Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: TJ Green Associates LLC - Expert Witness, Seminar Presenter, Visual Inspection Criteria... (full story)

:: Neoganth® W Pre Dip - Atotech’s new horizontal activator pre dip for fine line applications (full story)

:: Crystal Mark - Micro Abrasive Processing: Customize it for your Specific Requirement (full story)

:: Prevent EMI issues with this free tool (full story)

:: Join Amkor for a FREE Webinar: ASICs Unlock Deep Learning Innovation - May 2nd (full story)

:: Indium Corporation Adds Two Technical Support Engineers (full story)

:: Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications (full story)

:: Redesign Driven by Mobile Trends and Improving End-User Experience (full story)

:: Palomar Technologies Introduces 6532HP: Ultra High Accuracy Die Bonding System (full story)

:: Latest Henkel News -- Peelable TIM Ideal for Rework of High-Value Assemblies (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Heraeus

ASE Group

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brian Schieman, bschieman@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brian.


::TJ Green Associates LLC - Expert Witness, Seminar Presenter, Visual Inspection Criteria...

TJ Green Associates

A veteran-owned small business, TJ Green Associates, LLC is the recognized industry leader in consulting services, expert witness testimony, and training solutions related to the assembly and packaging of microelectronic components for high reliability military, space and medical device applications. Tom Green, Principal, has more than 34 years of combined experience in industry/academia and the Department of Defense, including years developing curriculum and teaching industry professionals about microelectronics assembly related packaging and processes. For the last 15 years, Tom’s expertise has helped position his company as a recognized industry leader in teaching and consulting services for high-reliability military, space, and medical device applications.

Expert Witness
Having spent time in industry, government research labs, and academia, Tom has gained considerable expertise regarding the materials and processes used in the microelectronic packaging of such devices. As such, he has become a sought-after expert witness for cases involving high-reliability military, space and medical device applications.

He has developed a strong perspective on the many possible causes of device failures as well as hermetic package sealing and hermeticity testing of hybrids and other types of hermetically sealed implanted Class III medical devices.

Seminar Presenter
Stay ahead of your competition and keep your engineering and technical staff current by sharpening your skills with leading-edge seminars that cover a variety of subjects critical to the field of microelectronics packaging. These multi-day seminars, presented by Tom and other industry experts, are typically held at a hotel conference center or professional training facility and are available to anyone in the industry. The most popular seminars are scheduled multiple times around the country and overseas, so there is sure to be a training session that will meet your organization’s needs.

Scrutinizing MIL-STD-883 Visual Inspection Criteria
An important consideration in wire bonding is visual inspection of the deformed wire after wire bond formation. The MIL-STD-883 criteria was developed over many years and is intended to cover a broad range of technologies ­­— both TM 2017 and TM 2010 contain much wisdom and still serve as the defacto standard. In some cases, however, the inspection criteria is lenient while in others instances it is overly restrictive. Take a closer look at the baseline requirements in Tom’s latest blog post and presentations/papers.

Tied to a particular page in MIL-STD-883, Tom’s Workmanship Standards eBook — an online illustrated guide of common workmanship defects as seen during production — is an indispensable resource for those in the industry.

To learn more about TJ Green Associates, LLC visit http://www.tjgreenllc.com.

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::Neoganth® W Pre Dip – Atotech’s new horizontal activator pre dip for fine line applications

Neoganth® W Pre Dip is Atotech’s new process for the desmear and metallization (PTH) process step for fine line HDI and package substrate applications. The new pre dip assures higher yield rates due to a significantly reduced occurrence of short circuits.

The trend for ever smaller lines and spaces in advanced HDI boards for mobile applications continues. Lines and spaces (L/S) will be reduced to 25/25 µm by 2019. The trend was made possible by manufacturing technologies such as modified semi-additive processes (mSAP) and advanced modified semi-additive processes (amSAP). With this minimization comes the need for new PORs (process of record), which offer significant technical advantages over existing ones.

