Corporate Bulletin
:: Corporate Member News ::

:: Rudolph Technologies Expands Memory Customer Base with $21M in System Orders (full story)

:: Torrey Hills Technologies Donates Slow Roller Machine and Ceramic Microwave Packages to NCSU (full story)

:: Axus Technology Announces New VP of Sales and Marketing (full story)

:: News from Indium (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

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:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: Rudolph Technologies Expands Memory Customer Base with $21M in System Orders

Orders are part of a record $100 Million in fourth quarter bookings driving record backlog for 1H 2018

Rudolph Technologies, Inc. (NYSE: RTEC) announced that it has received over $21 million (USD) in orders for process control solutions from two customers: a Korean-based manufacturer of advanced DRAM ranking in the top five of worldwide semiconductor companies and a rapidly expanding 3D NAND manufacturer in China. The orders, which are evenly split between the two customers, span Rudolph’s broad portfolio of total process control solutions comprising metrology, inspection, and software.

The Korean-based manufacturer continues to add to their previously installed Rudolph fleet as they boost production of advanced memory, while the new customer recognizes the value of Rudolph’s solutions and is adopting them to optimize their initial volume ramp. The solutions installed at the new facility in China further add to Rudolph’s growing revenue from memory applications, which nearly doubled from 2016 to 2017, including a significant contribution from expansion in China. All systems are scheduled to ship in the first half of 2018.

Equipment demand from memory manufacturers continues to grow as they transition from planar NAND to 3D NAND, which allows them to pack more memory into a smaller volume. This transition is driven by growing demand for memory in mobile devices, AI, and servers.  
“Our flagship NSX® and MetaPULSE® systems have been selected for process control of critical deposition and etch steps for hard mask etch control in 3D NAND and for TSV process control in high bandwidth DRAM,” said Tim Kryman, senior product marketing director at Rudolph Technologies.  “We have been working extensively with industry leaders to increase output volumes by maximizing yields in advanced memory. This experience and value was recognized by our new customer in China and was a key factor in their selection of Rudolph’s solutions.”   

“We are pleased that our integrated process control solutions are proving to be essential in-line components for our existing customers and an enabler for new customers in the memory market,” said Mike Plisinski, chief executive officer of Rudolph Technologies. “2017 was a record year for Rudolph’s memory business and our orders for the first half of 2018 already exceed the first half of 2017.”

Mr. Plisinski concluded, “While memory remains a key market, we are also seeing strong demand from advanced packaging, CIS, RF, and automotive markets into 2018. The value represented by our solutions across these various markets resulted in a record $100 million in new orders during the fourth quarter with deliveries primarily in the first half of 2018.  This signifies a clear endorsement of our products from our customers and the broad strength of the industry.”    

For more information about Rudolph’s process control solutions, visit  

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, Rudolph’s business momentum and future growth and the market demand for semiconductors generally as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, Rudolph’s ability to plan and manage its resources and production capability, including its supply chain and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2016 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.


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:: Torrey Hills Technologies Donates Slow Roller Machine and Ceramic Microwave Packages to NCSU

Torrey Hills Technologies, LLC (THT) recently donated a slow roller machine and ceramic microwave packages to the Packaging Research in Electronic Energy Systems (PREES) lab at North Carolina State University (NCSU). PREES is breaking new ground in the field of power electronics research, including developing a new packaging discipline called “Printable Power Electronics,” which focuses on evolving 3D printing technologies of ceramics, metals and polymers to provide rapid, flexible methods for physically creating one-of-a-kind 3D electro-physical power circuits. THT has previously donated a high temperature box oven to the PREES lab.

"PREES Director Dr. Douglas Hopkins is my professor within the IMAPS circle," said Ken Kuang, president of THT. " It is a great honor to support him and his lab.”

THT’s slow rollers can be used for many different applications, including those requiring that the uniformity of solder and thick film paste is strictly maintained. It can thoroughly de-air to avoid paste separation, which will solve Dr. Hopkins’s students’ problem of their pastes not being mixed correctly. The machines feature an adjustable shaft distance to accommodate containers of different sizes, and the jar speed is adjustable from 0-5 rpm.

THT Packages have excellent thermal performance and microwave performance, suitable for silicon power transistor, LDMOS devices, GaAs, SiC and GaN power devices packaging. Currently the company carries more than 40 types of ceramic RF, microwave, and power packages with a maximum pulsed output power of up to 500W.

Torrey Hills Technologies, LLC ( develops and delivers quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to mixing equipment and furnace equipment manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.

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:: Axus Technology Announces New VP of Sales and Marketing

Axus Technology  is pleased to announce that Jim Kelly has joined the company as Vice President of Sales and Marketing.  Jim's new role will provide management, sales, marketing, and business development support to the Axus global customer base and sales team.  Due to Axus' explosive growth with customers in the Silicon Valley area, Jim will be based in the Richmond, California facility to give additional support and focus to that region, creating a new sales and support office to expand our previous system repair facility there.

