Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Heraeus to Introduce High Performance Printable and Etchable Gold Conductor at IMAPS 2018 (full story)

:: DfR Solutions Announces Sherlock Automated Design Analysis™ for SOLIDWORKS® 3D CAD, plus Greg Caswell Announced Recipient of IMAPS Lifetime Achievement Award (full story)

:: ORS Acquires Silicon Cert Laboratories (full story)

:: Teledyne e2v HiRel Releases a New 650V/60A Bottom Side Cooled GaN FET at the Industry’s Highest Available Voltage (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC
Event Sponsors:

Supporting Technology Sponsor:

JCET Group - Supporting Technology Sponsor

Networking Sponsor:

EMD Performance Materials - Corporate Sponsor

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Keynote/Plenary Sponsor:

Student Programs Sponsor:

Honeywell - Student Programs Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Coffee Break Sponsor:

Coffee Break Sponsor: ORS Oneida Research Services & Silicon Cert Labs

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

Supporting Sponsor:

American Elements, global manufacturer of high purity metals, semiconductors, nanomaterials, sputtering targets & evaporation materials for optoelectronics, sensors, thin films, MEMS devices & Microelectronics Materials

     
Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: US Tech

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: Special Career Opportunities At IMAPS 2018


Visit Honeywell at Booth #230 for more information about these open positions.

Electronics Test Inspector

Technician III Engineering

Engineer Senior Electrical

PCB Engineering Technician

Senior Technical Manager

Electrical Engineer

Principal Software Process Automation

:: Sponsors and Exhibitors at IMAPS 2018

 

THANK YOU IMAPS 2018 SPONSORS AND EXHIBITORS
Visit exhibitors and sponsors on Tuesday, October 9th and Wednesday, October 10th.

TUESDAY, OCTOBER 9, 2018:
Exhibit Hall Open: 11:00 AM - 5:00 PM
Lunch in Exhibit Hall: 11:15 AM - 2:00 PM
Coffee Break in Exhibit Hall: 3:25 PM - 4:30 PM

WEDNESDAY, OCTOBER 10, 2018:
Exhibit Hall Open: 11:00 AM - 5:30 PM
Lunch in Exhibit Hall: 12:00 PM - 1:15 PM
Happy Hour in Exhibits: 3:45 PM - 5:30 PM

 

Exhibitor Booth # Size
5N Plus Micro Powders 325 10x10
ACI Materials 305 10x10
ACCRETECH America 730 10x10
Accu-Tech Laser Processing 511 10x10
AdTech Ceramics 313 10x10
Advanced Dicing Technologies 424 10x10
AEMtec GmbH 210 10x10
AI Technology 410 10x10
Air Products and Chemicals 509 10x10
Ajinomoto Fine-Techno USA Corporation 204 10x10
Akrometrix 302 10x10
Amada Miyachi America 209 10x10
Ametek 207 10x10
ASE 803 10x20
ASM Amicra Microtechnologies GmbH 524 10x10
Axus Technologies 403 10x10
Binghamton University - IEEC 224 10x10
BSET EQ 811 10x10
Cadence Design Systems 605 10x10
Canon U.S.A. Inc. 624 10x10
Chief Up International Corp. 710 10x20
Cicor Group 513 10x10
CWI Technical Sales 525 10x20
cyberTechnologies 608 10x10
DeWeyl Tool Company 426 10x10
DfR Solutions 402 10x10
ENrG Inc. 202 10x10
EPP GmbH 825 10x10
F&K Delvotec, Inc. 625 10x10
Ferro Corporation 404 10x10
Finetech 512 10x10
Geib Refining 709 10x10
Golden Altos Corp. 311 10x10
HaikuTech 819 10x10
Hary Manufacturing Inc. 713 10x10
Heraeus Electronics 703 10x20
Hesse Mechatronics 425 10x10
Hi-Rel Laboratories, Inc. 606 10x10
Honeywell FM&T 230 10x10
Hybond Inc. 307 10x10
IBM Canada 413 10x10
Indium Corporation 722 10x10
ISI / Interconnect Systems 510 10x10
JCET Group 830 10x20
JSR Micro 530 10x10
Kulicke & Soffa Industries 327 10x10
Kyocera International, Inc. 422 10x10
LINTEC of America, Inc. 603 10x10
Machine Vision Products, Inc. 125 10x10
Metallix Refining 631 10x10
Micro Systems Technologies (MST) 622 10x10
MicroScreen 724 10x10
Micross 203 10x10
Midas Technology 809 10x10
Mini-Systems, Inc. 610 10x10
MRSI Systems 423 10x10
NAMICS Technologies, Inc. 213 10x10
nanosystec GmbH 231 10x20
NeuDynamics 612 10x10
NorCom Systems, Inc. 808 10x10
Nordson DAGE 505 10x10
Nordson Sonoscan 523 10x10
Noritake Co., Inc. 211 10x10
NTK Technologies, Inc. 702 10x20
Oasis Materials 123 10x10
Oneida Research 310 10x20
PacTech USA Inc 602 10x10
Palomar Technologies 503 10x10
Panasonic System Solutions Co. of North America 212 10x10
Perfection Products, Inc. 312 10x10
Plasma-Therm 323 10x10
Plasmatreat 821 10x10
PPI Systems 531 10x20
Practical Components 827 10x10
Protavic 306 10x10
Quik-Pak 623 10x10
Reldan Metals Co. Div of Abington Reldan Metals LLC 303 10x10
Riv Inc. 711 10x10
Royce Instruments 813 10x10
Rudolph Technologies 522 10x10
Sales and Service Inc 405 10x10
Samtec 611 10x20
Sekisui Chemical Co., Ltd. 810 10x10
SemiDice, Inc. 507 10x10
Sentec 113 10x10
Sikama International Inc. 408 10x10
Silicon Cert Labs 308 10x10
Sims Recycling Solutions 431 10x10
SMART Microsystems 222 10x10
Stellar Industries Corp. 504 10x10
StratEdge Corp. 309 10x10
Tanaka Precious Metals 331 10x20
Technic Inc. 412 10x10
TechSearch International 604 10x10
Teikoku Taping System Inc. 626 10x10
Teledyne e2v HiRel Electronics 502 10x10
Torrey Hills Technologies 406 10x10
UTZ Technologies 812 10x10
XYZTEC 205 10x10
YXLON FeinFocus 411 10x10
Zestron 304 10x10

