Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China (full story)

:: Palomar Technologies Intensifies Footprint in Southeast Asia with First Photonics Innovation Center in Singapore (full story)

:: Indium Corporation's Indium10.1HF Solder Paste Wins Mexico Technology Award (full story)

:: TechSearch International Explores Power Device Packaging and Assembly Trends (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement.  

This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (< 3 micrometers), and superior flexibility for true multi-process, multi-chip, high-volume production. The superior performance is enabled by dual head, dual stage, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.

The MRSI-HVM3 is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding. This also provides great opportunities to discuss with MRSI’s local process experts for solutions within the extended product configurations of HVM3e, HVM3P, H3TO, and H3LD. These configurations are based upon the same design as HVM3 but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging and high power laser diode packaging, respectively.

MRSI Systems Launches MRSI-HVM3P for New Applications
 
MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain

MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

Contact MRSI Systems (sales@mrsisystems.com) to schedule a demo at the Shenzhen facility and learn about how MRSI’s assembly solutions can meet your specific application requirements.

This is an important milestone for MRSI Systems allowing us to better serve our local Chinese market by offering timely and relevant demonstrations of our new expanded MRSI-HVM3 family of products.

Dr. Yi Qian
Vice President of Marketing, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
Time Zone: ET – Eastern Time
Tobias Bülow
Director IR & Corporate Communications, Mycronic
Tel: +46 734 018 216, e-mail: tobias.bulow@mycronic.com
Time Zone: CET - Central European Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products.  With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarter is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. www.mycronic.com

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:: Palomar Technologies Intensifies Footprint in Southeast Asia with First Photonics Innovation Center in Singapore

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today the launch of its Innovation Center in Singapore. The launch is in partnership with the LUX Photonics Consortium1 and DenseLight Semiconductors, a division of POET Technologies, a developer and manufacturer of optical light source products.

As the first-of-its-kind in Southeast Asia, Palomar Technologies’ Innovation Center – Asia offers local companies unprecedented access to expert-designed, automated, complex, photonic and microelectronic assembly processes that are both cost-effective and reliable. It will also offer companies low-volume prototyping and process development service for the assembly of high performance packages that enable the Internet-of-Things (IoT) and 5G wireless networks.

Read the full press release: http://www.palomartechnologies.com/news-room/press-releases/palomar-technologies-intensifies-footprint-in-southeast-asia-with-first-photonics-innovation-center-in-singapore.

Subscribe to the PTI Blog! Join the industry peers who already have!
http://www.palomartechnologies.com/blog

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::Indium Corporation's Indium10.1HF Solder Paste Wins Mexico Technology Award

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste.

The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.

From left: Iván Castellanos, Technical Services Manager, Latin America, Indium Corporation; Ron Friedman, Publisher, Mexico EMS; and Ross Berntson, President and COO, Indium Corporation.

The awards are designed to promote best practices in technical innovation, manufacturing quality, and productivity by celebrating the companies and people achieving high standards and driving the industry forward.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies. 

In addition to the ultra-low voiding, Indium10.1HF is engineered with a unique flux chemistry to improve reliability and address the challenges of the industry’s trend toward miniaturization, including:

  • High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
  • Solder beading minimization
  • Very low bridging, slump, and solder balling
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation

To learn more about Indium10.1HF, visit http://www.indium.com/avoidthevoid or contact an Indium Corporation representative directly at askus@indium.com.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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:: TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas.  TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 with stronger growth projected for Cu clip packages.  Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, datacenters, industrial automation, smart cities and buildings, home appliances, and transportation are driving demand for power devices.  While many companies continue to expand production of silicon-based power devices, the need for increased power density and system efficiency is driving demand for devices based on new wide band gap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN).  The ramp of WBG devices will push operating junction temperatures to 200°C and beyond, and require new materials and assembly processes to deliver the necessary thermal and high current-carrying performance.    

New Packages and Materials for Power Devices is a 100+ page report with full references and an accompanying set of more than 100 PowerPoint slides.  Growth drivers and package types are identified.  Key IDMs and OSATs that assemble WBG power devices are listed.  Market projections for leadframe (including a breakdown of Cu clip) and embedded die packages are provided. Critical material needs for packaging and assembly are identified.  New developments in die attach materials are described, with a focus on Pb-free options.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch.

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:: Issue 235 ::
November 30, 2018

Presidio Components

Gannon & Scott

TopLine