Neoganth® W Pre Dip
Atotech’s newly developed Neoganth® W Pre Dip is a low foaming activator pre dip designed for horizontal transportation mode such as in Atotech’s Uniplate® LB line. The process leads to a significant reduction in particle formation thereby enabling higher yield rates in fine line production. A key feature to achieve this is its alkaline pH.

Customer data has shown that using Neoganth® W Pre Dip reduces the occurrence of short circuits in the process by up to 50% compared to competitive products. At the same time, the process provides excellent coverage performance while significantly reducing foaming behavior.

Coverage performance comparison on 4 different base materials (Isola IS410,Panasonic R1755C, Nanya NP140,Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth® W Pre Dip into the subsequent activator bath

Neoganth® W Pre Dip is best used in front of an ionic PTH activator, such as Neoganth® U Activator or Neoganth® X Activator. It ensures proper wetting, pre-conditions the glass fibers and securely removes remaining copper oxides after etch cleaning.

The process has already been rolled-out successfully in Korea, Taiwan and China. Its key benefits allow it to exceed previous PTH POR process steps thereby assuring customers receive outstanding performance results.

Contact Yvonne Fuetterer
Erasmusstr. 20 10553 Berlin, Germany
+49 30-349 85-220
yvonne.fuetterer@atotech.com
www.atotech.com

About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.1 billion. The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs more than 4,000 people in over 40 countries.

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:: Crystal Mark - Micro Abrasive Processing: Customize it for your Specific Requirement

CONSIDER THE POSSIBILITIES > R&D: PROCESS DEVELOPMENT

Learn how we:

• Confirm the viability of an application

• Develop and validate a process

• SEE MORE >>

> MICRO ABRASIVE PROCESSING: 101

UNPARALLELED PRECISION, CONTROL >>

Email: Sales@CrystalMarkInc.com
www.CrystalMarkInc.com
Toll Free: 800.659.7926

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::Prevent EMI issues with this free tool

High-speed traces crossing over a gap in the return path are a sure way to produce EMI on your PCB. Worse, they're hard to find on your own because multiple layers must be compared at the same time.

The net crossing gap rule in HyperLynx DRC automatically searches your design for signal traces that cross gaps between two copper shapes to ensure there are no violations on your PCB.

Download HyperLynx DRC Free Edition to start checking your designs for EMI issues today.

Download free design rule checks

 

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::Join Amkor for a FREE Webinar: ASICs Unlock Deep Learning Innovation - May 2nd

amkor

Deep learning algorithms, powered by neural nets, hold promise to automate our world in ways previously reserved for science fiction. Computers and cell phones that recognize us and talk to us, along with cars that drive us are just a few of the revolutionary products on the near horizon.

Practical implementation of this technology demands extreme performance, low power and efficient access to massive amounts of data. Advanced ASICs play a critical role in the path to production for these innovations. In fact, many applications cannot be realized without the performance and security that a custom chip provides.  

 

May 2nd, 2018 

Choose a time:

8:00AM PDT
or
6:00PM PDT 
 
FREE WEBINAR 

 

Please join Amkor Technology, Samsung Electronics, eSilicon and Northwest Logic as we explore a complete implementation platform for deep learning ASICs.

The webinar will be moderated by Dan Nenni, CEO and founder of SemiWiki 

Agenda  

  • Dan Nenni, SemiWiki: Market overview
  • Samsung Electronics: HBM2 Memory Solutions
  • Amkor Technology: Advanced Packaging Solutions
  • eSilicon: ASIC/2.5D Design and Enabling 7/14nm IP Platforms
  • Northwest Logic: HBM Controllers
Register now! 

 

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::Indium Corporation Adds Two Technical Support Engineers

Indium Corporation has welcomed two new technical support engineers to its global support team.

Meagan Sloan and Miloš Lazić are responsible for providing expert technical assistance and guidance to Indium Corporation’s customers and potential customers in the Americas to resolve soldering process related issues.