:: Heraeus to Introduce High Performance Printable and Etchable Gold Conductor at IMAPS 2018

In 2018 Heraeus is celebrating its 50th year in thick film technology. In the 50 years of Heraeus the thick film industry has grown exponentially and looks to continue to grow for many years to come. This year at IMAPS 2018 in Pasadena CA, Heraeus will introduce its all new high performance printable and etchable gold conductor. It is fitting that in our 50th year we will introduce a gold material that is versatile and can be used in many high reliability applications.



As circuits are continuing to decrease in size the thick film properties are becoming increasingly critical. With this paste we have created a RoHS and Reach compliant product for fine features which can be printed down to 4 mil lines and can be etched down to 1 mil lines for higher density circuit designs.  IMAPS 2018 Samson Shabazi will be presenting this technology to the IMAPS community.

In addition to our new Gold Conductor we will be presenting our solutions for SiP and Advanced packaging applications. This year at Semiconwest in San Francisco we introduced our all new WS5112 type 7 fine pitch solder paste. This paste is the world’s first no spatter type 7 material. For these and all our other solutions please visit the Heraeus booth at booth# 703. Heraeus will also be presenting many papers during the technical portion of the event. Please see below for that list.

Session WA5:
129
Solderable Polymer Thick-film Conductors for Low Temperature Substrates
Gregory Berube, Heraeus Precious Metals North America
Session THA4:
107
Fine Pitch Paste for System-in-Package Applications
Zhang Ruifen, Heraeus Materials Singapore Pte Ltd
Session THA5:
106
Growth of Intermetallics at Coated Silver Wire Bond Interfaces

Sarangapani Murali, Heraeus Materials Singapore Pte Ltd
Poster Session (Thursday lunch):
130
High Performance Etchable RoHS Compliant Thick Film Gold Conductor
Gregory Berube, Heraeus Precious Metals North America

WIRE BONDING WORKSHOP
(Monday 10/8/18 – separate event at convention center):

Curriculum of Coated Silver Bonding Wire
Sarangapani Murali, Heraeus Materials Singapore Pte Ltd (Tan "Eric" Swee Seng, Wong "Jason" Chin Yeung)

 

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:: News from Dfr Solutions

Announcing Sherlock Automated Design Analysis™ for SOLIDWORKS® 3D CAD
The only CAD to CAE solution delivering reliability physics predictions

DfR Solutions, pioneer in Reliability Physics Analysis and leader in quality, reliability, and durability solutions for the electronics industry, today announced a major new release of its Sherlock Automated Design Analysis™ software, version 6.0, Sherlock for SOLIDWORKS 3D CAD Integration.  This significant new release includes integration with SOLIDWORKS 2018 that now empowers all SOLIDWORKS users with the ability to predict product reliability before a prototype is ever built. Sherlock users will now be able to use one tool to complete complex, 3D design and reliability analyses. This groundbreaking new feature is democratizing the process of electronics design by bringing powerful, analytical tools to everyday designers of electronics.

