Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Indium Corporation to Feature Thermal Interface Materials at IMAPS Thermal Management Workshop (full story)

:: Technic Announces the Release of TechniStrip® Micro D2 (full story)

:: Teledyne e2v HiRel Expands its Microelectronics Portfolio by Unveiling New, Fully Integrated Point-of-Load Converter Modules for Space Applications (full story)

:: Amkor Technology: At the Forefront of Packaging Technology Innovation - Interview by Yole Développement (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Indium Corporation to Feature Thermal Interface Materials at IMAPS Thermal Management Workshop

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation’s metallic TIMs are easy to handle and rework.  These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.

Metallic TIMs can be used as either a solder or compressible material:

  • Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
  • Compressible TIMs, such as Heat-Spring® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications

Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.

See our experts at the show or visit www.indium.com to learn more.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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:: Technic Announces the Release of TechniStrip® Micro D2

Technic has announced the release of TechniStrip® Micro D2, a specially developed non- hazardous replacement for N-methylpyrrolidone (NMP) - based photoresist strippers.

With increased concerns and regulations of NMP as a reprotoxin, Technic has developed a new photoresist stripper, free of NMP that achieves higher performance without an increase in cost. TechniStrip® Micro D2 is an environmentally friendly, non-hazardous solution of specially developed organic solvents with running costs similar to NMP-based strippers. TechniStrip® Micro D2 provides better dissolution and faster lift off in high volume production testing around the globe. TechniStrip® Micro D2 also provides greater metal and material compatibility, allowing it to be used on all stacks and particularly on sensitive materials such as III/V substrates.

TechniStrip® Micro D2 is currently in mass production around the world and is used in a variety of applications including the removal of negative and positive tone resist, rework, and as a cleaner for adhesives and glues.

To learn more about TechniStrip® Micro D2, visit us online at www.technic.com

Technic is a global supplier of advanced chemical solutions and controls for the semiconductor industry. The company manufactures a complete line of cleaners, photoresist strippers and metal etchants under the names TechniClean, TechniStrip® , and TechniEtch. Technic also manufactures fabrication and packaging chemistry marketed under the Elevate® brand name.

 

About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing, and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

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:: Teledyne e2v HiRel Expands its Microelectronics Portfolio by Unveiling New, Fully Integrated Point-of-Load Converter Modules for Space Applications

The TD5 Series of DC-DC converter module components are space-qualified, rad-tolerant, and simplify the design process

Teledyne e2v HiRel Electronics, part of the Teledyne Defense Electronics Group, today announced new,  integrated module capabilities for demanding space and satcom applications. This ‘plug and play’ option has no external passive components, and is the newest product innovation from e2v HiRel’s rapidly expanding microelectronics operations.

The new designs are embedded in the TD5 Series, a family of point-of-load DC-DC converter modules engineered specifically for harsh radiation environments which require low voltages and tight regulation.  

The modules cover an input voltage range of 4.6 to 6.0V and are available in 2, 6, and 10 A output surface-mount options. Where conventionally a designer implementing regulated voltage conversion for a space application would be required to choose, specify, purchase and inventory up to a dozen space-qualified passive components to achieve a complete solution, this new integrated module removes those responsibilities and costs, simplifying design, implementation and reducing time to market.

The TD5 Series uses the Teledyne/PSemi PE9915X family of radiation tolerant synchronous buck regulators to provide high power density, fast transient response, and up to 90% efficiency. The PE9915X are characterized for Total Ionizing Dose (TID) of 100krad (Si).  The Single Event Effects (SEE) performances for the PE9915X die are > 90 MeV-cm2/mg. 

“The high radiation tolerance of the TD5 Series is powered by the PSemi patented UltraCMOS® technology,” said Hector Rivera Integrated Solutions Product Line Manager for Teledyne e2v HiRel. “The product design provides a plug and play option for the designers of modern space digital electronics, which is especially important as digital power rail tolerances continue to shrink.” 

Additional features of the TD5 Series include power good signal and shutdown pin for power sequencing.  Full power operation of the TD5 Series is rated for -40° C to +85° C.  Click here to view the datasheet and more information.

“Space systems have increased the use of digital processing components that require low-voltage, tightly regulated point of load converters,” explained Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “Bottom line, this new module family greatly simplifies the job of space designers. This new capability showcases our growing footprint in microelectronics design and production, and is owed in part to the decades of experience we have leveraged working with our Teledyne sister company, Teledyne Advanced Electronics Systems (AES).  Engineering units of the TD5 series are available today. 

 

ABOUT TELEDYNE DEFENSE ELECTRONICS
Serving Defense, Space and Commercial sectors worldwide, Teledyne Defense Electronics offers a comprehensive portfolio of highly engineered solutions that meet your most demanding requirements in the harshest environments. Manufacturing both custom and off-the-shelf product offerings, our diverse product lines meet emerging needs for key applications for avionics, energetics, electronic warfare, missiles, radar, satcom, space, and test and measurement . www.teledynedefelec.com.   TDE is a business unit of Teledyne Technologies, Inc., a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems.  www.teledyne.com

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:: Amkor Technology: At the Forefront of Packaging Technology Innovation - Interview by Yole Développement

Yole Développement (Yole) released its famous annual technology & market analysis, Status of the Advanced Packaging Industry few weeks ago. Yole, the market research and strategy consulting company, had the opportunity to share its vision of the industry with the leading company Amkor Technology. The full length discussion between Ron Huemoeller, CVP - Head of WWRD & Technology Strategy, Christopher A. Chaney, IRC, VP - Investor Relations, Amkor Technology and Santosh Kumar, Director Packaging, Assembly & Substrates, Yole Korea can be read here.

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:: Issue 234 ::
October 26, 2018

Presidio Components

Gannon & Scott

TopLine