Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
SPTS - Corporate Sponsor

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:: Be Sure to Visit the 66 Booths on Display at Device Packaging on March 6 (10:00am-6:30pm) and March 7 (10:00am-4:00pm) (view exhibitors)

:: Visit ASE Group at Device Packaging Booth #47 (full story)

:: Unity SC (A FOGALE Nanotech Company) disclosed two new metrology solutions for advanced packaging applications (full story)

:: Visit the MST Group at booth#28 and find out more about our advanced rigid substrates for ultra-thin build-ups and chip packages (full story)

:: MicroChem Corp develops and manufactures specialty chemicals including photoresists and ancillary materials - Stop by Booth #58 to learn more (full story)

:: nanosystec (Booth # 10): Passive and Active Alignment and Placement (full story)

:: Micross invites you to visit us at IMAPS Device Packaging, Booth 52 (full story)

:: LINTEC is a worldwide leader in adhesive technologies - Come visit us at Booth #11 for more information about our products! (full story)

:: Metalor’s Advanced Coatings Division is uniquely positioned as the only global source of precious metal commodities, plating solutions, and anodes with manufacturing sites and refineries in US, Asia, and Europe (full story)

:: Booth #61 - XYZTEC manufactures bond testers that satisfy military, medical and semiconductor process engineering requirements (full story)

:: Visit Amkor Technology at IMAPS - Stop by Booth #37 to Find Out What Makes Us the #1 Automotive OSAT (full story)

:: NAMICS Corporation Develops Improved Dam-and-Fill Encapsulants (full story)

:: Mentor, A Siemens Business - Visit Us in Booth #48 (full story)

:: Technic Engineered Powders - Experimental Silflake 661 (full story)

:: Neutronix Quintel (NXQ) is a US based manufacturer of photolithography systems (full story)

:: Meet with Nikon Precision representatives at Booth #51, March 6-7, in Fountain Hills, AZ to learn about the latest lithography solutions for advanced MEMS applications (full story)

:: EV Group will showcase its broad portfolio of industry-leading lithography solutions and wafer bonding technologies at the 14th Device Packaging (full story)

:: MacDermid Enthone Electronics Solutions to exhibit at the 2018 IMAPS Device Packaging Show (full story)

:: Visit Rudolph Technologies at the upcoming IMAPS Device Packaging conference and exhibit in Arizona! (full story)

:: Stop by booth #14 to discuss an upcoming project with SMART Microsystems (full story)

:: Have you tried Film? Stop by Booth #66 to discuss Die Attach Film for your Applications (full story)

:: Zuken Inc. -- Come visit us at Booth #27 at the IMAPS Device Packaging Conference 2018 (full story)

:: Sputtering Components Inc. will display equipment used for physical vapor deposition of thin films (full story)

Corporate Sponsor: Evatec

 

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Thank you to our Premier PLATINUM Sponsor:

Thank you to our Premier GOLD Sponsors:

Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC

Thank you to our Premier SILVER Sponsors:

Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics Premier Silver Sponsor: Kyocera

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brian Schieman, bschieman@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brian.


::Visit ASE Group at Device Packaging Booth #47

Alongside a broad portfolio of established technologies, OSAT industry leader ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, Fanout, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: www.aseglobal.com

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::Unity SC (A FOGALE Nanotech Company) disclosed two new metrology solutions for advanced packaging applications

T-MAP 3D: Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is the minimum measurable thickness due to the high coherence length of the IR LED source. A new Near-Infrared Interferometer was recently developed at Fogale Nanotech Laboratories. The spectral bandwidth was increased to 110 nm, i.e. the minimum detectable optical thickness was improved by a factor of nearly three. This technology has been implemented into the Unity SC T-MAP series.

NST 300: The NST 300 has been qualified by a major customer for CMP process control performed prior to 3D hybrid bonding process used in BSI (Back Side Imager) manufacturing. The tool is able to measure nanoscale topography at die level and at the extreme edge of the wafer with high lateral resolution and from several hundred of nm to few nm level of amplitude. Mechanical profilometry comparisons have shown good potential to perform measurement on wafers without metal layer coating. This represents a key advantage for inline control, as the technology will allow higher throughput than mechanical profilometry and the ability to give much more information to tune and control the CMP process.