The current key trends in electronic technology – Internet of Things (IoT), Electrification, and Autonomous Transportation – share a focus in bringing power and intelligence closer to our everyday environment. But, this intelligence requires innovative electronic hardware that has never lived outside a datacenter, office, or home. And this hardware must operate at reliability levels far beyond what is currently expected for mobile phones or gaming consoles. How to solve this design reliability and safety challenge within the timeframe and price expectations of consumers? Simulation and modeling. Specifically, Reliability Physics Analysis or RPA which uses knowledge of failure mechanisms to predict reliability and improve product performance.

With the new Sherlock for SOLIDWORKS 3D CAD integrated software, mechanical and electronics designers and engineers can now quickly and easily predict the reliable lifetime of entire PCBAs (Printed Circuit Board Assemblies) under real world conditions, before a product is ever built.  Mechanical, electrical, or reliability engineers, even non-FEA experts, can now seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures, such as enclosures, batteries, thermal solutions, chassis, displays, and stiffeners influence and affect the robustness of electronics exposed to thermal and mechanical loads. This information is vital for simulating circuit card assemblies as close to reality as possible and improving overall product performance.

Previously, design and engineering teams had to use several tools to accomplish reliability testing of 3D objects. Now users of CAD/CAE tools like SOLIDWORKS, Sherlock Automated Design Analysis™ or any other FEA tool, can easily build complex assemblies and complete complicated reliability physics-based analyses with just one, user-friendly tool.

Sherlock for SOLIDWORKS 3D CAD requires SOLIDWORKS 2018 and Sherlock 6.0. The SOLIDWORKS FEA package add-on is required.

To learn more, visit DfR Solutions at IMAPS in Pasadena, RAMS in Orlando, IPC APEX in San Diego or attend the 2019 Design for Reliability Conference in Baltimore, MD March 25-28.

Sherlock Automated Design Analysis™ software, by DfR Solutions, is the only Reliability Physics electronics design tool that analyzes and predicts product failure before it happens.  DfR Solutions is world-renowned for its expertise in applying Reliability Physics Analysis to electronics technologies and is a leading provider of quality, reliability, and durability research and consulting to the electronics industry. The company pioneered the use of Reliability Physics with its innovative, Sherlock Automated Design Analysis™ software providing crucial insights and solutions early in product design and throughout the product life cycle. DfR Solutions empowers its customers to accelerate and maximize product development while saving time, managing resources, and improving customer satisfaction. The company supports Fortune 500 clients in every industry including aerospace/avionics, automotive, consumer, industrial, medical, military, solar and telecommunications. For more information about DfR Solutions, visit www.dfrsolutions.com.

SOLIDWORKS, a Dassault Systèmes brand, leads the global 3D computer-aided design (CAD) industry with easy-to-use 3D software that trains and supports the world’s engineering and design teams as they drive tomorrow’s product innovation. For more information visit www.solidworks.com.

 

Greg Caswell Receives Lifetime Achievement Award
Presented by International Microelectronics Assembly and Packaging Society

Greg Caswell, Senior Member of the Technical Staff at DfR Solutions, has been awarded the 2018 Lifetime Achievement Award by the International Microelectronics Assembly and Packaging Society (IMAPS).

The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, recipients of this award automatically become Life Members and Fellows of the Society.

Mr. Caswell has been a highly-regarded thought leader in the electronics contract manufacturing and component packaging industries for the past 45 years. Caswell is an industry expert in SMT, advanced packaging, printed board fabrication, circuit card assembly and bonding solutions using nanotechnology. He led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Caswell continues to be the leading authority in NanoBonding® implementation for component mounting applications.  During his 10-year tenure at DfR Solutions, he has worked on more than 300 client projects ranging from design reviews and failure analyses to on-site supplier audits across the globe. He continues to write highly sought-after technical papers, journal articles, and blogs and he is a popular webinar presenter. Mr. Caswell has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the first pick and place system used exclusively for SMT in 1978, edited and co-authored the first book on SMT in 1984 for ISHM, and built the first SMT electronics launched into space. Mr. Caswell has a B.S. in electrical Engineering from Rutgers University in New Brunswick, New Jersey and a B.A. in Management from St. Edwards University in Austin, Texas.

Mr. Caswell is teaching the course A Methodology for Understanding the Reliability of Electronic Packaging from 1pm to 3pm on Monday, October 8 at the 51st Annual IMAPS conference at the Pasadena Convention Center. He will be recognized for his lifetime of achievement during the presentation ceremony on Tuesday, October 9th during the President’s Party from 6pm to 8pm.

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:: ORS Acquires Silicon Cert Laboratories

ORS Labs, Inc., the parent company of Oneida Research Services, Inc. (ORS), announces the acquisition of Silicon Cert Laboratories in Reading, Pennsylvania. Silicon Cert Laboratories is an internationally recognized leader in environmental and mechanical testing and qualification of products and components for the telecommunications, defense, automotive, aerospace and medical-device industries. Silicon Cert Laboratories testing services include mechanical shock, vibration, drop testing and environmental exposure such as temperature and humidity cycling to evaluate the impact of changing environmental conditions on products.

