Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: News from Indium Corporation (full story)

:: April 26 Webinar - PCB Thermal Modelling with Empirical Thermal Conductivity Methods (full story)

:: DfR Solutions - Why Do Temperature-Based FEA? & Optimization of Capacitive Touch Sensors Through Simulation (full story)

:: Technic Presents PER Cleaning Innovation at 19th Surface Preparation and Cleaning Conference (SPCC) (full story)

:: Amkor Factories Receive Key Automotive Certification (full story)

:: Our industry’s experts will be presenting their insights at IMAPS New England - register today and gain the knowledge you need to improve your skills! (full story)

:: ORS Acquires Silicon Cert Laboratories (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brian Schieman, bschieman@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brian.


::News from Indium Corporation

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality”

Indium Corporation has been recognized by ON Semiconductor for their “perfect” quality in 2017.


                                                   
Indium Corporation, one of more than 3,000 ON Semiconductor production suppliers, was selected for its commitment to ensuring high quality and supply continuity in an evolving semiconductor market.

The annual Perfect Quality Award was presented to Weng Fai Pang, Managing Director for Asia-Pacific Operations, and Tim Twining, Vice President of Marketing, at ON Semiconductor’s Supplier Executive Conference in March in Hong Kong, China.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

 

Indium Corporation’s Vareha-Walsh Shares Insights at Indium, Germanium, Gallium Forum

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared industry insights on indium supply and demand at the 11th World Indium and Germanium and Gallium Forum event on March 22-23 in China.

Vareha-Walsh’s presentation, Indium Supply and Demand Overview, described the multiple events that can trigger price increases or decreases within the market. Vareha-Walsh also provided insights into growth expected in the flat-panel display industry.

Vareha-Walsh is responsible for sourcing of critical raw materials, such as indium, gallium, germanium, tin, and silver, and other products and services that support Indium Corporation’s manufacturing operations, as well as the trading of metals and sales of reclaim services for Indium Corporation’s Korean operation. She has more than 15 years of metals market experience from numerous roles and responsibilities, including Director of Global Procurement for a global premium alloy company, and Director of Metallurgical Operations and Procurement for a global tungsten-based business. She also has experience in finance as a Business Unit Controller and, sales expertise as Director of Sales and New Business Development Manager, and has participated in metals recycling and scrap/reclaim markets. Vareha-Walsh earned a bachelor’s degree in finance from Duquesne University and an MBA from the University of Pittsburgh. She is a Certified Public Accountant (CPA), holds certificates in leadership development and manufacturing excellence, and has a Lean Green Belt.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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::April 26 Webinar - PCB Thermal Modelling with Empirical Thermal Conductivity Methods

PCB Thermal Modelling with Empirical Thermal Conductivity Methods

Date: Thursday, April 26th, 2018

Time: 11:00 a.m. - 11:45 a.m. Europe/London Time
10:00 a.m. - 10:45 a.m. US/Pacific Time

Join us at this live event to learn more about PCB effective thermal conductivity modelling and to learn more about the benefits that can be gained by using the empirical method over the analytical method.
Also covered in this presentation:

  • Introduction to the Analytical calculation.
  • Review layered and compact modelling.
  • What is the technology behind the empirical calculation?
  • Limitations of empirical calculation.
  • Review Empirical In-Plane and Axial Thermal Conductivity calculations.
  • Validation examples.

Register Now

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:: DfR Solutions - Why Do Temperature-Based FEA? & Optimization of Capacitive Touch Sensors Through Simulation

Why Do Temperature-Based FEA?
Thursday, April 19
Presented by Dr. Natalie Hernandez

Unless you’re in a perfectly controlled, relatively benign environment, there will be thermomechanical stresses impacting your product. This can occur while driving your car or sending a submarine to explore the Mariana Trench or launching a spacecraft to circle the sun. The combination of thermal and vibration loading conditions significantly impacts the lifetime of the components in your printed circuit card assembly (PCBA). Understanding the responses of your PCBAs under these environmental stressors is key to answering that ultimate question, “When will my board fail?”

With the release of Sherlock v.5.4, the industry can assess the effects of temperature-dependent vibrational and shock events on the fatigue life of PCBAs. Most importantly, the analyses now incorporate temperature-dependent material mechanical properties existing throughout the assembly. One can quickly and easily model their designs and run a temperature-based simulation to discern more accurate fatigue predictions based on real-life, extreme environments.

Optimization of Capacitive Touch Sensors Through Simulation
Thursday, April 26
Presented by Fieldscale (Guest Presenter)

Capacitive touch sensors are replacing all types of mechanical switches in a very wide range of applications due to their low cost and high reliability: white goods, automotive interior, aviation, consumer electronics are only some of them.
Interfaces of capacitive touch systems typically consist of the sensor and the controller that combines a capacitance-to-digital converter (CDC) together with a microprocessor. The controller drives the sensor through conductive lines, usually called “traces”, on a standard PCB or flex circuit.
The specifications of the different applications set limitations on the sensor’s sensitivity. Traces routing, proximity to conductive parts, shielding elements etc. influence the final design. More often than not, you are left with a design that in theory follows generic guidelines but does not function when installed in the end product.

