Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Honeywell High Reliability Electroplating Solutions (full story)

:: Materion Recognized for Supplier Excellence - Texas Instruments Presents Materion With Prestigious Annual Award (full story)

:: Technic Releases Techni Indium HS for Whisker Resistant Pure Indium Plating (full story)

:: ORS has expanded its client service offerings with the acquisition of Silicon Cert Laboratories (full story)

:: DfR Solutions to Address Reliability Physics at IMAPS NORDPAC (full story)

:: Newly Released & Updated: What They Didn't Teach you in School About Heat Transfer (full story)

:: Indium Corporation Receives EM Asia Innovation Award (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brian Schieman, bschieman@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brian.


::Honeywell High Reliability Electroplating Solutions

Honeywell is now offering its deep knowledge and proven expertise in high quality electroplating to a broader range of industrial applications. Its processes and techniques have served the space and defense industries with a variety of applications for more than 40 years.

In these regards, some of the products are:

  • RF/microwave components
  • Multiplexers, waveguides, filters
  • Switches (RF, coax)
  • Avionics/satellite receivers
  • Specialty payloads
    • Optics, AIS (ship tracking)
    • James Webb space telescope
    • Smallsats/microsats

Honeywell

Our qualified processes include:

Process

Substrate

Electrolytic Gold Plating (Soft and Hard Gold) 
Typical Thickness: 50 µ” to 400 µ”

Oxygen Free Copper, Beryllium Copper, Brass, Invar 36, Invar 32-5, Kovar, Netic, Carpenter 49, Thermkon, Palinery, Aluminum

High Phosphorus Electroless Nickel
Typical Thickness: 50 µ” to 1000 µ”

6061 Aluminum, 7075 Aluminum, Beryllium Copper, Oxygen Free Copper, Brass, Stainless Steel, Hiperco, Kovar, Netic, Carpenter 49, Invar 32-5, Invar 36, R3100

Electrolytic Nickel
Typical Thickness: 50 µ” to 300 µ”

Titanium, Beryllium Copper, Invar 32-5, Invar 36, Stainless Steel

Electrolytic Copper and Silver
Typical Thickness: 100 µ” to 1000 µ”

Invar 36, Invar 32-5, Netic, R3100, Kovar, TC-31, Aluminum, Oxygen Free Copper, Beryllium Copper, Brass, Stainless Steel, Titanium

Chemical Conversion Coating
Class 1A and Class 3

6061 Aluminum, 7075 Aluminum

Passivation
Type 2 and Type 6

Type 2: Stainless Steel alloys containing 12-14% Cr, or alloys with greater than 0.15% sulfur or selenium
Type 6: Austenitic 200 and 300 series chromium nickel alloys and chromium grades with greater than 17% Cr composition

Cleaning Processes

Aluminum, Stainless Steel, Nickel, Invar, Kovar, Copper, Cobalt, Hiperco 50, Nickel, Copper, Gold, and Silver Plsted cotings.Non porous loads, gamets, ferrites, quartz, fluorody, boron nitride, corderite, RS4200CHP

Honeywell’s processes have industry-leading RF quality, with low loss and high Q performance.

Honeywell’s quality driven culture, and characterization capabilities enables it to deliver industry-leading products to its global customers. Honeywell also has a wet-chemical lab capable of performing atomic absorption spectroscopy for metal analysis; enabling all bath analyses to be performed in-house. In terms of material testing, Honeywell has a state of the art SEM/EDX, and can perform micro-sections, hardness, bend and thermal/humidity tests as well.

Honeywell-ComDev’s site is an ISO 9001:2015 and AS9100D certified facility, along with a strict adherence to any applicable industry standard (e.g. MIL, AMS, ASTM, etc.). Our specialized facility is in the process of being NADCAP certified (~Q4 2018 – Q1 2019), which will be achieved in 2019. Also, we are registered under the Canadian Controlled Goods Program, allowing processing of ITAR controlled items.

For additional information, feel free to visit https://aerospace.honeywell.com or contact us by email at: highrelplating@honeywell.com.

 

 
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::Materion Recognized for Supplier Excellence - Texas Instruments Presents Materion With Prestigious Annual Award

Materion Corporation, an advanced materials solutions provider, is being honored for supplier excellence by Texas Instruments Incorporated (TI), a global leader in semiconductor design and manufacturing. This annual award is given only to a very select group of suppliers whose dedication and commitment in supplying products and services meet TI’s stringent standards. To achieve this award, Materion demonstrated the highest level of ethical behavior and exceptional performance in the areas of cost, environmental and social responsibility, technology, responsiveness, assurance of supply and quality.

