to world-wide customers
and help them stay ahead in their respective industries.”

About Strama-MPS
Strama-MPS, a technology leader, develops custom machines and complete solutions
as a single-source supplier, offering complete solutions in the automotive industry and
automotive supply industry. Strama-MPS offers customized developments for special purpose machine manufacturing and supplies custom tailored solutions in the following
sectors: assembly and testing technology, machining centers, test rigs, body-in-white,
and cleaning machines. Besides locations in Germany, there are production facilities in
Croatia and Bosnia. In China, India, the U.S. and Mexico are sales, service and
production locations to meet customer requirements for a global foot-print. In total
Strama-MPS group has 1,200 employees. For more information, please visit

About F&K Delvotec
F&K Delvotec is the worldwide leader in innovative wire bonding technology. F&K
Delvotec’s expansive portfolio of products deliver intelligent one-stop shop solutions for
any wire bonding application, from lab bond process development to completely
automated systems. Over 40 patents in wire bonding technology, and award-winning
new products and customer satisfaction, attest to the continuing emphasis on providing
innovative solutions that drive the industry forward. Whatever bonding is required, F&K
Delvotec delivers smart technology that follows the "staying ahead" philosophy that is
the heart of the company. F&K Delvotec's main office is in Germany, with satellite offices
in Singapore and the U.S. For more information, please visit

Steven Buerki
F&K Delvotec, Inc.
27182 Burbank
Foothill Ranch, CA 92610
Ph: 949-595-2200

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:: Issue 203 ::
March 3, 2017

Panel Session organized by YOLE


Gannon & Scott



Oneida Research Services