Join Fieldscale for this live webinar to learn:

  • Touch buttons and sliders simulation tips
  • Trace routing optimization techniques
  • Material selection do’s and don'ts

This webinar is ideal for touch sensor designers from automotive, avionics, white goods or industrial applications that have no expertise in simulation software and want fast answers on how to move on with their project.


About Fieldscale:
Fieldscale provides simulation software that helps IC makers and touch screen manufacturers scale capacity, reduce product development cycles and go-to-market 10x faster. With Fieldscale companies experience unprecedented simulation speed and massive cost savings. Our flagship product, Fieldscale SENSE, is the first simulation software dedicated to touch sensor design. It can be used by any engineer, beginner or an expert, to make informed design decisions, starting from day one.
Click below to learn more and to register.

 

Why Do Temperature-Based FEA?
Presented by Dr. Natalie Hernandez
Thursday, April 19
11 AM Session
2 PM Session 

 

Optimization of Capacitive Touch Sensors Through Simulation

Presented by Fieldscale
Thursday, April 26
11 AM Session

 

 

 

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::Technic Presents PER Cleaning Innovation at 19th Surface Preparation and Cleaning Conference (SPCC)

Technic presented a technical paper on the Selective Removal of Post-Etch Residues Formed by Patterning of High-K Materials Through Precise Control of Water During Cleaning at the Business of Cleans and Surface Preparation and Cleaning Conference (SPCC) held April, 9-11 at the Royal Sonesta Hotel, Cambridge, MA.

The paper is a collaboration between Technic, STMicroelectronics, and CEA-Leti and was presented by Technic’s Technology and Innovation Director, Dr. Jerome Daviot. The presentation focused on an optimized cleaning solution to meet the challenges of post-etch residue (PER) removal of high-k materials such as tantalum, zirconium, and hafnium, which are notoriously resilient and difficult to remove.

Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry..

 

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::Amkor Factories Receive Key Automotive Certification

Multiple sites pass IATF 16949:2016 audit

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.

Included in the list of factories that achieved certification is Amkor's newest, K5 - a state-of-the-art facility with 2.3 million square feet of floor space located in Incheon, South Korea. K5 combines automation, world class particle control and automotive processes to meet stringent quality and reliability requirements.

"This certification is a testament to Amkor's significant automotive experience, as well as our exacting quality standards," said YongChul Park, Amkor's executive vice president, Worldwide Manufacturing. "Semiconductors are the foundation for automotive electronic systems that help keep passengers connected and safe. Certifying our factories for automotive applications offers significant growth opportunities for Amkor and enables us to deliver the leading-edge solutions our customers and automotive OEMs require."

Automotive ICs must perform reliably under harsh conditions for extended periods of time. To deliver the durability and accuracy expected by automakers, IC suppliers are required to use specialized packaging techniques with additional process steps and controls.

Amkor has factories in several countries that have achieved IATF-16949:2016 certification, including ATK, ATP, ATM, ATT, and ATC; IATF-16949:2016 certifications for J-Devices and Amkor Technology Portugal are in process. For more information, visit https://amkor.com/quality-management/

Learn more about Amkor's automotive solutions by downloading our Automotive IC Packaging brochure in English, Japanese or Korean

About ISO/TS-16949 and IATF-16949:2016
ISO/TS-16949 was jointly developed by The International Automotive Task Force (IATF) members and emphasizes the development of a process-oriented quality management system that provides for continual improvement, defect prevention, and reduction of variation and waste in the supply chain.

On October 3rd, 2016 IATF-16949:2016 was published by the IATF and supersedes and replaces the current ISO/TS-16949, defining the requirements of a quality management system for organizations in the automotive industry.

About the International Automotive Task Force (IATF)
The IATF is a group of automotive manufacturers and their respective trade associations, formed to provide improved quality products to automotive customers worldwide.

The IATF members include BMW Group, Chrysler Group, Daimler AG, Fiat Group Automobile, Ford Motor Company, General Motors Company, PSA Peugeot Citroen, Renault SA, Volkswagen AG, AIAG (U.S.), ANFIA (Italy), FIEV (France), SMMT (U.K.) and VDA (Germany).

 

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::Our industry’s experts will be presenting their insights at IMAPS New England — register today and gain the knowledge you need to improve your skills!

TJ Green Associates

When you plan for this year’s IMAPS NE Symposium & Expo on May 1, you owe it to yourself and your future to bookend your trip with two cutting-edge seminars presented by the industry experts at TJ Green Associates.


