Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Kester Launches Robotic Cored Wire (full story)

:: Master Bond Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications (full story)

:: Recent Palomar Technologies News (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Kester Launches Robotic Cored Wire

Kester is proud to announce the launch of 268 Flux-Cored Wire, a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based systems. 268 provides a clean release which prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results in a clear post-soldering residue without the need for cleaning.

For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/268-flux-cored-wire.

For any questions or additional information, please contact: Chad Showalter, Global Product Manager at cshowalter@kester.com.

 

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:: Master Bond Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bonding, sealing, coating and encapsulation applications in the medical device industry. This two component epoxy system withstands a variety of sterilization methods, including EtO, radiation and many cold sterilants.

EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good flow properties. It bonds well to metals, composites, glass, ceramics, plastics and many rubber materials. This dimensionally system offers a high tensile modulus of 450,000-500,000 psi, a compressive strength exceeding 18,000 psi and very low shrinkage upon curing. EP21AOLV-2Med’s viscosity and low coefficient of thermal expansion enable it to be suitable for potting and encapsulation applications. It also resists many chemical including water, oils and fuels. This medical grade product is serviceable over the temperature range of -60°F to +250°F.

Featuring a one to one mix ratio by weight, a 100 gram batch of EP21AOLV-2Med has a working life of 4-6 hours at room temperature. Part A is gray and Part B is off-white, which further simplifies mixing. It can be easily applied with a spatula, knife, trowel, brush or paint roller.

This system cures at room temperature or more rapidly with the addition of heat. EP21AOLV-2Med has a shelf life of 6 months in its original, unopened containers and is available in ½ pint kits, pint kits, quart kits, gallon kits and 5 gallon kits.

Master Bond Electrically Insulative Epoxy Systems
Master Bond EP21AOLV-2Med meets USP Class VI and ISO 10993-5 specifications for medical device applications. It is thermally conductive and a competent electrical insulator. Read more about Master Bond’s electrically insulative systems at http://www.masterbond.com/properties/electrically-insulative-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

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:: Recent Palomar Technologies News

Pattern Recognition Software that Works Like the Human Eye and Brain
Standard bonding machine pattern recognition vision systems today determine their location based on a “pixel to pixel” matching system. Standard bonding vision systems look for similarities based on the pixel grid of the part as seen through the camera. The standard software uses that pixel-to-pixel matching to reference the part. The limitations of the standard software is that it is very sensitive to changes in light, differences in coloration of parts, and especially inefficient when dealing with poor materials (which can be caused by different chips from different suppliers, or variations in chip fabrication). These limitations prevent the bonder from “capturing” the part reference when it does the bonding. When part capture fails, this requires the operator to manually reference the part. The operator must look through the microscope and one-by-one manually reference the part. When the operator has to manually reference, the process becomes extremely tedious and time consuming and gives away some of the automation power of the machine. Also, the customer often has to throw away parts that are too difficult to see, reducing the yield of the bonder and increasing the cost of building the part. If all parts were perfect, the standard vision system would be sufficient every time. However, all parts are not perfect and variations are to be expected.

Read the full blog: http://www.palomartechnologies.com/blog/pattern-recognition-software-that-works-like-the-human-eye-and-brain.

New Advances in Ultra-Short Bond Span and Ultra-Low Loop Profile
The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential grow in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for RF base stations modules and optoelectronic modules; associated assembly and test instruments also continue to advance in bandwidth to allow engineers to efficiently build a system and validate its performance. Among all packaging technologies, wire bonding technology has made it possible for reliable interconnection and keeps advancing to push the practical limits forward.

Read the full blog: http://www.palomartechnologies.com/blog/new-advances-in-ultra-short-bond-span-and-ultra-low-loop-profile.

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:: Issue 216 ::
November 3, 2017

Nordson ASYMTEK

JC Cherry