Texas Instruments (TI) produces the industry’s broadest and most diverse portfolio of analog and embedded processing products for consumer and industrial electronic applications. Materion leads the industry in the production of a comprehensive range of thin film deposition and evaporation materials. Throughout 2017, Materion Advanced Materials facilities across the U.S. were a critical supplier of precious and non-precious metal sputtering targets to nearly every Texas Instruments wafer fab, including 10 global locations. They provided targets that support TI metals tools up to a 300mm wafer size. Additional support included precision parts cleaning and precious metal recovery, providing fully integrated precious metal services.

As a longtime supplier to Texas Instruments, Materion is focused on providing superior customer service, consistently delivering world-class products, and being a proactive technology partner.

“On behalf of the entire Materion team, we are proud to be recognized with this prestigious award for supporting Texas Instruments in its every day goal to serve their customers,” said Don Klimkowicz, President, Materion Advanced Materials. “We are committed to our ongoing partnership with TI and to continuing to deliver world-class solutions and service.”

About Materion:
Materion Corporation is headquartered in Mayfield Heights, Ohio. The Company, through its wholly owned subsidiaries, supplies highly engineered advanced enabling materials to global markets. Our unique product portfolio includes high performance alloys, beryllium products, clad metal strip, composite metals, ceramics, inorganic chemicals, microelectronics packaging materials, precision optics, thin film coatings and thin film deposition materials.

Learn more about Materion at (http://materion.com/About). Connect with Materion on social media through:
Facebook - https://www.facebook.com/MaterionCorp/
LinkedIn - https://www.linkedin.com/company/materion-corporation
Twitter - https://twitter.com/MaterionCorp
YouTube - https://www.youtube.com/user/MaterionVideos
Google+ - https://plus.google.com/+MaterionCorporation

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::Technic Releases Techni Indium HS for Whisker Resistant Pure Indium Plating

Technic announces the release of the Techni Indium HS pure Indium plating process. This process is designed for use in the selective plating of press fit pin connectors in order to prevent the formation of harmful metallic whiskers.

Technic has performed extensive in-house and field testing of the Techni Indium HS process which has shown the electrolyte is very robust, with deposits that are exceptionally whisker resistant. The current density range of the process is extremely wide – 50 ASF to 250 ASF – with relatively low metal concentrations in the electrolyte. Unlike competitive processes, there is no need for an Indium strike when plating over nickel, which will minimize cost.

Technic
Techni Indium HS - Whisker resistant pure
Indium plating d
eposit before and after reflow

For more information on Techni Indium HS, please contact your local Technic representative. Learn more at www.technic.com

About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

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::ORS has expanded its client service offerings with the acquisition of Silicon Cert Laboratories

ORS Labs, Inc., the parent company of Oneida Research Services, Inc. (ORS), announces the acquisition of Silicon Cert Laboratories in Reading, Pennsylvania. Silicon Cert Laboratories is an internationally recognized leader in environmental and mechanical testing and qualification of products and components for the telecommunications, defense, automotive, aerospace and medical-device industries. Silicon Cert Laboratories testing services include mechanical shock, vibration, drop testing and environmental exposure such as temperature and humidity cycling to evaluate the impact of changing environmental conditions on products.

“The acquisition of Silicon Cert Laboratories substantially increases the level of expertise and technology that ORS can offer when evaluating and qualifying products and components for mission-critical applications in the industries we serve,” said Daniel Rossiter, Senior Vice President of Oneida Research Services, Inc. “We are thrilled to be working together and look forward to many years of growth.”

John Schmoyer, Client Services Manager at Silicon Cert stated “Oneida and Silicon Cert have had a friendly cooperative relationship for over twelve (12) years. This is a win-win relationship for both Silicon Cert Laboratories and Oneida Research.”

About Silicon Cert Laboratories:
Based in Reading, Pennsylvania, Silicon Cert Laboratories was founded in 1998 by a group of former Bell Labs, AT&T Microelectronics and Lucent Technologies engineers with an extensive background in integrated circuit and optoelectronic component design, manufacturing and testing. The company achieved ISO certification in 2000 and is currently certified to ISO 9001:2008 through DNV-GL. In 2007, the Defense Logistics Agency in Columbus, Ohio approved Silicon Cert for multiple MIL-STD- 883 test methods. In 2009, the company was accredited by A2LA to ISO/IEC 17025:2005 to perform a wide variety of reliability tests. https://www.siliconcert.com

