Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Heraeus Electronics Unveils World's First Spatter-Free Type 7 Solder Paste (full story)

:: TechSearch International Analyzes Trends in FO-WLP including Panel Activity (full story)

:: Axus Technology Adds Sr. Process Engineer/Account Manager (full story)

:: Indium Corporation Engineers Earn Lean Six Sigma Green Belt Certification (full story)

:: Technic Announces US Distributor Partnership with OrigaLys (full story)

:: Recent Palomar Technologies News (full story)

:: Amkor's Japanese Version of Its Company Website is Now Live (full story)

 

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Making SIP manufacturing defects a thing of the past: Heraeus Electronics unveils world's first spatter-free Type 7 solder paste

New Water Soluble Ultra Fine Pitch Solder Paste significantly reduces defects for system-in-package manufacturers.

Heraeus Electronics, a leading provider of materials solutions for the semiconductor and electronic packaging industries, announced the introduction of the industry’s first spatter-free type 7 (2~11um) solder paste for fine pitch applications. This high-performing paste enables manufacturers to greatly reduce defects such as solder balling and solder beading. The paste will be featured at the Semicon West 2018 conference and exhibition, taking place July 10 to July 12 at the Moscone Center in San Francisco.

The type 6 (5~15um) version of this paste, which was introduced to the advanced packaging market in 2017, is now in high volume production and very successful for wireless and Bluetooth applications. The new type 7 version in the Heraeus WS5112 series provides superior performance to meet the demanding technical requirements of semiconductor packaging manufacturers, wafer bumping manufacturers and fabless design houses. Its ability to deliver splash-free/splatter-free performance is the result of two innovations: the company’s Welco™ solder powder and flux platform.

Welco™ is a proprietary method of producing perfectly round-shaped solder powder with very low oxide content. It is an in-process control method of solder powder manufacturing where no sieving is required to meet the powder size ranges as defined by IPC standards. Powders are fully protected from exposure to air or oxygen at elevated temperature, oxides formation on the surface of the powder is kept to a minimum.

The unique WS5112 flux platform was developed in-house at Heraeus Advanced Packaging product development facilities in Singapore. The innovative formulation of the flux results in highly consistency solder volume over printing life. With system-in-package applications, solder beads defects are often found on wire bonding pads and under passive components and flip-chips. Using carefully selected polymers, WS5112 has no or minimal solder splashing/splattering during the reflow process. Customer feedback indicates that solder beads formation was greatly reduced when using WS5112 solder paste.

Li-san Chan, Assembly Materials Advanced Packaging Global Product Manager for Heraeus Electronics, said, “As back-end manufacturing continues to move toward miniaturization, solder materials have to perform flawlessly. Our Type 7 WS5112 solder paste eliminates the costly production line delays and package defects caused by spatter-prone, under-performing solder pastes.”

Heraeus Electronics will be exhibiting at Semicon West 2018 in San Francisco, July 10-12, booth 2005. Click here for more information.

 



For more information visit www.heraeus-electronics.com.

 
   ^ Top

:: TechSearch International Analyzes Trends in FO-WLP including Panel Activity

While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate.  HiSilicon has been in production with ASE’s FOCoS for several years and MediaTek just announced a logic device for networking applications using TSMC’s InFO on Substrate (InFO_oS).  TSMC’s FO-WLP platform has been extended to mobile 5G.  A Multi-Stacking Technology (MUST) for 3D stacking based on InFO has been introduced for a baseband processor and a memory die.  TSMC’s InFO antenna in package (InFO_AIP) targets an RF front-end module (FEM) for mmWave applications.

A number of companies and research organizations have reported progress on developing large area process or panel fan-out wafer level packages (FO-WLPs).  ASE and Deca Technologies are cooperating to produce a panel version of the M-Series FO-WLP.  Nepes has developed a 600mm x 600mm FO-WLP panel process using a liquid crystal display (LCD) production line with a fingerprint sensor as a first product.  Powertech Technology’s first product on its panel line will be a PMIC.   Samsung Electro-Mechanics (SEMCO) has developed a chip-first panel FO-WLP process that is scheduled for introduction this year. Unimicron has established a pilot production line for panel RDL based on a glass substrate.     

