Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Thank you to all the IMAPS 2017 Exhibiting Companies - View the List & Plan Your Visit! (full story)

:: View the Full Exhibit Directory and Floor Plan to Learn more about the IMAPS 2017 before you arrive next Week! (full story)

:: Register for your complimentary Exhibits Only Visitor Pass to visit the vendors, listen to the keynotes, have some fun at the welcome reception, and network! (full story)

:: Download and Review the Final Program (full story)

:: Recent Palomar Technologies News (full story)

:: Technic Announces Release of Experimental Silflake 608 (full story)

:: GPD Global to Exhibit at IMAPS 2017 with the Latest Dispense Technology for Integration and Retrofit (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials
Premier Tech Sponsor - Amkor Technology
Event Sponsors:
Keynote Sponsor:

Keynote Sponsor: SAMTEC

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

Student Programs Sponsor:

Honeywell - Student Programs Sponsor

Student Programs Sponsor:

Applied Materials - Keynote Sponsor
Bag Insert Sponsor:

Bag Insert Sponsor: ASE Group
Panel Wine Reception Sponsor:

Wine Reception Sponsor: Nagase America Corp.
   
Golf Sponsors
EMD Performance Materials - Corporate Sponsor
Technic - Golf Hole Sponsor
Stellar Industries - Golf Hole Sponsor
Golf Hole Sponsor: 
Advance Reproductions
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Chip Scale Review
     

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Recent Palomar Technologies News

Capabilities for Gold Ball Bumping Die

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked bumps) on each interconnect location on a die. Palomar Technologies’ standard process makes a bump where the top height is about 60% of the bump diameter. The bump shape could best be described as a flattened “Hershey Kiss”. This shape works very well for thermosonic flip chip attach processing. The smaller top diameter is about the diameter of the wire used and is much more easily deformed during the attach process than a flat “pancake” bump would be. This allows for looser top height variations than would be required for a flat bump. Read the full blog: http://www.palomartechnologies.com/blog/capabilities-for-gold-ball-bumping-die

Ball and Wedge Bonders & Loop Mode Development
The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” to accommodate various process situations and achieve various wire loop profiles.
On Palomar wire bonders, these “loop modes” represent the type of wire to be executed. For loop modes that represent two-bond wire types, the loop mode indicates the type of motion profile that will be executed by the real-time controller between the first bond and the second bond. For loop modes that represent single-bond wire types, such as stitch-off and ball bumps (on the 8000i Ball Bonder), the loop mode represents the different approaches to preparing or completing the wire for the single-bond type. Read the full blog: http://www.palomartechnologies.com/blog/ball-and-wedge-bonders-and-loop-mode-development.

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

   ^ Top

:: Technic Announces Release of Experimental Silflake 608

Technic EPD has announced the release of Experimental Silflake 608, a new highly engineered silver flake. The flake is mechanically flattened, and has a residual lubricant that works well in most polymeric systems. The applications include a wide variety of conductive adhesives, die attach polymeric and thermally conductive applications.

The flake exhibits a D50 particle size of 5.0 to 8.0 micron, a high tap density of greater than 5.0 g/cm3, with a specific surface area of 0.1 to 0.3 m2/g and a weight loss at 538ºC of less than 0.3%. Benefits of the powder are a high packing density making it a great product for thermally conductive applications. Please contact Technic via email, info@technic.com, or phone, 401-769-7000, with any questions.

About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more at www.technic.com or contact us at (401) 769-7000.
Customer Satisfaction Survey
Technology Support Hub
Mazerustar Mixers

   ^ Top

:: GPD Global to Exhibit at IMAPS 2017 with the Latest Dispense Technology for Integration and Retrofit

GPD Global, a manufacturer of high quality precision fluid dispensing systems, conformal coating and component prep systems will exhibit at the upcoming IMAPS 2017. The Expo is scheduled to take place October 10-11 at Raleigh Convention Center in Raleigh, North Carolina.

At booth# 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.

Furthermore, GPD Global manufactures a selection of fully automated fluid dispensing systems to meet high production demands and development versatility.

Stop by booth#244. Experts are there to discuss your production needs. Whether your project requires a pump for retrofitting an existing dispense system or a fully automated dispensing system, coating or component preparation, we have a solution for you.

More information, visit www.gpd-global.com

   ^ Top

 

 

 

View the Corporate Bulletin Archives

 

 


:: Issue 215 ::
October 3, 2017

Nordson ASYMTEK

JC Cherry