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::Visit the MST Group at booth#28 and find out more about our advanced rigid substrates for ultra-thin build-ups and chip packages

Micro Systems Technologies Group (MST) invites you to the upcoming IMAPS Device Packaging exhibition. Please visit us at booth #28.

DYCONEX, one of the MST companies, features an advanced rigid multilayer material allowing ultra-thin build-ups for various high frequency applications particularly suitable for HF chip packaging. The material offers low dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength. Using any layer technology the layers of the substrates are only connected by laser drilled, copper filled microvias allowing for high-density / high-reliability designs. Other HDI build-up solutions are available in addition.

The MST Group is your one-stop partner for turning any of your ideas into an innovative solution in the field of highly reliable and miniaturized electronics. Our solutions are targeted at the requirements of high-tech industries demanding exceptional performance and the highest level of reliability. The capabilities include design service, manufacturing of organic and ceramic substrates, component qualification, semiconductor packaging, advanced board assembly and module qualification.

Our exhibition team looks forward to meeting you. For an appointment on site, kindly contact us at: sales.msti@mst.com www.mst.com

MST Group

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::MicroChem Corp develops and manufactures specialty chemicals including photoresists and ancillary materials - Stop by Booth #58 to learn more

MicroChem Corp develops and manufactures specialty chemicals including photoresists and ancillary materials for MEMS, Microelectronics, Advanced Lithography, Specialty Displays, Packaging, Optoelectronics and other dynamic technology markets. Our most recent commercialized product, KMRD, is a low temperature cure ‘amide’ type polymer designed for Wafer Level Packaging RDL.

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::nanosystec (Booth # 10): Passive and Active Alignment and Placement

The NanoGlue Alignment and Gluing Station aligns actively or passively with high precision in the submicron regime and short process times. It handles various types of optical, electronic and mechanical parts.

The active alignment uses any feedback signal, passive placement is performed via machine vision to recognize the part’s location in space. The attachment is automatically performed by epoxy gluing and subsequent UV or thermal curing. Alternatively, nanosystec offers laser soldering or laser welding as assembly methods. Several complex process steps can be integrated into one system with a small footprint of approximately 1.5 m². The customization of the set-up and the loading concepts provides an efficient solution for niche application with specific requirements.

nanosystec

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::Micross invites you to visit us at IMAPS Device Packaging, Booth 52

Micross will be showcasing advanced packaging solutions and their extensive range of interconnect & 3D integration technologies including 2.5/3D enabled applications; high density fan-out; image sensor technology; advanced assembly technology; bumping & copper pillar technology, equipment and materials. Micross provides full in-house state-of-the-art wafer bumping and WLCSP solutions. Whether you have a need to process a single wafer or are looking for a source to provide recurring production services, Micross has a wide array of WLP technologies.

In business for 35+ years, Micross’ comprehensive array of high-reliability capabilities serves the global defense, space, medical, industrial and fabless semiconductor markets. Micross is the leading one-source provider of bare die & wafers, wafer bumping & advanced interconnect technologies, custom packaging & assembly, component modification services, electrical & environmental testing and Hi-Rel products to manufacturers and users of semiconductor devices. Learn more: Visit micross.com or email: onesource@micross.com

Micross

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::LINTEC is a worldwide leader in adhesive technologies - Come visit us at Booth #11 for more information about our products!

LINTEC of AMERICA INC.
15930 S. 48th Street Suite 110
Phoenix, AZ 85048
Phone: 480-966-0784
Website: www.lintec-usa.com
Booth #11

LINTEC is a worldwide leader in adhesive technologies. For 30+ years, LINTEC has created equipment and materials to solve difficult semiconductor process issues. With a catalog of hundreds of tapes and equipment, and decades of application experience, LINTEC is positioned to help. Whether you are looking for tape, need equipment to mount, peel or UV cure - our staff stands ready to assist you to provide the Adwill Advantage.

