Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Technic Announces New Products (full story)

:: Brewer Science Seeks to Ignite Creative Spark; Hosts Internationally Acclaimed Jacques Thibaud String Trio for Evening Concert (full story)

:: Amkor Delivers Industry's First Package Assembly Design Kit to Support Mentor's High-Density Advanced Packaging Tools (full story)

:: Indium Corporation Announces Partnership with MELSS (full story)

:: Integra Technologies Receives ISO 13485:2016 Certification (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

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:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Technic Announces New Products

Technic Introduces Silflake 741

Technic EPD has announced the release of Silflake 741. The flake is mechanically flattened with a coating compatible with most fired and polymeric applications. The flakes are characterized by a low aspect ratio that results in dense films. Silflake 741 has been developed for use in photovoltaic inks, component inks, and similar fired applications.



The flake exhibits a D50 particle size of 1.5 to 4.5 micron, a tap density of 3.0 to 4.0g/cm3, with a specific surface area of 0.7 to 1.2 m2/g and a weight loss at 538ºC of less than 0.7%. Benefits of the flake are its low aspect ratio as well as residual lubricant that works well in most fired and polymeric systems. Please contact Technic via email, info@technic.com, or phone, 401-769-7000, with any questions or inquiries.

 

Technic Introduces the RTA 3D

Technic’s Analytical Controls group officially announced the introduction of the Real Time Analyzer RTA 3D. The RTA 3D is a much-anticipated upgrade to the RTA, which has set the standard for robust analytical performance in electroplating solutions over the last decade. 

Historically, the RTA’s highly reliable design has been consistently responsible for delivering trouble-free and accurate electroplating solution analysis. Now, with the culmination of several years of lab and field experience, the RTA 3D system combines successful technologies utilized by the well-established RTA system with new features that further improve accuracy and reproducibility.

New analytical approaches and innovative electrochemical techniques have made it possible to widen analytical model control ranges and improve accuracy. Updated hardware advancements, including state-of-the-art electronic components, help minimize the impact of external noise while enhancing relevant signals affecting measurement readings. Coupled with intelligent software, the RTA 3D delivers tighter process control and offers users the ability to self-diagnose and even self-correct a variety of hardware issues and miscellaneous disturbances. 

Most notably, the RTA 3D integrates a new “logic” feature that  automatically makes adjustments based on information obtained from customer data; this allows the unit to self-correct minor issues and create customer-specific parameters. Building on the success of Technic’s original RTA, designed to communicate across many platforms, the open architecture of the RTA 3D makes customization even easier. The system easily integrates into any closed loop/in-line/at-line environment with minimal customization to software. Additional options such as software enhancements, plating health detection, and automatic calibration tools are also available.

About Technic’s Analytical Controls Group
Technic provides a full range of analytical control tools, from simple pH meters and chemical feeders to proprietary, real-time monitoring analysis and advanced automated control systems.

Learn more at www.technic.com/analytical-controls

 

Technic Techniseal and Tarniban(R)

Techniseal and Tarniban® KS II are Technic’s premier silver anti-tarnish processes designed to prevent yellow discoloration under the harshest conditions. Both are production proven processes that can be used in barrel, rack, and high-speed reel-to-reel applications.


 
Techniseal is Technic’s most powerful silver anti-tarnish. The electrolytic process deposits a nano-scale inorganic coating on the surface of the silver deposit within 5 seconds. This high-speed deposition makes it particularly suited for reel-to-reel applications. Silver deposits treated with Techniseal pass all ammonium and potassium sulfide tests. Additionally, Techniseal will prevent silver discoloration caused by high-temperature exposure, making this product especially useful for automotive “under the hood” and LED applications. Producers of silver plated castings are also using Techniseal to prevent discoloration on the product after long-term exposure to temperatures above 232 °C and under humid storage conditions.

Technic’s Tarniban® KS II is an organo-thiol process that can be used in immersion or electrolytic applications. It forms a SAM (Self-Assembled Molecular) barrier layer on silver deposits and prevents discoloration at temperatures below 232 °C. Tarniban® withstands all standard ammonium and potassium sulfide tests and provides a more lubricious coating to the silver deposit. Rack and barrel applications require only simple immersion for at least 30 seconds.  For reel-to-reel applications, Technic recommends an electrolytic treatment, providing full protection of the silver deposit in just 5 – 10 seconds.

For more information on Tarniban® and Techniseal, please contact your local Technic representative.



About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more at www.technic.com or contact us at (401) 769-7000.


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:: Brewer Science Seeks to Ignite Creative Spark; Hosts Internationally Acclaimed Jacques Thibaud String Trio for Evening Concert

Brewer Science understands the importance of the arts to ignite the creative spark in its employees and the community. To inspire and delight, Brewer Science is bringing the internationally acclaimed Jacques Thibaud Trio to Missouri for an intimate evening of stringed chamber music on August 18.  This is the 19th year that Brewer Science has sponsored a concert by the group and it is the only concert the Jacques Thibaud String Trio will perform in Missouri during 2018. 

The concert will begin at 8:00 pm on Saturday, August 18, at the Cedar Street Playhouse, located at 701 N. Cedar Street, Rolla, MO.   Hors d’oeuvres will be served at 7:00 pm.
Tickets are available online at
https://www.etix.com/ticket/p/8046734/jacques-thibaud-trio-rolla-cedar-street-playhouse
or by calling 573-364-9523 (ext. 1). Tickets are $35 each and seating is limited.