Prior to joining Indium Corporation, Sloan served as a laboratory technician at Anoplate, an electroplating company that serves the aerospace, computer, and defense industries. Before that she was a laboratory assistant at Syracuse University, where she prepared and wrote experiments for students, and managed and ordered materials for inventory. Sloan has a bachelor’s degree in Chemistry, with a concentration in pre-engineering from LeMoyne College, and a master’s degree in Chemical Engineering from Syracuse University. Her advanced coursework includes advanced organic chemistry, inorganic chemistry, physical chemistry, instrumental chemistry, chemical reaction engineering, and engineering materials.

Lazić previously worked at Radio-Television Nis in Serbia, where he held the position of deputy technical director. He also served as an electrical engineer for Montelektro, where he designed electrical installations for industrial, commercial, and residential applications. He co-founded, “Urban Youth Forum,” a non-profit organization designed to help primary and high school students plan, develop, and execute projects that recycle electronic waste. Lazić earned his bachelor’s degree in Electrical Engineering and his Master of Engineering in Electronics Engineering from the University of Nis, in Serbia,  He also earned the title of Energy Efficiency Engineer by passing the proficiency exam of the Serbian Chamber of Engineers in Belgrade. He is fluent in English, Serbian, Croatian, and Bosnian.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

From Left to Right: Miloš Lazić and Meagan Sloan

 

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::Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications

Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or encapsulation. This product exhibits excellent wetting properties and can readily flow by capillary action in tight clearances or beneath devices. It adheres well to metals, plastics, composites, polyimides, glass and ceramic substrates.

EP62-1LPSPMed has an advantageously long working life of 12-24 hours for a 100 gram mass and requires moderate heat for curing. Cure schedule is overnight at room temperature followed by 60-90 minutes at 80-100°C. The higher the temperature the faster the cure. Post curing at 100-150°C for 3-4 hours will optimize its properties.

Master Bond EP62-1LPSPMed passes USP Class VI and ISO 10993-5 cytotoxicity requirements. It also has been tested for 1,000 hours at 85°C/85% RH. It has excellent toughness, tensile strength of 11,000-12,000 psi and resists repeated cycles of ethylene oxide, radiation, and chemical sterilization. This compound has volume resistivity of more than 1014 ohm-cm, withstands mechanical shock/vibration and is serviceable from 4K to +400°F. In very thin sections it will transmit light, but in thicker sections it is opaque. Shore D hardness is 75-85 and its glass transition temperature is 125-130°C.

EP62-1LPSPMed has a 100 to 25 mix ratio by weight and can be supplied in standard sized units: ½ pint, pint, quart, gallon, 5 gallon kits. It can also be packaged in premixed and frozen syringes, as well as in cartridges for gun dispensers. Shelf life in original unopened containers is 6 months.

Master Bond Biocompatible Adhesives
Master Bond EP62-1LPSPMed is a tough, thermally stable, high strength, low viscosity epoxy that meets USP Class VI and ISO 10993-5 specifications. This two part system can withstand exposure to repeated sterilization and withstand thermal cycling, mechanical vibration. Read about Master Bond medical grade adhesives at https://www.masterbond.com/properties/biocompatible-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Masterbond

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::Redesign Driven by Mobile Trends and Improving End-User Experience

Technic

We are pleased to announce the launch of a new global website aimed at improving the overall user experience for both desktop and mobile visitors. The site has been designed to offer visitors quick and easy access to a wealth of information about Technic products, applications, and expertise, as well as industry-related news content and a variety of useful tools and resources.

Significant growth in mobile web traffic over the past few years prompted Technic to implement this new responsive web design. End-users will now find the site quicker and easier to navigate whether using a desktop or mobile device.

"Our primary focus throughout the redesign was on end-user experience. It was important for us to upgrade Technic’s online presence in a way that would allow each end-user to have key information at their fingertips. The introduction of responsive design was an important aspect of the new site, allowing us to have more meaningful interactions with our mobile device, tablet, and desktop users."
- Steve Schaefer, Chief Operating Officer

The Chemistry Database, a popular resource for both existing and prospective customers, allows visitors to search Technic’s database by category, process, application, or by keyword. Search results indicate the availability of each product by global region. Taking it one step further, users can now easily add a product to their “shopping cart” and then submit a form requesting additional information, creating a seamless user experience. Continue Reading

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::Palomar Technologies Introduces 6532HP: Ultra High Accuracy Die Bonding System

Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). Developed for the demanding needs of the optoelectronics industry, the 6532HP exceeds industry standards for placement accuracy, production speed and high volume capacity.

