Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Materion

:: Recent PTI News (full story)

:: News from Master Bond (full story)

:: NEW Cost-effective Solutions for Conformal Coating (full story)

:: STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments (full story)

:: Kester Launches WP601-ZH Solder Paste (full story)

:: Indium Corporation Promotes Macartney IV to Manager, Global Channel Programs and Welcomes Twining as Vice President, Marketing (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Raytheon

Palomar

Promex

Specialty Coating Systems

 

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Recent PTI News

Low or High Production Volumes with Assembly Services or Fabrinet
Palomar has had successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual customers to provide equipment and developed processes to successfully transition into manufactured goods. Many of these products started as prototypes in Palomar Technologies' Assembly Services department where the designs were validated for functionality. These were then further refined through pilot builds to include DFM (designed for manufacturability) changes. We learn much about a product when we build the first ten; we learn much more when we build the next 100 to 1,000 pieces. This is the time that we start understanding how to tweak the design and processes to make it easier, quicker and cheaper to produce. Read the full blog: http://www.palomartechnologies.com/blog/low-or-high-production-volumes-with-assembly-services-or-fabrinet.

Vacuum Reflow System Basic Processing Techniques
Typical applications for the family of SST Vacuum Reflow Systems are: Package Assembly, Lid Attach, Die Attach, Glass to Metal Seals, and Brazing. These process profiles share a common sequence. Most process cycles begin by removing as much of the ambient atmosphere as possible and diluting what remains with an inert gas. Vacuum is turned on until the chamber reaches a low pressure. Inert gas, usually dry nitrogen, is then introduced into the chamber. This vacuum/pressure step can be repeated to further increase the cleanliness of the sealing environment and reduce the overall moisture level. Read the full blog: http://www.sstinternational.com/blog/vacuum-reflow-system-basic-processing-techniques.

SST Vacuum Reflow Systems Introduces Model 518 Vacuum/Pressure Furnace
Today, SST Vacuum Reflow Systems announced the introduction of a new vacuum/pressure reflow system – Model 518. The new Model 518 rounds out SST’s range of radiant heated vacuum/pressure reflow furnaces. Positioned between the existing Model 1200 table top and Model 5100 production level furnaces, the 518 provides the right combination of features and value to create void-free, flux-free microelectronics packages. Read the full blog: http://www.sstinternational.com/press-releases/sst-vacuum-reflow-systems-introduces-model-518-vacuum/pressure-furnace.



Palomar

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:: News from Master Bond

Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation

Placing an emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that doesn’t require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity.

Suitable for a variety of bonding, sealing and coating applications, MasterSil 705TC delivers thermal conductivity of 14 BTU·in/(h·ft²·°F) or 2.1 W/m·K and retains its electrical insulation properties. This system can also withstand temperatures ranging from -60°F to 400°F. It adheres well to metals, composites and many plastics. As a silicone based system, MasterSil 705TC is also flexible and offers a degree of reworkablity.

Master Bond

This off-white colored silicone is available in 130 gram (100 cc) tubes and has a shelf life of 6 months at room temperature.

Master Bond One Component Silicones

MasterSil 705TC is thermally conductive and electrically insulative for bonding, sealing and coating applications. This single component system is easy to handle, cures readily at ambient temperatures and eliminates the need for mixing and. Read more about Master Bond’s one part silicones at http://www.masterbond.com/products/one-part-silicone-adhesives-sealants-and-coatings or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

 

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:: NEW Cost-effective Solutions for Conformal Coating

GPD

GPD Global introduces its NEW Conformal Coating System (SimpleCoat), an Inline and Cost-effective Conformal Coating System with full featured programming - making conformal coating processes quick and easy.

 

SimpleCoat is a robust, 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform for inline conformal coating processing with SMEMA Communication.
GPD
GPD This Conformal Coating System incorporates a spray valve with a 10 mm conical spray needle dispense valve and Luer tip for selective coating. In addition, the equipment also includes external reservoir fluid feeding, nozzle park area with solvent, fume extraction, and a pin chain conveyor.
GPD SimpleCoat is driven by powerful programmable software and stepper motors. A laptop interface simplifies the design and application of conformal coating at all levels. Programming this machine is simple and can be done either by manually teaching the machine a program or by using a digital image (JPG) of a PCB. All parameters, such as pump parameters and motion parameters, can be easily altered. Various shapes, patterns, and areas can also be programmed.