“As innovators, we recognize the creativity inspired by the arts and we are delighted to bring the Jacques Thibaud String Trio to Missouri, to provide the community with an opportunity to enjoy an evening of exceptional music,” said Loretta Wallis, corporate relations manager for Brewer Science.   “Brewer Science, a creator of original technology solutions in the microelectronics industry, has a long-standing reputation for bringing value to the community through its long-term commitment to the arts, education and environmental sustainability.”

For more information, contact Loretta Wallis, corporate relations manager at (573) 364-0300 or mwallis@brewerscience.com.

About the Jacques Thibaud String Trio

The Jacques Thibaud String Trio is comprised of Hannah Strijbos, viola; Burkhard Maiss, violin; and Bogdan Jianu, cello. The original international trio was founded at the Berlin School of Art in 1994. Internationally, the Trio has appeared at London’s Wigmore Hall, has performed throughout Germany and Japan, and continues to perform at many of Europe’s most prestigious festivals including Belgium’s Musica Mundi, Gidon Kremer’s Echternach Festival in Luxembourg, and Denmark’s Roskilde Schubert Festival. Follow the Trio and hear portions of their recordings at facebook.com/jttrio or visit www.jttrio.com to learn more about the group.
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:: Amkor Delivers Industry's First Package Assembly Design Kit to Support Mentor's High-Density Advanced Packaging Tools

Amkor's SmartPackage™ Speeds Accurate Design and Verification of Heterogeneous Integration Package Solutions

Amkor Technology announced it has partnered with Mentor to release Amkor's SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor's High-Density Advanced Packaging (HDAP) design process and tools. Amkor's award-winning High-Density Fan Out (HDFO) process can now be used in conjunction with Mentor's software to deliver early, rapid and accurate verification results of advanced packages required for Internet-of-Things, automotive, high-speed communications, computing and artificial intelligence applications.

"Amkor leads the way in HDFO technology for OSAT companies, and with the rise of complex ICs with multi-die packages, we prioritized the creation of Mentor-based PADKs to significantly reduce cycle time," said Ron Huemoeller, corporate vice president - research & development, Amkor Technology. "Since the Mentor flow includes Calibre, the golden sign-off tool for the fabless ecosystem, our customers can easily close any physical verification issued for their entire solution."

The complex and compact design of devices for today's smart applications is driving the need for sophisticated packaging techniques such as heterogeneous integration and Advanced System-in-Package. These solutions combine one or more ICs of different functionality with increased I/O and circuit density in 2.5D (side-by-side) and 3D constructions. With Amkor's SmartPackage PADK and Mentor's proven HDAP tool flow, mutual customers of Amkor and Mentor have the ability to create and review multiple assemblies and LVS (layout vs. schematic), connectivity, geometry and component spacing scenarios using Amkor's HDFO process. The graphic environment features robust data and is straightforward to use before and during the implementation of physical design, resulting in faster sign-off and fewer verification cycles.

"Amkor was the first OSAT company to join the Mentor OSAT Alliance program, and now the first to build and make available a PADK for its customers," said AJ Incorvaia, vice president and general manager of Mentor's BSD division. "By providing a fully validated PADK for Amkor's HDFO process for Mentor's proven HDAP tool flow, customers can more easily transition from classic chip design to 2.5 and 3D solutions."

The OSAT Alliance program helps promote the adoption, implementation and growth of HDAP throughout the semiconductor ecosystem and design chain, enabling system and fabless semiconductor companies to have a friction-free path for emerging packaging technologies.

For additional information, please contact us at Sales@amkor.com  

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::Indium Corporation Announces Partnership with MELSS

Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India.

MELSS will be selling all of Indium Corporation’s soldering materials, such as low-voiding solder paste and solder preforms for bottom termination components, solder wire for hand and robotic soldering, and rework fluxes.

“This partnership enables us to provide enhanced service and increased attention to our customers throughout India,” said Ross Berntson, Indium Corporation President and Chief Operating Officer.

Founded in 1982, MELSS has been at the forefront of offering cutting-edge technology solutions to its customers, using the company’s extensive expertise and specialized knowledge in many areas of the electronics field. With headquarters in Chennai, and branches in New Delhi, Mumbai, Bangalore, Pune, Hyderabad, Kolkata and Coimbatore, MELSS is capable of providing complete support to the expanding customer base.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Integra Technologies Receives ISO 13485:2016 Certification

Integra Technologies Silicon Valley (Integra SV) announces the completion of a successful audit of its Medical Device Quality Management System, and the award of ISO 13485:2016 Certification by the International Certification Body for Medical Devices, NSF-ISR.

This standard is an update to the previous ISO 13485:2003 standard, which Integra SV was also certified. Integra SV is now operating under the new standard, placing Integra among the best in the industry.

The specific scope of the ISO 13485:2016 registration covers Semiconductor wafer probing, wafer thinning, dicing and integrated circuit assembly, IC burn-in, environmental test, lead scan, electrical test, marking, and tape & reel for medical device applications.

Brett Robinson, Integra Technologies President and CEO said, "We would like to recognize the hard work the Silicon Valley location has put in to achieving this certification. This dedication to quality and responsiveness to customer needs is what Integra’s reputation is built on."

About Integra Technologies

Integra Technologies is a global provider of semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA services for high-reliability applications. Integra offers comprehensive turnkey solutions to support applications throughout their entire program lifecycle.
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:: Issue 229 ::
July 27, 2018

Presidio Components

Gannon & Scott

TopLine