The 6532HP delivers 1.5 micron placement accuracy and speeds up to 1200UPH to maximize throughput. Fully automated presentation of dual 8 inch wafers, up to 72 wafflepak/GelPaks™, or tape feeders provides a high production, flexible, parts presentation platform. A 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility.

Palomar

Read the full press release: http://www.palomartechnologies.com/news-room/press-releases/palomar-technologies-introduces-6532hp-ultra-high-accuracy-die-bonding-system.

Subscribe to the PTI Blog! Join the industry peers who already have! http://www.palomartechnologies.com/blog

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::Latest Henkel News -- Peelable TIM Ideal for Rework of High-Value Assemblies

Peelable TIM formulation enables easy assembly rework

New Liquid GAP FILLER from Henkel Delivers Thermal Control, Automation and Reworkability

Building on the leading BERGQUIST brand thermal management portfolio, Henkel has developed a brand new liquid GAP FILLER material that offers the rare advantage of thermal interface material (TIM) reworkability without sacrifices in thermal conductivity or automation performance. BERGQUIST GAP FILLER TGF 1500RW delivers these three valuable benefits in a single material, extending even greater process flexibility and post-assembly adaptability.

Henkel’s new TIM is a one-part, cure-in-place liquid gap filler allowing use with automated dispensing equipment for high-volume manufacturing operations. Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity, and also delivers excellent low and high temperature mechanical and chemical stability.

“In addition to its high throughput and thermal control capabilities, what makes BERGQUIST GAP FILLER TGF 1500RW distinctive among other liquid thermal interface materials is its peelability,” explains Doug Dixon, Henkel Adhesive Electronics Global Marketing Director. “Traditional cure-in-place TIMs generally require very high force for disassembly, which often results in permanent damage to components and substrates. The new BERGQUIST TIM, however, peels away cleanly from contact surfaces to safeguard delicate componentry and preserve product value.”

Supply chain simplification is another advantage of BERGQUIST GAP FILLER TGF 1500RW. Notably, the material facilitates infinite thickness variations and accommodates multiple dimensions, allowing a single material to be used for many products and applications across the manufacturing operation. Conversely, TIMs in pad or film formats are supplied in pre-determined die cut shapes and thickness, with each requiring its own part number. Simplification of inventory complexity adds to cost-efficiency and optimized resource utilization.

“As today’s manufacturers must compete in demanding and dynamic environments where product performance, operational efficiency and profitability are equally prioritized,” says Dixon in summary, “materials like BERGQUIST GAP FILLER TGR 1500RW that deliver thermal transfer performance, enable high volume production, streamline the supply chain and preserve assembly value help assembly specialists achieve their business objectives.”

For more information, visit www.henkel-adhesives.com/thermal.

About Henkel in North America
Henkel operates across its three business units – Adhesive Technologies, Beauty Care and Laundry & Home Care – in North America. Its portfolio of well-known consumer and industrial brands includes Schwarzkopf® hair care, Dial® soaps, Right Guard® antiperspirants, professional hair care brand Sexy Hair®, Persil®, Purex® and all® laundry detergents, Snuggle® fabric softeners as well as Loctite®, Technomelt® and Bonderite® adhesives. North America is an important region for Henkel: With sales of around 5.8 billion US dollars (5.2 billion euros) in 2017, North America accounts for 26 percent of the company’s global sales. Henkel employs more than 9,000 people across the U.S., Canada and Puerto Rico. For more information, please visit www.henkel-northamerica.com.

 

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:: Issue 224 ::
April 4, 2018

Presidio Components

Gannon & Scott

Dow Electronic Materials

NAMICS