Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Kester Launches SELECT-10™ Flux-Pen® (full story)

:: TechSearch International Analyzes Trends in Packages for AI Applications (full story)

:: Nordson ASYMTEK and The Peters Group Present Conformal Coating Solutions Seminars in China (full story)

:: Henkel's Latest Innovation Overcomes Performance and Processability Challenges of Traditional Materials (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Kester Launches SELECT-10™ Flux-Pen®

Kester’s SELECT-10™ is now available as a Flux-Pen®. SELECT-10™ is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog the fluxer head. SELECT-10TM residues are non-tacky for improved cosmetics. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B. For additional information on this product including technical and safety data sheets, please click here.

For any questions or additional information, please contact: Fil Marcial-Hatfield, Global Product Manager at fmarcial@kester.com.


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:: TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind the applications.  AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM).  Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is used for smartphone processors incorporating AI.  FO-WLP and MCeP PoP versions are in production.  A variety of packages including QFNs and WLPs are found in Smart Home Speakers and Hubs.

Package trends for network systems are analyzed, including laminate BGAs with large body size, silicon interposers with TSVs, and Fan-Out on Substrate.  New package options under development include embedded ceramic bridge and organic interposers.

The latest Advanced Packaging Update is a 90-page report with full references and an accompanying set of 46 PowerPoint slides.  The report also examines the growing shortage of components and provides an analysis of OSAT financials.  A section on micro LEDs, stacked CMOS image sensors, and a peek inside Samsung’s latest Galaxy smartphone are included.  A major section of the report examines laminate substrate package design rules and the materials used by each supplier. 

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch

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:: Nordson ASYMTEK and The Peters Group Present Conformal Coating Solutions Seminars in China

Nordson ASYMTEK a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces a collaboration with The Peters Group, Kempen, Germany, to conduct a series of seminars in China on conformal coating. The Conformal Coating Solutions Seminar is geared to those in the automotive manufacturing supply chain, as conformal coating plays a significant part in manufacturing for the growing electric car, autonomous and assisted driving, and connectivity markets. The first seminar was held at the Novotel Suzhou in June.




"Conformal coating has become a necessity in electronics manufacturing because of reduced component size, the demand for higher reliability, and, with more electronic components in cars, the harsh environment where these electronics operate. Conformal coating helps circuit boards withstand moisture, electro-corrosion, salt spray fog, corrosive gases, migration, temperature, thermal cycling, and vibration," said Eric Gu, applications manager, Nordson ASYMTEK.

Some of the topics covered in the seminar include how to choose conformal coating, how to select a coating machine, coating machine/process optimization, and conformal coating test and trouble shooting. Nordson's Advanced Technology-Electronics Systems (AT-ES) group is well-positioned to assist customers with their conformal coating needs, as this group provides a full line of integrated solutions for conformal coating including automation, ovens, and inspection. The Peters Group specializes in the development, production, and distribution of high-tech coatings for electronics applications.

Future events in South China are being planned, so contact us to find out more. Email: izzie.liu@nordson.com; Tel: +86. 21.3866.9166, visit our website: www.nordsonasymtek.com/cn; or follow Nordson AT-ES on WeChat.

About Nordson ASYMTEK

Nordson ASYMTEK, a world leader in precision fluid dispensing, conformal coating, and jetting technologies, designs and manufactures dispensing and coating systems, supported by an award-winning global applications and service network for over 35 years. To find out more, visit www.NordsonASYMTEK.com, or on social media.

About Nordson Corporation

Nordson Corporation engineers, manufactures, and markets differentiated products and systems that precisely dispense adhesives, coatings, sealants, biomaterials, polymers, plastics, and other materials, fluid management, test and inspection, UV curing, and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and offices in nearly 40 countries. Visit Nordson at www.nordson.com, Twitter, or Facebook.

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:: Henkel's Latest Innovation Overcomes Performance and Processability Challenges of Traditional Materials

High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements

Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products. The patent-pending LOCTITE® ABLESTIK® ABP 8068T portfolio includes high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high power density devices.