Jim has over 20 years of experience in semiconductor automation, particularly in wafer handling. Jim was VP of Sales and Marketing at Isel Robotik USA for 5 years before the company was sold to Moog, after which he stayed on as a Market Manager for the worldwide sales of Moog's semiconductor portfolio of products for 3 additional years. Prior to joining Axus, Jim was Director of Global Sales at Metlsaw.

"Jim's vast experience in global semiconductor equipment sales will help Axus penetrate into new markets worldwide," stated Dan Trojan, President of Axus Technology. "We're very excited to have Jim join us and are looking forward to being better equipped to support our existing Silicon Valley customers and to gain new ones by his presence in the area."

About Axus Technology
Axus Technology is a leading-edge surface processing solutions company providing, global, CMP, wafer thinning, and wafer polishing services for semiconductor, MEMS / Nanofabrication, and substrate applications. Axus Technology is an industry expert in providing material processing, CMP foundry services, process tools and custom configured upgrades designed to meet all current semiconductor process and production requirements. 

Based in Chandler, Arizona, Axus Technology operations include a fully-equipped development and foundry processing facility, as well as design, manufacturing, and worldwide service and parts support. For more information visit our website at
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::News from Indium Corporation

Indium Corporation Announces New Corporate Leadership
Greg Evans Named CEO, Ross Berntson Promoted to President and COO

Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.

Evans has been with Indium Corporation for 36 years. He began as a Technical Support Engineer and quickly rose to Product Line Manager, helping expand the company’s product lines into the SMT assembly field. As Division Director for Indium Corporations electronics assembly materials, he guided the steady growth of the solder paste product line and instituted a formal corporate R&D function. Evans eventually became the VP of Manufacturing and Sales, overseeing the expansion of the company’s manufacturing footprint and sales structure in the UK, Singapore, China, South Korea, and Malaysia, and addressing the growing global demand for Indium Corporation products. Evans was named President and COO in 1997, leading the company’s growth from dozens of people to over 800 and from one factory in Utica, N.Y. to 12 facilities, worldwide. Under his leadership, Indium Corporation has earned numerous awards, honors, and recognition due to the strengthening of corporate culture and performance.

Evans earned his AAS in Engineering Science from Mohawk Valley Community College, his BS in Chemical Engineering from Clarkson University, and his MBA from Rensselaer Polytechnic Institute.

“Greg’s leadership has propelled Indium Corporation to the position of more than just an electronics assembly materials manufacturer and supplier of choice, but also an employer of choice,” Macartney III said. “I very much look forward to continuing our close work together as we spend many more years dedicated to the success of Indium Corporation and strengthening the company. Together, we are equally dedicated to the success of each member of the Indium Corporation family, and will work to secure our futures, achieve everyone’s potential, and uphold our company culture – The Indium Way.”

As CEO, Evans will focus, primarily, on the company’s long-term mission and strategies. His work will ensure the ongoing growth and vibrancy of Indium Corporation.

Berntson joined Indium Corporation in 1996 as a product specialist. He quickly rose to the roles of product manager, marketing leader, sales leader, tech support leader, and, most recently, as Executive Vice President. Berntson is an active member of numerous industry organizations, including IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in business administration and a bachelor’s degree in chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.

“Over the past 20 years, Ross has been intelligent and strategic in his results-driven approach to leadership at Indium Corporation,” Evans said. “I look forward to continuing to work alongside Ross as we further secure Indium Corporation’s position as the global leader in quality electronics assembly materials and technical support.”


Indium Corporation Earns International Automotive Quality Recognition – ISO/TS 16949

Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters.

“SRI Quality System Registrar (SRI) is pleased to acknowledge that Indium Corporation has demonstrated effective implementation of a management system that satisfies the tough auto standard: ISO/TS 16949,” stated Edward L. Maschmeier, Director, Certification. “This certification shows their automotive customers worldwide that Indium Corporation is committed to being recognized as a long-term supplier of quality goods and services.”

Indium Corporation’s Business Park Drive facility in Utica, N.Y., earned an ISO/TS 16949 management certificate for the design and manufacturing of brazing and solder materials as ribbon, wire, preforms, and engineered solders; flux-coated materials; NanoFoil®; sputtering target bonding; pure indium metal and fabricated indium metals for electronics assembly.

Indium Corporation’s headquarters and manufacturing operations in Clinton, N.Y., earned certification for the design and manufacture of solder powders, solder pastes, soldering fluxes, epoxy, and related materials for semiconductor manufacturing and electronics assembly.

“Quality, precision, and reliability are core tenets at the heart of every activity at Indium Corporation,” said Ross Berntson, Indium Corporation President and COO. “These certifications are formal evidence of the commitment to quality as a core operating principle since Indium Corporation was founded more than 80 years ago.”

The ISO/TS 16949:2009 is an international technical specification standard aimed at the development of a quality management system that provides for continuous improvement, emphasizing defect prevention, and the reduction of variation and waste in the automotive industry supply chain.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


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:: Issue 220 ::
January 23, 2018


JC Cherry