Corporate Bulletin
:: Corporate Member News ::

:: Heraeus to Introduce High Performance Printable and Etchable Gold Conductor at IMAPS 2018 (full story)

:: Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Pakaging (full story)

:: Indium Corporation Experts to Present at IMAPS 2018 (full story)

:: Micross Announces Key Hires in Component Modification Services Division (full story)

:: Using Information Asymmetry in Your Favor with Today's Competitive Environment by Torrey Hills Technologies (full story)

:: Palomar Technologies Awarded ISO 9001:2015 Certificate (full story)


:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:


    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC
Event Sponsors:

Supporting Technology Sponsor:

JCET Group - Supporting Technology Sponsor

Networking Sponsor:

EMD Performance Materials - Corporate Sponsor

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Keynote/Plenary Sponsor:

Student Programs Sponsor:

Honeywell - Student Programs Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Coffee Break Sponsor:

Coffee Break Sponsor: ORS Oneida Research Services & Silicon Cert Labs

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

Supporting Sponsor:

American Elements, global manufacturer of high purity metals, semiconductors, nanomaterials, sputtering targets & evaporation materials for optoelectronics, sensors, thin films, MEMS devices & Microelectronics Materials

Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: US Tech


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: Heraeus to Introduce High Performance Printable and Etchable Gold Conductor at IMAPS 2018

In 2018 Heraeus is celebrating its 50th year in thick film technology. In the 50 years of Heraeus the thick film industry has grown exponentially and looks to continue to grow for many years to come. This year at IMAPS 2018 in Pasadena CA, Heraeus will introduce its all new high performance printable and etchable gold conductor. It is fitting that in our 50th year we will introduce a gold material that is versatile and can be used in many high reliability applications.

As circuits are continuing to decrease in size the thick film properties are becoming increasingly critical. With this paste we have created a RoHS and Reach compliant product for fine features which can be printed down to 4 mil lines and can be etched down to 1 mil lines for higher density circuit designs.  IMAPS 2018 Samson Shabazi will be presenting this technology to the IMAPS community.

In addition to our new Gold Conductor we will be presenting our solutions for SiP and Advanced packaging applications. This year at Semiconwest in San Francisco we introduced our all new WS5112 type 7 fine pitch solder paste. This paste is the world’s first no spatter type 7 material. For these and all our other solutions please visit the Heraeus booth at booth# 703. Heraeus will also be presenting many papers during the technical portion of the event. Please see below for that list.

Session WA5:
Solderable Polymer Thick-film Conductors for Low Temperature Substrates
Gregory Berube, Heraeus Precious Metals North America
Session THA4:
Fine Pitch Paste for System-in-Package Applications
Zhang Ruifen, Heraeus Materials Singapore Pte Ltd
Session THA5:
Growth of Intermetallics at Coated Silver Wire Bond Interfaces

Sarangapani Murali, Heraeus Materials Singapore Pte Ltd
Poster Session (Thursday lunch):
High Performance Etchable RoHS Compliant Thick Film Gold Conductor
Gregory Berube, Heraeus Precious Metals North America

(Monday 10/8/18 – separate event at convention center):

Curriculum of Coated Silver Bonding Wire
Sarangapani Murali, Heraeus Materials Singapore Pte Ltd (Tan "Eric" Swee Seng, Wong "Jason" Chin Yeung)


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:: Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Dragonfly G2 system delivers greater than 50 percent higher 2D inspection speed and accommodates multiple sensor options, including Clearfind Technology

Rudolph Technologies, Inc. (NYSE: RTEC) announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafer-based application challenges on a single platform. To date, customer evaluations have reported throughput increases greater than 50 percent over the first-generation Dragonfly system.

The Dragonfly G2 system achieves significant throughput and productivity increases using proprietary camera technology combined with stage speed and accuracy. Additionally, its modular architecture permits plug-and-play configurability of Rudolph’s technologies such as Truebump™ Technology, for more accurate bump height measurement, and Clearfind Technology, for non-visual residue detection. Streamlined software algorithms contribute to the faster throughput and enable the system to handle increasing bump counts, which have already exceeded 80 million bumps per wafer.

“Advanced packaging processes are evolving rapidly, with larger packages, shrinking features, and higher counts of smaller bumps on every wafer, and the Dragonfly G2 system is designed to meet these new challenges,” said Tim Kryman, senior director of corporate marketing at Rudolph Technologies. “At the same time, its increased throughput reduces cost-of-ownership and its configurable modular design lets one system do the work of two. Based on the positive feedback from customers’ beta testing we are expecting strong demand for this latest evolution of our technology. We expect the Dragonfly G2 system to meet our customers’ future inspection needs as increasing demands for higher quality products are driving more data with greater integrity and faster throughput to meet the growing volumes of consumer and auto electronics products.”

“An important driver for Rudolph Technologies is to increase our pace of innovation to ensure we are anticipating our customers’ roadmaps,” added Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “We were very pleased to be able to demonstrate that commitment with the release of this Dragonfly G2 system. Not only have we significantly improved throughput and imaging capability, but we have also provided the powerful Clearfind Technology to make a compelling, no compromise, advanced packaging process control system.”

The Dragonfly G2 system can be ordered now with shipments expected to begin in Q4. First-generation Dragonfly systems can be retrofitted on-site with a second-generation upgrade kit.

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:: Indium Corporation Experts to Present at IMAPS 2018

Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif.

