Corporate Bulletin
:: Corporate Member News ::

:: Quik-Pak Installs New QFN Production Line in San Diego (full story)

:: Micro Systems Technologies at IMAPS 2017 in Raleigh (full story)

:: Technic Releases TechniFlex LCL1000F/423M (full story)

:: News from Indium Corporation (full story)

:: Find Your Packaging Solution at IMAPS in Raleigh with Finetech (full story)

:: Rudolph Technologies Launches New Truebump Technology (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: Quik-Pak Installs New QFN Production Line in San Diego

Microelectronic Packaging and Assembly Solutions Provider Exhibits at IMAPS 2017 International Symposium Oct. 10-11, Raleigh, NC, Booth 210

Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, has installed a new production line for Overmolded QFN Packages at its San Diego facility. The addition of a K&S IConn Plus wirebonder, molding press and laser marker onsite allows the company to package devices quickly. This enables its customers to more rapidly validate their designs and accelerate time to market.

“We’ve seen steady growth for die packaging in the QFN platform. It has become the package of choice for single die, multi-die, SiPs and stacked die,” said Quik-Pak Global Sales and Marketing Director Casey Krawiec. “Having a production line onsite in San Diego enables us to expedite packaging for quick-turn engineering builds and offer an alternative to going offshore for high-volume production.”

Quik-Pak’s overmolded, open-tooled QFN and DFN packages are designed for quick-turn engineering builds, with standard five-day delivery of assembled QFNs. Custom designs will be available in as little as five weeks after drawing approval. The QFNs are available in over 35 designs, with multiple thicknesses. Package sizes range from 2x2 mm to 12x12 mm for QFNs and 1.5x1.5 mm to 4x4 mm for DFNs.  All QFNs are RoHS compliant and utilize NiPdAu-plated lead frames.

Quik-Pak recently had an independent third-party laboratory confirm two overmolded packages from the line (4x4mm QFN24 and 6x6mm QFN48) passed MSL3 level criteria for delamination and cracking per IPC/JEDEC-J-STD-020E.

Quik-Pak will officially introduce its new production services in Booth 210 at the IMAPS 2017 International Symposium on Microelectronics in Raleigh, North Carolina, October 10-11, 2017. Quik-Pak and its parent company Promex are Corporate Premier Members of IMAPS. In addition, last year Quik-Pak received the IMAPS Corporate Recognition Award for Significant Technical Contributions to the Microelectronics Industry.

Quik-Pak, a division of Promex, provides IC packaging, assembly and wafer preparation services in its ISO 9001:2008-certified, ITAR-registered facility in San Diego, California. The company’s overmolded QFN/DFN packages and premolded air cavity QFN packages provide a fast, convenient solution for prototype to full production needs. Same-day assembly services are provided to reduce time to market. More information is available at or by calling 858-674-4676.

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:: Micro Systems Technologies at IMAPS 2017 in Raleigh

Visit Micro Systems Technologies (MST) at booth# 325 during the IMAPS 2017 exhibition in Raleigh and find out about our comprehensive solutions in the field of microelectronics and electrical components for high-reliability / high-performance industries.

The offering includes HDI/microvia PCBs, ceramic substrates, design and manufacturing of electronic modules, advanced assembly and semiconductor packaging technologies, as well as batteries and battery packs for medical implants.

Dr. Rainer Dohle, a member of the R&D team at Micro Systems Engineering GmbH, one of the MST companies, will hold a presentation on «LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging» on October 11, 2017, 1:30 pm – 1:55 pm.

We invite you to attend this presentation and visit us at booth #325.

For more information please visit

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:: Technic Releases TechniFlex LCL1000F/423M

New Flexible Black Soldermask for Direct Imaging

Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask for flexible applications.

TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive beta site testing of TechniFlex 423M has shown no cracking after multiple 180o bends, even when processing 12-micron polyimide substrate.

TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. TechniFlex LCL 1000F/423M is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll to roll coating operations.

“Today’s cutting-edge flexible circuits require a strong yet flexible material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements. Technic’s new TechniFlex LCL 1000F/423M makes processing these advanced flexible PCBs possible.”
- Tom Horigome, Global Director of Imaging Products, Technic
Learn more at

About Technic
Technic is a Rhode Island based corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

Learn more at or contact us at (401) 781-6100.

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:: News from Indium Corporation

Indium Corporation Experts to Present at IMAPS 2017
Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC.

Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course, Choosing Solders for the New Era: Low-Cost High-Reliability Solder Alloys. This course explores the roles of solder composition in relation to cost and reliability, including materials properties, soldering performance, known failure modes, and the primary merit of discussed alloys. 

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will co-chair a session on polymers in microelectronics (WA5). This session focuses on the development of polymers for use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.

Tim Jensen, Product Manager for Engineered Solders Materials, will present Reinforced Solder Technology for Increased Reliability. The presentation details the outcomes of a study that showed how, through an optimized design, a reinforced solder preform can produce a solder joint with high-reliability and low-voiding. Jensen will also co-chair a session on reliability (THA5). This session focuses on several facets of electronics reliability that are impacted as devices generate more power from smaller form factors in broader ranges of applications.

To register for the IMAPS conference, visit:

Indium Corporation Expands Global Corporate Leadership Team
Indium Corporation has expanded the responsibilities of its global leadership team with the promotion of several top executives.

Brian Reid serves as Vice President of Global Operations, Rick Short is now Corporate Associate Vice President and Senior Director of Marketing Communications, Dawn Roller has been named Associate Vice President of Human Resources, and Bill Jackson has been appointed Senior Director and General Manager of the Compounds Business Unit and Korean Operations.