Come visit us at Booth #11 for more information about our products!

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::Metalor’s Advanced Coatings Division is uniquely positioned as the only global source of precious metal commodities, plating solutions, and anodes with manufacturing sites and refineries in US, Asia, and Europe

Metalor Technologies USA
Booth #15
255 John L. Diestch Blvd.
North Attleboro, MA 02763
(P) 508-699-8800

Metalor’s Advanced Coatings Division is uniquely positioned as the only global source of precious metal commodities, plating solutions, and anodes with manufacturing sites and refineries in US, Asia, and Europe. Product portfolio includes gold, silver, platinum, palladium, rhodium, ruthenium materials designed for use in decorative and electronic applications. Our comprehensive range of refining services along with our plating processes can be your one-stop-provider for all your precious metal solution needs.

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::Booth #61 - XYZTEC manufactures bond testers that satisfy military, medical and semiconductor process engineering requirements

XYZTEC manufactures bond testers that satisfy military, medical and semiconductor process engineering requirements. Our award winning Rotating Measurement Unit allows users to switch from one test to another within a few seconds. The entire bond test process can be fully automated such that operators no longer have to sit in front of a machine all day to perform wire pull or shear testing. See us at Booth 61.

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::Visit Amkor Technology at IMAPS - Stop by Booth #37 to Find Out What Makes Us the #1 Automotive OSAT

Each day brings new headlines about self-driving and electric cars. These trends are driving strong growth in electronic content in cars. Amkor is an OSAT (Outsourced Semiconductor Assembly & Test) partner to semiconductor companies supplying to Automotive OEMs and Tier 1 manufacturers.

Wins in automotive applications are "sticky" and provide a stable volume base for 10+ years. Automotive suppliers must be able to offer support for these long lifecycle applications to ensure business continuity.

The "Multiplier Effect" is the main challenge in automotive semiconductor reliability. Even a 1 ppm (part per million) failure at the component level will translate to a 1% defect rate in the vehicle. For the highest reliability, we need Zero Defects. This challenge is even more pronounced with the rising electronic content in cars.

Suppliers to the automotive market must be able to address the "Multiplier Effect" with intelligent design techniques, higher integration, redundancy and intensive screening. From an OSAT perspective, achieving automotive certifications is a good start, but is really only the minimum requirement.

OSATs must implement automotive controls such as automotive designated machines and automotive certified operators. OSATs must also develop enhanced automotive material sets and process flows to achieve the highest levels of reliability. They must establish a reliable and high-quality supply chain. Finally, increased used of automation in the factories is essential to eliminate human error and minimize variation in production.

Amkor is the #1 automotive OSAT with several decades of experience and the capability to meet these stringent requirements. In 2018, we will grow our automotive revenue by providing best in class back-end manufacturing services to our customers.

 
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::NAMICS Corporation Develops Improved Dam-and-Fill Encapsulants

NAMICS Corporation has developed an epoxy dam material (CHIPCOAT G8345D) and an accompanying epoxy fill material (CHIPCOAT G8345-6) for the semiconductor market. Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a highviscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. CHIPCOAT G8345D and G8345-6 are fast curing, low CTE (low stress), offer high package reliability and reduced warpage.

CHIPCOAT G8345D and G8345-6 are in full production and are available for sampling. Standard packaging is frozen syringes with 50 grams in a 30cc syringe; larger cartridges are available. To find out more about these NAMICS Dam-and-Fill materials, please visit www.namics.co.jp/e/product/chipcoat04.html or contact your local NAMICS sales representative.


G8354D (Dam)


G8345D & G8345-6 (Dam & Fill)

NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

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::Mentor, A Siemens Business - Visit Us in Booth #48

Mentor, A Siemens Business is the worldwide market leader in PCB systems design, advanced IC Packaging solutions and analysis technologies. Mentor, A Siemens Business will be showcasing its Xpedition High Density Advanced Packaging (HDAP) prototyping, design and verification solutions for heterogeneous multi-substrate designs such as FO-WLP, 2.5D and system-in-package. Visit booth #48 to learn more about Mentor’s technologies and best practices for IC/Package/Board co-design.

