Corporate Bulletin
:: Corporate Member News ::

:: TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential (full story)

:: Master Bond One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications (full story)

:: GPD Global Offers Cost-Effective Conformal Coating System (full story)

:: Indium Corporation Announces New Corporate Leadership (full story)

:: News from Technic (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors.  Standard FO-WLP has experienced a few bumps on the road to higher volumes this year.  Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next.  While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity.  FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP.  Adoption of fan-out on substrate for high-performance applications is expanding. 

With the continued quest for lower cost packaging, promoters of panel-level FO-WLP in a variety of formats are receiving greater attention.  Supplier panel production plans are highlighted. 

The Advanced Packaging Update features special coverage of OSAT financials for the first half of the year.  Revenues for the top 20 OSATs in the fist half of 2017 are presented and an analysis of the strength of the top 10 are discussed.  Electronics industry growth drivers are discussed and the global economic outlook is presented.  A section on trends in copper clip packaging includes a market forecast for QFNs with Cu clip.  Material developments for Pb-free clip attach are discussed.  The report also examines trends in connectivity modules with a focus on Wi-Fi modules.  This latest Advanced Packaging Update is a 38-page report with full references and an accompanying set of 35 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services are offered.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or visit  Follow us on twitter  @Jan_TechSearch
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:: Master Bond One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries. This system fully passes ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments.

As a toughened epoxy, Supreme 12AOHT-LO resists rigorous thermal cycling and shocks over the wide service temperature range of 4K to +500°F. It offers high thermal conductivity of 9-10 BTU•in/ft2•hr•°F and is a competent electrical insulator.

It bonds well to an array of substrates including metals, composites, glass, rubbers, ceramics and many plastics. This compound delivers high tensile lap shear, compressive and peel strengths exceeding, 3,500 psi, 22,000 psi and 5-10 pli, respectively. It is dimensionally stable and has low shrinkage upon cure. Supreme 12AOHT-LO is resistant to a variety of chemicals, particularly to water, oil, fuels and solvents.

Supreme 12AOHT-LO is a thixotropic paste with a smooth consistency that is easy to handle. As a single component epoxy, it doesn’t require any mixing and offers an “unlimited” working life at room temperature. It cures rapidly at elevated temperatures. This gray colored system can be stored at ambient temperatures, but maximum shelf life is achieved when it is refrigerated at 45-55°F. Supreme 12AOHT-LO is available in syringes, ½ pints, pints, quarts, gallons and 5 gallon containers.

Master Bond Adhesives for Aerospace Applications
Supreme 12AOHT-LO is thermally conductive, electrically isolating epoxy offering high strength, cryogenic serviceability and NASA low outgassing approval. This one component epoxy is well suited for a variety of bonding and sealing applications in the aerospace industry. Read more about Master Bond’s systems for aerospace at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

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:: GPD Global Offers Cost-Effective Conformal Coating System

Conformal Coating Machine with Excellent Repeatability

GPD Global, manufacturer of high quality precision fluid dispensing systems, conformal coating and component prep systems offers a cost-effective automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!

SimpleCoat is a NEW low cost, inline, simple Conformal Coating System with full featured programming making the conformal coating processes quick and easy to set up. It is ideal for selective conformal coating and dispensing applications that require a high level of accuracy & repeatability.

This coating machine is equipped with a robust 3-axis motion platform that, in the base configuration, includes a spray valve and a needle valve.  An optional volumetric pump may be used in place of the needle valve.

SimpleCoat works with a customer-supplied laptop computer.  Programming of this conformal coating system is easy and can be done either by manually teaching a program or by using a JPG image. All dispense and motion parameters can be easily altered with the easy-to-use interface. Various shapes, patterns, and areas can also be programmed.

This video demonstrates Spray and Dispense process with HumiSeal 1B31.
Standard Features of the SimpleCoat Conformal Coating System base model:

  • Reliable XYZ Motion System
  • Full featured Programing, including teach from .JPG
  • Inline Operation with SMEMA Communication
  • Spray and Needle Valve
  • Purge and Solvent Cups
  • Stainless Steel Surfaces
  • Bottom Side Fume Extraction with Exhaust Flow Sensor
  • Two 300 ml Cartridges for Fluid Feeding
  • Internal Black Light for Coating Inspection
  • Keyed maintenance Mode
  • Light Tower

You can also enhance the Conformal Coating process with add-on options:

  • Low level Material Sensor
  • Large Volume Reservoir
  • Stand-alone Configuration
  • Volumetric Pump
  • Multiple Reservoirs

GPD Global is an equipment manufacturer of high quality, precision, automated fluid dispensing, conformal coating & component-prep systems. The company is an international, state-of-the-art equipment supplier for the PCB assembly and semiconductor industries. We design and manufacture a wide variety of Automatic Fluid Dispensing & Conformal Coating Systems. We also manufacture SMT Cover Tape Peel Tester and Component Prep equipment for Thru-Hole applications.

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:: Indium Corporation Announces New Corporate Leadership

Greg Evans Named CEO, Ross Berntson Promoted to President and COO

Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.