As Vice President of Global Operations, Reid supports global operations, engineering, and quality activities in all of Indium Corporation’s manufacturing facilities. He is responsible for promoting best practices and expanding inter-departmental cooperation with R&D, product management, sales, and technical support. Reid joined Indium Corporation in 2014 and has over 19 years of international manufacturing experience. His previous positions include Vice President of Operations for Norwich Pharmaceuticals and director of operations, operational excellence, and strategy for Wyeth Pharmaceuticals/Pfizer. He has experience in Lean Six Sigma deployment in the USA, Asia-Pacific, and South America, and holds a Lean Master certification. Additionally, Reid has global experience in the creation and implementation of strategic plans, facility and capital management, and site master planning. He has a bachelor’s degree in Interdisciplinary Engineering and Management, and a master’s degree in Engineering and Global Operations Management from Clarkson University.

As Corporate Associate Vice President, Short ensures that all programs and initiatives align with corporate branding and culture. This includes oversight of community engagement activities and image and reputation management, all supporting the company’s philosophy of The Indium Way®. As Senior Director of Marketing Communications, Rick creates and enhances global communications, aligning strategies and activities. Short has been with the company for over 30 years, and has served as Marketing Director, International Sales Director, and Technical Service Manager, in addition to his current role. He has an MBA from Rensselaer Polytechnic Institute, a bachelor’s degree in Business Management from Utica College, and an associate degree from Mohawk Valley Community College.

Roller oversees Indium Corporation’s global human resources program, ensuring that the company remains in full compliance with all requirements and continues to be an employer of choice. She joined Indium Corporation in 1986 and has served in many capacities, including office management, sales administration, customer service, transportation and logistics, international business, trade compliance, and information technology. Roller has been instrumental in many significant developments throughout her career with Indium Corporation, including the early development of international sales regions and the startup of several global facilities. More recently, Roller introduced and led Indium Corporation’s initial STEM outreach program, as well as direct recruiting efforts. She leads the company’s award-winning college internship program. Roller achieved HRCI-PHR certification in 2008 and SHRM-CP certification in 2015. In 2016, she also participated in LeadFORWARD, a year-long leadership development program.

As Senior Director and General Manager of the Compounds Business Unit and Korean Operations, Jackson oversees worldwide operations for refining and compounds. With more than 30 years in the electronics industry, his responsibilities include facilities management, operations planning, research, development, and engineering, as well as overseeing Compound’s product management and field sales. Jackson has helped Indium Corporation grow into a leading global manufacturer and supplier. Prior to becoming Senior Director and General Manager of the Compounds Business Unit and Korean Operations, he held many titles, including Director and General Manager of Compounds, Director of Indium Corporation's Solar Products Line, Director of Corporate Quality, Director of Operations, and Managing Director for Indium Corporation's Singapore and UK facilities. Jackson has a bachelor's degree in Business and Public Management from the State University of New York's Institute of Technology.

Indium Corporation Launches New Halogen-Free, Ultra-Low Voiding Indium10.1HF Solder Paste
Indium Corporation has launched Indium10.1HF, a new solder paste specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance. 


Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste with a flux chemistry engineered to improve reliability with:

  • High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
  • Solder beading minimization
  • Very low bridging, slump, and solder balling
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation

Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.
For more information about Indium10.1HF Solder Paste, visit

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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:: Find Your Packaging Solution at IMAPS in Raleigh with Finetech

Challenged with a bonding or packaging application?  Stop by the Finetech booth to learn about the only table top die bonder with 0.5 micron placement accuracy.

We've got your application covered!

  • Opto-e devices
  • Sensors / MEMs
  • Copper pillar
  • LEDs
  • Si photonics
  • Flip chip
  • Chip on Flex

With process flexibility in one platform -- Thermo-compression, Thermo-sonic, Flip chip, Au/Sn Soldering, Epoxy, Die attach and UV cure

And an equipment pathway to move from manual to semi-automated to fully-automated, high accuracy solutions.

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:: Rudolph Technologies Launches New Truebump Technology

The Dragonfly System now features fast, accurate and repeatable 3D bump metrology

Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to microbumps, and even large C4 bumps. With the Dragonfly system, the advanced packaging industry now has premier high-volume 2D inspection and 3D bump metrology on a single platform. The first Dragonfly system with Truebump Technology has shipped to a major IC manufacturer in the United States.


Truebump Technology combines multiple 3D metrology techniques to provide faster, more accurate, and more repeatable measurements of the 3D features that are critical in advanced packaging technologies,” said Matt Wilson, senior director of inspection product management, Rudolph Technologies. “As 2D and 3D dimensions decrease, the tolerances for manufacturing become tighter, and device stacking continues to drive an increase in functionality. Because these 3D connections are so vital for reliability, the bump height measurements need to be absolutely accurate.”

Wilson continued, “A single wafer may contain 50 million bumps, each with multiple data points, creating massive amounts of data. The Dragonfly system’s integrated connection with Discover® analytics software gives users tools to visualize data, correct coplanarity variations, and improve yields.

Truebump Technology is three times faster and 25 percent more repeatable than Rudolph’s previous generation tool. The Dragonfly system’s high volume throughput combined with industry leading accuracy and repeatability enable further adoption of stacked devices in advanced packaging applications that fuel today’s drive for thinner and lighter products that deliver more capability in a smaller form factor.

For more information about Rudolph’s systems and software, please visit  


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:: Issue 214 ::
September 19, 2017


JC Cherry