“The acquisition of Silicon Cert Laboratories substantially increases the level of expertise and technology that ORS can offer when evaluating and qualifying products and components for mission-critical applications in the industries we serve,” said Daniel Rossiter, Senior Vice President of Oneida Research Services, Inc. “We are thrilled to be working together and look forward to many years of growth.”

John Schmoyer, Client Services Manager at Silicon Cert stated “Oneida and Silicon Cert have had a friendly cooperative relationship for over twelve (12) years. This is a win-win relationship for both Silicon Cert Laboratories and Oneida Research.”

About Silicon Cert Laboratories: Based in Reading, PA, Silicon Cert Laboratories was founded in 1998 by a group of former Bell Labs, AT&T Microelectronics and Lucent Technologies engineers with an extensive background in integrated circuit and optoelectronic component design, manufacturing and testing. The company achieved ISO certification in 2000 and is currently certified to ISO 9001:2008 through DNV-GL. In 2007, the Defense Logistics Agency in Columbus, Ohio approved Silicon Cert for multiple MIL-STD-883 test methods. In 2009, the company was accredited by A2LA to ISO/IEC 17025:2005 to perform a wide variety of reliability tests. https://www.siliconcert.com

About ORS: Oneida Research Services, Inc. has testing facilities in Whitesboro, New York and Denver, Colorado. Both locations are accredited to ISO 9001:2015 and AS9100D and approved by the Defense Logistics Agency in Columbus, Ohio for several test methods per Mil Std. 883 and Mil Std. 750. Throughout its 40 years, ORS has established strong working relationships with experts in the field of applied analytical chemistry, gas analysis, destructive physical analysis, hermeticity testing and organic mass spectrometry. ORS also has an affiliate in Sophia Antipolis, France. https://www.orslabs.com

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:: Teledyne e2v HiRel Releases a New 650V/60A Bottom Side Cooled GaN FET at the Industry’s Highest Available Voltage

Teledyne e2v HiRel Electronics, a business unit of the Teledyne Defense Electronics Group, today introduced a new 650V GaN FET device that is dedicated to demanding HiRel applications. This 650V FET is the highest voltage GaN FET device currently in use in the market.

The TDG650E60 is a 650V/60A enhancement mode power transistor.  It is built in a gallium nitride (GaN) on silicon process and packaged in GaN System’s industry-leading GaNPX™ Package.  This package enables very low inductance and thermal resistance in a small 11x9mm outline. The package is bottom-side cooled to offer very low junction-to-case thermal resistance. GaN System’s patented “Island” technology is key to enabling high voltage, current, and efficiency.

This new Teledyne e2v HiRel plastic GaN FET is the first 650V part released from the new Teledyne e2v HiRel Enhanced Product (EP) series that addresses the concerns of customers in applications where ceramic packages are not required. In such applications, the cost and earliest availability of newer technologies are the highest priorities for design engineers.

Teledyne e2v HiRel GaN screening, baseline control, and a 10 year longevity support program will give customers the reliability and availability assurance they need when addressing demanding military, space, avionics, and related HiRel applications.

“Releasing a HiRel 650V GaN FET is an industry milestone, giving design engineers more margin in the most demanding space and military COTS applications”, said Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “The non-ceramic package will allow customers to benefit from the low weight and efficient GaNPX package for the best performance in these stringent applications.”

For demanding high power applications, GaN power FET technology is the newest, most efficient solution for customers. The new 650V part builds on this by offering additional differentiating benefits, including:

  • Very high switching frequency
  • SWaP – the device is a offered in a very small package
  • High voltage and high current
  • High energy density
  • Modular Flexibility – the parts can be used in parallel to increase current

Teledyne HiRel Electronics is able to offer samples of the new device available for review, and shipping will commence in November.

About Teledyne e2v HiRel Electronics
Teledyne e2v HiRel Electronics innovations lead developments in space, transportation, defense and industrial markets. Teledyne’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom solutions, bringing increased value to their systems. For more information, visit www.e2v.com

About GaN Systems
GaN Systems is the global leader in GaN power semiconductors with the largest portfolio of transistors that uniquely address the needs of today’s most demanding industries including data center servers, renewable energy systems, automotive, industrial motors and consumer electronics. As a market-leading innovator, GaN Systems makes possible the design of smaller, lower cost, more efficient power systems. The company’s award-winning products provide system design opportunities free from the limitations of yesterday’s silicon. By changing the rules of transistor performance, GaN Systems is enabling power conversion companies to revolutionize their industries and transform the world. For more information, please visit: www.gansystems.com or follow GaN Systems on Facebook, Twitter and LinkedIn.

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:: Issue 233 ::
October 5, 2018

Presidio Components

Gannon & Scott

TopLine