Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Heraeus Electronics 50th Anniversary (full story)

:: Technic Announces the Commercial Release of Elevate Copper 6370 (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Heraeus Electronics 50th Anniversary

Heraeus Electronics, for 50 years, has been a market leader and innovator of materials solutions for the thick film industry. This year Heraeus Electronics will celebrate its 50th Anniversary in the thick film market and the advancements that have been made in leading the way for the future of this technology. Thick Film technology is well known as a reliable solution for circuits and components. Over time the applications for thick film materials have grown substantially from its early beginning of hybrid circuits. It is now used for passive components and low temperature printed electronics to name a few. The driving force of the growth is because of the proven value and reliability with thick film materials. The performance of thick film materials and their ability to withstand harsh and demanding conditions has helped us succeed in the automotive, aerospace, military, consumer, and medical fields worldwide.

Heraeus would not be in the position that they are in today without the partnerships they have developed with their customers. Without the vision and technical demands from our customers we would not have had the pipeline of innovation to propel thick film technology forward. Developing the business and growth hand-in-hand with our customers is at the core of our business.  Collaboration with our customers is key in defining the demands of the market as well as extending our customers’ technical abilities. We not only provide our customers with the materials to move their designs into the future, but a staple in Thick Film culture has been providing our customers with best in class technical and customer service as well as the dependability and stability of Heraeus organization.

Visit us in Pasadena Ca during the 51st annual IMAPS Conference and Exhibition at booth 703.


For more information visit www.heraeus-electronics.com.

 
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:: Technic Announces the Commercial Release of Elevate Copper 6370

Technic is pleased to announce the full commercial release of Elevate Cu 6370, a versatile electrolytic copper plating process for semiconductor advanced packaging applications.
 
Over the past two years, Elevate Cu 6370 has been in limited release and used in wide variety of applications. With slight modifications to the electrolyte, Elevate Cu 6370 has been highly successful in tight RDL patterns, standard pillars, 200-micron tall mega pillars, bump on passivation structures, and other advanced packaging structures.  The process is ideally suited for a variety of semiconductor advanced packaging platforms, including FOWLP (Fan-Out Wafer Level Packaging) Fan-In Wafer Level Packaging, and 2.5D/3D.

Elevate Cu 6370 can be adjusted to plate at lower speeds of 1 – 2 microns per minute or very high speeds of 6 – 7 microns per minute.  It can also be tuned to provide a domed, flat or dished deposit. 

“As the copper ECD market for advanced packaging continues to grow, customers are looking for a single solution to meet a variety of feature specifications. Elevate Cu 6370 has demonstrated consistent and proven success, offering versatility, high performance, and low Cost of Ownership (CoO).”

  • Anthony Gallegos, Global Product Manager, Semiconductor Technology

Learn more at www.technic.com

About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

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:: Issue 227 ::
May 22, 2018

Presidio Components

Gannon & Scott

TopLine