Don’t miss our two seminars:
Pre-Cap Visual Inspection per Mil-Std-883 (TM 2017)
April 30 with Tom Green

Hybrids/MCMs/RF Microwave Modules all require a visual inspection step prior to encapsulation or hermetic seal — this is a critical process that requires a high degree of operator skill and understanding! This seminar will provide you with the knowledge base necessary to know what to look for and reject as part of the inspection process.


The seminar will also provide you with a hands-on tour of our Workmanship Standards eBook, our online illustrated guide of common workmanship defects as seen during production, tied to a particular page in MIL-STD-883.

If you can't make the seminar, visit me at booth 107 for a free trial subscription and to learn more on how to use the Workmanship Standards eBook.

 

Copper and Gold Wire Bonding
May 2 with Lee Levine

More than 15 trillion wires are bonded annually! Gold wire was the dominant material in use prior to 2015 when copper and palladium coated copper wire captured the market. Copper provides numerous benefits but it is significantly harder to achieve a robust, reliable process. Enter wire bonding, which is one of the most reliable manufacturing processes.

Achieving high yields requires rigorous attention to details and excellent statistical process control. Dive deeper into ultrasonic welding, intermetallics and intermetallic failures of gold and copper, copper wire bonding, and more!

When you make your travel plans for IMAPS, don’t forget about these important seminars you should also attend! Reserve your seats now — Register Here.

To view the entire TJ Green calendar of events, click here.

MEET OUR EXPERTS

Tom Green
Tom has more than 34 years of combined experience in industry/academia and the Department of Defense, including years developing curriculum and teaching industry professionals about microelectronics assembly-related packaging and processes. For the last 15 years, Tom’s expertise has helped position his company, TJ Green Associates, as a recognized industry leader in teaching and consulting services for high-reliability military, space, and medical device applications.

Lee Levine
Lee is a consultant for Process Solutions Consulting, Inc. where he provides process engineering consultation, SEM/EDS analysis, and wire bond training. His previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He has been awarded four patents, published more than 70 technical papers, and has won both the John A. Wagnon Technical Achievement award and the Daniel C. Hughes award from the International Microelectronics and Packaging Society (IMAPs). Lee is an IMAPs Fellow and a senior, life member of IEEE.

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::ORS Acquires Silicon Cert Laboratories

ORS Labs, Inc., the parent company of Oneida Research Services, Inc. (ORS), announces the acquisition of Silicon Cert Laboratories in Reading, Pennsylvania. Silicon Cert Laboratories is an internationally recognized leader in environmental and mechanical testing and qualification of products and components for the telecommunications, defense, automotive, aerospace and medical-device industries. Silicon Cert Laboratories testing services include mechanical shock, vibration, drop testing and environmental exposure such as temperature and humidity cycling to evaluate the impact of changing environmental conditions on products.

“The acquisition of Silicon Cert Laboratories substantially increases the level of expertise and technology that ORS can offer when evaluating and qualifying products and components for mission-critical applications in the industries we serve,” said Daniel Rossiter, Senior Vice President of Oneida Research Services, Inc. “We are thrilled to be working together and look forward to many years of growth.”

John Schmoyer, Client Services Manager at Silicon Cert stated “Oneida and Silicon Cert have had a friendly cooperative relationship for over twelve (12) years. This is a win-win relationship for both Silicon Cert Laboratories and Oneida Research.”

About Silicon Cert Laboratories: Based in Reading, PA, Silicon Cert Laboratories was founded in 1998 by a group of former Bell Labs, AT&T Microelectronics and Lucent Technologies engineers with an extensive background in integrated circuit and optoelectronic component design, manufacturing and testing. The company achieved ISO certification in 2000 and is currently certified to ISO 9001:2008 through DNV-GL. In 2007, the Defense Logistics Agency in Columbus, Ohio approved Silicon Cert for multiple MIL-STD-883 test methods. In 2009, the company was accredited by A2LA to ISO/IEC 17025:2005 to perform a wide variety of reliability tests.

About ORS: Oneida Research Services, Inc. has testing facilities in Whitesboro, New York and Denver, Colorado. Both locations are accredited to ISO 9001:2015 and AS9100D and approved by the Defense Logistics Agency in Columbus, Ohio for several test methods per Mil Std. 883 and Mil Std. 750. Throughout its 40 years, ORS has established strong working relationships with experts in the field of applied analytical chemistry, gas analysis, destructive physical analysis, hermeticity testing and organic mass spectrometry. ORS also has an affiliate in Sophia Antipolis, France.

Contact: Krista Vivenzo, Customer Service Representative, Oneida Research Services, Inc.
kvivenzo@orslabs.com |  315.736.5480, ext. 2231

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:: Issue 225 ::
April 17, 2018

Presidio Components

Gannon & Scott

Dow Electronic Materials

NAMICS