About ORS:
Oneida Research Services, Inc. has testing facilities in Whitesboro, New York and Denver, Colorado. Both locations are accredited to ISO 9001:2015 and AS9100D and approved by the Defense Logistics Agency in Columbus, Ohio for several test methods per Mil Std. 883 and Mil Std. 750. Throughout its 40 years, ORS has established strong working relationships with experts in the field of applied analytical chemistry, gas analysis, destructive physical analysis, hermeticity testing and organic mass spectrometry. ORS also has an affiliate in Sophia Antipolis, France. https://www.orslabs.com

Contact: Krista Vivenzo, Customer Service Representative, Oneida Research Services, Inc. kvivenzo@orslabs.com | 315.736.5480, ext. 2231

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::DfR Solutions to Address Reliability Physics at IMAPS NORDPAC

DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics at The Nordic Conference on Microelectronics Packaging, NordPac 2018, held June 12-14, 2018 in Oulu, Finland. Dr. Natalie Hernandez of DfR Solutions will present this paper as well as teach a short course called, Reliability Physics in the Early Design Phase. This conference is a collaboration between IMAPS Nordic and IEEE EPS Nordic.

Frequently, the selection of components and materials for the design of an electronic product are not the best choices to assure that the product will function for its intended lifetime in its intended environments. This human factor element can be avoided using advanced modeling of the materials, solder joints, printed circuit boards, components and potting compounds (if needed). A high reliability electronic assembly is a complex interaction of materials that depends on the harmonious interface of their various mechanical, thermal, and electrical properties. Identifying and correcting design flaws later in the product development cycle is extremely costly, especially once a product is in the field. Dr. Hernandez will discuss how implementing Reliability Physics analyses early in the design phase will mitigate design flaws, saving time and money, improving overall product safety and customer satisfaction.

Increasingly, electronics are being used in more extreme environments where the combination of thermal and mechanical loading conditions significantly impacts the lifetime of the components in a printed circuit card assembly (PCBA). Understanding the responses of PCBAs under environmental stressors is key to answering the ultimate question, ‘When will my board fail?’ In her short course, Dr. Hernandez will discuss in more detail, the use of Reliability Physics to make more accurate fatigue predictions for electronics operating in extreme environments.

‘The traditional, design-build-test-fix method of engineering is ineffective and wastes valuable time and money during product development,’ said Dr. Craig Hillman, CEO of DfR Solutions. ‘Reliability Physics methods are a much better way to identify potential design flaws and predict reliability in real world conditions,’ noted Hillman. ‘We are pleased to be speaking about this critical topic at such a prestigious event,’ said Hillman.

About Sherlock Automated Design Analysis™ Software:
Sherlock is the first-of-its-kind Automated Design Analysis software for analyzing, grading, and predicting the expected reliability of products at the circuit card assembly level. Based on the science of Reliability Physics, it is used by the electronics industry across all markets. Sherlock continues to evolve, incorporating new innovations and enhancements allowing users to manage increasingly complex analyses faster and more efficiently than ever before. For more information about Sherlock, visit www.dfrsolutions.com/what-is-sherlock.

About DfR Solutions:
DfR Solutions has world-renowned expertise in applying Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Sherlock Automated Design Analysis™ Software and best practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit www.dfrsolutions.com.

 

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::Newly Released & Updated: What They Didn't Teach you in School About Heat Transfer

Heat. Like most things, it takes the path of least resistance. Sometimes that's good and sometimes not so much. So how do you harness its power in your designs?

Mentor, A Siemens Business

Receive this new, free technical white paper to learn how you can make sure your designs are not too hot to handle.
What you will learn:

  • What activity is the most effective for improving your design?
  • What is your starting point?
  • How you can solve heat distribution problems?

Download the updated version of our most popular paper on Heat Transfer What They Didn't Teach You in School About Heat Transfer now

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::Indium Corporation Receives EM Asia Innovation Award

Indium Corporation earned Electronics Manufacturing (EM) Asia's Innovation Award for its Indium10.1HF Solder Paste. The award was presented in Shanghai, China, during NEPCON China.

The EM Asia Innovation Award program recognizes and celebrates excellence in the Asian electronics industry, encouraging companies to achieve the highest standards and push the industry forward.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies. It increases the reliability of solder joints due to low-voiding, high ECM performance, and solder beading minimization. Together, these qualities enable customers to reduce overall costs associated with end-of-line rework and electrical/thermal reliability that could result in field failures.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: Issue 226 ::
May 4, 2018

Presidio Components

Gannon & Scott

TopLine