Evans has been with Indium Corporation for 36 years. He began as a Technical Support Engineer and quickly rose to Product Line Manager, helping expand the company’s product lines into the SMT assembly field. As Division Director for Indium Corporations electronics assembly materials, he guided the steady growth of the solder paste product line and instituted a formal corporate R&D function. Evans eventually became the VP of Manufacturing and Sales, overseeing the expansion of the company’s manufacturing footprint and sales structure in the UK, Singapore, China, South Korea, and Malaysia, and addressing the growing global demand for Indium Corporation products. Evans was named President and COO in 1997, leading the company’s growth from dozens of people to over 800 and from one factory in Utica, N.Y. to 12 facilities, worldwide. Under his leadership, Indium Corporation has earned numerous awards, honors, and recognition due to the strengthening of corporate culture and performance.

Evans earned his AAS in Engineering Science from Mohawk Valley Community College, his BS in Chemical Engineering from Clarkson University, and his MBA from Rensselaer Polytechnic Institute.

“Greg’s leadership has propelled Indium Corporation to the position of more than just an electronics assembly materials manufacturer and supplier of choice, but also an employer of choice,” Macartney III said. “I very much look forward to continuing our close work together as we spend many more years dedicated to the success of Indium Corporation and strengthening the company. Together, we are equally dedicated to the success of each member of the Indium Corporation family, and will work to secure our futures, achieve everyone’s potential, and uphold our company culture – The Indium Way.”

As CEO, Evans will focus, primarily, on the company’s long-term mission and strategies. His work will ensure the ongoing growth and vibrancy of Indium Corporation.

Berntson joined Indium Corporation in 1996 as a product specialist. He quickly rose to the roles of product manager, marketing leader, sales leader, tech support leader, and, most recently, as Executive Vice President. Berntson is an active member of numerous industry organizations, including IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in business administration and a bachelor’s degree in chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.


“Over the past 20 years, Ross has been intelligent and strategic in his results-driven approach to leadership at Indium Corporation,” Evans said. “I look forward to continuing to work alongside Ross as we further secure Indium Corporation’s position as the global leader in quality electronics assembly materials and technical support.”

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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:: New Product Announcements from Technic

New Product Announcement
Experimental Silflake 144

Technic EPD has announced the release of Experimental Silflake 144, a new highly engineered silver flake. The flake is mechanically flattened, and has specific physical and chemical properties to satisfy a wide range of applications. The applications include conductive inks, epoxies, and adhesives. This flake can also be used to cover broad range areas or shiny surface finishes.

The flake exhibits a large D50 particle size of 12.0 to 18.0 micron, a tap density of 2.0 to 4.5 g/cm3, with a specific surface area of 0.25 to 0.75 m2/g and a weight loss at 538ºC of less than 0.6%. Benefits of the flake are a large partical size making it a great product for shiny surface finshes and covering broad range areas. Please contact Technic via email,, or phone, 401-769-7000, with any questions.

Technic Releases TechniStrip® NI555
New, Complete Dissolution, High-Speed Photoresist Stripper

Technic has announced the release of TechniStrip® NI555, a new photoresist stripper specially formulated to achieve complete dissolution of AZ15nXT and AZnLOF 2000 series photoresists.

TechniStrip® NI555 is the only commercially available photoresist stripper that provides fast and complete dissolution of today’s advanced photoresists. Unlike current materials used for photoresist stripping such as NMP, DMSO, and TMAH which cannot fully dissolve this kind of photoresist, TechniStrip® NI555 operates with a unique blend of acidic based solvents that offer fast and complete dissolution without the use of toxins.

AZ15nXT - 7µm on Si/InP
Left: Incomplete dissolution with NMP/TMAH
Right: Complete dissolution with NI555

TechniStrip® NI555 also offers a superior metal compatibility, longer bath life and can be used in a variety of production tools including immersion systems, soak & spray, and batch spray.

As feature sizes continue to decrease there is an increased demand on photoresist companies to supply products that provide optimum sidewall profiles and good adhesion to the substrate in order to withstand an aggressive plating process. Amplifying the resist to provide these properties often makes them difficult to remove. Traditional photoresist strippers struggle to dissolve these products and can leave behind debris that may cause problems in subsequent processes resulting in wafer defects. Only TechniStrip® NI555 completely dissolves these new resists without the use of toxic solvents, eliminating the risk of downstream problems.”

  • Anthony Gallegos, Global Product Manager, Semiconductor Technology

Technic’s semiconductor fabrication and packaging chemistries, marketed under the name Elevate®, are well respected for innovation and high quality. Elevate® processes offer high performing electroplating chemistries for copper, nickel, tin, and precious metals. Technic also manufactures a complete line of photoresist cleaners, strippers, and etchants under the names TechniClean, TechniStrip®, and TechniEtch.

About Technic
Technic Inc. is a Rhode Island based corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

Learn more at or contact us at (401) 781-6100.

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:: Issue 217 ::
November 21, 2017


JC Cherry