The expanded functionality and shrinking dimensions of devices within mobile, datacom/telecom, consumer and automotive applications are driving increased power densities and resulting in the need to manage heat dissipation more effectively. The use of thermal interface materials provides this relief at the board and component level, but more capable solutions at the die level are an important piece of the holistic thermal management equation.

“Historically, solder has been the predominant solution for high thermal and electrical performance,” explains Raj Peddi, Henkel Market Segment Head for Wirebond IC Packaging, “but its impending phase out due to environmental legislation is driving the need for alternative materials. Other approaches such as conventional high thermal die attach adhesives and pure silver sintering products are also less than ideal because of interfacial contact limitations and processability challenges. For these reasons, Henkel developed the LOCTITE ABLESTIK ABP 8068T series of semi-sintering die attach materials which combine high thermal conductivity, robust reliability and simplified manufacturing processes.”

Henkel’s new high thermal, semi-sintering die attach adhesives provide a lead-free alternative for die attach within high power density semiconductor packages. LOCTITE ABLESTIK ABP 8068T series materials can be implemented using standard processes without the need for high pressure and temperature, as is the case with conventional silver sintering materials. Because the novel die attach pastes form an interpenetrating network of sintered silver (Ag) and resin, they establish excellent contact with the interface for void-free bond lines to achieve outstanding thermal conductivity and result in good thermal cycling performance. LOCTITE ABLESTIK ABP 8068T series materials are a drop-in replacement solution for standard die attach applications, can be cured with nitrogen or air, and have robust adhesion on a variety of surface finishes including silver, copper, nickel-palladium-gold and gold.

Other attributes of LOCTITE ABLESTIK ABP 8068T series materials include applicability on a wide range of die sizes up to 5 mm x 5 mm; excellent thermal performance with bulk thermal conductivity up to 110 W/m-K and low in-package resistance of about 0.5 K/W for silver, copper and nickel-palladium-gold lead frames; and broad workability that includes consistent dispensing up to 24 continuous hours, open time of two hours and stage time of as long as four hours.

“Truly, for high power density semiconductor packages, this is the solution manufacturers have been seeking,” says Peddi, noting the material’s combination of performance, reliability and processability. “For packaging specialists that want a lead-free replacement for solder that doesn’t require expensive or complicated processing, yet ensures equal or better performance as compared to conventional materials, the LOCTITE ABLESTIK ABP 8068T portfolio delivers.”

For more information, visit www.henkel-adhesives.com/electronics and/or register to attend a free August 22nd webinar to learn more about market trends and how the semi-sintering material is addressing new requirements.

About Henkel in North America
Henkel operates across its three business units – Adhesive Technologies, Beauty Care and Laundry & Home Care – in North America. Its portfolio of well-known consumer and industrial brands includes Schwarzkopf® hair care, Dial® soaps, Right Guard® antiperspirants, professional hair care brand Sexy Hair®, Persil®, Purex® and all® laundry detergents, Snuggle® fabric softeners as well as Loctite®, Technomelt® and Bonderite® adhesives. North America is an important region for Henkel: With sales of around 5.8 billion US dollars (5.2 billion euros) in 2017, North America accounts for 26 percent of the company’s global sales. Henkel employs more than 9,000 people across the U.S., Canada and Puerto Rico. For more information, please visit www.henkel-northamerica.com.

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2017, Henkel reported sales of 22.6 billion US dollars (20 billion euros) and adjusted operating profit of around 3.9 billion US dollars (3.5 billion euros). Combined sales of the respective top brands of the three business units – Loctite, Schwarzkopf and Persil – amounted to 7.2 billion US dollars (6.4 billion euros). Henkel employs more than 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX.

For more information, please visit www.henkel.com.

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:: Issue 230 ::
August 14, 2018

Presidio Components

Gannon & Scott

TopLine