The following technical presentations from Indium Corporation experts will be featured: 

  • Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications by Dr. Ning-Cheng Lee, Vice President of Technology
  • Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High-Reliability Performance up to 175°C by Dr. Lee
  • Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly by Dr. Lee
  • Perspectives of High-Temperature Lead-Free Solders by Dr. HongWen Zhang, Manager, R&D Alloy Group
  • Shear Strength and Thermo-Mechanical Reliability of Sintered Ag Joints Containing Low CTE Non-Metal Additives for Die Attach by Guangyu Fan, Research Chemist

Dr. Lee will also lead the course Achieving High-Reliability Solder Joints for Lead-Free Alloys, which will examine how various factors contribute to the overall reliability of the solder joint. The discussion will include a review of novel solder alloys designed for wide service temperature range automotive applications, as well as the mechanisms of achieving high-reliability.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.
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:: Micross Announces Key Hires in Component Modification Services Division

Micross announces key additions to its ITAR-registered facility, Component Modification Services (CMS) located in Hatfield, Pennsylvania: Marshall (Mac) Blythe in the role of General Manager; Kevin McKenna as Engineering Manager and Sharon Feiller as Quality Manager.
Micross CMS offers the most comprehensive range of capabilities available from one source including: BGA Reballing, GEIA-STD-0006 Robotic Hot Solder Dipping & Exchange, Lead Attach, Trim & Form, Counterfeit Mitigation Testing and Tape & Reel Services. For additional information about Micross Component Modification Services, visit or contact

About Micross
Micross is the one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices.  In business for more than 40 years, our comprehensive array of hi-reliability capabilities serve the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.  For additional information, visit

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:: Using Information Asymmetry in Your Favor with Today's Competitive Environment by Torrey Hills Technologies

In a perfect world, a customer buying a product would have the exact same knowledge about the product that the seller does. Unfortunately, this is rarely the case. The concept of Information Asymmetry was invented in 1970 by Nobel Prize-winning American economist George Akerlof. In its essence, information asymmetry refers to a relatively common sales situation: when one party in a transaction knows more about the deal than the other party does. Only sellers know the real quality of their products, so sellers always have a disproportionate advantage over buyers. While Akerlof developed this idea using automobiles as the primary example, information asymmetry exists in all industries with all types of products. Awareness of information asymmetry can help buyers reevaluate their knowledge of a product before making a purchase, in order to make a better, more informed decision.

Understanding the concept of information asymmetry can benefit consumers in a big way. For instance, a customer in need of a belt furnace can choose between a used or new furnace. If they start out by discussing their needs with a used inventory salesperson, they might be told about the initial monetary savings involved with purchasing used equipment, but may not be informed about the ongoing cost of maintenance, lack of energy savings, and difficulty involved in finding parts that may have been discontinued. Once a customer has a better grasp on the limits of their own knowledge about a product and can start to comprehend what they don’t know, they are already in a better position to ask more relevant questions and continue learning.

Unfounded assumptions by customers can be quite costly. For instance, a customer could easily be swindled into thinking that a company with a large marketing budget is a “better” manufacturer, just because they spend more money selling this idea. In comparing a fast fire belt furnace by Torrey Hills Technologies (see Table 1 below) to a similar model by a major competitor, THT’s HSK model has many more benefits than the competitor’s 9” model. In fact, THT has the advantage over the competing model for every single specification except for one. If a customer wasn’t aware of this and didn’t take the time to compare specifications, they would literally pay more for less manufacturing productivity.

From the perspective of an honest, high-quality seller, information asymmetry is a complete disadvantage. An honest seller has nothing to hide, and wants their customers to possess the same product information that they do. A genuine seller believes that if a customer possesses all of the information about a product then they will avoid any future regret about their purchase.

Information asymmetry has a direct relationship to a phenomenon known as “purchasing regret,” where a buyer is confident about a product up until actually purchasing it, and then regrets the decision to buy immediately afterwards. After the customer purchases a product, their preconceived notions about the product disappear; they will acquire their own personal experience going forward. Once the playing field levels and the buyer has access to the same full experience of the product that the seller already possessed, they might realize that they should have broadened their search or asked more questions. Understanding that information asymmetry exists in almost every purchasing situation is fundamental for the wise consumer; this way, one can truly find the best belt furnace while saving money at the same time.

About Torrey Hills Technologies

Torrey Hills Technologies, LLC is a leader in developing and delivering quality but affordable materials and equipment for multiple industries. Over the years, the company has expanded its business from microelectronics packaging components and refractory metals to include solar cell and the thick film manufacturing equipment. Headquartered in San Diego, Calif., its mission is to help customers achieve higher profitability by providing innovative products and services. Products from Torrey Hills Technologies are now shipping worldwide to more than 30 countries. From 2005-2007, Torrey Hills Technologies achieved an accumulated growth rate of 517%, 5th among privately held companies in San Diego (rated by San Diego Business Journal).

Torrey Hills Technologies is currently owned by a small group of private investors and G Tech Systems Group, Inc. (a California corporation, most with substantial experience in the semiconductor industry.


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:: Palomar Technologies Awarded ISO 9001:2015 Certificate

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced the successful completion of its International Organization for Standardization (ISO) 9001:2015 audit for its corporate offices in Carlsbad, CA. The audit was performed by SGS North America, Inc.  Palomar was audited and certified as meeting the ISO requirements for design, manufacturing, sales, servicing, and marketing of automated assembly equipment and contract manufacturing serving the optoelectronic, wireless, disk drive, automotive, aerospace, defense, and medical industries.  Read the full press release:  

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:: Issue 232 ::
September 21, 2018

Presidio Components

Gannon & Scott