Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Micross Launches New Website at www.Micross.com (full story)

:: Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronics Industry (full story)

:: Torrey Hills Technologies Offers Unprecedented 5-Year Warranty for Its Thick Film Furnaces (full story)

:: News from MRSI (full story)

:: Indium Corporation Features InFORMS Reinforced Solder Ribbon for Automated Assembly at IMAPS 2017 (full story)

:: Technic Engineered Powders Division Introduces Two New Powders (full story)

:: Recent Palomar Technologies News (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

ASE Group

Kyocera

MRSI Systems

Palomar

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Micross Launches New Website at www.Micross.com

Micross is excited to unveil their newly redesigned website. The new www.micross.com streamlines navigation and offers quick & easy access to Micross’ vast capabilities and comprehensive portfolio of semiconductor solutions to better serve our customers.  It will be updated frequently with added product & service capabilities, enhanced search/filter functionality as well as conferences and other releases.  

In addition, our social media presence has been expanded: 

  • Follow us on Twitter @Microsscomps
  • Connect with Micross on LinkedIn
  • Like Microsscomps on Facebook

Visit www.micross.com to learn how Micross can be your one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle. For the last 35 years+, Micross has been serving the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets.

Email: onesource@micross.com
Request Info: https://www.micross.com/contact-us/request-info/
Request A Quote: https://www.micross.com/contact-us/request-a-quote/

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:: Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronics Industry

New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications. Convenient, efficient and reliable packaging options are also reviewed.

Products are available as liquids, pastes, films and preforms. Electrically insulative, thermally conductive and electrically conductive grades are listed. Pertinent mechanical, electrical, thermal and chemical resistant properties are shown. Additionally, information is provided on viscosity, cure speed, working life, color, etc.

This catalog is available for immediate download in PDF format or in print. They can be requested at http://www.masterbond.com/catalog/adhesives-electronic-applications.

Master Bond Catalog Library

Master Bond features convenient, user friendly catalogs for the medical industry, oil and chemical processing and electronic applications. Request copies or download digital versions at http://www.masterbond.com/catalog. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: marketing@masterbond.com.

CONTACT
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: +1-201-343-8983
Fax: +1-201-343-2132

MASTER BOND INC
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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:: Torrey Hills Technologies Offers Unprecedented 5-Year Warranty for Its Thick Film Furnaces

Torrey Hills Technologies, LLC (THT) will begin to offer an industry leading five-year warranty for all of their thick film furnaces installed in North America. That is 500% of THT competitors’ warranty.

THT has absolute confidence in the quality and durability in every new thick film furnaces installed. It firmly believes that customers deserve the peace of mind against unforeseen furnace service and repairs. This warranty covers defects in material and workmanship for a period of five years from the date of installation by the end user.

"We want to shield our customers against unexpected repair bills," said Ken Kuang, president of THT. "They will feel assured knowing that their equipment is protected under a warranty that is top in the industry, structured as solid as our furnaces."

In the rare case that a customer needs to use the warranty, THT trained service technicians will repair qualifying thick film furnaces to precise THT standards and requirements. The above stated warranty does not apply to products that have failed due to improper installation, misuse, alteration, unauthorized repair or modification. All implied warranties, if any, are limited in duration to the above stated five-year warranty period.

Torrey Hills Technologies, LLC (http://www.beltfurnaces.com) develops and delivers quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to mixing equipment and furnace equipment manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.

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:: News from MRSI

MRSI Systems Launches HIgh Speed Die Bonder for Photonics High Volume Manufacturing

MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to customers worldwide.

Scaling Imperatives

Our customers need to scale up manufacturing to unprecedented levels for advanced applications such as data center, telecommunication upgrades to 100G+, 5G wireless, IoT, and advanced optical sensors. Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands a die bonding system that can deliver industry leading speed without sacrificing high precision and superior flexibility. Our new MRSI-HVM3, a high speed, flexible, 3 micron die bonder, has been built to address this challenge. This new system leverages a well-defined set of MRSI’s core competencies, built up over 30 years, in the areas of system design, software development, machine vision, motion control, industrial automation, and process solutions.

Customer Outcomes

As Dr. Yi Qian, Vice President of Product Management, states, “The new MRSI-HVM3 incorporates the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all products, MRSI’s platform software makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine. Ultimately the system will generate great ROIs for customers. The MRSI-HVM3 high speed die bonder supports many applications including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB).”