The latest Advanced Packaging Update is a 72-page report with full references and an accompanying set of 42 PowerPoint slides.  The report also examines trends in integrated photonics packaging and an analysis of OSAT financials.  A discussion of 3D sensing modules highlights production examples.  VCSEL technology developments are introduced. 

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch
   ^ Top

:: Axus Technology Adds Sr. Process Engineer/Account Manager

Axus Technology is pleased to announce that Catherine Bullock has joined the company as Sr. Process Engineer and Account Manager. In this role, Catherine will provide support to the Axus Technology Foundry and Process Development facility as well as strategic account management for customers using our Process lab. Catherine's responsibilities include process development and support for CMP technology, substrate thinning, bonding, and cleaning technologies.
 
Catherine joins Axus as a 22-year semiconductor veteran specializing in CMP, Cu Electroplate, Metrology, Diffusion and Implant. Before joining Axus, she was most recently with Skorpios Technologies where she established best practices and design rules for CMP integration and saved $200,000 annually in copper electroplate chemical usage. Catherine has also held CMP Process Engineering positions at Applied Materials, Motorola and National Semiconductor. She has been heavily involved in industry standards for device layout, tool and consumable features and processing of novel materials.  Catherine has a B.S. degree in Chemical Engineering from Louisiana Tech University.

"Catherine is a great asset to the Axus Process Development team. As a certified project manager and technical instructor for 200 and 300 mm Mirra, Mirra Mesa, Reflexion, and Reflexion LK AMAT product lines, she is already well-versed in our equipment and processing systems and her expertise in CMP process improvements will be a great benefit for our customers," stated Dr. Peter Wrschka, Director of Process Technology at Axus.

"With the enormous growth in our foundry business, Catherine will help manage and support our increasing account base. She will not only help support our existing customer base, but with her expertise, help us move our foundry to the next level and make it the leading foundry and development lab for CMP, cleans and wafer grinding," stated Jim Kelly, Vice President of Sales.
   ^ Top

:: Indium Corporation Engineers Earn Lean Six Sigma Green Belt Certification

Indium Corporation is proud to announce that three company engineers have earned their designation as Lean Six Sigma Green Belt-certified.

With their recent designation, Daniel Siedsma, Chemical Process Engineer; Adam Murling, Technical Support Engineer; and Michael Wood, Manufacturing Process Engineer join a number of employees who are Lean Six Sigma certified at Indium Corporation.

Lean Six Sigma is a business approach that focuses on improving workplace performance by reducing waste and process variations. The certification process involves two weeks of training that culminates in an examination in statistics, designed experiments, statistical process control, and “lean” continuous improvement concepts.

Siedsma joined Indium Corporation in 2011 as a Chemical Process Engineer and performs research and development with Indium Corporation’s metals and compounds products. He earned his bachelor’s degree in chemical engineering from Rensselaer Polytechnic Institute (RPI) with a minor in general psychology.

Murling joined Indium Corporation in 2014 as a Technical Support Engineer. He is responsible for providing leading-edge technical support for Indium Corporation’s global account initiatives through SMT process optimization, material recommendations, and customer training. He is an active blogger and has authored numerous technical papers. He earned his bachelor’s degree in chemical engineering from Clarkson University.

Wood joined Indium Corporation in 2017 as a manufacturing process engineer working with Indium Corporation’s engineered solder products. He earned his bachelor’s degree in mechanical engineering technology from the State University of New York Polytechnic Insitute.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

   ^ Top

:: Technic Announces US Distributor Partnership with OrigaLys

Technic has announced an agreement with OrigaLys ElectroChem of Lyon France for distribution of their product line to the US market.  OrigaLys manufactures an extensive line of electrochemistry instruments , including Potentiostats (mono and multi-channel), Galvanostats, Impedance Meter or Rotating Disc Electrodes. The company also distributes software and accessories including a variety of electrodes, tips and ancillary equipment and tools.