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::Technic Engineered Powders - Experimental Silflake 661

New Product Announcement Experimental
Silflake 661

Technic EPD has announced the release of Experimental Silflake 661. The flake is mechanically flattened with a bi-modal particle size distribution. The residual lubricant works well in most polymeric applicaitons. The flake has been developed for use in a variety of applications including conductive adhesives, die attach, and other polymeric applications.

The flake exhibits a D50 particle size of 2.5 to 5.5 micron, a tap density of 2.2 to 3.5 g/cm3, with a specific surface area of 1.0 to 1.5 m2/g and a weight loss at 538ºC of less than 0.7%. Benefits of the flake are its bi-model particle size distribution and residual lubricant that works well in most polymeric systems. Please contact Technic via email, info@technic.com, or phone, 401-769-7000, with any questions or inquiries.

About Technic:
Technic Inc. is a Rhode Island based, privately held corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

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::Neutronix Quintel (NXQ) is a US based manufacturer of photolithography systems

Neutronix Quintel (NXQ) is a US based manufacturer of photolithography systems since 1978. We will be showcasing our new NXQ9000 Series Proximity Stepper for 300mm wafers or large area glass interposers at the 14th International Conference and Exhibition on Device Packaging. The NXQ9000 series is the first-of-its-kind 1x proximity stepper in the marketplace for full field or step and repeat exposures. Available in Roll to Roll or large area substrate formats.

With the ability to do either 1x full field exposures up to 320mm square, or step and repeat quadrant alignment and exposures by recipe selection, the user can optimize the print modes for specific process requirements. Step and repeat mode is required for controlling run-out and CD variations that are common problems with 1x large area aligners and 1x full field projection systems.

The NXQ9000 fills a market void for an affordable large area photolithography system for feature sizes 2um and larger. Many large area photolithography systems are based on expensive projection technology and do not meet the ROI criteria of many emerging markets that require low Cost of Ownership to make the technology financially viable. The NXQ9000 is priced at 50-80% less than 1x full field projection systems and 1x or reduction steppers in the marketplace.

Target Markets include wafer level packaging, interposer, sensors, display, product security / anti-counterfeiting, RFID, solar, Medical and wearable electronics. We welcome the opportunity to discuss your applications and to learning how we may help you by providing a superior cost-effective solution.

Visit us at Booth 53

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::Meet with Nikon Precision representatives at Booth #51, March 6-7, in Fountain Hills, AZ to learn about the latest lithography solutions for advanced MEMS applications

Nikon MEMS Steppers provide extremely diverse processing capabilities. They are successful in meeting customers’ unique requirements for not only HDD/LED and MEMS applications, but also for discretes, packaging (backend) applications, and more. In addition, MEMS Steppers are well-suited for patterning Cu Pillar insulating layers as well as the insulating layers used in bumping processes.

MEMS Steppers use low numerical aperture lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus. Nikon MEMS Steppers also provide a high degree of alignment flexibility, and the majority of MEMS Steppers support critical Backside Alignment (BSA) capabilities as well.

Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. Newly developed systems maximize productivity, support substrates up to 200 mm and beyond, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield are available.

Nikon is pleased to offer the NES2W-i10, which features a reduction lens with a 44mm x 44mm field size, optimal cost of ownership, and enhanced overlay to offer customers a superior alternative to Mask Aligners, and we continue to grow our product line to meet the dynamic requirements of these markets.

Nikon Precision provides sales, marketing, and unparalleled support for Nikon Lithography systems worldwide. Our extensive product portfolio includes specialized solutions for MEMS/LED, packaging (backend), and flat panel display (FPD) processing, as well as advanced i-line, KrF, ArF, and immersion lithography systems used throughout the semiconductor and thin-film magnetic head (TFH) industries. Please visit our website at https://www.nikonprecision.com or contact:

Brenden Wells
Key Account Manager
Nikon Precision Inc.
brenden.wells@nikon.com

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::EV Group will showcase its broad portfolio of industry-leading lithography solutions and wafer bonding technologies at the 14th Device Packaging

EV Group (EVG) will showcase its broad portfolio of industry-leading lithography solutions and wafer bonding technologies, including fusion and hybrid bonding as well as temporary bonding and debonding at the 14th International Conference and Exhibition on Device Packaging.

Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable leading-edge 3D chip stacking applications in high volume manufacturing, including 3D stacked image sensors, memory stacking and die-partitioning for next-generation 3D system-on-chip devices. EVG’s proprietary SmarView®NT face-to-face aligner, supported by the latest alignment verification module to enable in-situ post-bond IR alignment measurement, achieves industry leading alignment accuracy and supported the latest pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy, representing a breakthrough in enabling high-density IC applications.

EVG’s next-generation low-temperature laser debonding solution combines a solid-state laser and proprietary beam-shaping optics with a modular equipment platform to provide a universal, high-throughput and low cost-of-ownership (CoO) wafer debonding process optimized for FO-WLP. EVG’s proprietary optics enables tighter process control, which coupled with the high pulse repetition rate of the laser leads to a well-controlled, high-throughput debonding process. Building on years of experience in slide-off, mechanical and laser debonding, EVG’s breakthrough solution for FO-WLP also includes low laser maintenance, high carrier wafer lifetime, support for fully automated handling on film frame, oversized carriers or free-standing thin wafers, and optimized footprint layout. Based on the company’s open adhesive platform concept, EVG enables the use of a wide range of adhesives from various suppliers.

Visit the EVG booth #41 to discuss your manufacturing needs.

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::MacDermid Enthone Electronics Solutions to exhibit at the 2018 IMAPS Device Packaging Sho

MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2017.

MacDermid Enthone‘s Advanced Electronics Solutions (AES) business is a global leader in high performance semiconductor chemistries and assembly materials. OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the IMAPS booth to collaboratively develop solutions that meet the fast paced semiconductor market demands. The AES team will highlight the MICROFAB family of products which provides advanced packaging solutions that exceed aggressive packaging design requirements and enable greater device reliability. MEES will showcase its chemical processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter.

The booth will also include specialty product offerings from their sister company, Alpha Advanced Materials (AAM). AAM is committed to providing the global semiconductor packaging industry with innovative high performance materials including ATROX, the hybrid sintering die attach paste, and their full suite of solder, spheres and wafer level fluxes.

Eric Gongora, General Manager and Stretegic Marketing Director of Wafer Level Packaging, AES, along with Torey Tomaso, OEM, Marketing and Sales Manager from AAM, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.

Each technology supports a broad spectrum of package applications that ranges from MEMS, RF filters and PAs to leading edge FOWLPs, high die count memory stacks and high performance RF modules. The combined innovation, experience and product offerings make MacDermid Enthone and Alpha the new industry leader in all materials for Advanced Packaging.

For more information on our latest product technologies, visit us at Booth 45/46.

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::Visit Rudolph Technologies at the upcoming IMAPS Device Packaging conference and exhibit in Arizona!

Visit Rudolph Technologies at the upcoming IMAPS Device Packaging conference and exhibit in Arizona! Stop by booth #32 to talk all things advanced packaging and learn about the latest application challenges Rudolph has solved.

Rudolph provides process and control solutions for RDL, UBM, PR/PI, TSV, bumping, fan-out, panel, saw optimization, and more.

Rudolph’s integrated process control solutions include combined 2D/3D inspection and metrology, post-saw dicing/chipping detection, residue detection, and interconnect metrology. Advanced ADC reduces operator review time, improving throughput.


Figure 1: Residue detection on Cu pillars and bumps

Employ powerful fabwide process analysis software tools to take control of back-end yield and optimize the packaging process.

Rudolph’s advanced packaging lithography stepper images down to 2µm, with extensive experience in fan-out, RDL and Cu pillar applications. The JetStep Lithography Series handles both wafers and panels.


Figure 2: JetStep System’s advanced imaging optics prints high density, high aspect ratio Cu pillars

Join us for the poster session on Wednesday afternoon where Rudolph experts will explore creation of high density, high aspect ratio copper pillars with the poster “Integration of a Chemically-Amplified Photoresist and an Advanced Packaging Stepper for Advanced Packaging Technologies”

See you in sunny Arizona!