“MRSI Systems has been serving optoelectronic and microelectronic customers for the past 33 years and understands their requirement to scale efficiently in today’s fast paced marketplace. MRSI is pleased to meet these needs with the launch of our new high speed die bonder for high volume manufacturing of photonics packaging,” said Mr. Michael Chalsen, President, MRSI Systems.

Private Demonstrations at CIOE

MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 performing CoC eutectic and epoxy bonding. Please reach out to your MRSI contact to ensure you have an opportunity to see the capabilities of this exciting new product.

MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017

MRSI Systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017.  This year 3,000 exhibitors and 60,000 professionals are expected to attend including world leading optoelectronic manufacturers to showcase their latest products and technologies. MRSI Systems will be offering private demonstrations of our new product MRSI-HVM3. We will demonstrate the MRSI-HVM3 completing chip on carrier (CoC) eutectic and epoxy bonding. Please contact MRSI, if you are attending the show, to ensure you have an opportunity to see the capabilities of this exciting new product.

MRSI Systems offers a new 3μm die bonder for high volume manufacturing of photonic, sensor, and semiconductor devices. The system delivers industry leading speed without sacrificing high precision and superior flexibility by incorporating MRSI’s latest hardware and software innovations.  These benefit customers with best-in-class throughput for capacity expansion, high accuracy for advanced high density product packaging, and unmatched flexibility for multi-chip production in one machine.

For over 33 years, MRSI Systems has been a strong advocate for developing laser technologies and expanding laser applications for new markets. This year we are pleased to sponsor “The 1st Executive Forum on Laser Technologies” September 6-7, 2017 during CIOE. We are looking forward to discussing, with worldwide industrial and academic leaders, new laser technologies and applications in communications, sensors, industrial and other emerging areas. Learn more about the forum.

About MRSI Systems

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. Our headquarters is located in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States.
For more information visit: www.mrsisystems.com.

 

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:: Indium Corporation Features InFORMS Reinforced Solder Ribbon for Automated Assembly at IMAPS 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 50th Anniversary Symposium, Oct. 10-12, in Raleigh, N.C.

Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:

  • Increases lateral strength
  • Maintains bondline co-planarity
  • Improves thermal cycling reliability

For more information about InFORMS, visit www.indium.com/inform.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Technic Engineered Powders Division Introduces Two New Powders

Technic Engineered Powders Division Introduces Silpowder 590

Technic EPD has announced the release of Silpowder 590, a new highly engineered powder designed primarily for the photovoltaic industry. The powder has a spherical morphology, narrow particle size distribution, and functional surfactant that is compatible with most fired ink systems.

This powder has a narrow particle size distribution with D10 at 1.1 microns, D50 at 1.7 to 2.2 microns, and D90 at 3.4 microns. The tap density ranges from 4.5 to 5.5 grams per cubic centimeter,  with a specific surface area of 0.3 to 0.5 meters squared per gram and a weight loss at 538ºC of less than 0.8%.

Technic Engineered Powders Division Introduces Experimental Platinum Powder 700

Technic EPD has announced the release of Experimental Platinum Powder 700.  It is a high purity, chemically precipitated platinum powder designed primarily for various high-fired applications. The end uses include ceramic thick film inks, catalysts and medical.  

The powder exhibits a D50 particle size of 8.0 to 13.0 micron, a tap density of 3.0 to 5.0 g/cm3, with a specific surface area of 1.5 to 2.4 m2/g and a weight loss at 538ºC of less than 0.6%. Benefits of the powder are the spherical morphology and high packing density.

Please contact Technic via email, info@technic.com, or phone, 401-769-7000, with any questions.

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:: Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies

The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which Palomar Technologies focuses. In fact, some of the most challenging photonic assemblies produced today are manufactured by Palomar. In a recent webinar presented by our Chief Technical Officer, Dan Evans discussed his technical paper diving deeper into this market: “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies”. Read the full blog: http://www.palomartechnologies.com/blog/active-optical-cable-transceiver-packaging-trends-and-die-bonding-case-studies.

Subscribe to the PTI Blogs! Join the industry peers who already have!
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:: Issue 213 ::
September 1, 2017

Nordson ASYMTEK

JC Cherry