“We are excited to be offering the OrigaLys line of electrochemical and analytical instruments to the US market. Since its inception, the engineering team at OrigaLys has devoted itself to designing and manufacturing products in collaboration with its customers, offering affordable technologies that are
well designed, highly accurate and reliable.”

                              Kaz Wikiel, Ph.D.
                              Vice President,  Analytical Controls, Technic

OrigaLys instruments are designed to perform in a variety of applications including battery, biofilm monitoring, coatings, corrosion, quality control, research, and water monitoring.  The company offers additional services and materials including application manuals, education, and training.

Learn more

About OrigaLys ElectroChem
Founded in 2010, by R&D engineers from Tacussel, Radiometer, and Hach, the OrigaLys team with more than 30 years of experience in designing electrochemical devices, works closely with customers and users to develop technologies and products that can best address the challenges and quality needed in today's analytical environments.

Learn more at www.origalys.com

About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

Learn more at www.technic.com

   ^ Top

:: Recent Palomar Technologies News

RF GaN Die Bonding for a SMART Era
Since the early 2000s, the RF market has witnessed significant amounts of investment (individual, industrial corporate, venture capital) in GaN technologies. Some of it is in “big name” companies, but a surprisingly large portion has gone into startups and other newer entrants, but most especially university spin-offs (for reasons we shall identify in a moment). The key players in RF GaN have been developing the technology for well over 15 years, and built up a significant bank of knowledge, expertise, and competence—but above all, an almost evangelical sense of belief in the long term value of the technology. Read the full blog: http://www.palomartechnologies.com/blog/rf-gan-die-bonding-for-a-smart-era.  

Optoelectronic and RF Wireless Technologies Enabling IPL Cricket Finals Via Live Streaming
On May 27, 2018, the Indian Premier League (IPL) Final will be played at Wankhede Stadium in Mumbai. Millions of fans are expected to be watching via live stream. This will put the content delivery networks and communications infrastructure which enables this technology on overtime. The IPL fans’ demands for high quality, low-latency and accessibility require a robust communications infrastructure that works quietly behind the scenes. Live events are major growth areas for streaming services, as are the events themselves. Yet consumers demand more than a grainy image moving across their screens. High definition streaming at 4k and in the future 8k, 360-degree viewing and 3D formats, and augmented and virtual reality media are either coming or are now here. Read the full blog: http://www.palomartechnologies.com/blog/optoelectronic-and-rf-wireless-technologies-enabling-ipl-cricket-finals-via-live-streaming.

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/blog

   ^ Top

:: Amkor's Japanese Version of Its Company Website is Now Live - Amkor.com/JP

As a major step toward strategic global branding, Amkor Technology recently announced the launch of its Japanese language website, https://amkor.com/jp/.

The new Japanese corporate website was developed with focus on user-centric improvements for a friendlier digital platform, smoother site navigation, and clearer communication to help customers locate the latest information on Amkor's IC packaging, test and turnkey semiconductor services.

Amkor is committed to building a global web presence and bringing our content to important markets like Japan while delivering a mobile-first experience. Recently released documents in Japanese include the Automotive IC Packaging brochure and soon the Corporate brochure, Test Services brochure and the Design Center brochure.

Amkor is the largest OSAT in Japan and provides our customers with immediate access to the Japanese market where we have long-standing ties with the top automotive companies and major automotive components manufacturers. Amkor has a strong turnkey manufacturing presence throughout Japan and is equipped with a large installed test base with burn-in and 100% automated x-ray infrastructure capability.


   ^ Top

 

View the Corporate Bulletin Archives

 

 


:: Issue 228 ::
June 28, 2018

Presidio Components

Gannon & Scott

TopLine