 

For more information, see Conformal Coating System data sheet. Contact us at request@gpd-global.com  or call +1.970.245.0408 to learn about our exceptional pricing.

About GPD Global
GPD Global is an equipment manufacturer of high-quality, precision, automated fluid dispensing, conformal coating, and component-prep machines and systems. The company is an international, state-of-the-art equipment supplier for the PCB assembly and semiconductor industries. We design and manufacture a wide variety of Automatic Fluid Dispensing and Conformal Coating Systems. We also manufacture an SMT Cover Tape Peel Tester and Component Prep equipment for Thru-Hole applications.

 

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:: STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments

In March, STATS ChipPAC announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). In high volume production for over seven years, STATS ChipPAC has led the industry in FOWLP technology innovations and unit shipments.

FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package. STATS ChipPAC has a comprehensive portfolio of eWLB package designs, including small die, large die, multi-die, multi-layer, Micro-Electro-Mechanical Systems (MEMS), 2.5D and 3D Package-on-Package (PoP) and System-in-Package (SiP) architectures. A number of eWLB technology milestones have been driven by STATS ChipPAC such as dense vertical interconnections as high as 500 – 1,000 I/O, very fine line width and spacing down to 2um/2um and ultra-thin package profiles below 0.3mm (including solderball) for single packages and below 0.6mm for a stacked PoP with proven warpage control.

Although there are multiple variations of fan-out packaging in development in the industry, eWLB is the only FOWLP solution in the market today that has been in high volume manufacturing for over seven years. STATS ChipPAC has been instrumental in driving important optimizations in the manufacturing process and infrastructure. The eWLB manufacturing process has evolved into the innovative FlexLineTM manufacturing method which was introduced and implemented by STATS ChipPAC in 2014. The FlexLineTM method delivers unprecedented flexibility in producing both fan-out eWLB and fan-in wafer level chip scale packages (WLCSP) on the same manufacturing line for higher economies of scale and lower cost.

Currently all leading mobile products as well as some consumer electronics contain eWLB packages that are baseband processors, RF transceivers, connectivity devices, near field communication (NFC), security devices, MCUs, memory, memory controllers, RF MEMS and power management ICs (PMICs). The compelling performance, integration and size advantages of eWLB are also accelerating customer adoption in new and emerging market segments such as the Internet of Things (IoT), wearable electronics, millimeter wave (mmWave) technology for 5G wireless devices, MEMS and sensors, and automotive applications such as Advanced Driver Assistance Systems (ADAS).

For more information, visit www.statschippac.com.

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:: Kester Launches WP601-ZH Solder Paste

Kester is proud to announce the launch of WP601-ZH, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.

For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/wp601-zh-solder-paste.

For any questions or additional information, please contact: Fil Marcial, Global Product Manager at fmarcial@kester.com.

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:: Indium Corporation Promotes Macartney IV to Manager, Global Channel Programs and Welcomes Twining as Vice President, Marketing

Indium Corporation Promotes Macartney IV to Manager, Global Channel Programs

Indium Corporation has named Bill Macartney IV as Manager, Global Channel Programs.
Indium Macartney is responsible for managing Indium Corporation’s global sales channel programs, including executing program strategies and developing tactical plans to enhance the sales channel program. His duties will include developing and implementing communication tools, and implementing product and program training.
 Macartney joined Indium Corporation in 1996 and has served in several roles, including most recently as the Rocky Mountain Regional Sales Manager. Macartney earned his bachelor’s degree in history from Trinity College in Hartford, Conn. He has been a member of the SMTA since 1997 and has served three terms as a board member for regional SMTA chapters in the Silicon Valley and Orange County. Macartney also serves as an officer for Indium Corporation & Macartney Family Foundation, Inc.
 Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Indium Corporation Welcomes Twining as Vice President, Marketing
Indium Corporation has hired Tim Twining as the company’s new Vice President, Marketing.
IndiumTwining is responsible for leading the development, implementation, and oversight of Indium Corporation’s market strategies.
Twining has extensive global sales and marketing experience in industrial, business-to-business, and manufacturing environments. As part of his extensive career, he has lived and worked in England, Russia, Singapore, and the USA.
Twining earned a bachelor’s degree in Mechanical Engineering from the University of Minnesota and an MBA with a concentration in finance from the University of St. Thomas in Minneapolis, Minn.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Issue 204 ::
March 17, 2017

STATSChipPAC

Gannon & Scott

Kester

Metallix

Oneida Research Services