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::Stop by booth #14 to discuss an upcoming project with SMART Microsystems

SMART Microsystems is a Microelectronic Assembly company located in Northeast Ohio and provides Product Development and Manufacturing Services for sensors, MEMS, and power electronics. SMART works with customers to 1) develop prototypes, 2) qualify new products, and 3) manufacture in volume.

Their assembly capabilities are housed in state-of-the-art Class 1,000 and Class 10,000 cleanrooms and include: dicing, die attach, wire bonding, and encapsulation. We also have environmental testing and failure analysis capabilities.

SMART Microsystems is ISO 9001:2015 certified, reflecting our commitment to high quality and continuous improvement.

Stop by booth #14 to discuss an upcoming project.

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::Have you tried Film? Stop by Booth #66 to discuss Die Attach Film for your Applications

Global Thin and Ultra-Thin Films Market: "The major forces driving the global thin and ultra-thin films market includes ongoing miniaturization in semiconductor and electronics industry, developments in nanotechnology and rising demand for affordable renewable energy sources." According to this report by GII

Die Attach Film

ESP8680-SC
• As Thin as 15 Micron Thickness
• Exceptional Strength
• Cure: 125 C for 10 minutes

ESP7660-HK
• High Moisture Resistance
• High-Bond Strength
• Electrically Insulating

ESP7450-RC
• Outstanding Thermal Stability
• Rapid Cure
• Tack-Free

ESP8450
• Flexible "Stress-Free"
• Electrically Conductive
• Tack-Free

Die Attach Pastes

ME8418-SC
• Thermally Conductive
• Reworkable
• Cure: under 10 minutes

ME8650-RC
• Flexible "Stress-Free"
• Low Temp Curable
• Electrically Conductive

ME8630-SSC
• 100% Solid
• Moisture Resistant
• Fine Pitch

Other Products:

Thermal Interface Materials
AIT LED thermal management material solutions are engineered to prevent "drying" or cracking inside the materials and along the interface surfaces.

Coupler/IMTS
AIT Coupler can be used to build one of the thinnest components and circuit boards with 40-50 micron dielectric over a 1/4 oz (9 micron) copper conductor.

About Us
AIT has a team of experienced engineers, scientists, sales and service staff ready to serve your needs for any electronic and semi-conductor packaging material solutions. We pride ourselves on providing products that meet your needs! AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040

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::Zuken Inc. -- Come visit us at Booth #27 at the IMAPS Device Packaging Conference 201

3D System Co-Design – FOWLP, 3DIC and more
Get to know Zuken: https://us.zuken.com/

Zuken Inc. provides EDA solutions for system co-design in a true 3D format allowing users to design chip, package and PCB structures. We will be demonstrating how users can do co-design through optimizing fan-out packages, IO floorplans, RDL routing, automatic daisy chain creation across chip-package interfaces amongst other examples. Please join us at booth # 27 to have a chat with our technical staff.

Zuken Inc., SOZO Center
1900 McCarthy Blvd #400,
Milpitas, CA 95035
Ph: (408) 890-2831
https://us.zuken.com/

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::Sputtering Components Inc. will display equipment used for physical vapor deposition of thin films

Sputtering Components Inc. (SCI) of Owatonna, MN USA will display equipment used for physical vapor deposition of thin films. SCI's PVD products include rotary sputtering magnetrons (end blocks and magnetics) and complete vacuum coater lid systems.

On hand will be a demonstration of our new Nickel Magnet bar, which enables sputtering of sprayed and monolithic nickel targets with the utilization and uptime benefits of a rotary cathode while providing a mechanical means for safe and easy adjustment, inser¬tion, and removal by the operator with common tools.

Visit us in Booth #30 to discuss how Sputtering Components’ innovative products can help improve your device packaging.

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:: Issue 222 ::
February 28, 2018

Corporate Sponsor - Dow Electronic Materials

Premier Silver Sponsor: NAMICS